ES1AL thru ES1JL Taiwan Semiconductor CREAT BY ART Surface Mount Super Fast Rectifiers FEATURES - Glass passivated junction chip - Ideal for automated placement - Low profile package - Low power loss, high efficiency - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: Sub SMA Sub SMA Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - green compound (halogen-free) Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL Marking code ES ES ES ES ES ES ES ES 1AL 1BL 1CL 1DL 1FL 1GL 1HL 1JL EAL EBL ECL EDL EFL EGL EHL EJL UNIT Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 500 600 V Maximum RMS voltage VRMS 35 70 105 140 210 280 350 420 V Maximum DC blocking voltage VDC 50 100 150 200 300 400 500 600 V Maximum average forward rectified current IF(AV) 1 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 A Maximum instantaneous forward voltage (Note 1) @1A VF Maximum reverse current @ rated VR TJ=25 ℃ TJ=125 ℃ IR Typical junction capacitance (Note 2) Cj Maximum reverse recovery time (Note 3) Trr 35 Typical thermal resistance RθJL RθJA 35 85 TJ - 55 to +150 O C - 55 to +150 O C Operating junction temperature range Storage temperature range TSTG 0.95 1.3 1.7 V 5 μA 100 10 8 pF ns O C/W Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Measured at 1 MHz and Applied VR=4.0 Volts. Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Document Number: DS_D1405035 Version: I14 ES1AL thru ES1JL Taiwan Semiconductor ORDERING INFORMATION PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND PACKAGE PACKING Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA 1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) RH Sub SMA 10,000 / 13" Paper reel (12mm tape) MH Sub SMA 10,000 / 13" Plastic reel (12mm tape) QUALIFIED ES1xL (Note 1) CODE RU RV RT MT RQ MQ R3 RF R2 M2 Prefix "H" Suffix "G" Note 1: "x" defines voltage from 50V (ES1AL) to 600V (ES1JL) EXAMPLE PREFERRED P/N PART NO. ES1JL RU ES1JL ES1JL RUG ES1JL ES1JLHRU AEC-Q101 QUALIFIED PACKING CODE GREEN COMPOUND DESCRIPTION CODE RU RU H ES1JL G Green compound RU AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) FIG. 2 TYPICAL FORWARD CHARACTERISTICS 1.2 1 0.8 0.6 0.4 RESISTIVE OR INDUCTIVE LOAD 0.2 0 80 90 100 110 120 130 140 150 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) FIG.1 FORWARD CURRENT DERATING CURVE 100 Pulse Width=300μs 1% Duty Cycle ES1HL-ES1JL 10 ES1FL-ES1GL ES1AL-ES1DL 1 0.1 0.4 LEAD TEMPERATURE (oC) 0.6 0.8 1 1.2 1.4 1.6 1.8 FORWARD VOLTAGE (V) 30 25 8.3ms Single Half Sine Wave 20 15 10 5 0 1 10 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1405035 100 FIG. 4 TYPICAL REVERSE CHARACTERISTICS 1000 INSTANTANEOUS REVERSE CURRENT (μA) PEAK FORWARD SURGE CURRENT (A) FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT TJ=125℃ 100 10 TJ=75℃ 1 TJ=25℃ 0.1 0.01 0 20 40 60 80 100 120 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 140 Version: I14 ES1AL thru ES1JL Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE 14 CAPACITANCE (pF) 12 ES1AL-ES1DL 10 8 6 ES1FL-ES1JL 4 f=1.0MHz Vsig=50mVp-p 2 0 1 10 100 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Unit (mm) DIM. Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 MARKING DIAGRAM P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1405035 Version: I14 ES1AL thru ES1JL Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1405035 Version: I14