Ambient Light Sensor ICs Digital 16bit Serial Output Type Ambient Light Sensor IC BH1710FVC No.10046EBT07 ●Descriptions BH1710FVC is an digital Ambient Light Sensor IC for I2C bus interface. This IC is the most suitable to obtain the ambient light data for adjusting LCD and Keypad backlight power of Mobile phone. It is possible to detect wide range at High resolution. (1 - 65535 lx). ●Features 2 1) I C bus Interface (f / s Mode Support) 2) Spectral responsibility is approximately human eye response 3) Illuminance to Digital Converter 4) Wide range and High resolution. (1 – 65535 lx) 5) Low Current by power down function 6) 50Hz / 60Hz Light noise reject-function 7) 1.8V Logic input interface 8) No need any external parts 9) Light source dependency is little. (ex. Incandescent Lamp. Fluorescent Lamp. Halogen Lamp. White LED. Sun Light) 2 10) It is possible to select 2 type of I C slave-address. 11) Adjustable measurement result for influence of optical window (It is possible to detect min. 0.24 lx, max. 100000 lx by using this function.) ●Applications Mobile phone, LCD TV, NOTE PC, Portable game machine, Digital camera, Digital video camera, Car navigation, PDA, LCD display ●Absolute Maximum Ratings Parameter Symbol Ratings Units Supply Voltage Vmax 4.5 V Operating Temperature Topr -30~85 ℃ Storage Temperature Tstg -40~100 ℃ SDA Sink Current Imax 7 mA Power Dissipation Pd 260※ mW ※ 70mm × 70mm × 1.6mm glass epoxy board. Derating in done at 3.47mW/℃ for operating above Ta=25℃. ●Operating Conditions Parameter Symbol Ratings Min. Typ. Max. Units VCC Voltage VCC 2.4 3.0 3.6 V I2C Reference Voltage VDVI 1.65 - VCC V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/16 2010.06 - Rev.B Technical Note BH1710FVC ●Electrical Characteristics(VCC = 3.0V, DVI = 3.0V, Ta = 25℃, unless otherwise noted) Limits Parameter Symbol Min. Typ. Max. Units Conditions Supply Current Icc1 - 120 190 µA Ev = 100 lx ※1 Powerdown Current Icc2 - 0.01 0.2 µA No input Light Peak Wave Length λp - 560 - nm Measurement Accuracy S/A 0.75 1.2 1.65 times Sensor out / Actual lx EV = 1000 lx ※1, ※2 Dark (0 lx) Sensor out S0 0 0 2 count H-Resolution Mode ※3 H-Resolution Mode Resolution rHR - 1 - lx M-Resolution Mode Resolution rMR - 4 - lx L-Resosution Mode Resolution rLR - 32 - lx H-Resolution Mode Measurement Time tHR - 120 180 ms M-Resolution Mode Measurement Time tMR - 16 24 ms L-Resolution Mode Measurementt time tLR - 2.9 4.5 ms Incandescent / Fluorescent Sensor out ratio rIF - 1 - times ADDR Input ‘H’ Voltage VAH 0.7×VCC - - V ADDR Input ‘L’ Voltage VAL - - 0.3×VCC V DVI Input ‘L’ Voltage VDVL - - 0.4 V SCL, SDA Input ‘H’ Voltage 1 VIH1 0.7×DVI - - V DVI ≧1.8V SCL, SDA Input ‘H’ Voltage 2 VIH2 1.26 - - V 1.65V≦DVI<1.8V SCL, SDA Input ‘L’ Voltage 1 VIL1 - - 0.3×DVI V DVI ≧1.8V SCL, SDA Input ‘L’ Voltage 2 VIL2 - - DVI-1.26 V 1.65V≦DVI<1.8V SCL, SDA, ADDR Input ‘H’ Current IIH - - 10 µA SCL, SDA, ADDR Input ‘L’ Current IIL - - 10 µA VOL 0 - 0.4 V fSCL - - 400 kHz tHDSTA 0.6 - - µs I2C ‘L’ Period of the SCL Clock tLOW 1.3 - - µs I2C ‘H’ Period of the SCL Clock tHIGH 0.6 - - µs I C Set up time for a Repeated START Condition tSUSTA 0.6 - - µs I2C Data Hold Time tHDDAT 0 - 0.9 µs I2C Data Setup Time tSUDAT 100 - - ns I2C Set up Time for STOP Condition tSUSTO 0.6 - - µs tBUF 1.3 - - µs I2C SDA Output ‘L’ Voltage 2 I C SCL Clock Frequency EV = 1000 lx IOL = 3 mA 2 I C Hold Time (repeated) START Condition 2 I2C Bus Free Time between a STOP and START Condition ※1 White LED is used as optical source. ※2 Measurement Accuracy typical value is possible to change '1' by "Measurement result adjustment function". ※3 Use H-Resolution Mode if dark data (less than 10 lx) is need. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/16 2010.06 - Rev.B Technical Note BH1710FVC ●Reference Data 64 1.2 100000 56 0.6 0.4 40 H-Res. L-Res. 32 24 16 400 500 600 700 800 900 1000 1 0 1100 8 16 24 32 40 Illuminance [ lx ] Wavelength [ nm ] 48 56 1 64 1pin 0.8 Ratio 0.6 0.6 - - + 0.2 0.2 0 0 -90 -60 1pin - 0.4 0.4 -30 0 30 60 -60 -30 6 蛍光灯白熱灯感度比 4 H-Res. + 0 0 30 60 90 -30 0 1.2 Fig.5 Directional Characteristics 2 ICC @ Measurement Halogen Light 0.6 Kripton Light 0.4 90 200 Incandescent Light 0.8 60 Fig.6 Dark Response Fluorescent Light 1 30 Ta [ ℃ ] Angle [ deg ] Angle [ deg ] Fig.4 Directional Characteristics 1 100000 2 + -90 90 10000 8 0.8 + 受信指向角特性 1000 10 1 1 100 Fig.3 Illuminance – Measurement Result 2 1.2 1.2 10 Illuminance [ lx ] Fig.2 Illuminance – Measurement Result 1 Fig.1 Spectral Response Ratio 10 0 0 Ratio 100 M-Res. 8 0.2 1000 Measurement Result Ratio 0.8 10000 48 Measurement Result Measurement Result 1 Artifical Sun Light VCC vs. ICC@測定 150 中 100 50 0.2 White LED 0 -30 0 30 60 0 90 0.5 Ta [ ℃ ] Fig.7 Measurement Result Temperature Dependency 1.5 0 2 2 Fig.8 Light Source Dependency ( Fluorescent Light is set to '1' ) 2.5 VCC=3V 0.8 Ratio Ratio 0.8 0.6 -20 0 20 40 60 80 Ta [ ℃ ] Fig.10 VCC – ICC@0 Lx ( POWER DOWN ) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 0.6 0.4 0.4 0.2 0.2 0 0.01 4 1 DVI=1.8V 0.1 3.5 1.2 1 1 3 VCC [ V ] Fig.9 VCC – ICC ( During measurement ) 1.2 10 ICC @ POWER DOWN [ uA ] 1 Ratio 0 2 2.5 3 VCC [ V ] 3.5 4 Fig.11 Measurement Result VCC Dependency 3/16 1.5 2 2.5 DVI [ V ] 3 3.5 Fig.12 Measurement Result DVI Dependency 2010.06 - Rev.B Technical Note BH1710FVC ●Block Diagram DVI VCC AMP Logic + I2C Interface ADC SCL SDA PD OSC GND ADDR ●Block Diagram Descriptions ●PD Photo diode with approximately human eye response. ●AMP Integration-OPAMP for converting from PD current to Voltage. ●ADC AD converter for obtainment Digital 16bit data. 2 ●Logic + I C Interface Ambient Light Calculation and I2C BUS Interface. It is including below register. Data Register → This is for registration of Ambient Light Data. Initial Value is "0000_0000_0000_0000". Measurement Time Register → This is for registration of measurement time. Initial Value is "01_0010_1100". ●OSC Internal Oscillator (typ. 320kHz). It is CLK for internal logic. ●Measurement Procedure Power supply Initial state is Power Down mode after VCC and DVI supply. State is automatically changed to Power Down mode. Power Down Power On Measurement Command One Time Measurement Continuous Measurement 2 State Transition by I C write-command. Automatically State Transition * "Power On" Command is possible to omit. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/16 2010.06 - Rev.B Technical Note BH1710FVC ●Instruction Set Architecture Instruction Opecode Comments Power Down 0000_0000 No active state. Power On 0000_0001 Waiting for measurement command. Reset 0000_0111 Reset Data register value. Reset command is not acceptable in Power Down mode. Continuously H-Resolution Mode 0001_0000 Start measurement at 1lx resolution. Measurement Time is typically 120ms. Continuously M-Resolution Mode 0001_0011 Start measurement at 4lx resolution. Measurement Time is typically 16ms. Continuously L-Resolution Mode 0001_0110 Start measurement at 32lx resolution. Measurement Time is typically 2.9ms. One Time H-Resolution Mode 0010_0000 Start measurement at 1lx resolution. Measurement Time