SOT834-1_fr

PC board footprint
NXP Semiconductors
Footprint for reflow soldering of HSOP16F package
SOT834-1
sr +0.075 mm
around copper
1.45
(4 ×)
0.60
(10 ×)
11.78
8.86 6.82 4.78 2.74 1.20
(2 ×)
0.45
5.90 7.62 16.40
sp −0.025 mm
around copper
11.50
solder lands
12.00
17.10
solder resist
solder paste
hole in printed-circuit board
Dimensions in mm
sot834-1_fr
SOT834-1_fr
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© NXP B.V. 2008 . All rights reserved.
28 October 2008
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