SMP1322 Series: Low Resistance, Plastic Packaged PIN Diodes

DATA SHEET
SMP1322 Series: Low Resistance, Plastic Packaged PIN
Diodes
Applications
 High-performance wireless switch applications
Features
 Resistance: 0.8 Ω typical @ 1 mA
 Packages rated MSL1, 260 C per JEDEC J-STD-020
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
Description
The SMP1322 series of plastic packaged, surface mountable PIN
diodes is designed for use in high volume switch applications
from 10 MHz to more than 10 GHz. The ultra-low resistance of
these diodes (1.5 Ω maximum at 1 mA and 0.5 Ω typical at
10 mA) makes the SMP1322 series particularly suited to low-loss
PIN diode switches in battery operated circuits.
The SMP1322 series is available in a selection of plastic
packages and a variety of configurations that include an SC-70, a
small footprint SC-79, and a miniature SOD-882.
Table 1 describes the various packages and marking of the
SMP1322 series.
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DATA SHEET • SMP1322 SERIES DIODES
Table 1. SMP1322 Series Packaging and Marking
Single
Series Pair
Single
Single
SOT-23
SOT-23
SC-79
Green™
SOD-882
Green™
SMP1322-001
Marking: PN1
SMP1322-005
Marking: PN2
SMP1322-001LF
Green™
Marking: RN1
SMP1322-005LF
Green™
Marking: RN2
SMP1322-079LF
Marking: Cathode and CC
SMP1322-040LF
Marking: T
LS = 1.5 nH
LS = 1.5 nH
LS = 0.7 nH
LS = 0.45 nH
SC-70
SMP1322-075LF
Green™
Marking: RN2
LS = 1.4 nH
The Pb-free symbol or “LF” in the part number denotes a lead-free, RoHS-compliant package unless otherwise noted as Green™.
Tin/lead (Sn/Pb) packaging is not recommended for new designs.
Electrical and Mechanical Specifications
Typical performance characteristics of the SMP1322 series are
illustrated in Figures 1 to 5. Package dimensions are shown in
Figures 6 to 12 (even numbers), and tape and reel dimensions are
provided in Figures 7 to 13 (odd numbers).
The absolute maximum ratings of the SMP1322 series are
provided in Table 2. Electrical specifications are provided in
Table 3. Resistance versus temperature measurements are
provided in Table 4.
Table 2. SMP1322 Series Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
Reverse voltage
VR
50
V
Power dissipation @ 25 °C lead temperature
PD
250
mW
Storage temperature
TSTG
–65
+150
C
Operating temperature
TA
–65
+150
C
Electrostatic discharge:
ESD
1000
1000
V
V
Charged Device Model (CDM), Class 4
Human Body Model (HBM), Class 1B
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
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DATA SHEET • SMP1322 SERIES DIODES
Table 3. SMP1322 Series Electrical Specifications (Note 1)
(TA = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Reverse current
IR
VR = 50 V
10
μA
Capacitance
CT
F = 1 MHz, V = 30 V
1
pF
Resistance
RS
F = 100 MHz
1.5
Ω
Ω
I = 1 mA
I = 10 mA
0.5
Forward voltage
VF
IF = 10 mA
0.85
V
Carrier lifetime
TI
IF = 10 mA
0.4
μs
8
μm
I region width
Note 1: Performance is guaranteed only under the conditions listed in this table.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Package and Handling Information
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
The SMP1322 series is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.
