Quality and Reliability Report Second Quarter 2015 Document ID: 15Q2_QR_Report.doc Note: All rights reserved. No part of this publication may be reproduced or transmitted without prior approval by Silicon Labs. This document is the property of Silicon Labs and shall be returned upon request. Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Table of Contents Quality and Reliability Report ............................................................................... 3 Overview .................................................................................................................. 3 Quality Assurance .................................................................................................. 4 Overview .................................................................................................................. 4 Figure 1 – Quality Monitor Flow ............................................................................... 4 Electrical and Visual / Mechanical Outgoing Quality Graphs ................................... 5 Part Numbers by Fab Technology ........................................................................ 6 Failure Rate Estimation ......................................................................................... 9 Failure Rate Calculation Method .............................................................................. 9 FIT Rate Curves and Data ..................................................................................... 10 0.11um OTP Reliability Summary .......................................................................... 44 0.13um OTP Reliability Summary .......................................................................... 45 0.18um Flash Reliability Summary ......................................................................... 46 0.18um OTP Reliability Summary .......................................................................... 47 0.25um HDR Flash Reliability Summary ................................................................ 48 0.35um Non-HE Flash Reliability Summary ........................................................... 49 0.35um HE Flash Reliability Summary ................................................................... 50 Reliability Monitor Program ................................................................................ 51 Overview ................................................................................................................ 51 Stress Descriptions .............................................................................................. 51 Reliability Tests, Procedures and Conditions Table ............................................... 51 Silicon Reliability Test Method and Conditions ................................................ 52 Reliability Monitor Report – Silicon Stresses .................................................... 53 Package Reliability Test Method and Conditions ............................................. 58 Reflow Profile and Moisture Sensitivity Level ................................................... 59 Overview ................................................................................................................ 59 Reflow Profile ......................................................................................................... 59 Moisture Sensitivity Level ....................................................................................... 59 Reliability Monitor Report – Package Stresses ................................................. 60 Revision History ................................................................................................... 70 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 2/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Quality and Reliability Report Overview Silicon Labs is pleased to share this Quality and Reliability Report with our customers. It provides the latest quality performance data along with failure rate estimates and reliability monitor data. These data are collected on a continual basis as qualification, production and reliability monitors are completed. The report is published and updated quarterly to provide customers visibility to the most recent information. The Quality Trend charts on page 5 are shown on a rolling five year basis. All other reports include data from the previous four quarters on a rolling, one year basis. The report provides data covering: Estimates of shipped product quality Long-term operating life estimates Mean time to failure estimates Data retention life estimates Reliability monitor results Silicon Labs is registered to the current versions of ISO 9001, ISO14001 and maintained certification to ISO/TS 16949 from January 2008 to January 2015. Due to a change in the ISO/TS 16949 certification eligibility requirements in 2013, fabless semiconductor companies are no longer eligible for certification. Silicon Labs will remain compliant to ISO/TS 16949 and continues to be audited to this standard during both internal and external annual audit cycles. Silicon Labs only uses ISO/TS 16949 certified suppliers. Silicon Labs is committed to quality excellence. That commitment is demonstrated by extensive product and process qualification. Each product undergoes extensive qualification testing prior to production release. Silicon Labs qualifies integrated circuit products using JEDEC JESD47, Stress-Test-Driven Qualification of Integrated Circuits or AEC-Q100, Stress Test Qualification for Integrated Circuits, as appropriate. Once a product is qualified, on-going product quality and reliability is verified through monitoring programs. Monitors are scheduled to periodically sample wafer fab technologies and package technologies. The results are published in this report. Any failures are used to drive corrective action and process and product improvement. We hope you find this report useful. Please let us know if you have any specific questions or suggestions. All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 3/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Quality Assurance Overview Two elements of product quality are reported – electrical quality and mechanical/visual quality. We measure electrical quality by taking a sample (monitor) of production parts and retesting the sample to the datasheet limits (see Figure 1). The sample electrical test may be performed at an alternate test temperature to verify part performance across the datasheet temperature range. This sample method identifies defects introduced at the test process step or that have escaped the test process. Any failures drive corrective actions and product/process improvements. Visual/Mechanical quality is estimated by sample inspection of the completed product prior to final pack. Inspection items cover a broad range of characteristics and include mark, count, label, cover tape workmanship, moisture barrier bag integrity, lead location, part placement, and many other general workmanship items required for customer satisfaction and product protection during shipment. Any failures drive corrective actions and process improvements. Figure 1 – Quality Monitor Flow Order Fulfillment Assembly Test Electrical DPPM Scan FGI Ship Mechanical DPPM All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 4/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Electrical and Visual / Mechanical Outgoing Quality Graphs 15Q2 Sample size = 6,228,357 15Q2 Sample size = 64,420,745 dppm = 3 dppm = 0 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 5/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Part Numbers by Fab Technology PN 5XX BCXX C8051F0XX C8051F1XX C8051F2XX C8051F30X C8051F31X C8051F32X C8051F33X C8051F34X C8051F35X C8051F36X C8051F37X C8051F37X C8051F38X C8051F39X C8051F4XX