here

05180
PKFC3.3C - PKFC36C
Only One Name Means ProTek’Tion™
250w encapsulated flip chip tvs array
Description
The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4
requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the PKFCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually
eliminates overshoot voltage due to package inductance.
Features
applications
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• Chip Scale Package 0.050” x 0.030”
• ESD Protection > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
• Bidirectional Configuration & Monolithic Structure
• Protection for 1 Line
• RoHS Compliant
• REACH Compliant
• Cellular Phones
• MCM Boards
• Wireless Communication Circuits
• IR LEDs
• SMART & PCMCIA Cards
Mechanical characteristics
• Molded DFN-2 Package Configuration
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Solder Reflow Temperature:
• Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Tape per EIA Standard 481
circuit diagram
05180.R8 7/13
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05180
PKFC3.3C - PKFC36C
Only One Name Means ProTek’Tion™
typical device characteristics
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
SYMBOL
VALUE
UNITS
PPP
250
Watts
TA
-55 to 150
°C
TSTG
-55 to 150
°C
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(Note 1)
device
marking
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
V WM
VOLTS
@ 1mA
V(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
@ IP = 1A
VC
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
@ 8/20µs
VC @ I PP
MAXIMUM
LEAKAGE
CURRENT
(Note 2)
@VWM
ID
µA
TYPICAL
CAPACITANCE
@0V, 1MHz
C
pF
PKFC3.3C
03
3.3
4.0
7.0
12.5V @ 20A
75*
150
PKFC05C
05
5.0
6.0
11.0
14.7V @ 17A
10**
100
PKFC08C
08
8.0
8.5
13.2
19.2V @ 13A
10***
75
PKFC12C
12
12.0
13.3
19.8
29.7V @ 9A
1
50
PKFC15C
15
15.0
16.7
25.4
35.7V @ 7A
1
40
PKFC24C
24
24.0
26.7
37.2
55.0V @ 5A
1
30
PKFC36C
36
36.0
40.0
70.0
84.0V @ 3A
1
25
notes
1. All devices are bidirectional. Electrical characteristics apply in both directions.
2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V. ***Maximum leakage current < 200nA @ 5V.
05180.R8 7/13
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05180
PKFC3.3C - PKFC36C
Only One Name Means ProTek’Tion™
typical device characteristics
figure 1
peak pulse power vs pulse time
PPP - Peak Pulse Power - Watts
10,000
1,000
250W, 8/20µs Waveform
100
10
0.1
10
100
td - Pulse Duration - µs
Peak Value IPP
80
100
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
e-t
60
40
10,000
figure 3
power derating curve
Peak Pulse Power
8/20µs
80
% Of Rated Power
tf
100
td = t/(IPP/2)
60
40
20
20
0
1,000
figure 2
pulse wave form
120
IPP - Peak Pulse Current - % of IPP
1
0
05180.R8 7/13
5
10
15
t - Time - µs
20
25
0
30
Page 3
Average Power
0
25
50
75 100 125
TA - Ambient Temperature - °C
150
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05180
PKFC3.3C - PKFC36C
Only One Name Means ProTek’Tion™
typical device characteristics
figure 4
overshoot & clamping voltage for PKFC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape)
figure 5
typical clamping voltage vs peak pulse current PKFC05C
VC - Clamping Voltage - Volts
12
8
4
0
0
05180.R8 7/13
5
10
IPP - Peak Pulse Current - Amps
Page 4
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20
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05180
PKFC3.3C - PKFC36C
Only One Name Means ProTek’Tion™
DFN-2 package information
A
outline dimensions
dim
millimeters
inches
min
max
min
max
A
0.73
0.79
0.029
0.031
B
1.22
1.32
0.048
0.052
C
0.73
0.79
0.029
0.031
D
0.54
0.60
0.021
0.024
F
0.55
0.61
0.022
0.024
G
0.27
0.33
0.11
0.013
H
0.38
0.44
0.015
0.017
J
0.35
0.041
0.014
0.016
K
0.35
0.041
0.014
0.016
C
H
D
K
TOP
B
SIDE
BOTTOM
J
F
Notes
1. Controlling dimensions in inches.
2. Maximum size 0.052” (1.321mm) by 0.036” (0.914mm)
3. All dimensions ±0.003”.
A
layout dimensions
dim
millimeters
inches
min
max
min
max
A
1.00
1.04
0.039
0.041
B
0.62
0.66
0.024
0.026
C
1.44
1.50
0.056
0.060
E
0.18
0.22
0.007
0.009
F
0.49
0.63
0.019
0.021
G
0.31
0.035
0.012
0.014
G
E
B
Solder Print Diameter
0.010” - 0.012”
Notes
1. Controlling dimensions in inches.
2. All dimensions ±0.003”.
05180.R8 7/13
C
F
Page 5
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05180
PKFC3.3C - PKFC36C
Only One Name Means ProTek’Tion™
TAPE AND REEL information
D
t
P2
Top Cover
Tape
P0
10 Pitches Cumulative
Tolerance on tape ± 0.2
E
A0
F
K0
W
B0
P
User Direction of Feed
specifications
Reel Dia.
Tape
Width
178mm(7”)
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
tmax
0.89 ± 0.05 1.47 ± 0.10 0.81 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10
0.25
Notes
1.
2.
3.
4.
5.
6.
Dimensions in millimeters.
Top view of tape. Solder pads are face down in tape package.
Orientation: preferred stencil - 0.1mm (0.004”).
Surface mount product is taped and reeled in accordance with EIA 481.
8mm plastic tape: 7” Reels - 5,000.
Marking on Reel - part number, date code and lot number.
ORDERING INFORMATION
base PART NUMBER
(xx = voltage)
LEADFREE SUFFIX
TAPE SUFFIX
QTY/REEL
REEL SIZE
TUBE qty
PKFCxxC
-LF
-T75-1
5,000
7”
n/a
This device is only available in a Lead-Free configuration.
05180.R8 7/13
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05180
PKFC3.3C - PKFC36C
Only One Name Means ProTek’Tion™
company information
COMPANY PROFILE
In business more than 20 years, ProTek Devices™ is a privately held semiconductor company. The company offers a product line of overvoltage protection and overcurrent protection components. These include transient voltage suppressor array (TVS arrays) avalanche breakdown diode, steering
diode TVS array and electronics SMD chip fuses. These components deliver circuit protection in electronic systems from numerous overvoltage and
overcurrent events. They include lightning; electrostatic discharge (ESD); nuclear electromagnetic pulses (NEMP); inductive switching; and electromagnetic interference (EMI) / radio frequency interference (RFI). ProTek Devices also offers high performance interface and linear products. They
include analog switches; multiplexers; LED drivers; LED wafer die for ESD protection; audio control ICs; RF and related high frequency products.
CONTACT US
Corporate Headquarters
2929 South Fair Lane
Tempe, Arizona 85282
USA
By Telephone
General: 602-431-8101
Sales: & Marketing: 602-414-5109
Customer Service: 602-414-5114
Product Technical Support: 602-414-5107
By Fax
General: 602-431-2288
By E-mail:
Sales: [email protected]
Customer Service: [email protected]
Technical Support: [email protected]
ProTek Devices (Asia Pacific) Pte. Ltd.
8 Ubi Road 2, #06-19
Zervex
Singapore - 408538
Tel: +65-67488312
Fax: +65-67488313
Web
www.protekdevices.com
COPYRIGHT © ProTek Devices 2003 - This literature is subject to all applicable copyright laws and is not for resale in any manner.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice.
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of
its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special,
consequential or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory.
PATENT INFORMATION: Patent Pending
05180.R8 7/13
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