is typically 120ms. It is automatically set to Power Down mode after measurement. One Time M-Resolution Mode 0010_0011 Start measurement at 4lx resolution. Measurement Time is typically 16ms. It is automatically set to Power Down mode after measurement. One Time L-Resolution Mode 0010_0110 Start measurement at 32lx resolution. Measurement Time is typically 2.9ms. It is automatically set to Power Down mode after measurement. Change Measurement time (High bit) 010_MT[9,8,7,6,5] Change Measurement time (Low bit) 011_MT[4,3,2,1,0] Change measurement time. ※ Please refer "adjust measurement result for influence of optical window." Change measurement time. ※ Please refer "adjust measurement result for influence of optical window." ※ Don't input the other opecode. ●Measurement mode explanation Measurement Mode Measurement Time. Resolution H-Resolution Mode Typ. 120ms. 1 Lx. M-Resolution Mode Typ. 16ms. 4 Lx. L-Resolution Mode Typ. 2.9ms. 32 Lx. We recommend to use H-Resolution Mode. Measurement time (integration time) of H-Resolution Mode is so long that some kind of noise(including in 50Hz / 60Hz noise) is rejected. And H-Resolution Mode is 1 l x resolution so that it is suitable for darkness (less than 10 lx) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/16 2010.06 - Rev.B Technical Note BH1710FVC ●Explanation of Asynchronous reset and Reset command "0000_0111" 1) Asynchronous reset All registers are reset. It is necessary on power supply sequence. Please refer "Timing chart for VCC and DVI power supply sequence" in this page. It is power down mode during DVI = 'L'. 2) Reset command Reset command is for only reset Illuminance data register. (reset value is '0') It is not necessary even power supply sequence. It is used for removing previous measurement result. This command is not working in power down mode, so that please set the power on mode before input this command. ●Timing chart for VCC and DVI power supply sequence 2 DVI is I C bus reference voltage terminal. And it is also asynchronous reset terminal. It is necessary to set to 'L' is supplied. In DVI 'L' term, internal state is set to Power Down mode. after VCC 1) Recommended Timing chart1 for VCC and DVI supply. VCC DVI Reset Term ( more than 1µs ) 2) Timing chart2 for VCC and DVI supply. (If DVI rises within 1µs after VCC supply) VCC DVI Reset Term (more than 1µs) Don't care state ADDR, SDA, SCL is not stable if DVI 'L' term (1µs) is not given by systems. In this case, please connect the resisters (approximately 100kOhm) to ADDR without directly connecting to VCC or GND, because it is 3 state buffer for Internal testing. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/16 2010.06 - Rev.B Technical Note BH1710FVC ●Measurement sequence example from "Write instruction" to "Read measurement result" ex1) Continuously H-resolution mode (ADDR = 'L') from Slave to Master from Master to Slave ① Send "Continuously H-resolution mode " instruction ST 0100011 ② Wait to complete 1st 0 Ack 00010000 Ack SP H-resolution mode measurement.(max. 180ms.) ③ Read measurement result. ST 0100011 1 Ack Low Byte [ 7:0 ] High Byte [ 15:8 ] Ack Ack SP How to calculate when the data High Byte is "10000011" and Low Byte is "10010000" 15 9 8 7 4 (2 + 2 + 2 + 2 + 2 ) / 1.2 ≒ 28067 [ lx ] The result of continuously measurement mode is updated.(120ms.typ at H-resolution mode, 16ms.typ at M-resolution mode, 2.9ms.typ at L-resolution mode) ex2) One time M-resolution mode (ADDR = 'H') ① Send "One time M-resolution mode " instruction ST 1011100 0 Ack 00100011 Ack SP ② Wait to complete M-resolution mode measurement.