Data Sheet - Fairchild Semiconductor

74LCX574
Low Voltage Octal D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
Features
General Description
■ 5V tolerant inputs and outputs
The LCX574 is a high-speed, low power octal flip-flop
with a buffered common Clock (CP) and a buffered
common Output Enable (OE). The information presented
to the D inputs is stored in the flip-flops on the LOW-toHIGH Clock (CP) transition.
■ 2.3V–3.6V VCC specifications provided
■ 7.5ns tPD max. (VCC = 3.3V), 10µA ICC max.
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal(1)
■ ±24mA output drive (VCC = 3.0V)
■ Implements proprietary noise/EMI reduction circuitry
■ Latch-up performance exceeds JEDEC 78 conditions
■ ESD performance
– Human body model > 2000V
– Machine model > 200V
Note:
1. To ensure the high impedance state during power up
or down, OE should be tied to VCC through a pull-up
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
The LCX574 is functionally identical to the LCX374
except for the pinouts.
The LCX574 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX574 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintaining CMOS low power dissipation.
Ordering Information
Order
Number
Package
Number
Package Description
74LCX574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX574BQX(2)
MLP20B
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX574MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
December 2013
Pin Assignments for
SOIC, SOP, SSOP, TSSOP
OE
D0
D1
D2
D3
D4
D5
D6
D7
GND
1
20
2
19
3
18
4
17
5
16
6
7
15
14
8
13
9
12
10
11
D0 D1 D2 D3 D4 D5 D6 D7
CP
VCC
O0
O1
O2
O3
O4
O5
O6
O7
CP
OE
O0 O1 O2 O3 O4 O5 O6 O7
Truth Table
Inputs
OE CP D
Pad Assignments for DQFN
OE VCC
1
Internal Outputs
20
Q
On
Function
H
H
L
NC
Z
Hold
H
H
H
NC
Z
Hold
H
L
H
Z
Load
H
H
L
Z
Load
L
L
H
L
Data Available
D0 2
19 O0
D1 3
18 O1
H
L
H
D2 4
17 O2
L
H
L
NC
NC
No Change in Data
D3 5
16 O3
L
H
H
NC
NC
No Change in Data
D4 6
15 O4
D5 7
14 O5
D6 8
13 O6
D7 9
12 O7
10
L
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
= LOW-to-HIGH Transition
NC = No Change
11
GND CP
Functional Description
(Bottom View)
(Top View)
The LCX574 consists of eight edge-triggered flip-flops
with individual D-type inputs and 3-STATE true outputs.
The buffered clock and buffered Output Enable are common to all flip-flops. The eight flip-flops will store the
state of their individual D inputs that meet the setup and
hold time requirements on the LOW-to-HIGH Clock (CP)
transition. With the Output Enable (OE) LOW, the contents of the eight flip-flops are available at the outputs.
When OE is HIGH, the outputs go to the high impedance
state. Operation of the OE input does not affect the loading of the flip-flops.
Pin Descriptions
Pin Names
D0–D7
Data Available
Description
Data Inputs
CP
Clock Pulse Input
OE
3-STATE Output Enable Input
O0–O7
3-STATE Outputs
DAP
No Connect
Note: DAP (Die Attach Pad)
Logic Diagram
D0
D1
D2
D3
D4
D5
D6
D7
CP
C
Q
D
C
Q
D
C
Q
D
C
Q
D
C
Q
D
C
Q
D
C
Q
D
C
Q
D
OE
O0
O1
O2
O3
O4
O5
O6
O7
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate
propagation delays.
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
2
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Logic Symbol
Connection Diagrams
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Value
Units
Supply Voltage
–0.5 to +7.0
V
VI
DC Input Voltage
–0.5 to +7.0
V
VO
DC Output Voltage
–0.5 to +7.0
V
VCC
Parameter
Conditions
Output in 3-STATE
Output in HIGH or LOW
State(3)
–0.5 to VCC + 0.5
IIK
DC Input Diode Current
VI < GND
–50
mA
IOK
DC Output Diode Current
VO < GND
–50
mA
VO > VCC
+50
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature
–65 to +150
°C
Recommended Operating Conditions(4)
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
IOH / IOL
Output Current
Conditions
Min.
Max.
Units
Operating
2.0
3.6
V
Data Retention
1.5
3.6
0
5.5
V
HIGH or LOW State
0
VCC
V
3-STATE
0
5.5
VCC = 3.0V–3.6V
±24
VCC = 2.7V–3.0V
±12
VCC = 2.3V–2.7V
TA
∆t / ∆V
Free-Air Operating Temperature
Input Edge Rate
VIN = 0.8V–2.0V, VCC = 3.0V
mA
±8
–40
85
°C
0
10
ns /V
Notes:
3. IO Absolute Maximum Rating must be observed.
4. Unused inputs must be held HIGH or LOW. They may not float.
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
3
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Absolute Maximum Ratings
TA = –40°C to +85°C
Symbol
VIH
VIL
VOH
VOL
Parameter
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
VCC (V)
Conditions
Min.
