PC board footprint NXP Semiconductors Footprint for reflow soldering of HSOP16F package SOT834-1 sr +0.075 mm around copper 1.45 (4 ×) 0.60 (10 ×) 11.78 8.86 6.82 4.78 2.74 1.20 (2 ×) 0.45 5.90 7.62 16.40 sp −0.025 mm around copper 11.50 solder lands 12.00 17.10 solder resist solder paste hole in printed-circuit board Dimensions in mm sot834-1_fr SOT834-1_fr PDF © NXP B.V. 2008 . All rights reserved. 28 October 2008 1 of 1