TSA7887 Data Sheet

TSA7887
A Micropower, 2-channel, 125-ksps, Serial-Output 12-bit SAR ADC
FEATURES
DESCRIPTION
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Alternate Source for AD7887
Single-supply Operation: +2.7V to +5.25V
INL: ±1LSB - TSA7887B
±2LSBs - TSA7887A
One or Two Single-ended Analog Inputs
Internal Wide-bandwidth Track-and-Hold
Internal +2.5-V Reference
Flexible Power/Throughput-Rate Management
0.85mA at 125ksps (Internal VREF ON)
0.7mA at 125ksps (Internal VREF OFF)
Shutdown-mode Supply Current: 1μA (max)
SPI®/QSPI™/MICROWIRE™/DSP-Compatible
Serial Interfaces1
Operating Temperature Range:
-40ºC to +125ºC
8-pin SOIC and MSOP Packaging
APPLICATIONS
Instrumentation and Control Systems
High-Speed Modems
Battery-powered systems:
Personal Digital Assistants, Medical
Instruments, Mobile Communications
The TSA7887 – an alternate source for the AD7887 is
a
self-contained,
2-channel,
high-speed,
micropower, 12-bit analog-to-digital converter (ADC)
that operates from a single +2.7V to +5.25V power
supply. The TSA7887 is capable of a 125-ksps
throughput rate with an external 2MHz serial clock
and draws 0.85mA supply current.
The wideband input track-and-hold acquires signals
in 500ns and features a single-ended sampling
topology. Output data coding is straight binary and
the ADC is capable of converting full power signals
up to 2.5 MHz. The ADC also contains an integrated
2.5V reference or the VREF pin can be overdriven by
an external reference.
The TSA7887’s provides one or two analog inputs
each with an analog input range from 0 to VREF. In
two-channel operation, the analog input range is 0V
to VDD. Efficient circuit design ensures low power
consumption of 2mW (typical) for normal operation
and 3μW in power-down operation.
The TSA7887 is fully specified from -40ºC to +125ºC
and is available in 8-pin SOIC and MSOP packages.
FUNCTIONAL BLOCK DIAGRAM
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National
Semiconductor Corporation
1
Page 1
© 2014 Silicon Laboratories, Inc. All rights reserved.
TSA7887
ABSOLUTE MAXIMUM RATINGS
VDD to AGND ................................................................ −0.3V to +7V
Analog Input Voltage (AIN0, AIN1) to AGND .... −0.3V to VDD + 0.3V
Digital Input Voltage to AGND........................... −0.3V to VDD + 0.3V
Digital Output Voltage to AGND ........................ −0.3V to VDD + 0.3V
REFIN/REFOUT to AGND ................................ −0.3V to VDD + 0.3V
Input Current to Any Pin Except Supplies1 ............................. ±10mA
Operating Temperature Range
A, B Versions ..................................................... −40°C to +125°C
Storage Temperature Range ................................. −65°C to +150°C
Junction Temperature ........................................................... +150°C
SOIC/MSOP Package Power Dissipation ............................. 450mW
θJA Thermal Impedance .....................................157°C/W (SOIC)
205.9°C/W (MSOP)
θJC Thermal Impedance .......................................56°C/W (SOIC)
43.74°C/W (MSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) ........................................................ 215°C
Infrared (15 sec) ................................................................ 220°C
Pb-Free Temperature, Soldering Reflow ............................. 260(0)°C
ESD ............................................................................................. 4kV
Electrical and thermal stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections
of the specifications is not implied. Exposure to any absolute maximum rating conditions for extended periods may affect device reliability and
lifetime.
PACKAGE/ORDERING INFORMATION
ORDER NUMBER
TSA7887ARZ
TSA7887ARZ-REEL
TSA7887BRZ
TSA7887BRZ-REEL
ORDER NUMBER
TSA7887ARMZ
TSA7887ARMZ-REEL
PART MARKING
TS7887A
TS7887B
PART MARKING
TAAV
CARRIER
QUANTITY
TUBE
97
Tape & Reel
2500
TUBE
97
Tape & Reel
2500
CARRIER
QUANTITY
TUBE
50
Tape & Reel
2500
Lead-free Program: Silicon Labs supplies only lead-free packaging.
Consult Silicon Labs for products specified with wider operating temperature ranges.
Page 2
TSA7887 Rev. 1.0
TSA7887
ELECTRICAL CHARACTERISTICS
VDD = +2.7V to +5.25V; VREF = 2.5V External/Internal Reference unless otherwise noted; fSCLK = 2 MHz;
TA = TMIN to TMAX, unless otherwise noted.
Parameter
DYNAMIC PERFORMANCE
Signal to Noise + Distortion Ratio (SNR)2
Total Harmonic Distortion (THD)
Peak Harmonic or Spurious Noise
Intermodulation Distortion (IMD)
Second-Order Terms
Third-Order Terms
Channel-to-Channel Isolation
Full-Power Bandwidth
DC ACCURACY(Any channel)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Offset Error Match
Gain Error
Gain Error Match
ANALOG INPUT
Input Voltage Ranges
Leakage Current
Input Capacitance
REFERENCE INPUT/OUTPUT
REFIN Input Voltage Range
Input Impedance
REFOUT Output Voltage
REFOUT Temperature Coefficient
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
Input Capacitance, CIN3
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance4
A Version1
B Version1
Unit
71
−80
–80
71
−80
−80
dB (typ)
dB (typ)
db (typ)
fIN = 10 kHz sine wave, fSAMPLE = 125 ksps
fIN = 10 kHz sine wave, fSAMPLE = 125 ksps
fIN = 10 kHz sine wave, fSAMPLE = 125 ksps
−80
−80
−80
−80
−80
−80
dB (typ)
dB (typ)
dB (typ)
f1 = 9.983 kHz, f2 = 10.05 kHz, fSAMPLE = 125 ksps
f1 = 9.983 kHz, f2 = 10.05 kHz, fSAMPLE = 125 ksps
fIN = 25 kHz
2.5
2.5
MHz (typ)
Measured at 3 dB down
12
±2
±2
±3
12
±1
±1
±3
Bits
LSB (max)
LSB (max)
LSB (max)
Guaranteed no missing codes to 11 bits (A Grade)
VDD = 5V, dual-channel mode
±4
±6
0.5
±2
±1
±6
2
±4
±6
0.5
±2
±1
±6
2
LSB (max)
LSB (typ)
LSB (max)
LSB (typ)
LSB (max)
LSB (typ)
LSB (max)
0 to VREF
0 to VREF
V
±5
10
±5
10
μA (max)
pF (typ)
2.5/VDD
10
2.45/2.55
±50
2.5/VDD
10
2.45/2.55
±50
V (min/max)
kΩ (typ)
V (min/max)
ppm/°C (typ)
2.4
2.1
0.8
2.4
2.1
0.8
V (min)
V (min)
V (max)
VDD = 4.75V to 5.25V
VDD = 2.7V to 3.6V
VDD = 2.7 V to 5.25 V
±1
10
±1
10
μA (max)
pF (max)
Typically 10 nA, VIN = 0 V or VDD
VDD − 0.5
0.4
±1
10
VDD − 0.5
0.4
±1
10
V (min)
V (max)
μA (max)
pF (max)
Output Coding
CONVERSION RATE
Throughput Time
Track-and-Hold Acquisition Time
Conversion Time
TSA7887 Rev. 1.0
Test Conditions/Comments
VDD = 3V, dual-channel mode
Single-channel mode
Dual-channel mode
Single-channel mode, external reference
Single-channel mode, internal reference
Functional from 1.2V
Very high impedance if internal reference disabled
ISOURCE = 200 μA
VDD = 2.7V to 5.25V
ISINK = 200 μA
Straight (Natural) Binary
16
16
SCLK cycles
1.5
14.5
1.5
14.5
SCLK cycles
SCLK cycles
Conversion time plus acquisition time is 125 ksps,
with 2 MHz Clock
7.25 μs (2 MHz Clock)
Page 3
TSA7887
ELECTRICAL SPECIFICATIONS (continued)
VDD = +2.7V to +5.25V; VREF = 2.5V External/internal reference unless otherwise noted; fSCLK = 2 MHz;
TA = TMIN to TMAX, unless otherwise noted.
