SX9300 - Semtech

SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
GENERAL DESCRIPTION
KEY PRODUCT FEATURES
The SX9300 is the world’s first dual channel capacitive
Specific Absorption Rate (SAR) controller that accurately
discriminates between an inanimate object and human body
proximity. The resulting detection is used in portable
electronic devices to reduce and control radio-frequency
(RF) emission power in the presence of a human body,
enabling
significant
performance
advantages
for
manufacturers of electronic devices with electro-magnetic
radiation sources to meet stringent emission regulations'
criteria and Specific Absorption Rate (SAR) standards.
Operating directly from an input supply voltage of 2.7 to
5.5V, the SX9300 outputs its data via a 1.65 – 5.5V host
compatible I2C serial bus.
2.7 – 5.5V Input Supply Voltage
Dual SAR Capacitive Sensor Inputs
On-Chip SAR Engine For Body versus Inanimate Object
Detection
Down to 0.08 fF Capacitance Resolution
Stable Proximity Sensing With Temperature
20mm detection distance
Capacitance Offset Compensation up to 30pF
Active Sensor Guarding
Automatic Calibration
Ultra Low Power Consumption:
Active Mode:
Doze Mode:
Sleep Mode:
The I2C serial communication bus port is compatible with
1.8V host control to report body detection/proximity and to
facilitate parameter settings adjustment. Upon proximity
detection, the NIRQ output asserts, enabling the user to
either determine the relative proximity distance, or simply
obtain an indication of detection.
The SX9300 includes an on-chip auto-calibration controller
that regularly performs sensitivity adjustments to maintain
peak performance over a wide variation of temperature,
humidity and noise environments, providing simplified
product development and enhanced performance.
A
dedicated transmit enable (TXEN) pin is available to
synchronize proximity measurements to RF transmission,
enabling very low supply current and high noise immunity by
only measuring proximity when requested.
170 uA
18 uA
2.5 uA
400kHz I2C Serial Interface
Four programmable I2C Sub-Addresses
Input Levels Compatible with 1.8V Host Processors
Open Drain NIRQ Interrupt pin
Three (3) Reset Sources: POR, NRST pin, Soft Reset
-40°C to +85°C Operation
Compact Size: 3 x 3mm Thin QFN package
Pb & Halogen Free, RoHS/WEEE compliant
APPLICATIONS
•
•
•
•
•
SAR Compliant Systems
Notebooks
Tablets
Mobile Phones
Mobile Hot Spots
ORDERING INFORMATION
Part Number
SX9300IULTRT
SX9300EVKA
1
1
Package
Marking
QFN-20
ZM5C
Eval. Kit
-
3000 Units/reel
TYPICAL APPLICATION CIRCUIT
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
Table of Contents
GENERAL DESCRIPTION ........................................................................................................................ 1
KEY PRODUCT FEATURES..................................................................................................................... 1
APPLICATIONS....................................................................................................................................... 1
ORDERING INFORMATION...................................................................................................................... 1
TYPICAL APPLICATION CIRCUIT ............................................................................................................ 1
1
GENERAL DESCRIPTION ............................................................................................................... 4
1.1
1.2
1.3
1.4
Pin Diagram
Marking Information
Pin Description
Acronyms
4
4
5
5
ELECTRICAL CHARACTERISTICS ................................................................................................. 6
2
2.1
2.2
2.3
2.4
Absolute Maximum Ratings
Operating Conditions
Thermal Characteristics
Electrical Specifications
PROXIMITY SENSING INTERFACE ................................................................................................. 9
3
3.1
3.2
3.3
Introduction
Scan Period
Analog Front-End (AFE)
3.3.1
Capacitive Sensing Basics
3.3.2
AFE Block Diagram
3.3.3
Capacitance-to-Voltage Conversion (C-to-V)
3.3.4
Shield Control
3.3.5
Offset Compensation
3.3.6
Analog-to-Digital Conversion (ADC)
3.4
Digital Processing
3.4.1
Overview
3.4.2
PROXRAW Update
3.4.3
PROXUSEFUL Update
3.4.4
PROXAVG Update
3.4.5
PROXDIFF Update
3.4.6
PROXSTAT Update
3.5
Host Operation
3.6
Operational Modes
3.6.1
Active
3.6.2
Doze
3.6.3
Sleep
3.6.4
TXEN Pin
4
9
9
10
10
12
12
12
12
13
13
13
15
15
16
18
18
19
20
20
20
20
20
SMART SAR ENGINE .................................................................................................................. 21
4.1
4.2
4.3
5
Introduction
Sensor Design
Processing
21
21
22
I2C INTERFACE ........................................................................................................................... 23
5.1
5.2
5.3
6
6
6
6
7
Introduction
I2C Write
I2C Read
23
23
23
RESET ......................................................................................................................................... 25
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
6.1
6.2
6.3
7
Power-up
NRST Pin
Software Reset
INTERRUPT ................................................................................................................................. 27
7.1
7.2
8
Power-up
Assertion and Clearing
9
VDD and SVDD
TXEN
Capacitive Sensing Interface (CS0A, CS0B, CS1A, CS1B, CSG)
Host Interface
8.4.1
NIRQ
8.4.2
SCL, NRST and TXEN
8.4.3
SDA
28
28
28
28
28
29
29
REGISTERS ................................................................................................................................. 30
9.1
9.2
Overview
Detailed Description
30
31
APPLICATION INFORMATION ...................................................................................................... 36
10.1
10.2
11
27
27
PINS DESCRIPTION ..................................................................................................................... 28
8.1
8.2
8.3
8.4
10
25
25
26
Typical Application Circuit
External Components Recommended Values
36
36
PACKAGING INFORMATION ........................................................................................................ 37
11.1
11.2
Revision 4
Outline Drawing
Land Pattern
February 5, 2014
37
38
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
1 GENERAL DESCRIPTION
1.1
Pin Diagram
Figure 1: Pin Diagram
1.2
Marking Information
Figure 2: Marking Information
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
1.3
Pin Description
Number
Name
Type
Description
1
CSG
Analog
Capacitive Sensor Guard/Shield
2
CS1B
Analog
Capacitive Sensor B (inner) of pair 1
3
CS1A
Analog
Capacitive Sensor A (outer) of pair 1
4
CS0B
Analog
Capacitive Sensor B (inner) of pair 0
5
CS0A
Analog
Capacitive Sensor A (outer) of pair 0
6
GND
Ground
Ground
7
NC
Not Used
Do Not Connect
8
NC
Not Used
Do Not Connect
9
NC
Not Used
Do Not Connect
10
NC
Not Used
Do Not Connect
11
VDD
Power
Core power supply
12
SVDD
Power
Host interface power supply.