C8051F5XX C8051F7XX C8051F8XX C8051F9XX C8051TXXX CF0XX CF1XX CF2XX CF30X CF31X CF32X CF33X CF34X CF35X CF36X CF37X CF38X CF39X CF4XX CF5XX CF7XX CF8XX CF9XX CP2101 CP2102 CP2103 CP2104 CP2105 CP2107 CP2108 CP2109 CP211X CP2120 CP213X CP22XX CP240X CP254X CP26XX CP3XXX CP4000 CTXXX CY2277 CY2815 CY2831 CY2832 CY2834 CY28353 CY28354 Technology 0.13 um 0.11 um 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.18 um, embedded flash 0.35 um, EEPROM 0.18 um, embedded flash 0.18 um, embedded flash 0.25 um, embedded flash 0.25 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, OTP 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.25 um, embedded flash 0.25 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, embedded flash 0.18 um, OTP 0.18 um, OTP 0.35 um, embedded flash 0.18 um, OTP 0.35 um, embedded flash 0.18 um 0.18 um, OTP 0.18 um, embedded flash 0.18 um, OTP 0.13 um 0.18 um, OTP 0.6 um - 1.0 um 0.6 um - 1.0 um 0.45 um - 0.5 um 0.45 um - 0.5 um 0.315 um - 0.35 um 0.315 um - 0.35 um 0.25 um PN CY28354 CY2840 CY2841 CY2844 CY2854 CY2855 CY2880 CY28SR CY2SST CY505Y CYI953 CYI983 CYWXXX EFM32X EFM8X EM25X EM26X EM34X EM35X EZR32X EZR32X IA10XX IA11XX IA12XX IA13XX IA14XX IA21XX IA32XX IA35XX IAP24X IAP32X IAP38X IAP4XX IAP5XX IAP6XX IAP7XX IAP86X IAP87X IAP90X IAP91X IAP93X S3CX S3UX Si100X Si100X Si101X Si101X Si102X Si102X Si103X Si103X Si106X Si106X Si108X Si1102 Si1102 Si1120 Si1120 Si113X Si114X Si210X Si2110 Si2111 Si2113 Si2115 Technology 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.315 um - 0.35 um 0.25 um 0.315 um - 0.35 um 0.315 um - 0.35 um 0.45 um - 0.5 um 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.11 um 0.18 um, embedded flash Diode 0.6 um - 0.8 um BiCMOS 0.6 um - 0.8 um BiCMOS 0.6 um - 0.8 um BiCMOS 0.6 um - 0.8 um BiCMOS 0.6 um - 0.8 um BiCMOS 0.6 um - 0.8 um BiCMOS 0.315 um - 0.35 um 0.6 um - 0.8 um BiCMOS 0.6 um - 0.8 um BiCMOS 0.6 um - 1.0 um 0.6 um - 0.8 um BiCMOS 0.6 um - 0.8 um BiCMOS 0.6 um - 1.0 um 0.6 um - 1.0 um 0.6 um - 0.8 um BiCMOS 0.315 um - 0.35 um 0.6 um - 1.0 um 0.6 um - 0.8 um BiCMOS 0.6 um - 1.0 um 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, RF 0.18 um, embedded flash 0.18 um, RF 0.18 um, embedded flash 0.18 um, RF 0.18 um, embedded flash 0.18 um, RF 0.11 um 0.18 um, embedded flash 0.18 um, embedded flash 0.6 um - 0.8 um BiCMOS Diode 0.6 um - 0.8 um BiCMOS Diode 0.18 um, OTP 0.18 um, OTP 0.13 um 0.13 um 0.11 um 0.11 um 0.11 um PN Si2115 Si2124 Si2127 Si2128 Si2136 Si2137 Si2138 Si2140 Si2141 Si2143 Si2144 Si2145 Si2146 Si2147 Si2148 Si2150 Si2151 Si2153 Si2155 Si2156 Si2157 Si2158 Si2161 Si2162 Si2163 Si2164 Si2165 Si2166-AXX Si2166-BXX Si2167-AXX Si2167-BXX Si2168 Si2169 Si216XX Si2170 Si2171 Si2172 Si2173 Si2176 Si2177 Si2178 Si2180 Si2181 Si2182 Si2183 Si2185 Si2190 Si2191 Si2196 Si220X Si221X Si2400 Si2401 Si2404 Si2404-C Si2404-D Si2415-D Si2417-D Si2417-E Si241X-A Si241X-B Si241X-C Si241X-F Si241X-G Si241X-H Technology 0.11 um 55 nm 55 nm 55 nm 0.11 um 55 nm 55 nm 0.11 um 55 nm 0.11 um 55 nm 0.11 um 0.11 um 55 nm 55 nm 55 nm 55 nm 0.11 um 0.11 um 0.11 um 55 nm 55 nm 0.11 um 55 nm 0.11 um 55 nm 0.11 um 0.11 um 55 nm 0.11 um 55 nm 55 nm 55 nm 55 nm 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 0.11 um 55 nm 55 nm 0.11 um 0.315 um - 0.35 um 0.25 um 0.45 um - 0.5 um 0.18 um 0.18 um 0.18 um 0.11 um 0.11 um 0.18 um 0.11 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 6/70 Quarterly Quality & Reliability Report PN Si241X-H Si242X Si2433 Si2434 Si2434-C Si2434-D Si2435-B Si2435-C Si2435-D Si2435-E Si2435-F Si2436 Si2437 Si2438 Si2439 Si2456 Si2457 Si2457-C Si2457-D Si2493 Si2493-C Si2493-D Si2494 Si27XX Si3000 Si3005 Si3006 Si3007 Si3008 Si3009 Si3010 Si3011 Si3012 Si3014 Si3015 Si3016 Si3017 Si3018 Si3019 Si302X Si3050-D Si3050-E Si3052 Si3054 Si3056 Si306X Si307X Si308X Si31XX Si320X Si3210 Si3211 Si3215 Si3217 Si3217X Si3217X Si3220 Si3225 Si3226 Si3226X Si3226X Si3227 Si3230 Si3232 Si3233 Technology 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.11 um 0.18 um 0.18 um 0.18 um 0.11 um 0.11 um 0.18 um 0.18 um 0.18 um 0.11 um 0.18 um 0.18 um 0.18 um 0.11 um 0.18 um 0.18 um 0.11 um 0.11 um 0.11 um 0.45 um - 0.5 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.45 um - 0.5 um 0.45 um - 0.5 um 0.45 um - 0.5 um 0.45 um - 0.5 um 0.25 um 0.25 um 0.25 um 0.45 um - 0.5 um 0.25 um 0.18 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um High Voltage 0.45 um - 0.5 um 0.45 um - 0.5 um 0.45 um - 0.5 um 0.18 um 0.18 um High Voltage 0.45 um - 0.5 um 0.45 um - 0.5 um 0.18 um 0.18 um High Voltage 0.18 um 0.45 um - 0.5 um 0.45 um - 0.5 um 0.45 um - 0.5 um PN Si3233 Si3238 Si3239 Si324X Si3291X Si340X Si3450 Si3452 Si3452 Si3453 Si3453 Si3455 Si3456 Si3456 Si3457 Si3457 Si3458 Si3458 Si3459 Si3459 Si346X Si348X Si35XX Si401X Si402X Si403X Si405X Si406X Si41XX Si4310 Si4311 Si4312 Si4313 Si432X Si433X Si435X Si436X Si442X Si4430 Si4431 Si4432 Si4438 Si445X Si446X Si46XX Si4708 Si4709 Si470X-AXX Si470X-C19 Si471X-AXX Si472X-AXX Si4730-AXX Si4731-AXX Si474X Si475X Si476X Si477X Si4780 Si4780 Si47XX-B1X Si47XX-B2X Si47XX-B3X Si47XX-C3X Si47XX-C4X Si47XX-D Technology 0.45 um - 0.5 um High Voltage High Voltage 0.18 um 0.25 um High Voltage 0.18 um 0.18 um, OTP High Voltage 0.18 um, OTP High Voltage High Voltage 0.35 um, embedded flash High Voltage 0.18 um, OTP High Voltage 0.18 um, OTP High Voltage 0.18 um, OTP High Voltage 0.18 um, OTP 0.35 um, embedded flash High Voltage 0.13 um 0.6 um - 0.8 um BiCMOS 0.18 um, RF 0.11 um 0.11 um 0.315 um - 0.35 um 0.13 um 0.13 um 0.13 um 0.18 um, RF 0.6 um - 0.8 um BiCMOS 0.18 um, RF 0.11 um 0.11 um 0.6 um - 0.8 um BiCMOS 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.11 um 0.11 um 0.11 um 55 nm 0.11 um 0.11 um 0.13 um 0.11 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.11 um 0.11 um 0.11 um 0.13 um 0.35 um, embedded flash 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.11 um PN Si47XX-D Si482X Si4830 Si4834 Si4836 Si483X-B Si484X Si49XX Si500 Si5010 Si50122 Si50122 Si5013 Si502X Si504X Si510X Si511X Si512X Si5211X Si5213X Si5214X Si53019 Si5301C Si5306 Si5310 Si53102 Si53106 Si53108 Si5311X Si5315 Si5315X Si5316 Si5317 Si5319 Si5320 Si5321 Si5322 Si5323 Si5324 Si5325 Si5326 Si5327 Si5328 Si533X Si534X Si535X Si5364 Si5365 Si5366 Si5367 Si5368 Si5369 Si537X Si5409X Si7005 Si7006 Si7007 Si7008 Si701X Si702X Si703X Si705X Si803X Si804X Si805X 15Q2_QR_Report-01 Technology 0.11 um 0.11 um 0.13 um 0.13 um 0.11 um 0.11 um 0.11 um 0.6 um - 0.8 um BiCMOS 0.13 um 0.25 um 0.13 um 0.18 um 0.25 um 0.25 um 0.13 um 0.15 um 0.15 um 0.18 um 0.18 um 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.13 um 0.13 um 0.25 um 0.18 um 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.13 um 0.18 um, RF 0.13 um 0.13 um 0.13 um 0.25 um 0.25 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 55 nm 0.13 um 0.25 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.18 um, OTP 0.18 um, RF 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, OTP 0.18 um, embedded flash 0.25 um 0.25 um 0.25 um All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 7/70 Quarterly Quality & Reliability Report PN Si805X Si806X Si822X Si822X Si823X Si823X Si824X Si824X Si825X Si826X Si826X Si827X Si83XX Si84XX Si850X Si851X Si854X Si86XX Si87XX Si87XX Si88XX Si890X Si890X SiM3XXXX SL151 SL15100CZC-1 SL153 SL15300DZC-56 SL15300EZC-70 SL15300EZC-75 SL15300EZC-77 SL158 SL16XX SL188X SL2304 SL2305 SL2309 SL23EP SL281XX SL2850 SL2854 SL2861 SL2864 SL2874 SL28770 SL28773 SL28774 SL28775 SL28776 SL28779 SL28DB SL28EB636 SL28EB717 SL28EB720 SL28EB721 SL28EB725 SL28EB731 SL28EB735 SL28EB740 SL28EB742 SL28EB745 SL28EB774 SL28EB781 SL28EB797 SL28PCIE06 Technology 0.25 um 0.25 um 0.25 um High Voltage 0.25 um High Voltage 0.25 um High Voltage 0.25 um, embedded flash 0.25 um High Voltage 0.25 um 0.6 um - 1.0 um 0.25 um 0.315 um - 0.35 um 0.315 um - 0.35 um 0.6 um - 1.0 um 0.25 um 0.25 um High Voltage 0.25 um 0.18 um, OTP 0.25 um 0.18 um, embedded flash 0.18 um, RF 0.35 um, EEPROM 0.18 um, RF 0.35 um, EEPROM 0.35 um, EEPROM 0.35 um, EEPROM 0.35 um, EEPROM 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um 0.25 um 0.25 um 0.18 um, RF 0.25 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um, RF 0.18 um, RF 0.18 um 0.25 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um, RF 0.18 um, RF 0.18 um PN SL28PCIE06 SL28PCIE10 SL28PCIE14 SL28PCIE16 SL28PCIE19 SL28PCIE2 SL28PCIE30 SL28PCIE50 SL28SR SL3800 SL38020 SL3816 SL38160CZC-30B TS1001 TS1002 TS1003 TS1004 TS1005 TS11XX TS12XX TS3001 TS3002 TS3003 TS3004 TS3005 TS3006 TS3300 TS3310 TS6XXX TS7XXX TS9XXX TSAXXXX TSM12XX TSM60XX TSM91XX TSM92XX TSM93XX TSM96XX TSM97XX TSM98XX TSM99XX W1XXX W4XXX Technology 0.18 um 0.18 um 0.18 um, RF 0.18 um 0.18 um, RF 0.18 um 0.18 um 0.18 um, RF 0.18 um 0.18 um, RF 0.18 um, OTP 0.18 um, RF 0.35 um, EEPROM High Voltage High Voltage 0.18 um, OTP High Voltage 0.18 um, OTP 0.6 um - 1.0 um High Voltage 0.18 um 0.18 um High Voltage High Voltage High Voltage High Voltage High Voltage 0.18 um, OTP 0.6 um - 1.0 um 0.18 um 0.18 um 0.18 um 0.18 um 0.6 um - 1.0 um 0.18 um 0.18 um 0.18 um 0.6 um - 1.0 um 0.18 um 0.18 um 0.6 um - 1.0 um 0.45 um - 0.5 um 0.45 um - 0.5 um PN 15Q2_QR_Report-01 Technology All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 8/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Failure Rate Estimation Failure in Time (FIT) A long-term, steady-state failure rate is often required by circuit and system engineers for allocations of the failure rates at the component level during system design. FIT, which stands for failure-in-time, is a widely used term to describe failure rates of electronic components, and as used here, represents the number of failures in a billion hours of operation. FIT rates are reported in the following section as curves and in tables for specific temperatures and assumptions. Mean Time to Failure (MTTF) Another way to express failure rates is by mean time to failure (MTTF). MTTF is the inverse of the FIT rate and is useful for repair and maintenance planning. This relationship can be seen by examining the units of each measure: MTTF is given in time/failure; FIT is given in failure/time. MTTF is reported in the tables following the FIT rate curves for each specific fab technology. Failure Rate Calculation Method Long-term failure rates are estimated by applying the Arrhenius equation to data collected from long term operating life tests. A confidence factor is applied based upon the sample size and number of failures to estimate the maximum failure rate at a specific confidence level. The calculation details are provided in the table below each of the following FIT rate curves. All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 9/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 FIT Rate Curves and Data Process - 0.11 micron All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 10/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.11 micron Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 6353 6353 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 6352504 X2 4.6 FIT 1.5 MTTF MTTF 6.6E+08 75387.6 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 6352504 1.8 0.6 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] 1.7E+09 Mean Time To Failure [hours] (Note: MTTF is 1/FIT) 189444.6 Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.11 micron Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.2 0.3 0.4 0.7 1.0 1.5 2.2 3.2 4.6 6.6 9.2 12.8 17.7 24.2 32.7 44.0 58.7 77.7 102.1 133.3 FIT (60%) 0.1 0.1 0.2 0.3 0.4 0.6 0.9 1.3 1.8 2.6 3.7 5.1 7.0 9.6 13.0 17.5 23.4 30.9 40.6 53.0 MTTF MTTF 90% (yrs) 60% (yrs) 620945 1560399 396113 995409 256402 644323 168289 422900 111928 281267 75388 189445 51392 129144 35439 89056 24708 62091 17409 43747 12390 31135 8903 22373 6457 16226 4724 11872 3486 8761 2594 6518 1945 4887 1469 3692 1118 2809 857 2153 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 11/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.13 micron All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 12/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.13 micron Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 6714 6714 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 1 1 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 4.0 DH 6713649 X2 7.8 FIT 2.4 239.4 4.0 6713649 4.0 1.3 MTTF MTTF 7.9E+08 90715.4 4.1E+08 47164.0 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.13 micron Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.3 0.5 0.7 1.1 1.6 2.4 3.6 5.1 7.4 10.5 14.7 20.5 28.3 38.6 52.3 70.4 93.8 124.2 163.2 213.0 FIT (60%) 0.2 0.2 0.4 0.6 0.8 1.3 1.8 2.7 3.8 5.4 7.7 10.7 14.7 20.1 27.2 36.6 48.8 64.6 84.9 110.7 MTTF MTTF 90% (yrs) 60% (yrs) 388476 747195 247817 476651 160410 308533 105285 202505 70024 134685 47164 90715 32152 61841 22171 42644 15458 29732 10891 20948 7751 14909 5570 10713 4040 7770 2956 5685 2181 4195 1623 3121 1217 2340 919 1768 699 1345 536 1031 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 13/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.15 micron All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 14/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.15 micron Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 104 104 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 104144 X2 4.6 FIT 92.4 MTTF MTTF 1.1E+07 1235.9 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 104144 1.8 36.8 2.7E+07 3105.8 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.15 micron Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 11.2 17.6 27.2 41.4 62.2 92.4 135.5 196.5 281.8 400.0 562.0 782.1 1078.4 1473.9 1997.3 2684.7 3580.6 4739.6 6228.7 8128.9 FIT (60%) 4.5 7.0 10.8 16.5 24.8 36.8 53.9 78.2 112.1 159.2 223.6 311.2 429.1 586.5 794.8 1068.4 1424.8 1886.1 2478.6 3234.8 MTTF MTTF 90% (yrs) 60% (yrs) 10180 25581 6494 16319 4203 10563 2759 6933 1835 4611 1236 3106 843 2117 581 1460 405 1018 285 717 203 510 146 367 106 266 77 195 57 144 43 107 32 80 24 61 18 46 14 35 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 15/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.18 micron All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 16/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.18 micron Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 13127 13127 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 13126704 X2 4.6 FIT 0.7 MTTF MTTF 1.4E+09 155779.6 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 13126704 1.8 0.3 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] 3.4E+09 Mean Time To Failure [hours] (Note: MTTF is 1/FIT) 391465.0 Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.18 micron Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.1 0.1 0.2 0.3 0.5 0.7 1.1 1.6 2.2 3.2 4.5 6.2 8.6 11.7 15.8 21.3 28.4 37.6 49.4 64.5 FIT (60%) 0.0 0.1 0.1 0.1 0.2 0.3 0.4 0.6 0.9 1.3 1.8 2.5 3.4 4.7 6.3 8.5 11.3 15.0 19.7 25.7 MTTF MTTF 90% (yrs) 60% (yrs) 1283110 3224381 818522 2056897 529824 1331418 347749 873873 231285 581206 155780 391465 106195 266862 73231 184024 51057 128303 35973 90399 25602 64336 18397 46231 13342 33529 9763 24533 7204 18103 5359 13468 4019 10098 3036 7629 2310 5805 1770 4448 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 17/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.18 micron w/ embedded flash All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 18/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.18 micron w/ embedded flash Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 4926 4926 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 4925521 X2 4.6 FIT 2.0 MTTF MTTF 5.1E+08 58453.0 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 