Parameter
POWER REQUIREMENTS
VDD
IDD
Normal Mode4 (PM Mode 2)
Static
Operational (fSAMPLE = 125 kSPS)
Using Standby Mode (PM Mode 4)
Using Shutdown Mode
(PM Modes 1 and 3)
Standby Mode5
Shutdown Mode5
Normal Mode Power Dissipation
Shutdown Power Dissipation
Standby Power Dissipation
A Version1
B Version1
Unit
Test Conditions/Comments
+2.7/+5.25
+2.7/+5.25
V (min/max)
700
850
700
450
120
12
700
850
700
450
120
12
μA (max)
μA (typ)
μA (typ)
μA (typ)
μA (typ)
μA (typ)
Internal reference enabled
Internal reference disabled
fSAMPLE = 50 ksps
fSAMPLE = 10 ksps
fSAMPLE = 1 ksps
210
1
2
3.5
2.1
5
210
1
2
3.5
2.1
5
μA (max)
μA (max)
μA (max)
mW (max)
mW (max)
μW (max)
VDD = 2.7V to 5.25V
VDD = 2.7V to 3.6V
VDD = 4.75V to 5.25V
VDD = 5 V
VDD = 3 V
VDD = 5 V
3
1.05
630
3
1.05
630
μW (max)
mW (max)
μW (max)
VDD = 3 V
VDD = 5 V
VDD = 3 V
Note 1: The TSA7887’s temperature range is –40°C to +125°C for both A and B versions.
Note 2: SNR calculation includes distortion and noise components.
Note 3: Sample tested at TA = 25°C to ensure compliance.
Note 4: All digital inputs at GND except for CS at VDD. All digital outputs are unloaded. Analog inputs are connected to GND.
Note 5: SCLK is at GND when SCLK is off. All digital inputs are at GND except for CS at VDD. All digital outputs are unloaded. Analog inputs
are connected to GND.
Page 4
TSA7887 Rev. 1.0
RTFDS
TSA7887
TIMING SPECIFICATIONS1
Parameter
Limit at TMIN, TMAX
(A, B Versions)
Unit
4.75V to 5.25V
2.7V to 3.6V
2
14.5 × tSCLK
2
14.5 × tSCLK
tACQ
t1
t23
t33
t4
t5
t6
1.5 × tSCLK
10
30
1.5 × tSCLK
10
60
ns (min)
ns (max)
75
20
20
0.4 × tSCLK
100
20
20
0.4 × tSCLK
ns (max)
ns (min)
ns (min)
ns (min)
t7
t84
t9
0.4 × tSCLK
80
5
0.4 × tSCLK
80
5
ns (min)
ns (max)
μs (typ)
fSCLK2
tCONVERT
Description
MHz (max)
Throughput time = tCONVERT + tACQ = 16 tSCLK
CS to SCLK setup time
Delay from CS until DOUT three-state disabled
Data access time after SCLK falling edge
Data setup time prior to SCLK rising edge
Data valid to SCLK hold time
SCLK high pulse width
SCLK low pulse width
CS rising edge to DOUT high-Z
Power-up time from shutdown
Note 1: Timing specifications are sample tested at 25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of
VDD) and timed relative to a voltage level of 1.6V.
Note 2: The mark/space ratio for the SCLK input is 40/60 to 60/40. See Serial Interface section for additional details.
Note 3: Measured with the load circuit as shown below and defined as the time required for the output to cross 0.8V or 2.0V.
Note 4: Timing specification t8 is derived from the measured time taken by the data outputs to change 0.5V when loaded with the circuit shown
below. The measured result is then extrapolated back to remove the effects of charging or discharging the 50pF capacitor. This
means that the time, t8, quoted in the timing characteristics is the true bus relinquish time of the TSA7887 and is independent of bus
loading.
Load Circuit Used for TSA7887’s Digital Output Timing
Specifications.
TSA7887 Rev. 1.0
Page 5
TSA7887
TYPICAL PERFORMANCE CHARACTERISTICS
Dynamic Performance vs Frequency
Power Supply Rejection vs Frequency
0
-77
FFT RESULTS - dB
-20
POWER SUPPLY REJECTION - dB
4096-point FFT
125kHz Sampling Rate
10kHz Fundamental
-40
-60
-80
-100
-120
-140
10
0
20
30
40
50
60
FREQUENCY - kHz
-81
VDD = 2.7V/5.5V
REFIN (External) = 2.488V
100mVPP Sine Wave on VDD
-85
-89
-93
-97
2.65
12.9
23.2
33.7 43.9
54.4
64.2
FREQUENCY - kHz
Signal-to-Noise Ratio vs Frequency
SIGNAL-TO-NOISE RATIO - dB
72
VDD = 5V
REFIN (External) = 5V
71.5
71
70.5
70
0.7
11
21.4
31.8
42.1
FREQUENCY - kHz
Page 6
TSA7887 Rev. 1.0
TSA7887
PIN FUNCTIONS
PIN
LABEL
1
CS
2
VDD
3
GND
4
AIN1/VREF
5
AIN0
6
DIN
7
DOUT
8
SCLK
TSA7887 Rev. 1.0
DESCRIPTION
Chip Select: As an active low logic input signal, the CS input provides the dual function of
initiating TSA7887 conversions as well as framing the serial data transfer. When the
TSA7887 is operated in Mode 1(its default power management mode), the CS pin also
acts as the shutdown pin in that the TSA7887 is powered-down when the CS pin is logic
high.