Table 4. Resistance vs Temperature @ 500 MHz
IF
(mA)
RS @ –55 °C
(Ω)
RS @ –15 °C
(Ω)
RS @ +25 °C
(Ω)
RS @ +65 °C
(Ω)
RS @ +100 °C
(Ω)
0.02
9.5
9.4
9.9
10.5
10.9
0.10
3.0
3.0
3.0
3.3
3.5
0.30
1.5
1.5
1.5
1.6
1.8
0.50
1.1
1.1
1.2
1.2
1.4
1.0
0.922
0.914
0.902
0.963
1.100
10
0.568
0.559
0.533
0.563
0.655
20
0.532
0.520
0.494
0.521
0.610
100
0.483
0.469
0.440
0.464
0.565
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DATA SHEET • SMP1322 SERIES DIODES
Typical Performance Characteristics
100
Forward Current (mA)
Series Resistance (Ω)
100
10
1
10
1
0.1
0.01
0.1
0.01
0.1
1
10
400
100
500
600
700
800
900
1000
Forward Voltage (mV)
Forward Current (mA)
Figure 2. DC Characteristics
Figure 1. Series Resistance vs Current @ 100 MHz
1.4
3000
1.2
0V
Conductance (μS)
Capacitance (pF)
2500
1 MHz to 1 GHz
1.0
0.8
0.6
0.4
2000
1500
1000
500
0.2
0
0
1
2
5
10
20
50
0
10 V
40 V
0
500
1000
1500
Frequency (MHz)
Reverse Voltage (V)
Figure 4. Conductance vs Frequency and Reverse Voltage
Figure 3. Capacitance vs Reverse Voltage
25
IF = 10 mA
Loss (dB)
20
15
10
5
Zero Bias
0
0.5
1
2
3
4
Frequency (GHz)
Figure 5. SMP1322-017 Typical SPST Switch Performance
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2000
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DATA SHEET • SMP1322 SERIES DIODES
0.071 (1.80 mm) Min.
0.087 (2.20 mm) Max.
0.010 (0.25 mm) Min.
0.016 (0.40 mm) Max.
3
0.071 (1.80 mm) Min.
0.094 (2.40 mm) Max.
0.045 (1.15 mm) Min.
0.053 (1.35 mm) Max.
1
2
0.014 (0.35 mm) Ref.
0.026 (0.65 mm) Ref.
0.051 (1.30 mm) Ref.
0.004 (0.10 mm) Min.
0.007 (0.18 mm) Max.
0.031 (0.80 mm) Min.
0.039 (1.00 mm) Max.
0.004 (0.10 mm) Min.
0.012 (0.30 mm) Max.
0.000 (0.00 mm) Min.
0.004 (0.10 mm) Max.
Dimensions are in inches (millimeters shown in parentheses)
S1653
Figure 6. SC-70 Package Dimension Drawing
4.00
∅1.50 +0.1/–0
1.75 ± 0.10
A
R 0.20 Max.
1.19 (Ko)
2.50 (Bo)
2.00
2.25 (Ao)
1.00
8.00 +0.3/–0.1
∅0.76 Min.
3.50 ± 0.05
(See Note 3)
T ± 0.05
2.00 ± 0.05
(See Note 3)
4.00
(See Note 1)
A
Pin 1
R 0.3 Typ.
0.59
A
Notes:
1. Sprocket hole pitch cumulative tolerance ±0.2.
2. Carrier tape: black conductive polystyrene.
3. Pocket position relative to sprocket hole measured
as true position of pocket, not pocket hole.
4. Cover tape material: transparent conductive PSA with 9.2 mm width.
5. All measurements are in millimeters.
S1685c
Figure 7. SC-70 Tape and Reel Dimensions
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DATA SHEET • SMP1322 SERIES DIODES
Box
or
Bar
Polarity
Indicator Area
0.006 (0.15 mm) Min.
0.010
(0.25 mm) Min.
0.014
(0.35 mm) Max.
1
2
0.028
(0.70 mm) Min.
0.035
(0.90 mm) Max.
0.060 (1.50 mm) Min.
0.067 (1.70 mm) Max.
0.043 (1.10 mm) Min.
0.051 (1.30 mm) Max.
10° Max.
0.020
(0.50 mm) Min.
0.028
(0.70 mm) Max.
0.003
(0.07 mm) Min.
0.008
(0.20 mm) Max.
10° Max.
