DATA SHEET WIRELESS COMPONENTS Ceramic Chip Antenna ANT8868LL00R1880A DECT Product Specification –– March 27, 2013 V.0 8868 Series Product specification WIRELESS COMPONENTS Ceramic Chip Antenna FEATURES z Compact size z Omni-directional radiation z Tape & reel automatic mounting z Reflow process compatible z RoHS compliant ORDERING INFORMATION APPLICATIONS z DECT cordless telephone (1) PRODUCT 2 2 All part numbers are identified by the series, packing type, material, size, antenna type, working frequency and packing quantity. PART NUMBER ANT 8868 L L00 R 1880A (1) (2) (3) (4) (5) (6) ANT = Antenna (2) SIZE 8868 = 8.8 × 6.8 mm (3) ANTENNA TYPE L,F,A = Chip Antenna (4) SERIAL NO. L00 (5) PACKING TYPE R = Tape and Reel (6) WORKING FREQUENCY 1880 = 1.88 - 2.0GHz PHYCOMP CTC CAN4311788001881K 12NC 431178800188 www.yageo.com Mar. 27, 2013 V0 Product specification WIRELESS COMPONENTS 3 3 Ceramic Chip Antenna SPECIFICATION Table 1 VALUE DESCRIPTION Centre Frequency 1.88 ~ 2.0 GHz Bandwidth 220 MHz(Typ.) Return Loss 10 dB min Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 6.13 dBi (Typ.) Impedance 50 Ω – 40 ~105 °C Operating Temperature Maximum Power 1W Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to Soldering Heats 260℃ , 10sec. NOTE 1. The specification is defined on Yageo evaluation board DIMENSIONS Table 2 Machinical Dimension DIMENSION L (mm) 8.80 ± 0.20 W (mm) 6.80 ± 0.20 T (mm) 0.90 ± 0.20 A (mm) 4.30 ± 0.20 B (mm) 1.30 ± 0.20 C (mm) 0.50 ± 0.30 D (mm) 1.00 ± 0.20 E (mm) 7.60 ± 0.20 OUTLINES Top View Side View L T W Bottom View E S2 D A S1 S2 Table 3 Termination configuration TERMINAL NAME FUNCTION S1 Feeding Point S2 Soldering Point B S2 Fig. 1 Antenna outlines C YNH0096 www.yageo.com Mar. 27, 2013 V0 Product specification WIRELESS COMPONENTS 4 4 Ceramic Chip Antenna REFERENCE DESIGN OF EVALUATION BOARD 30 10 22 Unit : mm Fig. 2 Outlook and dimension of evaluation board Top Layer Bottom Layer / GND 8.0 Unit : mm 0.9 1.4 Matching Circuit 1.4 8.2 8.0 YNH0097 Fig. 3 Details of soldering Pad www.yageo.com Mar. 27, 2013 V0 Product specification WIRELESS COMPONENTS 5 5 Ceramic Chip Antenna ELECTRICAL PERFORMANCES Return loss (dB) 50 YNH0098 30 10 −10 3 1 2 −30 −50 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 f (GHz) Marker data 1. 1.88GHz, -10dB 2. 2.00GHz, -22.4dB 3. 2.1GHz, -10dB Fig. 4 Return loss Gain (dBi) 5.00 − Z axle 0.00 − X Y − 5.00 − − 10.00 − Z − 15.00 − − 20.00 − − 25.00 − X axle Y axle − 30.00 − Evaluation board and XYZ direction − 35.00 − YNH0099 Frequency = 1990 MHz Max gain = 6.13 dBi, at (150,240) MEG (mean effective gain)= 0.28 dBi Directivity (dB) = 7.39 Efficiency = -1.26dB, 74.80 % Fig. 5 Radiation pattern www.yageo.com Mar. 27, 2013 V0 Product specification WIRELESS COMPONENTS 6 6 Ceramic Chip Antenna REVISION HISTORY REVISION DATE CHANGE NOTIFICATION Version 0 - Mar. 27, 2013 DESCRIPTION - New datasheet for Ceramic Chip Antenna, DECT application, 8868 series www.yageo.com Mar. 27, 2013 V0