Must be ≤VDD at all times (including during power-up and power-down)
13
NIRQ
Digital Output
14
SCL
Digital Input
I2C Clock, requires pull-up resistor to SVDD
15
SDA
Digital I/O
I2C Data, requires pull-up resistor to SVDD
16
TXEN
Digital Input
Transmit Enable, active HIGH (Tie to SVDD if not used).
17
NRST
External reset, active LOW (Tie to SVDD if not used).
18
A1
Digital Input
Input
Digital Input
19
A0
Digital Input
I2C Sub-Address, connect to GND or VDD
20
GND
Ground
Ground
DAP
GND
Ground
Exposed Pad. Connect to Ground
Interrupt request, active LOW, requires pull-up resistor to SVDD
I2C Sub-Address, connect to GND or VDD
Table 1: Pin Description
1.4
Acronyms
DAP
SAR
RF
Revision 4
Die Attach Paddle
Specific Absorption Rate
Radio Frequency
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
2 ELECTRICAL CHARACTERISTICS
2.1
Absolute Maximum Ratings
Stresses above the values listed in “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these, or any other conditions beyond the
“Operating Conditions”, is not implied. Exposure to Absolute Maximum Rating conditions for extended periods
may affect device reliability and proper functionality.
Parameter
Symbol
Min
Max
Unit
VDD
-0.5
6.0
SVDD
-0.5
6.0
Input Voltage (non-supply pins)
VIN
-0.5
VDD+0.3
Input Current (non-supply pins)
IIN
-10
10
Operating Junction Temperature
TJCT
-40
125
Reflow Temperature
TRE
-
260
Storage Temperature
TSTOR
-50
150
ESDHBM
8
-
kV
Symbol
Min
Max
Unit
VDD
2.7
5.5
SVDD
1.65
VDD
TA
-40
85
Supply Voltage
ESD HBM (Human Body model, to JESD22-A114)
V
mA
°C
Table 2: Absolute Maximum Ratings
2.2
Operating Conditions
Parameter
Supply Voltage
V
Ambient Temperature
°C
Table 3: Operating Conditions
Note: During power-up or power-down, SVDD must be less than or equal to VDD
2.3
Thermal Characteristics
Parameter
Thermal Resistance – Junction to Air (Static Airflow)
Symbol
Typical
Unit
θJA
34
°C/W
Table 4: Thermal Characteristics
Note: θJA is calculated from a package in still air, mounted to 3" x 4.5", 4-layer FR4 PCB with thermal vias under
exposed pad per JESD51 standards.
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
2.4
Electrical Specifications
All values are valid within the operating conditions unless otherwise specified.
Typical values are given for TA= +25°C, VDD=SVDD=3.3V unless otherwise specified.
Parameter
Symbol
Conditions
Min
Typ
Max
ISLEEP
Power down, all analog circuits shut
down. (I2C listening)
-
2.5
-
Doze
(all sensors enabled)
IDOZE
SCANPERIOD = 200ms
DOZEPERIOD = 2xSCANPERIOD
FREQ = 167kHz
RESOLUTION = Medium
VDD = 5V
-
18
-
Active
(all sensors enabled)
IACTIVE
SCANPERIOD = 30ms
FREQ = 167kHz
RESOLUTION = Medium
VDD = 5V
-
170
-
Output Current at Output Low
Voltage
IOL
VOL = 0.4V
6
-
-
SVDD > 2V
-
-
0.4
Maximum Output LOW Voltage
VOL(Max)
SVDD ≤ 2V
-
-
0.2 x SVDD
Unit
Current Consumption
Sleep
(no sensor enabled)
uA
Outputs: SDA, NIRQ
mA
V
Inputs: SCL, SDA, TXEN
Input logic high
VIH
0.8 x SVDD
-
SVDD + 0.3
Input logic low
VIL
-0.3
-
0.25 x SVDD
Input leakage current
IL
CMOS input
-1
-
1
SVDD > 2V
-
0.05x
SVDD
-
-
0.1x
SVDD
-
-
100
-
V
VHYS
Hysteresis
SVDD≤ 2V
Delay between TXEN rising
TXENACTDLY edge and SX9300 starting
measurements
TXEN Delay
uA
V
µs
Inputs: A0, A1
Input logic high
VIH
0.7 x VDD
-
VDD + 0.3
Input logic low
VIL
-0.3
-
0.3 x VDD
SVDD> 2V
0.7 x SVDD
-
SVDD ≤ 2V
0.75 x SVDD
-
SVDD> 2V
-
-
0.6
SVDD ≤ 2V
-
-
0.3 x SVDD
TRESETPW
2
-
-
µs
TPOR
-
1
-
ms
V
Input: NRST
Input logic high
VIH
SVDD + 0.3
V
Input logic low
VIL
NRST minimum pulse width
Start-up
Power-up time
Table 5: Electrical Specifications
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
kHz
I2C Timing Specifications (Cf. Figure 3 and Figure 4 below)
SCL clock frequency
fSCL
-
-
400
SCL low period
tLOW
1.3
-
-
SCL high period
tHIGH
0.6
-
-
Data setup time
tSU;DAT
0.1
-
-
Data hold time
tHD;DAT
0
-
-
Repeated start setup time
tSU;STA
0.6
-
-
Start condition hold time
tHD;STA
0.6
-
-
Stop condition setup time
tSU;STO
0.6
-
-
Bus free time between stop and start
tBUF
1.3
-
-
Input glitch suppression
tSP
-
-
50
us
Note 1
ns
Note 1: Minimum glitch amplitude is 0.7VDD at High level and Maximum 0.3VDD at Low level.