4925521 1.8 0.8 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] 1.3E+09 Mean Time To Failure [hours] (Note: MTTF is 1/FIT) 146889.1 Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.18 micron w/ embedded flash MTTF MTTF Tja Af FIT (90%) FIT (60%) 90% (yrs) 60% (yrs) 25 1971.6 0.2 0.1 481460 1209881 30 1257.7 0.4 0.1 307133 771807 35 814.1 0.6 0.2 198806 499587 40 534.4 0.9 0.3 130486 327903 45 355.4 1.3 0.5 86785 218085 50 239.4 2.0 0.8 58453 146889 55 163.2 2.9 1.1 39847 100134 60 112.5 4.2 1.7 27478 69051 65 78.5 6.0 2.4 19158 48143 70 55.3 8.5 3.4 13498 33920 75 39.3 11.9 4.7 9607 24141 80 28.3 16.5 6.6 6903 17347 85 20.5 22.8 9.1 5006 12581 90 15.0 31.2 12.4 3663 9205 95 11.1 42.2 16.8 2703 6793 100 8.2 56.8 22.6 2011 5054 105 6.2 75.7 30.1 1508 3789 110 4.7 100.2 39.9 1139 2863 115 3.5 131.7 52.4 867 2178 120 2.7 171.9 68.4 664 1669 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 19/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.18 micron w/ OTP All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 20/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.18 micron w/ OTP Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 3241 3241 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 2.0 DH 3240832 X2 4.6 FIT 3.0 239.4 2.0 3240832 1.8 1.2 MTTF MTTF 8.5E+08 96648.2 3.4E+08 38460.2 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.18 micron w/ OTP Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.4 0.6 0.9 1.3 2.0 3.0 4.4 6.3 9.1 12.9 18.1 25.1 34.7 47.4 64.2 86.3 115.1 152.3 200.2 261.2 FIT (60%) 0.1 0.2 0.3 0.5 0.8 1.2 1.7 2.5 3.6 5.1 7.2 10.0 13.8 18.8 25.5 34.3 45.8 60.6 79.7 104.0 MTTF MTTF 90% (yrs) 60% (yrs) 316785 796062 202084 507824 130808 328712 85855 215749 57102 143493 38460 96648 26218 65885 18080 45433 12605 31676 8881 22318 6321 15884 4542 11414 3294 8278 2410 6057 1779 4469 1323 3325 992 2493 750 1883 570 1433 437 1098 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 21/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.18 micron w/ RF All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 22/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.18 micron w/ RF Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 1498 1498 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 2.0 DH 1498163 X2 4.6 FIT 6.4 239.4 2.0 1498163 1.8 2.6 MTTF MTTF 3.9E+08 44678.3 1.6E+08 17779.3 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.18 micron w/ RF Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.8 1.2 1.9 2.9 4.3 6.4 9.4 13.7 19.6 27.8 39.1 54.4 75.0 102.5 138.8 186.6 248.9 329.5 433.0 565.1 FIT (60%) 0.3 0.5 0.8 1.1 1.7 2.6 3.7 5.4 7.8 11.1 15.5 21.6 29.8 40.8 55.3 74.3 99.0 131.1 172.3 224.9 MTTF MTTF 90% (yrs) 60% (yrs) 146443 368002 93419 234756 60469 151956 39689 99736 26397 66334 17779 44678 12120 30457 8358 21003 5827 14643 4106 10317 2922 7343 2100 5276 1523 3827 1114 2800 822 2066 612 1537 459 1153 346 871 264 663 202 508 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 23/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.25 micron All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 24/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.25 micron Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 8537 8537 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 8536997 X2 4.6 FIT 1.1 MTTF MTTF 8.9E+08 101311.8 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 8536997 1.8 0.4 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] 2.2E+09 Mean Time To Failure [hours] (Note: MTTF is 1/FIT) 254590.6 Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.25 micron Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.1 0.2 0.3 0.5 0.8 1.1 1.7 2.4 3.4 4.9 6.9 9.5 13.2 18.0 24.4 32.8 43.7 57.8 76.0 99.2 FIT (60%) 0.1 0.1 0.1 0.2 0.3 0.4 0.7 1.0 1.4 1.9 2.7 3.8 5.2 7.2 9.7 13.0 17.4 23.0 30.2 39.5 MTTF MTTF 90% (yrs) 60% (yrs) 834475 2096987 532328 1337710 344573 865892 226160 568326 150417 377989 101312 254591 69064 173554 47626 119681 33205 83442 23395 58791 16650 41841 11965 30067 8677 21806 6349 15955 4685 11773 3486 8759 2613 6567 1974 4961 1502 3775 1151 2893 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 25/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.25 micron w/ embedded flash All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 26/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.25 micron w/ embedded flash Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 1694 1694 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 2.0 DH 1693540 X2 4.6 FIT 5.7 239.4 2.0 1693540 1.8 2.3 MTTF MTTF 4.4E+08 50504.8 1.8E+08 20097.9 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.25 micron w/ embedded flash MTTF MTTF Tja Af FIT (90%) FIT (60%) 90% (yrs) 60% (yrs) 25 1971.6 0.7 0.3 165540 415993 30 1257.7 1.1 0.4 105601 265370 35 814.1 1.7 0.7 68355 171773 40 534.4 2.5 1.0 44865 112743 45 355.4 3.8 1.5 29839 74984 50 239.4 5.7 2.3 20098 50505 55 163.2 8.3 3.3 13701 34429 60 112.5 12.1 4.8 9448 23742 65 78.5 17.3 6.9 6587 16553 70 55.3 24.6 9.8 4641 11663 75 39.3 34.6 13.8 3303 8300 80 28.3 48.1 19.1 2374 5964 85 20.5 66.3 26.4 1721 4326 90 15.0 90.6 36.1 1260 3165 95 11.1 122.8 48.9 929 2336 100 8.2 165.1 65.7 691 1738 105 6.2 220.2 87.6 518 1303 110 4.7 291.5 116.0 392 984 115 3.5 383.0 152.4 298 749 120 2.7 499.9 198.9 228 574 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 27/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process – 0.315 - 0.35 micron All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 28/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.315 um - 0.35 um Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 1058 1058 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 2.0 DH 1058304 X2 4.6 FIT 9.1 239.4 2.0 1058304 1.8 3.6 MTTF MTTF 2.8E+08 31560.8 1.1E+08 12559.3 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.315 um - 0.35 um Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) FIT (60%) 1.1 0.4 1.7 0.7 2.7 1.1 4.1 1.6 6.1 2.4 9.1 3.6 13.3 5.3 19.3 7.7 27.7 11.0 39.4 15.7 55.3 22.0 77.0 30.6 106.1 42.2 145.0 57.7 196.5 78.2 264.2 105.1 352.4 140.2 466.4 185.6 612.9 243.9 799.9 318.3 MTTF MTTF 90% (yrs) 60% (yrs) 103447 259957 65991 165832 42716 107342 28036 70454 18647 46858 12559 31561 8562 21515 5904 14836 4116 10344 2900 7288 2064 5187 1483 3727 1076 2703 787 1978 581 1460 432 1086 324 814 245 615 186 468 143 359 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 29/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.35 micron All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 30/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.35 micron Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 2157 2157 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 2.0 DH 2156808 X2 4.6 FIT 4.5 239.4 2.0 2156808 1.8 1.8 MTTF MTTF 5.6E+08 64320.4 2.2E+08 25595.7 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.35 micron Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.5 0.8 1.3 2.0 3.0 4.5 6.5 9.5 13.6 19.3 27.1 37.8 52.1 71.2 96.4 129.6 172.9 228.9 300.8 392.5 FIT (60%) 0.2 0.3 0.5 0.8 1.2 1.8 2.6 3.8 5.4 7.7 10.8 15.0 20.7 28.3 38.4 51.6 68.8 91.1 119.7 156.2 MTTF MTTF 90% (yrs) 60% (yrs) 210824 529788 134489 337962 87054 218761 57138 143583 38002 95496 25596 64320 17449 43847 12032 30236 8389 21081 5911 14853 4207 10571 3023 7596 2192 5509 1604 4031 1184 2974 881 2213 660 1659 499 1253 380 954 291 731 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 31/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.35 micron w/ embedded flash All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 32/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.35 micron w/ embedded flash Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 1099 1099 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 2.0 DH 1098504 X2 