2.3–2.7
1.7
2.7–3.6
2.0
Max.
V
2.3–2.7
0.7
2.7–3.6
0.8
2.3–3.6
IOH = –100µA
V
VCC – 0.2
2.3
IOH = –8mA
1.8
2.7
IOH = –12mA
2.2
3.0
IOH = –18mA
2.4
IOH = –24mA
2.2
V
IOL = 100µA
0.2
2.3
IOL = 8mA
0.6
2.7
IOL = 12mA
0.4
3.0
IOL = 16mA
0.4
IOL = 24mA
0.55
2.3–3.6
Units
V
Input Leakage Current
2.3–3.6
0 ≤ VI ≤ 5.5V
±5.0
µA
IOZ
3-STATE Output Leakage
2.3–3.6
0 ≤ VO ≤ 5.5V,
VI = VIH or VIL
±5.0
µA
IOFF
Power-Off Leakage Current
0
VI or VO = 5.5V
10
µA
ICC
Quiescent Supply Current
µA
II
∆ICC
Increase in ICC per Input
2.3–3.6
VI = VCC or GND
10
2.3–3.6
3.6V ≤ VI, VO ≤ 5.5V(5)
±10
2.3–3.6
VIH = VCC –0.6V
500
µA
AC Electrical Characteristics
TA = –40°C to +85°C, RL = 500Ω
VCC = 3.3V ± 0.3V,
CL = 50pF
Symbol
Parameter
Min.
fMAX
VCC = 2.7V,
CL = 50pF
VCC = 2.5 ± 0.2V,
CL = 30pF
Max.
Min.
Max.
Min.
Max.
Units
Maximum Clock Frequency
150
tPHL, tPLH
Propagation Delay,
CP to On
1.5
8.5
1.5
9.5
1.5
10.5
ns
tPZL, tPZH
Output Enable Time
1.5
8.5
1.5
9.5
1.5
10.5
ns
tPLZ, tPHZ
Output Disable Time
1.5
6.5
1.5
7.0
1.5
7.8
tS
Setup Time
2.5
2.5
4.0
ns
tH
Hold Time
1.5
1.5
2.0
ns
tW
Pulse Width
3.3
3.3
4.0
ns
tOSHL, tOSLH Output to Output
Skew(6)
MHz
1.0
ns
ns
Notes:
5. Outputs disabled or 3-STATE only.
6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two
separate outputs of the same device. The specification applies to any outputs switching in the same direction,
either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
4
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
DC Electrical Characteristics
TA = 25°C
Symbol
Parameter
VCC (V)
VOLP
Quiet Output Dynamic Peak VOL
3.3
VOLV
Quiet Output Dynamic Valley VOL
Conditions
Typical
Units
CL = 50pF, VIH = 3.3V, VIL = 0V
0.8
V
2.5
CL = 30pF, VIH = 2.5V, VIL = 0V
0.6
3.3
CL = 50pF, VIH = 3.3V, VIL = 0V
–0.8
2.5
CL = 30pF, VIH = 2.5V, VIL = 0V
–0.6
V
Capacitance
Symbol
Parameter
Conditions
Typical
Units
Input Capacitance
VCC = Open, VI = 0V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3V, VI = 0V or VCC
8
pF
CPD
Power Dissipation Capacitance
VCC = 3.3V, VI = 0V or VCC, f = 10MHz
25
pF
CIN
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
5
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Dynamic Switching Characteristics
VCC
OPEN
500Ω
TEST
SIGNAL
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ
GND
DUT
VI
CL
500Ω
Figure 1. AC Test Circuit (CL includes probe and jig capacitance)
DATA
IN
Test
Switch
tPLH, tPHL
Open
tPZL, tPLZ
6V at VCC = 3.3 ± 0.3V
VCC x 2 at VCC = 2.5 ± 0.2V
tPZH, tPHZ
GND
VCC
Vmi
tpxx
OUTPUT
CONTROL
GND
DATA
OUT
DATA
OUT
Vmo
tW
DATA
IN
VCC
Vmi
tS
tPLH
Vmo
OUTPUT
CONTROL
Vmi
tPZL
tPLZ
Vmo
VCC
GND
VCC
GND
trec
MR
OR
CLEAR
Vmo
Vmi
Setup Time, Hold Time and
Recovery Time for Logic
Propagation Delay, Pulse Width and
trec Waveforms
DATA
OUT
Vmi
tS
tPHL
tH
CONTROL
INPUT
Vmi
OUTPUT
Vmi
GND
trec
CLOCK
VOH
VY
Vmo
3-STATE Output High Enable and
Disable Times for Logic
Waveform for Inverting and
Non-Inverting Functions
CONTROL
IN
GND
tPHZ
tPZH
tpxx
VCC
Vmi
tr
VCC
tf
GND
ANY
OUTPUT
VX
VOL
3-STATE Output Low Enable and
Disable Times for Logic
90%
90%
10%
10%
VOH
VOL
trise and tfall
Figure 2. Waveforms (Input Characteristics; f =1MHz, tr = tf = 3ns)
VCC
Symbol
3.3V ± 0.3V
2.7V
2.5V ± 0.2V
Vmi
1.5V
1.5V
VCC / 2
Vmo
1.5V
1.5V
VCC / 2
Vx
VOL + 0.3V
VOL + 0.3V
VOL + 0.15V
Vy
VOH – 0.3V
VOH – 0.3V
VOH – 0.15V
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
6
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
AC Loading and Waveforms (Generic for LCX Family)
Input Stage