(max. 24ms.) ③ Read measurement result ST 1011100 1 Ack Low Byte [ 7:0 ] High Byte [ 15:8 ] Ack Ack SP How to calculate when the data High Byte is "00000001" and Low Byte is "00010000" 8 4 (2 + 2 ) / 1.2 ≒ 227 [ lx ] In one time measurement, Statement moves to power down mode after measurement completion. If updated result is need then please resend measurement instruction. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/16 2010.06 - Rev.B Technical Note BH1710FVC ●Application circuit example of DVI terminal The DVI terminal is an asynchronous reset terminal. Please note that there is a possibility that IC doesn't operate normally if the reset section is not installed after the start-up of VCC. (Please refer to the paragraph of "Timing chart for VCC and DVI power supply sequence") The description concerning SDA and the terminal SCL is omitted in this application circuit example. Please design the 2 application the standard of the I C bus as it finishes being satisfactory. Moreover, the description concerning the terminal ADDR is omitted. Please refer to the paragraph of "Timing chart for VCC and DVI power supply sequence" about the terminal ADDR design. ex 1) The control signal line such as CPU is connected. BH1710FVC 0.1µF VCC SCL ADDR DVI GND SDA Micro Controller 0.1µF ex 2) Reset IC is used. 1, For Reset IC of the Push-Pull type BH1710FVC 0.1µF VCC SCL ADDR DVI GND SDA 0.1µF RESET Reset IC( Pµsh-Pull type ) 2, For Reset IC of the Open drain output BH1710FVC 0.1μF VCC SCL ADDR DVI GND SDA 1kOhm 0.1µF RESET Reset IC( Open drain type ) ex 3) A different power supply is used. BH1710FVC VCC 0.1µF V1 SCL ADDR DVI GND SDA V2 0.1µF ※ Power supply of DVI must stand up later than power supply of VCC stand up, because it is necessary to secure reset section (1µs or more). www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/16 2010.06 - Rev.B Technical Note BH1710FVC ex 4) LPF using CR is inserted between VCC and DVI. This method has the possibility that the Reset section of turning on the power supply can not satisfied. cannot be satisfied. Please design the set considering the characteristic of the power supply enough. R1 : 1kOhm BH1710FVC 0.1µF VCC SCL ADDR DVI GND SDA C1 : 1µF ◆ Notes when CR is inserted between VCC and DVI ※ ※ ※ Please note that there is a possibility that reset section (1µs) can not be satisfied because the power supply is turned on when the rise time of VCC is slow When VCC is turned off, the DVI voltage becomes higher than VCC voltage but IC destruction is not occurred if recommended constant (R1 = 1kOhm, C1 = 1µF) is used. Please note that there is a possibility that Reset section (1usec) cannot be satisfied if wait time is not enough long after turning off VCC. (It is necessary to consider DVI voltage level after turning off VCC.) t1 VCC t2 DVI 2.4V 0.4V 0V Reset Section : 1µs or more *Please do the application design to secure Reset section 1µs or more after the reclosing of the power supply. ◆ Example of designing set when CR (C = 1µF, R = 1kΩ) is inserted between VCC and DVI with VCC=2.8V ①The rise time to 0→2.4V of VCC must use the power supply of 100µs or less. ②Please wait 25ms or more after VCC turn off (VCC <= 0.05V), because it is necessary to secure reset section (1µs or more). Rise time of power supply : 100µs or less Time to power supply reclosing : 25ms or more VCC 2.8V DVI 2.4V 0.4V 0V 0.05V Reset Section : 1µs or more * www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Please do the application design to secure Reset section 1µs or more after the reclosing of the power supply. 