Table 6: I2C Timing Specifications
Figure 3: I2C Start and Stop Timing
Figure 4: I2C Data Timing
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
3 PROXIMITY SENSING INTERFACE
3.1
Introduction
The purpose of the proximity sensing interface is to detect when a conductive object (usually a body part i.e.
finger, palm, face, etc) is in the proximity of the system. Note that proximity sensing can be done thru the air or
thru a solid (typically plastic) overlay (also called “touch” sensing).
The chip’s proximity sensing interface is based on capacitive sensing technology. An overview is given in figure
below.
Finger, palm,
face, lap, etc
Sensor
Shield
CSx
CSG
Analog
Front-End
(AFE)
PROXSTAT
Digital
0
1
0
Processing
SX9300
Figure 5: Proximity Sensing Interface Overview
The sensor can be a simple copper area on a PCB or FPC for example. Its capacitance (to ground) will
vary when a conductive object is moving in its proximity.
The optional shield can be also be a simple copper area on a PCB or FPC below/under/around the
sensor. It is used to protect the sensor against potential surrounding noise sources and improve its
global performance. It also brings directivity to the sensing, for example sensing objects approaching
from top only.
The analog front-end (AFE) performs the raw sensor’s capacitance measurement and converts it into a
digital value. It also controls the shield. See §3.3 for more details.
The digital processing block computes the raw capacitance measurement from the AFE and extracts a
binary information PROXSTAT corresponding to the proximity status, i.e. object is “Far” or “Close”. It also
triggers AFE operations (compensation, etc). See §3.4 for more details.
3.2
Scan Period
To save power and since the proximity event is slow by nature, the chip will be waken-up regularly at every
programmed scan period (SCANPERIOD) to first sense sequentially each of the enabled CSx pins and then
process new proximity samples/info. The chip will be in idle mode most of the time. This is illustrated in figure
below
Figure 6: Proximity Sensing Sequencing
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
The sensing and processing phase’s durations vary with the number of sensors enabled, the sampling
frequency, and the resolution programmed. During the Idle phase, the SX9300‘s analog circuits are turned off.
Upon expiry of the idle timer, a new scan period cycle begins.
The scan period determines the minimum reaction time (actual/final reaction time also depends on debounce and
filtering settings) and can be programmed from 30ms to 400ms.
3.3
Analog Front-End (AFE)
3.3.1
Capacitive Sensing Basics
Capacitive sensing is the art of measuring a small variation of capacitance in a noisy environment. As mentioned
above, the chip’s proximity sensing interface is based on capacitive sensing technology. In order to illustrate
some of the user choices and compromises required when using this technology it is useful to understand its
basic principles.
To illustrate the principle of capacitive sensing we will use the simplest implementation where the sensor is a
copper plate on a PCB.
The figure below shows a cross-section and top view of a typical capacitive sensing implementation. The sensor
connected to the chip is a simple copper area on top layer of the PCB. It is usually surrounded (shielded) by
ground for noise immunity (shield function) but also indirectly couples via the grounds areas of the rest of the
system (PCB ground traces/planes, housing, etc). For obvious reasons (design, isolation, robustness …) the
sensor is stacked behind an overlay which is usually integrated in the housing of the complete system.
PCB copper
Overlay
PCB dielectric
Sensor
Cut view
Top view
Ground
Figure 7: Typical Capacitive Sensing Implementation
When the conductive object to be detected (finger/palm/face, etc) is not present, the sensor only sees an
inherent capacitance value CEnv created by its electrical field’s interaction with the environment, in particular
with ground areas.
When the conductive object (finger/palm/face, etc) approaches, the electrical field around the sensor will be
modified and the total capacitance seen by the sensor increased by the user capacitance CUser. This
phenomenon is illustrated in the figure below.
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
Figure 8: Proximity Effect on Electrical Field and Sensor Capacitance
The challenge of capacitive sensing is to detect this relatively small variation of CSensor (CUser usually contributes
for a few percent only) and differentiate it from environmental noise (CEnv also slowly varies together with the
environment characteristics like temperature, etc). For this purpose, the chip integrates an auto offset
compensation mechanism which dynamically monitors and removes the CEnv component to extract and process
CUser only. See §3.3.5 for more details.
In first order, CUser can be estimated by the formula below:
CUser =
ε 0 ⋅ εr ⋅ A
d
A is the common area between the two electrodes hence the common area between the user’s finger/palm/face
and the sensor.
d is the distance between the two electrodes hence the proximity distance between the user and the system.
ε 0 is the free space permittivity and is equal to 8.85 10e-12 F/m (constant)
ε r is the dielectric relative permittivity.
Typical permittivity of some common materials is given in the table below.
Material
Glass
FR4
Acrylic Glass
Wood
Air
Typical
8
5
3
2
1
εr
Table 7: Typical Permittivity of Some Common Materials
From the discussions above we can conclude that the most robust and efficient design will be the one that
minimizes CEnv value and variations while improving CUser.
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
3.3.2
AFE Block Diagram
Figure 9: Analog Front-End Block Diagram
3.3.3
Capacitance-to-Voltage Conversion (C-to-V)
The sensitivity of the interface is defined by RANGE and GAIN parameters.
PROXFREQ defines the operating frequency of the interface and should be set as high as possible for power
consumption reasons.
3.3.4
Shield Control
SHIELDEN allows enabling or disabling the shield function.
3.3.5
Offset Compensation
Offset compensation consists in performing a one-time measurement of CEnv and subtracting it to the total
capacitance CSensor in order to feed the ADC with the closest contribution of CUser only.