P2
P1
VCC
Data
ESD
P5
D2 N+/P–
X1
VDD
N1
N2
GTO™
Output
Input Stage
D6
N+/P–
P4
P3
N5
Enable
N4
ESD
D4 N+/P–
N3
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
7
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Schematic Diagram (Generic for LCX Family)
Tape Format for DQFN
Package
Designator
Tape
Section
Number
Cavities
Cavity
Status
Cover Tape
Status
BQX
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
3000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
Tape Dimensions inches (millimeters)
Reel Dimensions inches (millimeters)
Tape Size
A
12mm
13.0 (330.0)
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
B
C
D
N
W1
0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) 0.488 (12.4)
W2
0.724 (18.4)
www.fairchildsemi.com
8
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Tape and Reel Specification
13.00
12.60
A
11.43
20
11
B
9.50
10.65 7.60
10.00 7.40
2.25
1
10
0.51
0.35
PIN ONE
INDICATOR
0.25
M
0.65
1.27
1.27
C B A
LAND PATTERN RECOMMENDATION
2.65 MAX
SEE DETAIL A
0.33
0.20
C
0.75
0.25
X 45°
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
(R0.10)
GAGE PLANE
(R0.10)
0.10 C
0.30
0.10
0.25
8°
0°
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) CONFORMS TO ASME Y14.5M-1994
1.27
0.40
SEATING PLANE
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
(1.40)
DETAIL A
F) DRAWING FILENAME: MKT-M20BREV3
SCALE: 2:1
Figure 3. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
9
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Physical Dimensions
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Physical Dimensions (Continued)
Figure 4. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
10
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Physical Dimensions (Continued)
Figure 5. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
11
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Physical Dimensions (Continued)
Figure 6. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
12
74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
Physical Dimensions (Continued)
Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.1
www.fairchildsemi.com
13
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower¥
AX-CAP®*
BitSiC¥
Build it Now¥
CorePLUS¥
CorePOWER¥
CROSSVOLT¥
CTL¥
Current Transfer Logic¥
DEUXPEED®
Dual Cool™
EcoSPARK®
EfficientMax¥
ESBC¥
F-PFS¥
FRFET®
SM
Global Power Resource
GreenBridge¥
Green FPS¥
Green FPS¥ e-Series¥
Gmax¥
GTO¥
IntelliMAX¥
ISOPLANAR¥
Making Small Speakers Sound Louder
and Better™
MegaBuck¥
MICROCOUPLER¥
MicroFET¥
MicroPak¥
MicroPak2¥
MillerDrive¥
MotionMax¥
mWSaver®
OptoHiT¥
OPTOLOGIC®
OPTOPLANAR®
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series¥
FACT®
FAST®
FastvCore¥
FETBench¥
FPS¥
Sync-Lock™
®
PowerTrench®
PowerXS™
Programmable Active Droop¥
QFET®
QS¥
Quiet Series¥
RapidConfigure¥
¥
Saving our world, 1mW/W/kW at a time™
SignalWise¥
SmartMax¥
SMART START¥
Solutions for Your Success¥
SPM®
STEALTH¥
SuperFET®
SuperSOT¥-3
SuperSOT¥-6
SuperSOT¥-8
SupreMOS®
SyncFET¥
®*
TinyBoost®
TinyBuck®
TinyCalc¥
TinyLogic®
TINYOPTO¥
TinyPower¥
TinyPWM¥
TinyWire¥
TranSiC¥
TriFault Detect¥
TRUECURRENT®*
PSerDes¥
UHC®
Ultra FRFET¥
UniFET¥
VCX¥
VisualMax¥
VoltagePlus¥
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
intended for surgical implant into the body or (b) support or sustain
life, and (c) whose failure to perform when properly used in
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I66
© Fairchild Semiconductor Corporation
www.fairchildsemi.com