Power Supply Voltage: The TSA7887’s VDD range +2.7V to +5.25V. In two-channel
operation, the VDD pin also serves as the TSA7887’s voltage reference source during
conversions. For optimal performance, the VDD pin should be bypassed to GND with a
10-µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor.
Analog Ground Pin: The GND pin is the ground reference point for all TSA7887 internal
circuitry. In systems with separate AGND and DGND planes, the TSA7887’s GND pin
should be connected to the AGND plane.
Analog Input Channel 1/External VREF Input: In single-channel mode, the AIN1/VREF pin
is configured as VREFIN/OUT. In this mode, the TSA7887’s internal 2.5V reference can be
accessed or an external reference can be applied to this pin thereby overriding the internal
reference. The reference voltage range for an externally-applied reference is 1.2V to VDD.
In two-channel mode, the AIN1/VREF pin operates as a second analog input channel,
AIN1. The input voltage range on AIN1 is 0 to VDD.
Analog Input Channel 0: In single-channel operation, AIN0 is the TSA7887’s analog input
with an input voltage range of 0V to VREF. In two-channel operation, the AIN0 pin exhibits
an analog input range of 0V to VDD.
Serial Data Input: Serial data to be loaded into the TSA7887’s control register is applied at
the DIN pin. Serial data is loaded into the ADC from the host processor on low-to-high
SCLK transitions (see the Control Register section for additional information). Configuring
the TSA7887 as a single-channel, read-only ADC can be achieved by hard-wiring the DIN
pin to GND or by applying a logic LOW at all times at the DIN pin.
Serial Data Output: The TSA7887’s conversion result is available on this pin. Serial data is
transferred out of the TS7887 on high-to low transitions of SCLK. The 12-bit conversion
result is comprised of four leading zeros followed by the 12 bits of conversion data
formatted MSB first. Thus, a total of 16 SCLK high-to-low transitions transfers the
conversion result to the host processor as shown in the corresponding timing diagram of
Figure 14.
Serial-Clock Input: SCLK is used for (3) purposes: a) to load serial data from the host
processor into the TSA7887’s control register on low-to-high SCLK transitions; b) to
transfer the 12-bit conversion result to the host processor on high-to-low SCLK transitions;
and c) to control the TSA7887’s conversion process.
Page 7
TSA7887
TSA7887 CONTROL REGISTER DESCRIPTION
serial data available on the first eight low-to-high
SCLK transitions is transferred into the control
register. The first bit in the serial data stream is
always interpreted as the MSB. Upon initial powerup, the TSA7887’s default control register bit is
cleared to all zeros (all “0”s). Table 1 lists the
functions of the Control Register’s 8 bits.
The TSA7887’s write-only control register is 8-bits
wide. Serial ADC configuration data is uploaded
from the host processor at the TSA7887’s DIN pin
on low-to-high SCLK transitions. Serial input data is
uploaded to the TSA7887 simultaneously as the
conversion result is transferred out of the TSA7887.
All serial data transfers require 16 serial clocks
transitions. After a high-to-low CS transition signal,
Table 1. TSA7887’s 8-Bit Control Register Content Description
DB7 (MSB)
DONTC
DB6
ZERO
DBx
7
Label
DONTC
6
ZERO
5
REF
4
SIN/DUAL
3
CH
2
ZERO
1
0
PM1
PM0
DB5
REF
DB4
SIN/DUAL
DB3
CH
DB2
ZERO
DB1
PM1
DB0 (LSB)
PM0
Comment
Control Register DB7: Bit status of DB7 is “Don’t Care.” In other words, the DB7 bit can be a “0” or a “1”.
Control Register DB6: To ensure correct TS7887 operation, Control Register DB6 status must always be a “zero”
(“0”).
Control Register DB5 – Internal Voltage Reference Configuration: The status of DB5 determines whether the
TSA7887’s internal voltage reference is enabled or disabled. A “0” in the DB5 location will enable the TSA7887’s
internal voltage reference (default condition). To disable the TSA7887’s internal voltage reference, a “1” must be
written into DB5’s register location.
Control Register DB4 - Single-Channel/Dual-Channel Configuration. Control Register DB4 configures the TSA7887 as
a single-channel or two-channel ADC. Loading a “zero” (“0”) into this register location configures the TSA7887 for
single-channel operation with the AIN1/VREF pin configured to for internal VREF operation (default configuration). In
this case, the analog input signal range is 0V to VREF. Loading a “one” (“1”) into this register location configures the
TSA7887 for two-channel operation with the AIN1/VREF pin configured to its AIN1 function as the second analog
input. In addition, the conversion process’s reference voltage is internally connected to VDD. In this case, the analog
input signal range is 0V to VDD. To obtain best performance from the TSA7887 in two-channel operation, the ADC’s
internal reference should be disabled; that is, a “1” should be loaded into DB5’s register location.
Control Register DB3 - Channel Select Bit: The bit status of DB3 determines on which channel the TSA7887 is
converting. When the ADC is configured for dual-channel operation, DB3 determines which channel is converted on
the next conversion cycle. When DB3 is a “zero” (a “0”), the AIN0 input is selected and, when DB3 is a “one” (a “1”),
the AIN1 input is selected. DB3 should be a “zero” (“0”) when the TSA7887 is configured for single-channel operation.
Control Register DB2: To ensure correct TS7887 operation, Control Register DB2 status must always be a “zero”
(“0”).
Control Register DB1 and DB0 - Power Management Operating Modes: DB1 and DB0 are decoded to configure the
TSA7887 into one of four operating modes as shown in Table 2.
Table 2. TSA7887’s Power Management Operating Modes
PM1
PM0
0
0
0
1
1
0
1
1
Page 8
Mode
PM Mode 1: In this operating mode, the TSA7887’s power-down mode is enabled if its CS input is a “one” ( a “1”) and is
operating in full-power mode when its CS input is a “zero” (a “0”). Thus, the TSA7887 is powered down on a low-to-high
CS transition and is powered up on a high-to-low CS transition.
PM Mode 2: In this operating mode and regardless of the status of any of the logic inputs, the TSA7887 is always fully
powered up.