4.6 FIT 8.8 239.4 2.0 1098504 1.8 3.5 MTTF MTTF 2.9E+08 32759.6 1.1E+08 13036.4 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.35 micron w/ embedded flash MTTF MTTF Tja Af FIT (90%) FIT (60%) 90% (yrs) 60% (yrs) 25 1971.6 1.1 0.4 107377 269831 30 1257.7 1.7 0.7 68498 172131 35 814.1 2.6 1.0 44338 111419 40 534.4 3.9 1.6 29101 73130 45 355.4 5.9 2.3 19355 48638 50 239.4 8.8 3.5 13036 32760 55 163.2 12.8 5.1 8887 22332 60 112.5 18.6 7.4 6128 15400 65 78.5 26.7 10.6 4273 10737 70 55.3 37.9 15.1 3010 7565 75 39.3 53.3 21.2 2142 5384 80 28.3 74.1 29.5 1540 3869 85 20.5 102.2 40.7 1117 2806 90 15.0 139.7 55.6 817 2053 95 11.1 189.4 75.4 603 1515 100 8.2 254.5 101.3 449 1127 105 6.2 339.5 135.1 336 845 110 4.7 449.3 178.8 254 638 115 3.5 590.5 235.0 193 486 120 2.7 770.7 306.7 148 372 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 33/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.45 - 0.5 um SPTM All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 34/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.45 - 0.5 um SPTM Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 206 206 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 206064 X2 4.6 FIT 46.7 MTTF MTTF 2.1E+07 2445.4 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 206064 1.8 18.6 5.4E+07 6145.2 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.45 - 0.5 um SPTM Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 5.7 8.9 13.7 20.9 31.4 46.7 68.5 99.3 142.4 202.1 284.0 395.3 545.0 744.9 1009.4 1356.8 1809.6 2395.4 3147.9 4108.3 FIT (60%) 2.3 3.5 5.5 8.3 12.5 18.6 27.2 39.5 56.7 80.4 113.0 157.3 216.9 296.4 401.7 539.9 720.1 953.2 1252.7 1634.9 MTTF MTTF 90% (yrs) 60% (yrs) 20142 50617 12849 32289 8317 20901 5459 13718 3631 9124 2445 6145 1667 4189 1150 2889 801 2014 565 1419 402 1010 289 726 209 526 153 385 113 284 84 211 63 159 48 120 36 91 28 70 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 35/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - 0.6 - 1.0um All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 36/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 0.6 - 1.0um Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 505 505 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 505487 X2 4.6 FIT 19.0 MTTF MTTF 5.3E+07 5998.8 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 505487 1.8 7.6 1.3E+08 15074.6 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 0.6 - 1.0um Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 2.3 3.6 5.6 8.5 12.8 19.0 27.9 40.5 58.1 82.4 115.8 161.1 222.2 303.7 411.5 553.1 737.7 976.5 1283.3 1674.8 FIT (60%) 0.9 1.4 2.2 3.4 5.1 7.6 11.1 16.1 23.1 32.8 46.1 64.1 88.4 120.8 163.8 220.1 293.6 388.6 510.7 666.5 MTTF MTTF 90% (yrs) 60% (yrs) 49410 124165 31520 79208 20403 51271 13391 33651 8906 22381 5999 15075 4089 10276 2820 7086 1966 4941 1385 3481 986 2477 708 1780 514 1291 376 945 277 697 206 519 155 389 117 294 89 224 68 171 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 37/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process – 55 nm All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 38/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for 55 nm Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 1315 1315 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 1 1 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 4.0 DH 1315251 X2 7.8 FIT 12.4 239.4 4.0 1315251 4.0 6.4 MTTF MTTF 1.6E+08 17771.8 8.1E+07 9239.8 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for 55 nm Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 1.5 2.4 3.6 5.5 8.3 12.4 18.1 26.3 37.7 53.5 75.2 104.6 144.2 197.1 267.2 359.1 478.9 634.0 833.1 1087.3 FIT (60%) 0.8 1.2 1.9 2.9 4.3 6.4 9.4 13.7 19.6 27.8 39.1 54.4 75.0 102.5 138.9 186.7 249.0 329.6 433.2 565.3 MTTF MTTF 90% (yrs) 60% (yrs) 76105 146381 48549 93379 31425 60444 20626 39672 13718 26386 9240 17772 6299 12115 4344 8354 3028 5825 2134 4104 1519 2921 1091 2099 791 1522 579 1114 427 822 318 611 238 458 180 346 137 264 105 202 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 39/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process – Diode All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 40/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for Diode Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 188 188 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 8.61E-05 Boltzman's constant [eV/K] Calculated Values: Af 239.4 v 2.0 DH 187703 X2 4.6 FIT 51.2 239.4 2.0 187703 1.8 20.4 MTTF MTTF 4.9E+07 5597.7 2.0E+07 2227.5 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] Mean Time To Failure [hours] (Note: MTTF is 1/FIT) Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for Diode Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) FIT (60%) 6.2 2.5 9.8 3.9 15.1 6.0 23.0 9.1 34.5 13.7 51.2 20.4 75.2 29.9 109.0 43.4 156.4 62.2 221.9 88.3 311.8 124.1 433.9 172.7 598.3 238.1 817.7 325.4 1108.2 441.0 1489.6 592.8 1986.6 790.6 2629.7 1046.5 3455.9 1375.2 4510.2 1794.8 MTTF MTTF 90% (yrs) 60% (yrs) 18348 46107 11704 29412 7576 19038 4973 12496 3307 8311 2228 5598 1519 3816 1047 2631 730 1835 514 1293 366 920 263 661 191 479 140 351 103 259 77 193 57 144 43 109 33 83 25 64 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 41/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Process - High Voltage All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 42/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability FIT Calculations for temperature acceleration Single Point Calculation for High Voltage Variables: 90% 60% Confidence Level Tja [C] 50 50 Junction Temperature at operating condition Tsa [C] 125 125 Ambient Temperature at stress Tjs [C] 140 140 Junction Temperature at stress (assume 15C rise) Ea 0.7 0.7 Energy Activation D 4755 4755 Equivalent Devices stressed (Assuming 1000hrs per device) H 1000 1000 Number of hours on stress F 0 0 Number of failures P 0.1 0.4 Confidence Level [.1 = 90%; .4 = 60%] Constants: k 8.61E-05 Calculated Values: Af 239.4 v 2.0 DH 4755306 X2 4.6 FIT 2.0 MTTF MTTF 4.9E+08 56433.0 8.61E-05 Boltzman's constant [eV/K] 239.4 2.0 4755306 1.8 0.8 Acceleration Factor: [exp(Ea/k*(1/(Tja + 273.15) - (1/(Tjs + 273.15))] degrees of freedom [2(F+1)] Total device hours D*H Chi-Square Distribution Value Failures in time [failures / 1xE9 hours] =[X2/(2*AF*D*H)*1E9] 1.2E+09 Mean Time To Failure [hours] (Note: MTTF is 1/FIT) 141812.9 Mean Time To Failure [years] (Note: MTTF is 1/FIT) FIT Estimation Curves for High Voltage Tja 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Af 1971.6 1257.7 814.1 534.4 355.4 239.4 163.2 112.5 78.5 55.3 39.3 28.3 20.5 15.0 11.1 8.2 6.2 4.7 3.5 2.7 FIT (90%) 0.2 0.4 0.6 0.9 1.4 2.0 3.0 4.3 6.2 8.8 12.3 17.1 23.6 32.3 43.7 58.8 78.4 103.8 136.4 178.0 FIT (60%) 0.1 0.2 0.2 0.4 0.5 0.8 1.2 1.7 2.5 3.5 4.9 6.8 9.4 12.8 17.4 23.4 31.2 41.3 54.3 70.8 MTTF MTTF 90% (yrs) 60% (yrs) 464822 1168071 296519 745136 191935 482322 125976 316571 83786 210549 56433 141813 38470 96674 26529 66665 18496 46479 13032 32748 9275 23307 6665 16748 4833 12146 3537 8887 2610 6558 1942 4879 1456 3658 1100 2764 837 2103 641 1611 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 43/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 0.11um OTP Reliability Summary Effective Dev-Hrs at 150°C Chargeable Failures 2,109,000 Typical Case: Predicted FIT @Ta=50°C, Worst Case: Predicted FIT @Ta=85°C, 60% UCL 10 Year Predicted Failure Rate Ta=50°C 60% UCL 60% UCL 10 Year Predicted Failure Rate Ta=85°C 60% UCL 3.0 0.027% 23.7 0.207% 0 Data Retention Reliability 1000000 MTTF (Years) 100000 10000 1000 100 10 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125 90 100 110 125 Use Temperature [C] 5 Year Continuous Use Fallout (% ) Data Retention Reliability Continuous Use Fallout 10% 1% 0% 0% 0% 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Use