Figure 10: Offset Compensation Block Diagram
The ADC input CUser is the total capacitance CSensor to which CEnv is subtracted.
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
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There are five possible compensation sources which are illustrated in the figure below. When set to 1 by any of
these sources, COMPSTAT will only be reset once the compensation is completed.
Figure 11: Compensation Request Sources
Reset: a compensation for all sensors is automatically requested when a reset is performed (power-up,
NRST pin, RegReset)
COMPDONEIRQ (I2C): a compensation for all sensors can be manually requested anytime by the host
through I2C interface by writing a 1 into COMPDONEIRQ.
AVGTHRESH: a compensation for all sensors or only the affected one (depending on COMPMETHOD)
can be automatically requested if it is detected that CEnv has drifted beyond a predefined range
programmed by the host.
COMPPRD: a compensation can be automatically requested at a predefined rate programmed by the
host.
STUCK: a compensation can be automatically requested if it is detected that the proximity “Close” state
lasts longer than a predefined duration programmed by the host.
Please note that the compensation request flag can be set anytime but the compensation itself is always done at
the beginning of a scan period to keep all parameters coherent.
Also, when compensation occurs, all PROXSTAT flags turn OFF (ie no proximity detected) independently from
the user’s potential actual presence.
3.3.6
Analog-to-Digital Conversion (ADC)
An ADC is used to convert the analog capacitance information into a digital word PROXRAW.
3.4
Digital Processing
3.4.1
Overview
The main purpose of the digital processing block is to convert the raw capacitance information coming from the
AFE (PROXRAW) into a robust and reliable digital flag (PROXSTAT) indicating if something is close to the
proximity sensor.
The offset compensation performed in the AFE is a one-time measurement. However, the environment
capacitance CEnv may vary with time (temperature, nearby objects, etc). Hence, in order to get the best
estimation of CUser (PROXDIFF) it is needed to dynamically track and subtract CEnv variations. This is performed
by filtering PROXUSEFUL to extract its slow variations (PROXAVG).
PROXDIFF is then compared to user programmable threshold (PROXTHRESH) to extract PROXSTAT flag.
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
Figure 12: Digital Processing Block Diagram
Digital processing sequencing is illustrated in figure below. At every scan period wake-up, the block updates
sequentially PROXRAW, PROXUSEFUL, PROXAVG, PROXDIFF and PROXSTAT before going back to Idle
mode.
Figure 13: Digital Processing Sequencing
Digital processing block also updates COMPSTAT (set when compensation is currently pending execution or
completion)
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
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3.4.2
PROXRAW Update
PROXRAW update consists mainly in starting the AFE and waiting for the new PROXRAW values (one for each
CSx/sensor pin) to be ready. If compensation was pending it is performed first.
Figure 14: ProxRaw Update
Note that PROXRAW is not available in the “Sensor Data Readback” section of the registers. If needed it can be
observed by setting RAWFILT=00 and reading PROXUSEFUL.
3.4.3
PROXUSEFUL Update
PROXUSEFUL update consists in filtering PROXRAW upfront to remove its potential high frequencies
components(system noise, interferer, etc) and extract only user activity (few Hz max) and slow environment
changes.
Figure 15: PROXUSEFUL Update
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
3.4.4
PROXAVG Update
PROXAVG update consists in averaging PROXUSEFUL to ignore its “fast” variations (i.e. user finger/palm/hand)
and extract only the very slow variations of environment capacitance CEnv.
One can program a debounced threshold (AVGTHRESH/AVGDEB) to define a range within which PROXAVG
can vary without triggering compensation (i.e. small acceptable environment drift).
Large positive values of PROXUSEFUL are considered as normal (user finger/hand/head) but large negative
values are considered abnormal and should be compensated quickly. For this purpose, the averaging filter
coefficient can be set independently for positive and negative variations via AVGPOSFILT and AVGNEGFILT.
Typically we have AVGPOSFILT > AVGNEGFILT to filter out (abnormal) negative events faster.
To prevent PROXAVG to be “corrupted” by user activity (should only reflect environmental changes) it is frozen
when proximity is detected.
Figure 16: ProxAvg vs Proximity Event
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
Figure 17: ProxAvg Update
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
3.4.5
PROXDIFF Update
PROXDIFF update consists in the complementary operation i.e. subtracting PROXAVG to PROXUSEFUL to
ignore slow capacitances variations (CEnv) and extract only the user related variations i.e. CUser.
Figure 18: ProxDiff Update
Note that only the 12 upper bits of [PROXUSEFUL – PROXAVG] are kept for PROXDIFF.
3.4.6
PROXSTAT Update
PROXSTAT update consists in taking PROXDIFF information (CUser), comparing it with a user programmable
threshold PROXTHRESH and finally updating PROXSTAT accordingly. When PROXSTAT=1, PROXAVG is
frozen to prevent the user proximity signal averaging and hence absorbed into CEnv.
Figure 19: PROXSTAT Update
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Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
3.5
Host Operation
An interrupt can be triggered when the user is detected to be close (in range), detected to be far (out of range),
or both (CLOSEIRQEN, FARIRQEN).
User
in
User out of range
SCANPERIOD
tick
PROXSTAT
NIRQ
I2C Read RegIrqSrc
Idle
Proximity Sensing (Analog + Digital)
Figure 20: Proximity Sensing Host Operation (RegIrqMsk[6:3] = 1100)
An interrupt can also be triggered at the end of each proximity sensing operation, indicating to the host when the
proximity sensing block is running (CONVDONEIRQEN). This may be used by the host to synchronize noisy
system operations or to read sensor data (PROXUSEFUL, PROXAVG, PROXDIFF) synchronously for
monitoring purposes.
User
in
User out of range
SCANPERIOD
tick
PROXSTAT
NIRQ
I2C Read
Idle
Proximity Sensing (Analog + Digital)
Figure 21: Proximity Sensing Host Operation (RegIrqMsk[6:3] = 0001)
In both cases above, an interrupt can also be triggered at the end of compensation (COMPDONEIRQEN).