PM Mode 3: In this operating mode, the TSA7887 is automatically powered down at the end of each conversion
regardless of the state of the CS input. ADC wake-up time from full shutdown is 5μs and system design should ensure
that at least 5μs have elapsed before attempting to perform a conversion in this mode; otherwise, an invalid conversion
result may occur.
PM Mode 4: In this operating mode, the TSA7887 is configured for standby operation after conversion. Sections of the
TSA7887 are powered down; however, the internal 2.5-V reference voltage remains powered up. While PM Mode 4 is
similar to PM Mode 3, PM Mode 4 operation allows the TSA7887 to power up much faster. For optimal performance, the
Control Register’s REF bit (DB5) should be a “zero” (“0”) to ensure the internal reference is enabled/remains enabled.
TSA7887 Rev. 1.0
TSA7887
DESCRIPTION OF OPERATION
The TSA7887 is a single-supply, low-power,
single/dual-channel,
12-bit
successiveapproximation ADC with an easy-to-use serial
interface. The ADC can be operated from a 3V
supply (2.7V to 3.6V) or from a 5V supply (4.75V to
5.25V). When operated from either a 3V or 5V
supply, the TSA7887 can operate at throughput
rates up to 125ksps when an external 2 MHz clock is
applied.
In 8-pin SOIC and MSOP packages, the TSA7887
integrates a 2.5-V reference, a high-speed
track/hold, a successive-approximation ADC, and a
serial digital interface. An external serial clock is
used to transfer data to/from the ADC and controls
the TSA7887’s conversion process. The TSA7887
can be configured for single- or two-channel
operation. When configured as a single-channel
ADC, the analog input range is 0 to VREF (where an
externally applied VREF, if used, can range between
1.2 V and VDD). When the TSA7887 is configured
for two-channel applications, the analog input range
on each channel is set internally from 0V to VDD.
If the TSA7887 is configured for single-channel
operation, the TSA7887 can be operated in a readonly mode by applying a logic LOW at all times to
the DIN pin (Pin 6) or by hard-wiring the DIN pin
permanently to GND. For maximum flexibility to
address multiple configurations based on the
application, the DIN input can be used to load ADC
configuration data from a host processor into the
TSA7887’s 8-bit Control Register.
TSA7887 Operation and Transfer Function
analog input on one side and REF on the other, the
analog signal is acquired. During the acquisition
phase, the inputs to the comparator are balanced
since both inputs are connected to REF.
During the conversion phase as shown in the
equivalent circuit in Figure 2, Switch SW1 is moved
from Position A to GND at Position B and Switch
SW2 is opened. At this point in time, the inputs to
Figure 2: TSA7887’s Conversion Phase Equivalent
Circuit
the
comparator
become
unbalanced.
The
TSA7887’s control logic and the chargeredistribution DAC work together to add or subtract
fixed packets of charge from the sampling capacitor
to balance once again the comparator input
terminals. At the time when the comparator is
rebalanced, the conversion process is complete and
the ADC’s control logic generates the ADC serial
output conversion data.
Figure 3 illustrates the ideal transfer function for the
TSA7887 where the output data is coded straight
binary. Thus, the designed code transitions occur at
successive integer LSB values (that is, at 1 LSB, at
2 LSBs, etc) where the LSB size is VREF/4096.
The TSA7887 is a successive-approximation ADC,
the core of which is a charge-redistribution DAC.
Figure 1 illustrates an equivalent circuit for the
TSA7887 in signal acquisition phase. Here, Switch
SW1 is in Position A and Switch SW2 is closed. With
the sampling capacitor’s terminals connected to the
Figure 1:TSA7887’s Acquisition Phase Equivalent
Circuit
TSA7887 Rev. 1.0
Figure 3: TSA7887’s Unipolar Transfer Function for
Straight Binary Digital Data.
Page 9
TSA7887
Typical Application Circuit
Figure 4 shows a typical application circuit for the
TSA7887 where the ADC’s GND pin is connected to
the analog ground plane of the system. In this
application circuit, the TSA7887 has been
configured for two-channel operation so the ADC’s
VREF is internally connected to VDD; as a result,
avoided. Thus, the analog input signal should never
exceed the either VDD or GND by more than
200mV. Even though the maximum current these
diodes can conduct without causing irreversible
damage to the ADC is 20mA, any small amount of
forward diode current into the substrate because of
an overvoltage condition on an unselected channel
can cause inaccurate conversion results on the
selected channel.
Attributed to parasitic package pin capacitance,
capacitor C1 in Figure 5 is typically about 1 pF.
Resistor R1 is the equivalent series resistance of the
TSA7887’s input multiplexer and input sampling
switch and is approximately 100Ω. Capacitor C2 is
the ADC sampling capacitor and has a typical
capacitance of 10 pF.
the analog input range on either analog input is 0V
to VDD. It is always considered good engineering
practice to bypass the ADC’s VDD with good quality
capacitors with short leads (surface-mount
components are preferred) and located a very short
distance from the ADC. The conversion result at the
DOUT pin is a 16-bit word with four leading zeros
followed by the MSB of the 12-bit conversion result.
In low-power applications, automatic-power-down-atthe-end-of-conversion modes (PM Modes 3 or 4)
should be used to improve the ADC’s power
consumption-versus-throughput rate performance.
For additional information on the TSA7887’s four
power management operating modes, please
consult the Operating Modes section of the
datasheet.
Analog Input Details
An equivalent circuit of the analog input structure of
the TSA7887 is illustrated in Figure 5 where diodes
D1 and D2 serve as ESD-clamp protection for the
analog inputs. Since there are diodes from the
analog input to both VDD and GND, it is important
any forward conduction of current in D1 or D2 is
Figure 5: TSA7887’s Analog Input Equivalent Circuit.
Page 10
When the analog input is not driven by an external
amplifier, the driving-point source impedance should
be low. The maximum source impedance will
depend upon the amount of total harmonic distortion
(THD) that can be tolerated in the application. THD
will increase as the source impedance increases
Figure 6: TSA7887 THD vs Analog Input Frequency
TOTAL HARMONIC DISTORTION - dBc
Figure 4: TSA7887's Typical Application Circuit.
In signal-acquisition (or ac) applications, the use of
an external R-C low-pass filter on either or both
analog inputs can be useful in removing out-of-band
high-frequency components from the analog input
signal. In applications where harmonic distortion and
signal-to-noise ratio performance are important, the
analog input(s) should be driven from a lowimpedance source. Large source impedances will
affect significantly the TSA7887’s ac performance.
To lower the driving-point impedance level may
impose the use of an input buffer amplifier. The
optimal choice for the external drive op amp will be
determined by application requirements as well as
the TSA7887’s dynamic performance.