Temperature [C] All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 44/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 0.13um OTP Reliability Summary Effective Dev-Hrs at 150°C Chargeable Failures 2,196,000 Typical Case: Predicted FIT @Ta=50°C, Worst Case: Predicted FIT @Ta=85°C, 60% UCL 10 Year Predicted Failure Rate Ta=50°C 60% UCL 60% UCL 10 Year Predicted Failure Rate Ta=85°C 60% UCL 2.9 0.026% 22.7 0.199% 0 Data Retention Reliability 1000000 MTTF (Years) 100000 10000 1000 100 10 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125 90 100 110 125 Use Temperature [C] 5 Year Continuous Use Fallout (% ) Data Retention Reliability Continuous Use Fallout 10% 1% 0% 0% 0% 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Use Temperature [C] All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 45/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 0.18um Flash Reliability Summary Effective Dev-Hrs at 150°C Chargeable Failures 19,961,489 Typical Case: Predicted FIT @Ta=50°C, Worst Case: Predicted FIT @Ta=85°C, 60% UCL 10 Year Predicted Failure Rate Ta=50°C 60% UCL 60% UCL 10 Year Predicted Failure Rate Ta=85°C 60% UCL 0.7 0.006% 5.5 0.048% 1 Data Retention Reliability 10000000 1000000 MTTF (Years) 100000 10000 1000 100 10 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125 90 100 110 125 Use Temperature [C] 5 Year Continuous Use Fallout (% ) Data Retention Reliability Continuous Use Fallout 10% 1% 0% 0% 0% 0% 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Use Temperature [C] All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 46/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 0.18um OTP Reliability Summary Effective Dev-Hrs at 150°C Chargeable Failures 14,702,512 Typical Case: Predicted FIT @Ta=50°C, Worst Case: Predicted FIT @Ta=85°C, 60% UCL 10 Year Predicted Failure Rate Ta=50°C 60% UCL 60% UCL 10 Year Predicted Failure Rate Ta=85°C 60% UCL 0.4 0.004% 3.4 0.030% 0 Data Retention Reliability 10000000 1000000 MTTF (Years) 100000 10000 1000 100 10 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125 90 100 110 125 Use Temperature [C] 5 Year Continuous Use Fallout (% ) Data Retention Reliability Continuous Use Fallout 10% 1% 0% 0% 0% 0% 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Use Temperature [C] All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 47/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 0.25um HDR Flash Reliability Summary Effective Dev-Hrs at 150°C Chargeable Failures 4,795,033 Typical Case: Predicted FIT @Ta=50°C, Worst Case: Predicted FIT @Ta=85°C, 60% UCL 10 Year Predicted Failure Rate Ta=50°C 60% UCL 60% UCL 10 Year Predicted Failure Rate Ta=85°C 60% UCL 1.3 0.012% 10.4 0.091% 0 Data Retention Reliability 1000000 MTTF (Years) 100000 10000 1000 100 10 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125 90 100 110 125 Use Temperature [C] 5 Year Continuous Use Fallout (% ) Data Retention Reliability Continuous Use Fallout 10% 1% 0% 0% 0% 0% 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Use Temperature [C] All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 48/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 0.35um Non-HE Flash Reliability Summary Effective Dev-Hrs at 150°C Chargeable Failures 7,472,366 Typical Case: Predicted FIT @Ta=50°C, Worst Case: Predicted FIT @Ta=85°C, 60% UCL 10 Year Predicted Failure Rate Ta=50°C 60% UCL 60% UCL 10 Year Predicted Failure Rate Ta=85°C 60% UCL 0.9 0.008% 6.7 0.059% 0 Data Retention Reliability 10000000 1000000 MTTF (Years) 100000 10000 1000 100 10 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125 90 100 110 125 Use Temperature [C] 5 Year Continuous Use Fallout (% ) Data Retention Reliability Continuous Use Fallout 10% 1% 0% 0% 0% 0% 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Use Temperature [C] All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 49/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 0.35um HE Flash Reliability Summary Effective Dev-Hrs at 150°C Chargeable Failures 2,610,053 Typical Case: Predicted FIT @Ta=50°C, Worst Case: Predicted FIT @Ta=85°C, 60% UCL 10 Year Predicted Failure Rate Ta=50°C 60% UCL 60% UCL 10 Year Predicted Failure Rate Ta=85°C 60% UCL 2.5 0.022% 19.1 0.167% 0 Data Retention Reliability 1000000 MTTF (Years) 100000 10000 1000 100 10 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 100 110 125 90 100 110 125 Use Temperature [C] 5 Year Continuous Use Fallout (% ) Data Retention Reliability Continuous Use Fallout 10% 1% 0% 0% 0% 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Use Temperature [C] All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 50/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability Monitor Program Overview Once a product is qualified, we verify continued product reliability with a reliability monitor program. The monitor program is scheduled to periodically sample wafer fab and package technologies. The results are published in this report. Any failures are used to drive corrective action and product and process improvement. Stress Descriptions Silicon Labs follows JEDEC as the preferred industry standard. The most common reliability tests and conditions are listed in the following table. The specific JEDEC documents are available on the Internet at www.jedec.org. Reliability Tests, Procedures and Conditions Table Symbol DR Stress Name Data Retention Bake Stress Procedure AEC_Q100 Standard Conditions 150°C (pkg form); 250C (wafer) ELFR Early Life Failure Rate JEDEC JESD22A108 125°C; Max operating voltage HAST Highly-Accelerated Temperature and Humidity Stress Test JEDEC JESD22A110 130°C; 85%rh; 22.2 psia; biased HTB High Temperature Bake JEDEC JESD22A103 150°C LTOL Low Temperature Operating Life JEDEC JESD22A108 -10°C; Max operating voltage HTOL High Temperature Operating Life JEDEC JESD22A108 125°C; Max operating voltage PC Preconditioning JEDEC JESD22A113 According to MSL level prior to package stresses (listed below) TC Temperature Cycle JEDEC JESD22A104 Condition C: -65 to 150°C Unbiased HAST JEDEC JESD22A118 130°C; 85%rh Temperature Humidity Bias JEDEC JESD22A101 85°C; 85%RH; Max operating voltage U-HAST THB Qualification Guideline Stress Test Driven Qualification of Integrated Circuits; EIA / JEDEC EIA/JESD47 / AEC-Q100 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 51/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Silicon Reliability Test Method and Conditions Early Life Failure Rate (ELFR) The purpose of this test is to simulate the user operation over the first portion of the product lifetime, also called early life. Silicon Labs typically uses dynamic conditions, meaning the device is powered up, and the inputs are toggled to exercise a maximum number of transistors and circuit area. Reliability acceleration is accomplished primarily by temperature and secondarily by voltage. High Temperature Operating Life (HTOL) The purpose of this test is to simulate the user part operation over the expected life of the product. We typically use dynamic conditions, meaning the device is powered up, and the inputs are toggled to exercise a maximum number of transistors and circuit area. Reliability acceleration is accomplished primarily by temperature and secondarily by voltage. High Temperature Storage Life (HTSL) / High Temperature Bake (HTB) The purpose of this test is to determine the effect of storage at elevated temperature. This is performed to assess the stability of semiconductor device materials and interfaces. Low Temperature Operating Life (LTOL) The purpose of this test is to simulate the user operation at low temperature. This is a specialized test to address specific fab failure mechanisms, such as hot-carrier injection. Wafer level reliability tests are more effective for this characterization and are the primary qualification method. Silicon