Dimensions are in inches (millimeters shown in parentheses)
S1652
Figure 8. SC-79 Package Dimension Drawing
Ø1.50± 0.10
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
0.229 ± 0.02 (T)
1.75 ± 0.10
B
A
B
Pin 1 Indicator
0.80 ± 0.05 (Ko)
B
8.00 ± 0.20
A
3.50 ± 0.05
1.40 ± 0.05
1.95 ± 0.05 (Bo)
2° Max
Ø0.50± 0.05
0.39 ± 0.05
2o Max
0.90 ± 0.05 (Ao)
A
Notes:
1. Carrier tape: black conductive polycarbonate or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 5.4 mm width.
4. ESD-surface resistivity is ≤1 x 108 Ohms/square per
EIA, JEDEC TNR Specification.
5. All measurements are in millimeters.
S2929
Figure 9. SC-79 Tape and Reel Dimensions
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DATA SHEET • SMP1322 SERIES DIODES
0.110 (2.80 mm) Min.
0.120 (3.04 mm) Max.
0.012 (0.30 mm) Min.
0.020 (0.50 mm) Max.
3
0.083 (2.10 mm) Min.
0.104 (2.64 mm) Max.
0.047 (1.20 mm) Min.
0.055 (1.40 mm) Max.
2
1
0.037 (0.95 mm) Ref.
0.020 (0.51 mm) Ref.
0.076 (1.92 mm) Ref.
0.035 (0.89 mm) Min.
0.044 (1.12 mm) Max.
0.003 (0.080 mm) Min.
0.008 (0.20 mm) Max.
8° Max.
0.0005 (0.01 mm) Min.
0.004 (0.10 mm) Max.
0.022 (0.55 mm) Ref.
Dimensions are in inches (millimeters shown in parentheses)
S1389
Figure 10. SOT-23 Package Dimension Drawing
4.00
ø1.00 Min.
ø1.5 + 0.1/–0
4.00
(See Note 5)
1.75 ± 0.10
3.50 ± 0.05
A
2.70 (Bo)
R 0.3 Max
2.2
1.20 (Ko)
1.0
0.8 ± 0.05
R 0.5 Typ.
Pin 1 Indicator
8.00 + 0.3/–0.1
2.00 ± 0.05
0.25 ± 0.05
A
3.10 (Ao)
A
Notes:
1. Carrier tape: black conductive polycarbonate.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 5.40 mm width.
4. Tolerance ±0.10 mm.
5. Ten sprocket hole pitch cumulative tolerance: ±0.2 mm.
6. All measurements are in millimeters.
7. Alternative carrier tape dimensions are:
Ao = 3.3
Bo = 2.9
Ko = 1.22
S1684b
Figure 11. SOT-23 Tape and Reel Dimensions
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DATA SHEET • SMP1322 SERIES DIODES
0.03 C
Seating Plane
0.05/0.00
Pin 1 Indicator
2X
5
2X 0.25 ± 0.05
0.10 M A B
C
0.05
0.325
Terminal 1
1.000
0.650
B
A
0.600
0.46 + 0.04
–0.06
0.05
2X 0.50 ± 0.05
0.10 M A B
4
2X
NOTES:
1. All measurements are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
3. These packages are used principally for discrete devices.
4. This dimension includes stand-off height and package body thickness,
but does not include attached features, e.g., external heatsink or chip capacitors.
An integral heatslug is not considered an attached feature.
5. This dimension is primarily terminal plating, but does not include small metal protrusion.
Y1410
Figure 12. SOD-882 Package Dimension Drawing
4.00 ± 0.10
Cathode
Indicator
2.00 ± 0.05
∅1.55 ± 0.05 (D0)
0.20
∅0.40 ± 0.05 (D1)
0.47 ± 0.05 (Ko)
2.00 ± 0.05
B
B
A
A
0.70 ± 0.05 (A0)
Notes:
1. Carrier tape: black conductive polycarbonate.
2. Cover tape: transparent conductive material.
3. Cover tape size: 5.4 mm width.
4. ESD surface resistivity is ≥1 x 104 ~ ≤ 1 x 108 Ohms/square.
5. All dimensions are in millimeters.
B
Figure 13. SOD-882 Tape and Reel Dimensions
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S1922
8.00 ± 0.1
1.75 ± 0.10
3.50 ± 0.05
1.15 ± 0.05 (Bo)
A
DATA SHEET • SMP1322 SERIES DIODES
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