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3.6
3.6.1
Operational Modes
Active
Active mode has the shortest scan periods, typically 30ms. In this mode, all enabled sensors are scanned and
information data is processed within this interval. The Active scan period is user configurable (SCANPERIOD)
and can be extended up to 400ms.
3.6.2
Doze
In some applications, the reaction/sensing time needs to be fast when the user is present (proximity detected),
but can be slow when not detection has been done for some time.
The Doze mode, when enabled (DOZEEN), allows the chip to automatically switch between a fast scan period
(SCANPERIOD) during proximity detection and a slow scan period (DOZEPERIOD) when no proximity is being
detected (up to 6.4s). This allows reaching low average power consumption values at the expense obviously of
longer reaction times.
As soon as proximity is detected on any sensor, the chip will automatically switch to Active mode while when it
has not detected an object for DOZEPERIOD, it will automatically switch to Doze mode.
3.6.3
Sleep
Sleep mode can be entered by disabling all sensors (SENSOREN=0000). It places the SX9300 in its lowest
power mode, with sensor scanning completely disabled and idle period set to continuous. In this mode, only the
I2C serial bus is active. Enabling any sensor will make the chip leave Sleep mode (for Doze if enabled, else
Active mode)
3.6.4
TXEN Pin
The TXEN input enables proximity sensing when HIGH, likewise when the TXEN input is LOW, the SX9300 is in
Sleep mode. Specifically, on the rising edge of TXEN the SX9300 will begin measuring the sensors normally at
the programmed rate (SCANPERIOD, DOZEPERIOD) as long as TXEN remains HIGH. When TXEN goes LOW
the current measurement sequence will complete and then measurement will cease until the next rising edge of
TXEN.
This feature can be used to synchronize proximity sensing with noisy and/or RF activity for example.
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4 SMART SAR ENGINE
4.1
Introduction
In addition to the proximity sensing interface, the SX9300 also embeds the world’s first smart SAR engine which
is able to discriminate between proximity generated by low permittivity (table) and high permittivity objects (body).
This is typically useful for Specific Absorption Rate (SAR) applications in portable devices (tablets, cellphones,
etc) where international regulations (FCC, ETSI, etc) impose to reduce RF power in the presence of human body
for safety reasons.
Typical capacitive sensing solutions are not able to discriminate between proximity detection generated when a
tablet for example is sitting on a table (no need to reduce RF power) vs when it is sitting the user’s lap (need to
reduce RF power) resulting in RF power and hence user’s experience reduced significantly even when it is not
needed.
The SX9300’s unique smart SAR engine allows reducing RF power only in the presence of body (high
permittivity material) and hence offering significantly better user experience while still conforming to safety
regulations.
4.2
Sensor Design
In order to use SX9300’s smart SAR engine, the sensors design must follow a few rules which are described in
this section.
Each smart SAR sensor is physically made of two sensors (outer and inner) connected respectively to pins CSxA
and CSxB. In the drawing below, the dark areas represent copper (conductor) and the light areas represents a
non-conductor (spacing between the two copper areas).
Figure 22: Typical Smart SAR Capacitive Sensor
IMPORTANT: The “A” and “B” sensors cannot be swapped. The outer copper area is always the “A” sensor,
and the inner copper area is always the “B” sensor else the smart SAR engine will not operate properly.
For each pair, the copper areas of CSxB and CSxA pads must be designed to be equal (as equal as the
FPC/PCB technology tolerance allows).
Figure above illustrates an example of circular shape but smart SAR sensors can of course be designed in a
variety of shapes (square, rectangular) depending on the physical/mechanical constraints of the system.
One SX9300 can support up to two pairs of sensors i.e. two smart SAR sensors.
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4.3
Processing
The smart SAR engine is active for a pair of sensors when its CSxPROXSTAT is set i.e. both CSxA and CSxB’s
internal PROXSTAT values are set (i.e. both sensors of a the same pair have detected proximity).
When active, the smart SAR engine computes two real time values called delta and ratio (SARDELTA,
SARRATIO), compares them to their respective user-defined debounced thresholds (SARDELTATHRESH,
SARRATIOTHRESH, SARDEB) and updates CSxBODYSTAT accordingly (set to 1 when both delta and ratio
exceed their respective thresholds).
Note that an hysteresis derivated from HYST is automatically applied to delta and ratio thresholds as defined
below:
HYST
Delta Threshold Hysteresis
Ratio Threshold Hysteresis
00
2
2
01
4
4
10
8
6
11
16
8
Table 8: Delta/Ratio Thresholds Hysteresis
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5 I2C INTERFACE
5.1
Introduction
The I2C implemented on the SX9300 and used by the host to interact with it is compliant with:
- Standard (100kb/s) and fast mode (400kb/s)
- Slave mode
- 7-bit address (default is 0x28 assuming A1=A0=0)
The SX9300 has two I/O pins (A0 and A1) that provides four possible, user selectable I2C addresses:
A1
0
0
1
1
A0
0
1
0
1
Address
0x28
0x29
0x2A
0x2B
Table 9: I2C Sub-Address Selection
The host can use the I2C to read and write data at any time, and these changes are effective immediately.
Therefore the user should ideally disable the sensor before changing settings, or discard the results while
changing.
5.2
I2C Write
The format of the I2C write is given in Figure 12. After the start condition [S], the slave address (SA) is sent,
followed by an eighth bit (‘0’) indicating a Write. The SX9300 then Acknowledges [A] that it is being addressed,
and the Master sends an 8 bit Data Byte consisting of the SX9300 Register Address (RA). The Slave
Acknowledges [A] and the master sends the appropriate 8 bit Data Byte (WD0). Again the Slave Acknowledges
[A]. In case the master needs to write more data, a succeeding 8 bit Data Byte will follow (WD1), acknowledged
by the slave [A]. This sequence will be repeated until the master terminates the transfer with the Stop condition
[P].