-60
-65
VDD = 5V
5V External Reference
-70
-75
-80
RIN = 10Ω, CIN = 10nF
-85
RIN = 50Ω, CIN = 2.2nF
-90
0.2
40
20
30
10
INPUT FREQUENCY - kHz
50
TSA7887 Rev. 1.0
TSA7887
The TSA7887’s Internal 2.5-V Reference
Using the REF bit (the DB5 bit) in the TSA7887’s
Control Register, the TSA7887’s internal 2.5-V
reference can be enabled (DB5 cleared to “0”) or
disabled (DB5 set to “1”). If enabled (the default
condition), the internal voltage reference can be
used in applications for other purposes and, if this is
desired, the reference should be buffered by an
external, precision op amp. If an external, precision
voltage reference is to be used instead of the
TSA7887’s internal reference, the internal reference
is automatically overdriven. In this case, the
TSA7887’s internal reference should be disabled by
setting the REF bit in the control register. When the
internal reference is disabled, switch SW1 as shown
in Figure 7 opens and the input impedance seen at
the AIN1/VREF pin is the reference buffer’s input
Figure 7: TSA7887’s Integrated 2.5-V VREF Circuitry.
impedance, approximately in the gigaohm range
(GΩ). When the internal reference is enabled, the
input impedance at the AIN1/VREF pin is typically
10kΩ. When the TSA7887 is configured for twochannel operation, the TSA7887’s reference is set
internally to VDD.
TSA7887’s Power-Down Operating Modes
The TSA7887 provides flexible power management
to allow the user to achieve the best power
performance for a given throughput rate. The four
power management options are selected by
programming the TSA7887’s power management
bits (“PM” Bits PM1 and PM0) in the control register
as summarized in Table 6. When the PM bits are
programmed for either of the auto power-down
modes (PM Mode 3 or 4), the TSA7887 is powereddown on the 16th low-to-high SCLK transition after a
high-to-low CS transition. The first high-to-low SCLK
transition after a high-to-low CS transition powers-
TSA7887 Rev. 1.0
up the TSA7887 again. When the TSA7887 is
programmed in PM Mode 1 (i.e., [PM1,PM0] = [0,0],
the default condition), the TSA7887 is powered
down on a low-to-high CS transition and powers up
from shutdown on a high-to-low CS transition. If the
CS pin is toggled low-to-high during the conversion
in this operating mode, the ADC is immediately
powered down.
Cold-Start and Standby Power-Up Delay Times
When VDD is first applied to the TSA7887 (in other
words, from cold start-up), the ADC powers up in PM
Mode 1 ([PM1,PM0] = [0,0]). Upon a subsequent
high-to-low CS transition, the TSA7887’s power-up
delay time is approximately 5μs When using an
external voltage reference in single-channel
operation or when the TSA7887 is powered up from
standby mode (PM Mode 4), its power-up delay time
is approximately 1μs because the internal reference
has been either disabled (refer to Control Register
DB5) or the internal reference has remained
powered up (via PM Mode 4). Since the TSA7887’s
power-up delay time PM Mode 4 is very short,
powering up the ADC and executing a conversion
with valid results in the same read/write operation is
feasible.
TSA7887 Power Consumption vs.
Throughput Rate Considerations
In operating the TSA7887 in auto-shutdown mode
(PM Mode 3), in auto-standby mode (PM Mode 4),
or in PM Mode 1, the average power drawn by the
TSA7887 decreases at lower throughput rates. As
shown in Figure 8, the average power drawn from
Figure 8: TSA7887 Power Consumption
vs Throughput Rate
10
POWER CONSUMPTION - mW
and performance will degrade. Figure 6 illustrates
how the TSA7887’s harmonic performance as a
function of frequency is affected by different source
impedances.
VDD = 5V
SCLK = 2MHz
1
VDD = 3V
SCLK = 2MHz
0.1
0.01
0
10
20
30
40
50
THROUGHPUT RATE - ksps
Page 11
TSA7887
the supplies by the ADC is commensurately reduced
the longer the TSA7887 remains in a powered-down
state.
For example, consider the following TSA7887
application configuration: (a) the ADC is powered
from VDD = 5V and is configured for PM Mode 3
(that is, [PM1, PM0] = [1,0], where the ADC’s
internal reference is enabled and the ADC
automatically powers down after the conversion is
completed); and (b) the ADC operates at a
throughput rate of 10 ksps with a 2-MHz SCLK.
Given the above configuration, the TSA7887’s
power consumption during normal operation is
3.5mW at VDD = 5 V (0.7mA x 5V). Since its powerup delay time is 5μs and its conversion-plusacquisition time is ~7.75μs (tCONVERT + tACQ = 14.5 x
tSCLK + 1.5 x tSCLK = 15.5 x tSCLK), the TSA7887
consumes 3.5mW for 12.75μs during each
conversion cycle. Since the conversion cycle time
(100μs) is the reciprocal of the ADC’s throughput
rate (10ksps), the average power consumed by the
TSA7887 during each conversion cycle is
(12.75/100) × (3.5mW), or 446.25μW. If the ADC’s
configuration were unchanged and, if the supply
voltage were then reduced to 3V, the power
consumed by the ADC would then be 2.1mW
(0.7mA x 3V). Since the total time required for
power-up, acquisition, and conversion remains at
12.75μs, the average power consumed during each
cycle at a 10-ksps throughput rate is (12.75/100) ×
(2.1mW), or 267.75μW. The TSA7887’s power
consumption vs. throughput rate when configured for
automatic shutdown post conversion and operating
on both 5V and 3V supplies is illustrated in Figure 8.
Power Management Operating Modes
Designed to provide flexible power consumption
profiles, the TSA7887 incorporates four different
operating modes to optimize the ADC’s power
consumption/throughput-rate ratio. As previously
described in Table 6, the four different modes of
operation in the TSA7887 are controlled by the PM1
and PM0 bits of the Control Register. Also
mentioned previously, the TSA7887 can be
configured as a read-only ADC by forcing an all
zeros (“0”s) condition in the control register. This can
be easily done by applying a logic LOW at all times
to the DIN pin or hard-wiring the DIN pin directly to
GND.
Power Management Mode 1 Operation:
[PM1,PM0] = [0,0]
Power Management Operating Mode 1 is used to
control the TSA7887’s power-down using the CS pin.
Whenever the CS pin is low, the TSA7887 is fully
powered up; whenever the CS pin is high, the
TSA7887 is completely powered down. When the
CS pin is toggled high-to-low, all internal circuitry
starts to power up where it can take as long as 5μs
for the TSA7887’s internal circuitry to power up
completely. As a result, any conversion start
sequence should not be initiated during this initial
5μs power-up delay.
