Part Number: ZMDKCBD55W-8 3.2x1.6mm SMD CHIP LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES D E Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Reverse Voltage VR Forward Current IF Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS Power Dissipation PD Electrostatic Discharge Threshold (HBM) Operating Temperature Storage Temperature MDK (AlGaInP) CBD (InGaN) Unit 5 5 L n V 30 30 mA u S 185 150 mA 75 120 mW - 250 V TA -40 ~ +85 Tstg -40 ~ +85 °C Operating Characteristics (TA=25°C) Emitting Color Red Emitting Material 1.95 3.3 V Forward Voltage (Max.) (IF=20mA) VF 2.5 4 V Reverse Current (Max.) (VR=5V) IR 10 50 uA Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) λP 645* 460* nm Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) λD 630* 465* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 28 25 nm C 35 100 pF Lens-color Water Clear Blue Unit VF AlGaInP ZMDKCBD55W-8 CBD (InGaN) Forward Voltage (Typ.) (IF=20mA) Capacitance (Typ.) (VF=0V, f=1MHz) Part Number MDK (AlGaInP) InGaN Luminous Intensity CIE127-2007* (IF=20mA) mcd Wavelength CIE127-2007* nm λP min. typ. 500 200* 895 397* 645* 100 100* 248 248* 460* Viewing Angle 2θ 1/2 30° *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Mar 07,2014 SDSA8097 V2-X Layout: Maggie L. P. 1/4 Part Number: ZMDKCBD55W-8 3.2x1.6mm SMD CHIP LED LAMP www.SunLED.com MDK u S L n D E CBD Mar 07,2014 SDSA8097 V2-X Layout: Maggie L. P. 2/4 Part Number: ZMDKCBD55W-8 3.2x1.6mm SMD CHIP LED LAMP www.SunLED.com LED is recommended for reflow soldering and soldering profile is shown below. The device has a single mounting surface. The device must be mounted according to the specifications. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) u S Tape Specification (Units : mm) L n D E Reel Dimension Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Mar 07,2014 SDSA8097 V2-X Layout: Maggie L. P. 3/4 Part Number: ZMDKCBD55W-8 3.2x1.6mm SMD CHIP LED LAMP www.SunLED.com PACKING & LABEL SPECIFICATIONS D E L n u S TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLED.com/TechnicalNotes Mar 07,2014 SDSA8097 V2-X Layout: Maggie L. P. 4/4