9/16 2010.06 - Rev.B Technical Note BH1710FVC ●I2C Bus Access 1) I2C Bus Interface Timing chart 2 Write measurement command and Read measurement result are done by I C Bus interface. Please refer the formally 2 specification of I C Bus interface, and follow the formally timing chart. SDA tSU ; DAT tr tf tf tr tHD ; STA tLOW tBUF SCL tSU ; STA tHD ; STA tSU;STO Sr tHIGH tHD ; DAT P S S 2) Slave Address Slave Address is 2 types, it is determined by ADDR Terminal ADDR = ‘H’ (ADDR ≧ 0.7VCC) → “1011100“ ADDR = 'L' (ADDR ≦ 0.3VCC) → “0100011“ 3) Write Format BH1710FVC is not able to accept plural command without stop condition. Please insert SP every 1 Opecode. ST R/W 0 Slave Address Ack Opecode Ack SP 4) Read Format ST R/W 1 Slave Address 27 26 High Byte [15:8] 215 214 213 212 211 210 29 28 Ack Low Byte [7:0] 25 24 23 22 21 20 Ack Ack SP from Slave to Master from Master to Slave ex) High Byte = "1000_0011" Low Byte = "1001_0000" 15 9 8 7 4 (2 + 2 + 2 + 2 + 2 ) / 1.2 ≒ 28067 [ lx ] * Please refer formality I2C bus specification of NXP semiconductors. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/16 2010.06 - Rev.B Technical Note BH1710FVC ●Adjust measurement result for influence of optical window. (sensor sensitivity adjusting ) BH1710FVC is possible to change sensor sensitivity. And it is possible to cancel the optical window influence (difference with / without optical window) by using this function. Adjust is done by changing measurement time. For example, when transmission rate of optical window is 50% (measurement result becomes 0.5 times if optical window is set), influence of optical window is ignored by changing sensor sensitivity from default to 2 times Sensor sensitivity is shift by changing the value of MTreg (measurement time register). MTreg value has to set 2 times if target of sensor sensitivity is 2 times. Measurement time is also set 2 times when MTreg value is changed from default to 2 times. ex) Procedure for changing target sensor sensitivity to 2 times. Please change Mtreg from ” 01_0010_1100” ( default ) to ” 10_0101_1000” ( default * 2 ). 1)Changing High bit of Mtreg ST Slave Address R/W 0 Ack 010_10010 Ack SP R/W 0 Ack 011_11000 Ack SP R/W 0 Ack 0001_0000 Ack SP 2)Changing Low bit of Mtreg ST Slave Address 3)Input Measurement Command. ST Slave Address ※This example is High Resolution mode, but it accepts the other measurement. 4)After about 240ms, measurement result is registered to Data Register. (High Resolution mode is typically 120ms, but measurement time is set twice.) The below table is seeing the changeable range of MTreg. Min. Changeable range of Mtreg Binary Decimal 00100_01100 (sensitivity : default*0.47) 140 (sensitivity : default*0.47) Typ. Max. 01001_01100 default 300 default 11111_11110 (sensitivity : default*3.41) 1022 (sensitivity : default*3.41) It is possible to detect 0.24lx by using this function at H-resolution mode. The below formula is to calculate illuminance per 1 count. Illuminance per 1 count ( lx / count ) = 1 / 1.2 *( 300 / X ) 1.2 : Measurement accuracy 300 : Default value of MTreg X : Mtreg value The below table is seeing the detail of resolution. Mtreg value lx / count 00100_01100 1.79 01001_01100 0.83 11111_11110 0.24 Please input the opecode at PowerDown state to change Mtreg.There is a possibility of malfunctioning when the opecode to change Mtreg is input while the illuminance measurement is going . www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/16 2010.06 - Rev.B Technical Note BH1710FVC ●Terminal Description Pin No. Pin Name 1 VCC Equivalent Circuit Function Power Supply Terminal VCC ※ 2 I C Slave-address Terminal ADDR = ‘H’ (ADDR ≧ 0.7VCC) “1011100“ ADDR = 'L' (ADDR ≦ 0.3VCC) “0100011“ ADDR Terminal is designed as 3 state buffer for internal test. So that please take care of VCC and DVI supply procedure.Please see P6. 