Figure 9 shows a general operating diagram of the
TSA7887 in PM Mode 1. The analog input signal is
sampled on the second low-to-high SCLK transition
following the initial high-to-low CS transition. System
timing design should incorporate a 5-μs delay
between the high-to-low CS transition and the
second
low-to-high
SCLK
transition.
In
microcontroller applications, this is achieved by
Figure 9: TSA7887’s Power Management Mode 1 Operation Diagram.
Page 12
TSA7887 Rev. 1.0
TSA7887
driving the CS pin from one of the host processor’s
port lines and ensuring that the serial data read
(from the microcontroller’s serial port) is not initiated
for at least 5μs.
In DSP applications, where the CS signal is derived
typically from the DSP’s serial frame synchronization
port, it is usually not possible to separate a high-tolow CS transition and a second low-to-high SCLK
transition by up to 5μs without affecting the DSP
system serial clock speed. Therefore, system timing
design should incorporate a WRITE to the
TSA7887’s control register to terminate PM Mode 1
operation and program the ADC into PM Mode 2;
that is, by writing [PM1,PM0] = [0,1] into the
TSA7887’s control register. To get a valid
conversion result, a second conversion must be
initiated when the ADC is powered up. A WRITE
operation that takes place with this second
conversion can program the ADC back into PM
Mode 1 where the power-down operation is enabled
when the CS pin is toggled high
Power Management Mode 2 Operation:
[PM1,PM0] = [0,1]
Regardless of the status of the CS signal, the
TSA7887 remains fully powered up in this mode of
operation. PM Mode 2 should be used for fastest
throughput rate performance because the system
timing design does not need to incorporate the
TSA7887’s 5-μs power-up delay time. Figure 10
shows the general operating diagram for the
TSA7887 in PM Mode 2.
Serial data programmed into the TSA7887 at the
DIN input during the first eight clock cycles of data
transfer are loaded to the control register. For the
TSA7887 to remain in PM Mode 2, system timing
design must always write [PM1, PM0] = [0,1] into the
control register on every serial input data transfer.
A high-to-low CS transition initiates the conversion
sequence and the analog input signal is sampled on
the second low-to-high SCLK transition. Sixteen
serial clock cycles are required to complete the
conversion and to transfer the conversion result to
the host processor. Another conversion can be
initiated immediately by toggling the CS pin low
again once data transfer is complete (that is, once
the CS signal is toggled high).
Power Management Mode 3 Operation: [PM1,
PM0] = [1,0]
In this mode, the TSA7887 is automatically powered
down at the end of every conversion. It is similar to
PM Mode 1 except that the status of the CS signal in
PM Mode 3 does not have any effect on the powerdown status of the TSA7887.
Figure 11 shows the general operating diagram of
the TSA7887 in PM Mode 3. On the first high-to-low
SCLK transition after CS is toggled low, all
TSA7887’s internal circuitry starts to power up.
Similarly to PM Mode 1, it can take as long as 5μs
for the TSA7887’s internal circuitry to power up
completely. As a result, any conversion start
sequence should not be initiated during this initial
5-μs power-up delay. The analog input signal is
sampled on the second low-to-high SCLK transition
following the high-to-low CS transition. As shown in
Figure 18, system timing design should incorporate
a 5-μs delay between the first high-to-low SCLK
transition and the second low-to-high SCLK
transition after the high-to-low CS transition.
Figure 10: TSA7887’s Power Management Mode 2 Operation Diagram.
TSA7887 Rev. 1.0
Page 13
TSA7887
Figure 11: TSA7887’s Power Management Mode 3 Operation Diagram for Slow-SCLK Microcontrollers.
Figure 12: TSA7887’s Power Management Mode 3 Operation Diagram for Fast-SCLK Microcontrollers and DSPs.
In microcontroller applications (or in systems with a
slow serial clock), the system timing design can be
devised to accommodate this timing alignment by
assigning the CS signal to one of the port lines and
then adjusting the timing such that the serial data
read (from the microcontroller’s serial port) is not
initiated for at least 5μs.
However, in systems with higher speed serial clocks
(not
unlike
high-speed
serial-clock
DSP
applications), it may not be possible to insert a 5μs
delay between ADC power up and the first low-tohigh SCLK transition. Therefore, system timing
design should incorporate a WRITE to the
TSA7887’s control register to terminate the ADC’s
PM Mode 3 operation and program the TSA7887
into PM Mode 2; that is, by writing [PM1,PM0] = [0,1]
into the TSA7887’s control register. To get a valid
conversion result, a second conversion must be
initiated when the ADC is powered up – see
Figure 19. A WRITE operation that takes place with
this second conversion can program the ADC back
Page 14
into PM Mode 3 where the power-down operation is
enabled when the conversion sequence terminates.
Power Management Mode 4 Operation:
[PM1,PM0] = [1,1]
In PM Mode 4, the TSA7887 is automatically placed
in standby (or sleep) mode at the end of every
conversion. In this mode, all internal circuitry is
powered down except for the internal 2.5-V
reference. PM Mode 4 is similar to PM Mode 3; in
this case, the power-up delay time is much shorter
(1μs vs 5μs) because the internal reference remains
powered up at all times.
Figure 13 shows the general operating diagram of
the TSA7887 in PM Mode 4. On the first high-to-low
SCLK transition after the CS pin is toggled low, the
TSA7887 is powered up out of its standby mode.
Since the TSA7887’s power-up delay time PM Mode
4 is very short, powering up the ADC and executing
a conversion with valid results in the same read/write
operation is feasible. The analog input signal is
sampled on the second low-to-high SCLK transition
TSA7887 Rev. 1.0
TSA7887
Figure 13: TSA7887’s Power Management Mode 4 Operation Diagram.
following the high-to-low CS transition. At the end of
conversion (after the last low-to-high SCLK
transition), the ADC is powered down automatically
back into its standby mode.
The TSA7887’s Serial Interface Description
Figure 14 shows the detailed timing diagram for
TSA7887’s serial interface. The serial clock provides
the conversion clock and also controls the transfer of
data to/from the TSA7887 during conversion.
The CS signal initiates the serial data transfer and
controls the TSA7887’s conversion process. In PM
Modes 1, 3, and 4, a high-to-low CS transition
powers up the ADC. In all cases, the CS signal
gates SCLK to the TSA7887 and sets the ADC’s
internal track-and-hold into track mode. The analog
input signal is then sampled on the second low-tohigh SCLK transition following the high-to-low CS
transition. Thus, the analog input signal is acquired
during the first 1.5 SCLK clock cycles (tACQ) after the
high-to-low CS transition. In modes where the high-
to-low CS transition powers up the ADC, the
acquisition time must include a 5-μs power-up delay.