Labs typically uses dynamic conditions, meaning the device is powered up, and the inputs are toggled to exercise a maximum number of transistors and circuit area. Nonvolatile Memory Data Retention (DR) The purpose of this test is to measure the ability of a nonvolatile memory cell to retain its charge state at elevated temperature in the absence of applied external bias. This test can be done either in wafer form or on packaged units. All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 52/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability Monitor Report – Silicon Stresses QLotNum Stress FabProcess ReadDate SampleSize ReadPt Fails ºC Q035721 Q035137 Q036627 Q035944 Q036822 Q035945 Q036801 Q036742 Q036805 Q036827 Q036573 Q037286 Q037410 Q037332 Q036679 Q035911 Q035910 Q035909 Q036080 Q036746 Q036195 Q036194 Q037318 Q037290 Q037577 Q036809 Q036780 Q035567 Q035559 Q035539 Q036149 Q036770 Q036766 Q037240 Q037239 Q037238 Q037237 Q037328 Q037298 Q035963 Q035524 Q036675 Q035887 Q035902 Q035899 HTOL HTOL HTSL ELFR HTSL HTOL HTSL HTSL HTSL HTSL ELFR HTSL HTSL HTSL HTSL HTSL HTSL HTSL ELFR HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTOL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTDR HTOL HTSL HTSL HTSL HTSL 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.11 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.13 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 31-Jul-14 31-Jul-14 13-Aug-14 25-Aug-14 26-Aug-14 15-Sep-14 18-Sep-14 14-Nov-14 15-Nov-14 28-Nov-14 05-Dec-14 28-Mar-15 06-Apr-15 10-Apr-15 13-Aug-14 25-Aug-14 25-Aug-14 25-Aug-14 22-Sep-14 17-Nov-14 17-Nov-14 17-Nov-14 26-Mar-15 28-Mar-15 23-Jun-15 13-Aug-14 02-Sep-14 30-Sep-14 30-Sep-14 30-Sep-14 11-Oct-14 18-Feb-15 18-Feb-15 27-Feb-15 27-Feb-15 27-Feb-15 27-Feb-15 26-Mar-15 28-Mar-15 07-Jul-14 15-Jul-14 14-Aug-14 20-Aug-14 27-Aug-14 27-Aug-14 81 85 80 812 80 83 80 80 78 80 812 80 77 80 80 26 26 26 433 80 30 30 80 80 80 80 80 30 27 30 83 30 30 30 30 30 30 80 80 80 80 80 27 50 50 1000 1000 1000 96 1000 1000 1000 1000 1000 1000 48 1000 1000 1000 1000 1000 1000 1000 48 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 125 125 150 125 150 125 150 150 150 150 70 150 150 150 150 150 150 150 125 150 150 150 150 150 150 150 150 150 150 150 125 150 150 150 150 150 150 150 150 130 125 150 150 150 150 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 53/70 Quarterly Quality & Reliability Report QLotNum Stress Q036139 Q036138 Q036793 Q036319 Q036318 Q036317 Q036470 Q036291 Q036290 Q036738 Q036548 Q036849 Q036547 Q036610 Q036549 Q036529 Q036555 Q036910 Q036939 Q036726 Q036893 Q035786 Q035784 Q035685 Q035783 Q035781 Q036985 Q035681 Q037251 Q036989 Q037111 Q037310 Q037302 Q037012 Q037007 Q036999 Q035682 Q037159 Q037016 Q037015 Q037010 Q035684 Q037195 Q037194 Q037193 HTSL HTSL HTSL HTSL HTSL HTSL ELFR HTSL HTSL HTSL ELFR HTSL LTDR HTSL HTOL HTDR HTSL ELFR ELFR HTSL HTSL LTDR LTDR HTOL HTDR HTDR HTOL ELFR ELFR HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTSL HTOL HTSL HTSL HTSL FabProcess 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, 0.18 um, embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash embedded flash 15Q2_QR_Report-01 ReadDate SampleSize ReadPt Fails ºC 10-Oct-14 10-Oct-14 11-Oct-14 23-Oct-14 23-Oct-14 23-Oct-14 05-Nov-14 10-Nov-14 10-Nov-14 18-Nov-14 01-Dec-14 17-Dec-14 19-Dec-14 06-Jan-15 12-Jan-15 13-Jan-15 16-Jan-15 19-Jan-15 22-Jan-15 27-Jan-15 03-Mar-15 03-Mar-15 03-Mar-15 06-Mar-15 09-Mar-15 09-Mar-15 11-Mar-15 16-Mar-15 23-Mar-15 23-Mar-15 25-Mar-15 26-Mar-15 26-Mar-15 06-Apr-15 06-Apr-15 06-Apr-15 17-Apr-15 20-Apr-15 20-Apr-15 20-Apr-15 20-Apr-15 27-Apr-15 28-Apr-15 28-Apr-15 28-Apr-15 27 26 80 28 28 28 813 27 27 80 575 80 42 20 84 45 30 839 508 30 30 45 45 84 44 45 80 839 836 30 27 80 80 30 30 30 30 30 25 25 25 84 30 30 30 1000 1000 1000 1000 1000 1000 48 1000 1000 1000 48 1000 500 1000 1000 1000 1000 48 48 1000 1000 1000 1000 500 1000 1000 1000 48 48 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 150 150 150 150 150 150 125 150 150 150 125 150 25 150 125 150 150 125 125 150 150 25 25 125 150 150 125 125 125 150 150 150 150 150 150 150 150 150 150 150 150 125 150 150 150 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 54/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress FabProcess ReadDate SampleSize ReadPt Fails ºC Q037252 Q037253 Q037374 Q036550 Q037277 Q036522 Q036521 Q036520 Q037415 Q036509 Q037028 Q037027 Q037026 Q037499 Q036021 Q036020 Q036019 Q037058 Q037059 Q036590 Q037359 Q037110 Q037563 Q037561 Q037559 Q036784 Q036491 Q036487 Q036483 Q037173 Q037356 Q037325 Q037412 Q037340 Q037362 Q037361 Q035577 Q035578 Q036666 Q036837 Q036129 Q036221 Q036248 Q036227 Q036936 HTDR LTDR HTSL LTOL HTSL HTSL HTSL HTSL HTSL ELFR HTSL HTSL HTSL HTSL HTSL HTSL HTSL ELFR HTOL HTSL ELFR HTOL HTSL HTSL HTSL HTSL HTSL HTSL HTSL ELFR HTSL ELFR ELFR HTSL HTSL HTSL ELFR ELFR HTSL HTSL HTSL HTOL HTSL HTSL HTSL 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, embedded flash 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, OTP 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.18 um, RF 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 11-May-15 12-May-15 14-May-15 15-May-15 24-May-15 25-May-15 25-May-15 25-May-15 29-May-15 04-Jun-15 11-Jun-15 11-Jun-15 11-Jun-15 12-Jun-15 15-Aug-14 15-Aug-14 15-Aug-14 14-Nov-14 06-Jan-15 07-Jan-15 25-Mar-15 26-Mar-15 05-Jun-15 05-Jun-15 05-Jun-15 27-Aug-14 26-Jan-15 26-Jan-15 26-Jan-15 27-Mar-15 18-Apr-15 24-Apr-15 15-May-15 10-Jun-15 15-Jun-15 15-Jun-15 12-Jul-14 16-Jul-14 16-Sep-14 24-Sep-14 12-Oct-14 30-Oct-14 30-Oct-14 30-Oct-14 08-Nov-14 45 45 25 35 80 28 28 28 27 420 25 25 25 26 25 25 25 500 100 50 507 90 160 160 160 80 30 30 30 679 80 680 679 80 80 80 828 814 80 79 46 85 50 50 72 1000 1000 1000 1000 1000 1000 1000 1000 1000 48 1000 1000 1000 1000 1000 1000 1000 48 1000 1000 48 1000 500 500 500 1000 1000 1000 1000 48 1000 48 48 1000 2000 2000 48 48 1000 1000 1000 1000 1000 1000 1000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 150 25 150 -40 150 150 150 150 150 125 150 150 150 150 100 100 100 125 125 150 125 125 150 150 150 150 150 150 150 125 150 125 125 150 150 150 125 125 150 150 150 125 150 150 150 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 55/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress FabProcess ReadDate SampleSize ReadPt Fails ºC Q037212 Q037211 Q037269 Q037231 Q037637 Q036576 Q036853 Q037273 Q036831 Q037218 Q037314 Q037294 Q036325 Q037813 Q035592 Q035622 Q035607 Q035640 Q035834 Q036058 Q035769 Q035994 Q036059 Q035875 Q035845 Q036165 Q036750 Q035905 Q035933 Q035892 Q036089 Q036788 Q036233 Q036188 Q036187 Q036662 Q035998 Q036155 Q036166 Q036256 Q036232 Q036343 Q036409 Q036406 Q036346 ELFR ELFR HTSL HTSL ELFR HTSL HTSL HTSL HTSL ELFR HTSL HTSL HTSL ELFR HTSL HTSL HTOL HTSL ELFR HTOL LTOL ELFR ELFR ELFR HTOL ELFR HTSL HTOL HTSL HTSL ELFR HTSL ELFR HTSL HTSL HTSL HTSL ELFR HTOL ELFR HTOL HTSL HTSL HTSL HTOL 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um 0.25 um, embedded flash 0.25 um, embedded flash 0.25 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.35 um, embedded flash 0.45 um - 0.5 um 0.6 um - 1.0 um 0.6 um - 1.0 um 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 10-Mar-15 10-Mar-15 13-May-15 15-May-15 10-Jun-15 14-Oct-14 22-Dec-14 28-May-15 29-Aug-14 17-Mar-15 27-Mar-15 30-Mar-15 12-Nov-14 30-Apr-15 02-Jul-14 07-Jul-14 08-Jul-14 10-Jul-14 25-Jul-14 08-Aug-14 11-Aug-14 12-Aug-14 13-Aug-14 16-Aug-14 16-Aug-14 22-Aug-14 27-Aug-14 29-Aug-14 29-Aug-14 29-Aug-14 02-Sep-14 05-Sep-14 09-Sep-14 10-Sep-14 10-Sep-14 14-Sep-14 15-Sep-14 16-Sep-14 16-Sep-14 26-Sep-14 29-Sep-14 07-Oct-14 14-Oct-14 14-Oct-14 23-Oct-14 204 608 80 80 818 80 80 80 79 504 80 80 30 500 25 77 79 27 1500 80 34 525 503 1250 85 505 80 85 77 77 519 80 503 25 25 80 30 510 80 521 80 25 25 25 