Figure 23: I2C Write
The register address is incremented automatically when successive register data (WD1...WDn) is supplied by the
master.
5.3
I2C Read
The format of the I2C read is given in Figure 13. After the start condition [S], the slave address (SA) is sent,
followed by an eighth bit (‘0’) indicating a Write. The SX9300 then Acknowledges [A] that it is being addressed,
and the Master responds with an 8-bit Data consisting of the Register Address (RA). The Slave Acknowledges
[A] and the master sends the Repeated Start Condition [Sr]. Once again, the slave address (SA) is sent,
followed by an eighth bit (‘1’) indicating a Read. The SX9300 responds with an Acknowledge [A] and the read
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Data byte (RD0). If the master needs to read more data it will acknowledge [A] and the SX9300 will send the
next read byte (RD1). This sequence can be repeated until the master terminates with a NACK [N] followed by a
stop [P].
Figure 24: I2C Read
The register address is incremented automatically when successive register data (RD1...RDn) is retrieved by the
master.
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6 RESET
6.1
Power-up
During a power-up condition, the NIRQ output is HIGH until VDD has met the minimum input voltage requirements
and a TPOR time has expired upon which, NIRQ asserts to a LOW condition indicating the SX9300 is initialized.
The host must perform an I2C read of RegIrqSrc to clear this NIRQ status. The SX9300 is then ready for normal
I2C communication and is operational.
Figure 25: Power-up vs. NIRQ
6.2
NRST Pin
When the host asserts NRST LOW (for min. TRESETPW) and then HIGH, the SX9300 will reset its internal registers
and will become active after TPOR. When not used, this pin must be pulled high to SVDD.
Figure 26: Hardware Reset
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6.3
Software Reset
The host can also perform a reset anytime by writing 0xDE into RegReset. The NIRQ output will be asserted
LOW and the Host is required to perform an I2C read to clear this NIRQ status.
High
SX9300
Ready
NIRQ
Low
HOST issues a soft Reset
HOST clears
the Interrupt
Figure 27: Software Reset
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7 INTERRUPT
Except RESETIRQ, all interrupt sources are disabled by default upon power-up and resets, and thus must be
enabled by the host. Any or all of the following interrupts can be enabled by writing a “1” into the appropriate
locations within the RegIrqMsk register:
• Close (proximity detected)
• Far (proximity un-detected)
• Compensation completed
• Conversion completed
The interrupt status can be read from RegIrqSrc for each of these interrupt sources.
7.1
Power-up
During initial power-up, the NIRQ output is HIGH. Once the SX9300 internal power-up sequence has completed,
NIRQ is asserted LOW, signaling that the SX9300 is ready. The host must perform a read to RegIrqSrc to
acknowledge and the SX9300 will clear the interrupt and release the NIRQ line.
7.2
Assertion and Clearing
The NIRQ can be asserted in either the Active or Doze mode during a scan period. The NIRQ will be
automatically cleared after the host performs a read of RegIrqSrc (which content will be cleared as well).
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8 PINS DESCRIPTION
8.1
VDD and SVDD
These are the device supply voltages. VDD is the supply voltage for the internal core. SVDD is the supply
voltage for the host interface. NOTE: SVDD MUST be equal or lower than VDD at all times.
8.2
TXEN
This signal can be used in many applications if a conversion trigger/enable is needed. This input pin
synchronizes the Capacitance Sensing inputs in systems that need to (for example) transmit RF signals. When
this signal is active, SX9300 performs capacitive measurements. If this input becomes inactive during the middle
of a measurement, the SX9300 will complete all remaining measurements and will enter sleep mode until TXEN
goes active again.
8.3
Capacitive Sensing Interface (CS0A, CS0B, CS1A, CS1B, CSG)
The Capacitance Sensing input pins CS0A, CS0B, CS1A and CS1B are connected directly to the Capacitance
Sensing Interface circuitry which converts the sensed capacitance into digital values. The Capacitive Sensor
Guard (CSG) output provides a guard reference to minimize the parasitic sensor pin capacitances to ground.
Capacitance sensor pins which are not used must not be connected. Additionally, CSx pins must be connected
directly to the capacitive sensors using a minimum length circuit trace to minimize external “noise” pick-up.
The capacitance sensor and capacitive sensor guard pins are protected from ESD events to VDD and GROUND.
8.4
Host Interface
The Host Interface consists of: NIRQ, NRST, SCL, SDA, and TXEN. These signals are discussed below.
8.4.1
NIRQ
The NIRQ pin is an open drain output that requires an external pull-up resistor (1...10 kOhm). The NIRQ pin is
protected from ESD events to VDD and GROUND.
SVDD
VDD
R_INT
NIRQ
NIRQ to Host
INT
SX9300
Figure 28: NIRQ Output Simplified Diagram
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8.4.2
SCL, NRST and TXEN
The SCL, NRST and TXEN pins are high impedance input pins that require an external pull-up resistor (1..10
kOhm). NRST and TXEN can be connected without the requirement for a pull-up resistor if driven from a pushpull host output. These pins are protected from ESD events to VDD and GROUND.
SVDD
VDD
R
SCL_IN/TXEN_IN/NRST_IN
From Host
SCL/TXEN/NRST
Figure 29: SCL/TXEN/NRST
8.4.3
SDA
SDA is an I/O pin that requires an external pull-up resistor (1…10 kOhm). The SDA I/O pin is protected to VDD
and GROUND.
SVDD
VDD
R_SDA
SDA
SDA_IN
To/From Host
SDA_OUT
Figure 30: SDA Simplified Diagram
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9 REGISTERS
9.1
Overview
The SX9300 allows the user full parameter customization for sensor sensitivity, hysteresis, detection thresholds,
etc. Custom parameters are controlled thru the volatile registers below and must be uploaded by the host thru
I2C after power-up or after a reset.