The ADC’s internal track-and-hold moves from track
mode to hold mode on the second low-to-high SCLK
transition and a conversion is also initiated on this
transition. The conversion process takes an
additional 14.5 SCLK cycles to complete. After the
conversion is completed, a subsequent low-to-high
CS transition sets the serial data bus back into a
high-Z (or three-state) condition. A new conversion
can be initiated if the CS signal is left low.
In dual-channel operation, the current conversion
result is associated to the selected analog channel
programmed during the previous write cycle to the
control register. Therefore, in dual-channel
operation, the system code design must perform a
channel address write for the next conversion while
the current conversion is in progress.
Writing serial data to the Control Register always
takes place and occurs on the first eight low-to-high
SCLK transitions. However, the TSA7887 can be
configured as a read-only device by physically
Figure 14: TSA7887’s Detailed Serial Interface Timing Diagram.
TSA7887 Rev. 1.0
Page 15
TSA7887
loading all “zeros” (“0”s) into the Control Register
every time, by applying a logic LOW to the DIN pin
at all times, or by hard-wiring the DIN pin to GND.
When the TSA7887 is configured in WRITE/READ
modes, system code design must be designed
always to load the correct data onto the DIN line
when reading data from the TSA7887.
Sixteen serial clock cycles are required to perform
the conversion process and to transfer data
to/access data from the TSA7887. In applications
where the first serial clock transition following a highto-low CS transition is a high-to-low SCLK transition,
DOUT transitions from a high-Z state to a first
leading zero; thus, the first low-to-high SCLK
transition generates the first leading zero on DOUT.
In applications where the first serial clock transition
following a high-to-low CS transition is a low-to-high
SCLK transition, the first leading zero may not be set
up in time for the host processor to read it correctly.
However, subsequent DOUT bits are transferred out
on high-to-low SCLK transitions so that they are
ready for the host processor on the following low-tohigh SCLK transition. Thus, the second leading zero
is transferred out on the high-to-low SCLK transition
subsequent to the first low-to-high SCLK transition.
Therefore, DOUT’s final bit in the data transfer is
valid on the 16th low-to-high SCLK transition, having
been transferred out of the ADC on the previous
high-to-low SCLK transition.
Figure 15: Interfacing the TSA7887 to TSM320C5x-type
DSPs.
TSA7887’s CS input. The TMS320C5x’s serial port
control register (SPC) must be configured in the
following manner:
Table 3: TMS320C5x Serial Port Control Register
Setup
FO
0
FSM
1
MCM
1
TXM
1
A TSA7887 to ADSP-21xx DSP Interface
The TSA7887 is easily interfaced to the ADSP-21xx
(or equivalent) family of DSPs using an inverter
between the ADSP-21xx’s serial clock and the
TSA7887 as shown in Figure 16. The ADSP-21xx’s
SPORT control register should be configured in
Alternate Framing mode as shown in Table 4 and
the ADSP-21xx’s serial clock frequency is set in its
SCLKDIV register.
Interfacing the TSA7887 to IndustryStandard Microprocessors and DSPs
The serial interface on the TSA7887 allows the ADC
to be directly connected to a number of many
microprocessors and DSPs. How to interface the
TSA7887 with some of the more common
microcontroller and DSP serial interface protocols is
covered in this section.
A TSA7887 to TMS320C5x DSP Interface
With peripheral serial devices like the TSA7887, the
TMS320C5x’s serial interface has a continuous
serial clock and frame synchronization signals to
time the data transfer operations. A single logic
inverter is the only glue logic required between the
TMS320C5x’s CLKX output and the TSA7887 SCLK
input and is illustrated in the connection diagram of
Figure 15. The TMS320C5x’s serial port is
configured to operate in burst mode using the
TMS320C5x’s internal CLKX (serial clock transmit)
and FSX (frame sync transmit) programmed as the
Page 16
Figure 16: Interfacing the TSA7887 to ADSP-21xx-type
DSPs.
Table 4: SPORT0 Control Register Setup
Bit(s)
TFSW, RFSW
INVRFS, INVTFS
DTYPE
SLEN
ISCLK
TFSR, RFSR
IRFS
ITFS
Setting
1
1
00
1111
1111
1
0
1
Description
Alternative framing
Active-low frame signal
Right justified data
16-bit data word
Internal serial clock
Frame every word
TSA7887 Rev. 1.0
TSA7887
With the ADSP-21xx’s TFS and RFS pins of its
SPORT connected together, the TFS is configured
as an output and RFS configured as an input. The
frame synchronization signal generated on the TFS
output serves as the TSA7887’s CS input. In this
example, however, since a timer interrupt is used to
control the sampling rate of the ADC, it may not be
possible to perform equidistant sampling (a required
criterion in all signal processing applications) under
certain application conditions.
The ADSP-21xx’s timer registers are configured in
such a manner that an interrupt is generated
internally at the required sample interval. When the
timer interrupt is received, an ADC control word is
transmitted at the DT output with TFS. The TFS
signal is then used to control the RFS and hence the
data read from the TSA7887. When the instruction
to transmit with TFS is executed (that is, AX0 =
TX0), the state of the SCLK is checked. The DSP
waits until the SCLK has toggled high-to-low-to-high
before a transmission will commence. If the timer
and SCLK values are set such that the instruction to
transmit occurs on or near the low-to-high SCLK
transition, data may be transmitted or the DSP may
wait to transmit data until the next clock edge.
For example, consider an ADSP-2111 that has been
chosen as the host processor. Since it has a
16-MHz master clock frequency, a SCLKDIV value
of 3 is necessary to program its SPORT serial clock
output to operate at 2MHz for the TSA7887
(16MHz ÷ 23 = 2MHz); thus, eight master clock
periods will elapse for every one TSA7887 SCLK
period. If the ADSP-2111’s timer registers are
loaded with a value of 803, 100.5 SCLKs will occur
between interrupts and subsequently between
transmit instructions. Because the transmit
instruction occurs on an SCLK edge, non-equidistant
sampling is the result. The DSP will implement
equidistant sampling only if the number of SCLKs
between interrupts is a whole integer number.
A TSA7887 to DSP56xxx DSP Interface
Connecting the TSA7887 for use with Freescale’s
(nee Motorola’s) DSP56xxx family of DSPs is shown
in Figure 17 where an inverter is used between the
DSP56xxx’s SCK output and the TSA7887’s SCLK
input. The DSP56xxx’s SSI (synchronous serial
interface) is configured in synchronous mode (SYN
bit = 1 in CRB) with an internally generated 1-bit
clock period frame sync for both Tx and Rx (Bits
FSL1 = 1 and FSL0 = 0 in CRB). Word length is set
to 16 by setting bits WL1 = 1 and WL0 = 0 in CRA.
