Ceramic Chip Antenna DECTZ 8868

DATA SHEET
WIRELESS COMPONENTS
Ceramic Chip Antenna
ANT8868LL00R1880A
DECT
Product Specification –– March 27, 2013 V.0
8868 Series
Product specification
WIRELESS COMPONENTS
Ceramic Chip Antenna
FEATURES
z Compact size
z Omni-directional radiation
z Tape & reel automatic
mounting
z Reflow process compatible
z RoHS compliant
ORDERING INFORMATION
APPLICATIONS
z DECT cordless telephone
(1) PRODUCT
2
2
All part numbers are identified by the series, packing type, material, size,
antenna type, working frequency and packing quantity.
PART NUMBER
ANT 8868 L L00 R 1880A
(1)
(2)
(3) (4)
(5)
(6)
ANT = Antenna
(2) SIZE
8868 = 8.8 × 6.8 mm
(3) ANTENNA TYPE
L,F,A = Chip Antenna
(4) SERIAL NO.
L00
(5) PACKING TYPE
R = Tape and Reel
(6) WORKING FREQUENCY
1880 = 1.88 - 2.0GHz
PHYCOMP CTC
CAN4311788001881K
12NC
431178800188
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Mar. 27, 2013 V0
Product specification
WIRELESS COMPONENTS
3
3
Ceramic Chip Antenna
SPECIFICATION
Table 1
VALUE
DESCRIPTION
Centre Frequency
1.88 ~ 2.0 GHz
Bandwidth
220 MHz(Typ.)
Return Loss
10 dB min
Polarization
Linear
Azimuth Beamwidth
Omni-directional
Peak Gain
6.13 dBi (Typ.)
Impedance
50 Ω
– 40 ~105 °C
Operating Temperature
Maximum Power
1W
Termination
Ni / Sn (Environmentally-Friendly Leadless)
Resistance to Soldering Heats
260℃ , 10sec.
NOTE
1. The specification is defined on Yageo evaluation board
DIMENSIONS
Table 2 Machinical Dimension
DIMENSION
L (mm)
8.80 ± 0.20
W (mm)
6.80 ± 0.20
T (mm)
0.90 ± 0.20
A (mm)
4.30 ± 0.20
B (mm)
1.30 ± 0.20
C (mm)
0.50 ± 0.30
D (mm)
1.00 ± 0.20
E (mm)
7.60 ± 0.20
OUTLINES
Top View
Side View
L
T
W
Bottom View
E
S2
D
A S1
S2
Table 3 Termination configuration
TERMINAL NAME
FUNCTION
S1
Feeding Point
S2
Soldering Point
B S2
Fig. 1 Antenna outlines
C
YNH0096
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Mar. 27, 2013 V0
Product specification
WIRELESS COMPONENTS
4
4
Ceramic Chip Antenna
REFERENCE DESIGN OF EVALUATION BOARD
30
10
22
Unit : mm
Fig. 2 Outlook and dimension of evaluation board
Top Layer
Bottom Layer / GND
8.0
Unit : mm
0.9
1.4
Matching Circuit
1.4
8.2
8.0
YNH0097
Fig. 3 Details of soldering Pad
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Mar. 27, 2013 V0
Product specification
WIRELESS COMPONENTS
5
5
Ceramic Chip Antenna
ELECTRICAL PERFORMANCES
Return loss
(dB)
50
YNH0098
30
10
−10
3
1
2
−30
−50
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
f (GHz)
Marker data
1. 1.88GHz, -10dB
2. 2.00GHz, -22.4dB
3. 2.1GHz, -10dB
Fig. 4 Return loss
Gain (dBi)
5.00 −
Z axle
0.00 −
X
Y
− 5.00 −
− 10.00 −
Z
− 15.00 −
− 20.00 −
− 25.00 −
X axle
Y axle
− 30.00 −
Evaluation board and XYZ direction
− 35.00 −
YNH0099
Frequency = 1990 MHz
Max gain = 6.13 dBi, at (150,240)
MEG (mean effective gain)= 0.28 dBi
Directivity (dB) = 7.39
Efficiency = -1.26dB, 74.80 %
Fig. 5 Radiation pattern
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Mar. 27, 2013 V0
Product specification
WIRELESS COMPONENTS
6
6
Ceramic Chip Antenna
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION
Version 0
-
Mar. 27, 2013
DESCRIPTION
- New datasheet for Ceramic Chip Antenna, DECT application,
8868 series
www.yageo.com
Mar. 27, 2013 V0