DATA SHEET GaAs Flip Chip Schottky Diodes Applications ● ● Mixer Detector Features ● ● ● ● ● ● ● Designed for high volume designs High frequency (20–100 GHz) Exceeds environmental requirements for MIC & hybrid applications Designed for low junction capacitance and low series resistance Applications include PCN mixers and circuits, as well as low power, fast switching Low parasitic flip chip configuration Available lead (Pb)-free, RoHS-compliant, and Green Description NEW Skyworks Green products are lead (Pb)-free, RoHS (Restriction of Hazardous Substances)-compliant, conform to the EIA/EICTA/JEITA Joint Industry Guide (JIG) Level A guidelines, and are free from antimony trioxide and brominated flame retardants. This series of Skyworks GaAs Schottky barrier flip chip diodes produces excellent high frequency performance up to millimeter wave range in a mechanically robust, small form factor. The series is comprised of a single junction device, DMK2790-000, and an antiparallel pair, DMK2308-000. These products offer very low series resistance and capacitance typically available only in beam lead devices, but without the fragility of beam leads. The DMK2790-000 antiparallel pair is well suited for use in subharmonically-pumped mixers or in limiting circuits. These diodes are designed to be mounted on hard or soft substrate printed circuit boards with conductive epoxy or solder. Typical applications include mixers or detectors in point-to-point millimeterwave radios, collision avoidance automotive radars, adaptive cruise control radar systems, etc. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200660 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • June 7, 2007 1 DATA SHEET • GAAS FLIP CHIP SCHOTTKY DIODES Electrical Specifications at 25 °C CT(2) 0 V, 1 MHz (pF) VB(1) @ 10 µA (V) Recommended Frequency (GHz) 20–100 3.0 RS @ 10 mA Ω) (Ω VF @ 1 mA (mV) Single Anti-Parallel Min. Max. Max. Min. Max. 540-011 540-025 0.04 0.07 7 650 750 DMK2790-000 DMK2308-000 1. VB cannot be measured nondestructively in anti-parallel configuration. 2. CT = junction capacitance plus 0.02 pF (overlay). 0.080 0.076 0.072 0.068 0.064 0.060 0.056 0.052 0.048 0.044 0.040 0.036 0.032 0.028 Number of Obs Device Capacitance (pF) Typical Parameter Distribution on Wafer 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 700 720 VF 1 mA (mV) Capacitance/Voltage Variation Histogram CJ 0.0063 pF Average 0.0014 pF SD 0.060 0.065 Number of Obs Number of Obs VF = Mixer DMK2790 x = 719 mV σ = 6.3 mV Bias Voltage (V) Aug 0.063 pF SD = 0.002 pF 60 55 50 45 40 35 30 25 20 15 10 5 0 0.055 65 60 55 50 45 40 35 30 25 20 15 10 5 0 680 0.070 165 x = 5.0 σ = 0.25 154 143 132 121 110 99 88 77 66 55 44 33 22 11 0 4.0 4.5 740 RT = Mixer DMK2790 x = 5.0 Ω σ = 0.25 Ω 5.0 Capacitance 0 V (pF) RT 10 mA (Ω) Histogram Histogram 5.5 6.0 Spice Parameters (Per Junction) IS Amp RS Ω n TD S CJ0 pF m EG eV VJ eV XTI FC BV V IBV A 0.5 E–12 4 1.05 1E–11 0.05 0.26 1.43 0.82 2 0.5 4.0 1E–05 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 June 7, 2007 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200660 Rev. A DATA SHEET • GAAS FLIP CHIP SCHOTTKY DIODES The Epoxy Die Attach Process For GaAs Flip Chip Devices Epoxy Material – Microelectronic grade conductive epoxy. For attachment to soft boards, a stress absorbent conductive epoxy must be used, to produce a consistent process and reliable bond. Cleanness – Flexible or hard substrate must be clean and free of contaminates, before epoxy die attachment takes place. Epoxy Dispensing – Dispense epoxy dot size, approximately 0.008” and a bond like thickness of approximately 0.001”, between die and substrate. 10 Mil Gap Absolute Maximum Ratings Characteristic Value Storage temperature (TST) -65 °C to +150 °C Operating temperature (TOP) -65 °C to +125 °C Junction temperature (TJ) 175 °C Electrostatic Discharge (ESD) Human Body Mode (HBM) Class 0 Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty. CAUTION: Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. Die Attachment – Flip device, aligning bond pads of device to dispensed dots, using even force of approximately 15-30 grams of bond force. Epoxy Curing – Cure per manufacture’s recommendations. Attachment Quality – The strength of the die attachment can be verified by stressing the attachment joint to failure, by performing die shear test on a sample base. The force of the shear test equipment on the die is increased until the component pops from the surface of the circuit, recording a gram force value at the time of fracture from substrate. This value for pass or fail criteria is based on the contact bond pad size of the die and compared against MIL requirements. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200660 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • June 7, 2007 3 DATA SHEET • GAAS FLIP CHIP SCHOTTKY DIODES 540-011 540-025 0.026 (0.66 mm) ± 0.001 (0.025 mm) 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.026 (0.66 mm) ± 0.001 (0.025 mm) 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.008 (0.20 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) ± 0.001 (0.025 mm) Max. 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.008 (0.20 mm) ± 0.001 (0.025 mm) 0.013 (0.33 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) ± 0.001 (0.025 mm) 0.005 (0.13 mm) ± 0.001 (0.025 mm) Max. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 June 7, 2007 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200660 Rev. A DATA SHEET • GAAS FLIP CHIP SCHOTTKY DIODES Copyright © 2002, 2003, 2004, 2005, 2006, 2007, Skyworks Solutions, Inc. 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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200660 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • June 7, 2007 5