TSA7887 Rev. 1.0
Figure 17: Interfacing the TSA7887 to DSP56xxx-type
DSPs.
A TSA7887 to 68HC11 Microcontroller Interface
Connecting the TSA7887 to Freescale’s 68HC11
(nee Motorola’s MC68HC11) is shown in Figure 18.
The microcontroller’s serial peripheral interface (SPI)
is configured for Master Mode (MSTR = 1) with its
Clock Polarity Bit (CPOL) set to 1 and Clock Phase
Bit (CPHA) set to 1. Serial data transfer from the
TSA7887 to the 68HC11 requires two 8-bit transfers
and the 68HC11’s SPI is configured by writing to the
SPI Control Register (SPCR) — consult the 68HC11
User Manual for more information.
Figure 18: Interfacing the TSA7887 to 68HC11-type
Microcontrollers.
A TSA7887 to 8051 Microcontroller Interface
Using the parallel port of legacy 8051-type (or
equivalent) microcontrollers, a serial interface to the
TSA7887 can be designed as shown in Figure 19.
As a result, full duplex serial transfer to be
implemented. The technique involves “bit-banging”
one of the the microcontroller’s I/O ports (for
example, P1.0) to generate a serial clock and using
Figure 19: Interfacing the TSA7887 to Legacy 8051-type
Microcontrollers.
Page 17
TSA7887
two other I/O ports (for example, P1.1 for DOUT and
P1.2 for DIN) to transfer data from/to the TSA7887.
A TSA7887 to PIC16C6x/PIC16C7x
Microcontroller Interface
As shown in Figure 20, the connection between the
TSA7887 and the PIC16C6x/PIC16C7x is simple
and does not require any glue logic circuits. The
PIC16C6x synchronous serial port (SSP) is
configured as an SPI master with its clock polarity bit
set to 1 by writing to the synchronous serial port
control register (SSPCON). In this example, I/O port
RA1 is being used to generate the TSA7887’s CS
signal. Since this microcontroller family only
transfers eight bits of data during each serial transfer
operation, two consecutive read/write operations are
required. For additional information, please consult
the PIC16/PIC17 Microcontroller User Manual.
Figure 20: Interfacing the TSA7887 to
PIC16C6x/PIC16C7x-type Microcontrollers.
APPLICATIONS INFORMATION
Ground Plane Management and Layout
For best performance, printed circuit boards should
always be used and wire-wrap boards are not
recommended. Good PC board layout techniques
ensure that digital and analog signal lines are kept
separate from each other, analog and digital
(especially clock) lines are not routed parallel to one
another, and high-speed digital lines are not routed
underneath the ADC package.
A contiguous analog ground plane should be routed
under the TSA7887 to avoid digital noise coupling. A
single-point analog ground (star ground point)
should be created at the ADC’s GND and separate
from any digital logic ground. All analog grounds as
well as the ADC’s GND pin should be connected to
the star ground. No other digital system ground
should be made to this ground connection. For
lowest-noise operation, the ground return to the star
ground’s power supply should be low impedance
and as short as possible.
Page 18
Even though the TSA7887’s exhibits excellent
supply rejection as shown in th Typical Operating
Characteristics, it is always considered good
engineering practice to prevent high-frequency noise
on the TSA7887’s VDD power supply from affecting
the ADC’s high-speed comparator. Therefore, the
VDD supply pin should be bypassed to the star
ground with 0.1μF and 10μF capacitors in parallel
and placed close to the ADC’s Pin 2 as was shown
in Figure 4. Component lead lengths should be very
short for optimal supply-noise rejection. If the power
supply is very noisy, an optional 10-Ω resistor
inserted in series with the TSA7887’s VDD pin can
be used in conjunction with the bypass capacitors to
form a low-pass filter.
Evaluating the TSA7887’s Dynamic Performance
The recommended layout for the TSA7887 is
outlined in the demo board manual for the TSA7887.
The
demo
board
kit
includes
a
fully
assembled/tested demo board and documentation
describing how to evaluate the TSA7887’s dynamic
performance using Silicon Labs’ proprietary TSDAVB data acquisition/capture kit.
TSA7887 Rev. 1.0
TSA7887
PACKAGE OUTLINE DRAWING
8-Pin MSOP Package Outline Drawing
(N.B., Drawings are not to scale)
3.10 Max
2.90 Min
0.38 Max
0.28 Min
0.65 REF
8
0.23 Max
0.13 Min
0.127
0.27 REF
3.10 Max
2.90 Min
5.08 Max
4.67 Min
GAUGE PLANE
0' -- 6'
1
2
0.70 Max
0.40 Min
0.25
0.38 Max
0.28 Min
DETAIL “A”
DETAIL ‘A’
0.95 Max
0.75 Min
1.10 Max
SEATING PLANE
0.10 Max
0.15 Max
0.05 Min
0.23 max
0.13 Min
NOTE:
1. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
2. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTUSIONS.
3. CONTROLLING DIMENSION IN MILIMETERS.
4. THIS PART IS COMPLIANT WITH JEDEC MO-187 VARIATIONS AA
5. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED AS SPECIAL CHARACTERISTIC.
TSA7887 Rev. 1.0
Page 19
TSA7887
PACKAGE OUTLINE DRAWING
8-Pin SOIC Package Outline Drawing
(N.B., Drawings are not to scale)
0.546 REF
0.33 - 0.51
5.80 – 6.20
1.27 TYP
4.80 - 5.00
LEADFARME
THICKNESS
0.19 – 0.25
1
1.32 – 1.52
7' REF ALL SIDE
1.75 Max
3.73 - 3.89
7' REF
ALL SIDE
2
0.48 Max
0.28 Min
45' Angle
0.76 Max
0.66 Min
GAUGE PLANE
3.81 – 3.99
0.25
0.10 – 0.25
0.10 Max
Notes:
1
Does not include mold flash, protrusions or gate burns.
Mold flash, protrusions or gate burrs shall not exceed
0.15 mm per side.
2
Does not include inter-lead flash or protrusions. Inter-lead
flash or protrusions shall not exceed 0.25 mm per side.
3.
Lead span/stand off height/coplanarity are considered as
special characteristic (s).
4.
Controlling dimensions are in mm.
5.
This part is compliant with JEDEC specification MS-012
6.
Lead span/stand off height/coplanarity are considered as
Special characteristic.
2
0 - 8°
0.406 – 0.863
Patent Notice
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analog-intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class
engineering team.
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400 West Cesar Chavez, Austin, TX 78701
+1 (512) 416-8500 ▪ www.silabs.com
TSA7887 Rev. 1.0