Address
0x00
0x01
0x03
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x7F
Name
RegIrqSrc
RegStat
RegIrqMsk
RegProxCtrl0
RegProxCtrl1
RegProxCtrl2
RegProxCtrl3
RegProxCtrl4
RegProxCtrl5
RegProxCtrl6
RegProxCtrl7
RegProxCtrl8
RegSarCtrl0
RegSarCtrl1
RegSensorSel
RegUseMsb
RegUseLsb
RegAvgMsb
RegAvgLsb
RegDiffMsb
RegDiffLsb
RegOffsetMsb
RegOffsetLsb
RegSarDelta
RegSarRatio
RegReset
Default
0x80
0x0F
0x00
0x0F
0x40
0x08
0x40
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
Description
Interrupt & Status
Proximity Sensing Control
Smart SAR Engine Control
Sensor Data Readback
Software Reset
Table 10: Registers Overview
NOTES:
1) Addresses not listed above are reserved and should not be written.
2) Reserved bits should be left to their default value unless otherwise specified.
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9.2
Detailed Description
Addr.
Name
0x00
RegIrqSrc
0x01
0x03
RegStat
RegIrqMsk
R/W
7
Variable
Default
Interrupt & Status
RESETIRQ
1
6
CLOSEIRQ
0
5
FARIRQ
0
R/W
4
COMPDONEIRQ
0
R
3
CONVDONEIRQ
0
R
2:1
0
7
Reserved
TXENSTAT
CS1PROXSTAT
00
0
0
6
CS1BODYSTAT
0
5
CS0PROXSTAT
0
4
CS0BODYSTAT
0
3:0
COMPSTAT
7
6
5
4
3
2:0
Reserved
0
CLOSEIRQEN
0
FARIRQEN
0
COMPDONEIRQEN
0
CONVDONEIRQEN
0
Reserved
000
Proximity Sensing Control
Reserved
0
SCANPERIOD
000
R
R
R/W
R
0x06
RegProxCtrl0
R/W
Bits
7
6:4
3:0
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1111
SENSOREN
1111
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Function
Reset interrupt source status. (i.e.
reset occurred)
Close interrupt source status. (i.e.
CSxPROXSTAT rising edge)
Far interrupt source status. (i.e.
CSxPROXSTAT falling edge)
Compensation interrupt source
status. (i.e. compensation occurred)
When set to 1, triggers compensation
Conversion interrupt source status.
(i.e. new set of sensor data available)
Indicates current TXEN pin status.
Indicates if proximity is being
detected for the pair CS1A/CS1B
(i.e. both A and B sensor’s
PROXDIFF values are above
detection threshold)
When CS1PROXSTAT=1, indicates if
the object detected is a human body.
(i.e. delta and ratio values of this pair
are above their respective threshold)
Indicates if proximity is being
detected for the pair CS0A/CS0B.
(i.e. both A and B sensor’s
PROXDIFF values are above
detection threshold)
When CS0PROXSTAT=1, indicates if
the object detected is a human body.
(i.e. delta and ratio values of this pair
are above their respective threshold)
Indicates which capacitive sensor(s)
has a compensation pending.
[3:0] = [CS1B, CS1A, CS0B, CS0A]
Enables the close interrupt.
Enables the far interrupt.
Enables the compensation interrupt.
Enables the conversion interrupt.
Defines the Active scan period :
000: 30 ms (Typ.)
001: 60 ms
010: 90 ms
011: 120 ms
100: 150 ms
101: 200 ms
110: 300 ms
111: 400 ms
Low values will allow fast reaction
time while high values will provide
low power consumption.
Enables sensor pins.
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[3:0] = [CS1B, CS1A, CS0B, CS0A]
0x07
RegProxCtrl1
R/W
7:6
SHIELDEN
R/W
R/W
5:2
1:0
Reserved
RANGE
01
0000
00
Sensors must always be enabled and
disabled by pair (CS0A/B; CS1A/B).
Enables shield function on CSG pin:
00: Off, high impedance.
01: On (Typ.)
1x: Reserved
Defines the input capacitance range:
00: Large
(typ. +/-7.3pF FS)
01: Medium Large (typ. +/-3.7pF FS)
10: Medium Small (typ. +/-3pF FS)
11: Small
(typ. +/-2.5pF FS)
This parameter can be seen as an
analog gain (small range = high gain)
Full scale (FS) values assume no
digital gain.
0x08
0x09
0x0A
RegProxCtrl2
RegProxCtrl3
RegProxCtrl4
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R/W
R/W
R/W
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7
6:5
Reserved
GAIN
0
00
4:3
FREQ
01
2:0
RESOLUTION
000
7
6
5:4
Reserved
DOZEEN
DOZEPERIOD
0
1
00
3:2
1:0
Reserved
RAWFILT
00
00
7:0
AVGTHRESH
0x00
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Defines the digital gain factor:
00: Off (x1)
01: x2
10: x4
11: x8 (Typ.)
This is a pure digital gain (value shift)
applied at the ADC output.
Defines the sampling frequency:
00: 83 kHz
01: 125 kHz
10: 167 kHz (Typ.)
11: Reserved
Defines the capacitance
measurement resolution/precision:
000: Coarsest
….
100: Medium
….
111: Finest (Typ.)
Enables Doze mode.
When DOZEN=1, defines the Doze
scan period:
00: 2x SCANPERIOD
01: 4x SCANPERIOD
10: 8x SCANPERIOD
11: 16x SCANPERIOD
Defines PROXRAW filter strength :
00: Off - No filtering
01: Low (Typ.)
10: Medium
11: High - Max filtering
Defines the positive and negative
average thresholds which will trigger
compensation:
Thresholds = +/- 128x AVGTHRESH
Typically set between +/-16384 and
+/-24576 (i.e. ½ to ¾ of the system
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0x0B
0x0C
0x0D
RegProxCtrl5
RegProxCtrl6
RegProxCtrl7
Revision 4
R/W
R/W
R/W
February 5, 2014
7:6
AVGDEB
00
5:3
AVGNEGFILT
000
2:0
AVGPOSFILT
000
7:5
4:0
Reserved
PROXTHRESH
7
AVGCOMPDIS
000
00000
0
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dynamic range).