2 ADDR 3 GND GND Terminal 4 SDA 2 I C bus Interface SDA Terminal 5 DVI SDA, SCL Reference Voltage Terminal And DVI Terminal is also asynchronous Reset for internal registers.So that please set to 'L' (at least 1µs, DVI <= 0.4V) after VCC is supplied. BH1710FVC is pulled down by 150kOhm while DVI = 'L'. 6 SCL 150kOhm 2 I C bus Interface SCL Terminal These values are design-value, not guaranteed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/16 2010.06 - Rev.B Technical Note BH1710FVC ●Package Outlines A B Lot No. Production code WSOF6 ( Unit : mm ) ●About an optical design on the device 0.8 mm 1.3 mm Min.0.4 mm Min.0.4 mm PD area ( 0.25 mm x 0.3 mm ) Please design the optical window so that light can cover at least this area. Min.0.4 mm Min.0.4 mm www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/16 2010.06 - Rev.B Technical Note BH1710FVC ●The method of distinguishing 1pin There is some method of distinguishing 1pin. ① Distinguishing by 1Pin wide-lead ② Distinguishing by die pattern ③ Distinguishing by taper part of 1-3pin side ② (by die pattern) is the easiest method to distinguish by naked eye. A B ② Production code ③ ① www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/16 2010.06 - Rev.B Technical Note BH1710FVC ●Cautions on use 1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage (Vmax), temperature range of operating conditions (Topr), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. 3) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. 4) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. 5) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. 6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals; such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. 7) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. 8) Treatment of package Dusts or scratch on the photo detector may affect the optical characteristics. Please handle it with care. 9) Rush current When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow instantaneously. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 10) The exposed central pad on the back side of the package There is an exposed central pad on the back side of the package. But please do it non connection. (Don't solder, and don't do electrical connection) Please mount by Footprint dimensions described in the Jisso Information for WSOF6. This pad is GND level, therefore there is a possibility that LSI malfunctions and heavy-current is generated. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/16 2010.06 - Rev.B Technical Note BH1710FVC ●Ordering part number B 1 H Part No. 7 1 F 0 Part No. 1710 V C - Package FVC: WSOF6 T R Packaging and forming specification TR: Embossed tape and reel (WSOF6) WSOF6 <Tape and Reel information> 5 4 4 5 6 (1.5) 6 (0.45) 2.6±0.1 (MAX2.8 include BURR) (1.2) 1 2 3 3 2 0.75MAX Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin 1 1PIN MARK 0.3 Tape (0.15) 3.0±0.1 1.6±0.1 (MAX1.8 include BURR) 0.145±0.05 S 0.08 S 0.5 0.22±0.05 0.08 Direction of feed M Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/16 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.06 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A