Should not be set below 0x40.
Defines the average debouncer
applied to AVGTHRESH:
00: Off
01: 2 samples
10: 4 samples
11: 8 samples
Defines the average negative filter
strength:
000: Off - No filtering
001: Lowest (Typ.)
….
111: Highest - Max filtering
Defines the average positive filter
strength:
000: Off - No filtering
001: Lowest
….
111: Highest - Max filtering (Typ.)
Defines the proximity detection
threshold (for all sensors).
00000: 0
00001: 20
00010: 40
00011: 60
00100: 80
00101: 100
00110: 120
00111: 140
01000: 160
01001: 180
01010: 200
01011: 220
01100: 240
01101: 260
01110: 280
01111: 300
10000: 350
10001: 400
10010: 450
10011: 500
10100: 600
10101: 700
10110: 800
10111: 900
11000: 1000
11001: 1100
11010: 1200
11011: 1300
11100: 1400
11101: 1500
11110: 1600
11111: 1700
Low
values
allow
good
sensitivity/distance
while
higher
values allow better noise immunity.
Disables the automatic compensation
triggered by AVGTHRESH.
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0x0E
0x0F
RegProxCtrl8
RegSarCtrl0
R/W
R/W
6
COMPMETHOD
0
5:4
HYST
00
3:2
CLOSEDEB
00
1:0
FARDEB
00
7:4
STUCK
0000
3:0
COMPPRD
0000
7:6
5:4
Smart SAR Engine Control
Reserved
00
SARDEB
00
3:0
SARDELTATHRESH
0000
Defines the compensation method:
0: Compensate each CSx pin
independently (Typ.)
1: Compensate all CSx pins together.
Defines the proximity detection
hysteresis applied to PROXTHRESH:
00: 32
01: 64
10: 128
11: 256
Defines the Close debouncer applied
to PROXTHRESH:
00: Off
01: 2 samples
10: 4 samples
11: 8 samples
Defines the Far debouncer applied to
PROXTHRESH:
00: Off
01: 2 samples
10: 4 samples
11: 8 samples
Defines the proximity “stuck” timeout:
0000 : Off (Typ.)
00XX: STUCK x 64 samples
01XX: STUCK x 128 samples
1XXX: STUCK x 256 samples
Defines the periodic compensation
interval:
0000: Off (Typ.)
Else: COMPPRD x 128 samples
Defines the SAR engine debouncer
applied to human body reporting
(CSxBODYSTAT):
00: Off
01: 2 samples
10: 4 samples
11: 8 samples
Defines the SAR delta threshold (for
both sensor pairs):
0000: Off
0001: 1
0010: 3
0011: 5
0100: 10
0101: 15
0110: 20
0111: 25
1000: 30
1001: 35
1010: 40
1011: 45
1100: 50
1101: 55
1110: 60
1111: 70
A hysteresis derivated from HYST is
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automatically applied, Cf. §4.
0x10
RegSarCtrl1
R/W
7:0
SARRATIOTHRESH
0x00
Off when set to 0000, i.e. delta value
not used for body detection.
At least one of Delta or Ratio
Threshold must be enabled.
Defines the SAR ratio threshold (for
both sensor pairs)
A hysteresis derivated from HYST is
automatically applied, Cf. §4.
Off when set to 0x00, i.e. ratio value
not used for body detection.
At least one of Delta or Ratio
Threshold must be enabled.
0x20
RegSensorSel
Sensor Data Readback
Reserved
000000
SENSORSEL
00
R
RW
7:2
1:0
R
R
R
R
R
R
R/W
R/W
7:0
7:0
7:0
7:0
7:0
7:0
7:0
7:0
PROXUSEFUL
Reserved
SARDELTA
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
RegUseMsb
RegUseLsb
RegAvgMsb
RegAvgLsb
RegDiffMsb
RegDiffLsb
RegOffsetMsb
RegOffsetLsb
0x29
RegSarDelta
R
7
6:0
0x2A
RegSarRatio
R
7:0
0x7F
RegReset
W
7:0
PROXAVG
PROXDIFF
PROXOFFSET
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
Defines which sensor’s data will be
available in registers RegUseMsb to
RegSarRatio (addr. 0x21 to 0x2A):
00: CS0A
01: CS0B
10: CS1A
11: CS1B
Useful current value.
Signed, 2's complement format.
Average current value.
Signed, 2's complement format.
Diff current value.
Signed, 2's complement format.
Compensation offset current value.
Unsigned.
To force a value, MSB and LSB
registers must be written in sequence
and change is effective after LSB.
0
0000000 SAR Delta current value of the pair.
Signed, 2's complement format
SARRATIO
0x00
SAR Ratio current value of the pair.
Unsigned.
Software Reset
SOFTRESET
0x00
Writing 0xDE resets the chip.
Table 11: Registers Detailed Description
Revision 4
February 5, 2014
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
10 APPLICATION INFORMATION
10.1 Typical Application Circuit
Figure 31: Typical Application Circuit
10.2 External Components Recommended Values
Symbol
CVDD
CSVDD
RPULL
Description
Core supply decoupling capacitor
Host interface supply decoupling capacitor
Host interface pull-ups
Note
+/- 50%
Min
-
Typ.
100
100
10
Max
-
Unit
nF
nF
kΩ
Table 12: External Components Recommended Values
Revision 4
February 5, 2014
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
11 PACKAGING INFORMATION
11.1 Outline Drawing
Figure 32: Outline Drawing
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February 5, 2014
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
11.2 Land Pattern
Figure 33: Land Pattern
Revision 4
February 5, 2014
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SX9300
Ultra Low Power, Dual Channel
Smart Proximity SAR Compliant Solution
WIRELESS & SENSING
© Semtech 2014
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