80 48 48 1000 1000 48 1000 1000 1000 1000 48 1000 1000 1000 48 1000 1000 1000 1000 48 1000 1000 48 48 48 1000 48 1000 1000 1000 1000 48 1000 48 1000 1000 1000 1000 48 1000 48 1000 1000 1000 1000 1000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 125 125 150 150 125 150 150 150 150 125 150 150 150 125 150 150 40 150 90 90 -10 40 90 90 90 90 150 90 150 150 40 150 90 150 150 150 150 125 90 90 90 150 150 150 90 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 56/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress FabProcess ReadDate SampleSize ReadPt Fails ºC Q036269 Q036263 Q036252 Q036242 Q036272 Q036841 Q036330 Q036754 Q036297 Q036422 Q036450 Q036464 Q037086 Q037155 Q037264 Q037392 Q037204 Q037348 Q037344 Q037468 Q037081 Q037216 Q037223 Q037227 Q037533 Q037469 Q037570 Q036683 Q036323 Q036402 Q036797 Q036797 Q036399 Q036401 Q036773 Q036901 Q036908 Q036534 Q036907 Q036535 Q037083 Q037080 Q037077 Q037352 Q037386 HTSL HTSL HTSL HTSL HTOL HTSL HTSL ELFR HTOL HTSL HTSL HTOL ELFR ELFR ELFR ELFR HTSL HTSL HTSL ELFR HTOL HTSL HTSL HTSL HTSL HTOL ELFR HTSL ELFR ELFR HTSL HTSL HTSL HTOL HTSL HTSL HTOL HTOL ELFR ELFR HTSL HTSL HTSL HTSL ELFR 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 55 nm 90 nm, embedded flash High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage High Voltage 07-Nov-14 07-Nov-14 07-Nov-14 07-Nov-14 10-Nov-14 13-Nov-14 13-Nov-14 17-Nov-14 17-Nov-14 03-Dec-14 05-Dec-14 05-Jan-15 11-Feb-15 07-Mar-15 24-Mar-15 14-Apr-15 16-Apr-15 18-Apr-15 18-Apr-15 07-May-15 07-May-15 14-May-15 17-May-15 18-May-15 23-Jun-15 24-Jun-15 22-May-15 13-Aug-14 15-Oct-14 21-Oct-14 30-Oct-14 30-Oct-14 01-Dec-14 03-Dec-14 21-Jan-15 19-Feb-15 07-Mar-15 07-Mar-15 12-Mar-15 12-Mar-15 16-Mar-15 16-Mar-15 16-Mar-15 18-Apr-15 27-Apr-15 30 30 30 30 80 80 30 503 80 30 30 80 504 828 827 518 80 80 80 514 80 80 80 80 80 80 508 80 440 63 80 80 25 89 25 25 90 90 503 504 30 30 30 79 1184 1000 1000 1000 1000 1000 1000 1000 48 1000 1000 1000 1000 48 48 48 48 1000 1000 1000 48 2000 1000 1000 1000 1000 1000 48 1000 48 48 1000 1000 1000 1000 1000 1000 1000 1000 48 48 1000 1000 1000 1000 48 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 150 150 150 150 65 150 150 90 90 150 150 40 75 75 75 90 150 150 150 75 75 150 150 150 150 75 125 150 125 125 150 150 150 125 150 150 125 125 125 125 150 150 150 150 125 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 57/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Package Reliability Test Method and Conditions Preconditioning (PC) This test method is performed to simulate the various shipping conditions, the end use environment and customer board mounting process for a given packaging system. Preconditioning is an industry standard flow for non-hermetic (plastic) integrated circuit packages that is representative of a typical industry solder reflow operation. The test parts are subject to bake, moisture soak and three reflow cycles prior to being submitted to package reliability testing. Temperature Cycling (TC) This test evaluates potential reliability degradation due to thermal cycling effects. Devices are placed in a chamber using forced air to cycle devices between the specified temperature extremes. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Temperature Humidity and Bias (THB) This test evaluates the reliability of non-hermetic packaged integrated circuits in humid environments. It employs severe conditions of temperature, humidity and bias to accelerate the penetration of moisture through the external protective material (encapsulant) or along the interface between the external protective material and the metallic conductors passing through it. This test is less accelerated than autoclave and unbiased HAST and takes longer to complete. It provides more realistic results in line with actual field performance. The dominant failure mechanism is aluminum corrosion accelerated by moisture, bias and contamination. Highly-Accelerated Temperature and Humidity Stress Test (HAST) This test evaluates the reliability of non-hermetic packaged integrated circuits in humid environments. It employs severe conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. The stress usually activates the same failure mechanisms as the “85/85” Temperature Humidity and Bias (THB) test. Unbiased Highly-Accelerated Stress Test (U-HAST) This test is performed to evaluate the reliability of non-hermetic packaged integrated circuits in humid environments. It is an alternate to Autoclave and tests for the same failure mechanisms. It employs severe conditions of temperature, humidity, and pressure to accelerate the penetration of moisture through the external protective material (encapsulant) or along the interface between the external protective material and the metallic conductors passing through it. UHAST is preferred over the autoclave stress method due to the reduction in artifacts induced by the 100%rh environment of autoclave, such as lead corrosion or contamination transfer by liquid water. The dominant failure mechanism is corrosion of internal materials. All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 58/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reflow Profile and Moisture Sensitivity Level Overview Non-hermetic (plastic) integrated circuit packages are classified by moisture sensitivity level according to IPC/JEDEC J-Std-020. It is critical for final product quality that the board assembly process account for package moisture sensitivity, especially the peak reflow temperature and the maximum manufacturing expose time (MET). Reflow Profile Non-hermetic integrated circuit SMD (surface mount devices) are qualified in compliance to the applicable reflow profiles provided in IPC/JEDEC J-Std-020. The board assembler should not exceed the limits defined in the reflow profile tables of IPC/JEDEC J-Std-020. Moisture Sensitivity Level The Moisture Sensitivity Level (MSL) and peak reflow temperature are indicated on each product packing label. All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 59/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Reliability Monitor Report – Package Stresses QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q035908 Q035907 Q035906 Q035914 Q035913 Q035912 Q036197 Q036196 Q036193 Q036192 Q037257 Q037256 Q037258 Q035917 Q035897 Q035896 Q035894 Q035916 Q035900 Q035918 Q035903 Q035901 Q036453 Q036618 Q037172 Q037171 Q036810 Q036808 Q035565 Q035557 Q035537 Q035566 Q035558 Q035538 Q037329 Q037327 Q035755 Q035753 Q035736 Q036073 Q036072 Q036071 Q036070 Q036069 Q036068 Q037319 Q037317 Q036490 Q036486 HAST HAST HAST Temp Cycle Temp Cycle Temp Cycle HAST HAST Temp Cycle Temp Cycle UHAST HAST Temp Cycle HAST UHAST UHAST UHAST HAST Temp Cycle HAST Temp Cycle Temp Cycle Temp Cycle UHAST UHAST UHAST UHAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle HAST HAST HAST UHAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST UHAST UHAST Temp Cycle Temp Cycle Temp Cycle UHAST Temp Cycle UHAST UHAST 4-DFN-2X2.5-LF 4-DFN-2X2.5-LF 4-DFN-2X2.5-LF 4-DFN-2X2.5-LF 4-DFN-2X2.5-LF 4-DFN-2X2.5-LF 4-DFN-5X7-LF 4-DFN-5X7-LF 4-DFN-5X7-LF 4-DFN-5X7-LF 4-SDFN-2x2-LF 4-SDFN-2x2-LF 4-SDFN-2x2-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 6-SDFN-3x3-LF 8-SOIC-150-LF 8-SOIC-150-LF 8-SOIC-150-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TDFN-1.4X1.6-LF 8-TSSOP-173-LF 8-TSSOP-173-LF 8-TSSOP-173-LF 10-DFN-2.0x2.5-LF 10-DFN-2.0x2.5-LF 10-DFN-2.0x2.5-LF 10-DFN-2.0x2.5-LF 10-DFN-2.0x2.5-LF 10-DFN-2.0x2.5-LF 10-MSOP-3.0-LF 10-MSOP-3.0-LF 10-TDFN-2.0X1.4-LF 10-TDFN-2.0X1.4-LF 22-Jul-14 22-Jul-14 22-Jul-14 23-Jul-14 23-Jul-14 23-Jul-14 16-Sep-14 16-Sep-14 01-Oct-14 01-Oct-14 19-Mar-15 19-Mar-15 23-Mar-15 22-Jul-14 22-Jul-14 22-Jul-14 22-Jul-14 13-Aug-14 13-Aug-14 21-Aug-14 13-Sep-14 13-Sep-14 06-Nov-14 16-Dec-14 31-Mar-15 31-Mar-15 13-Aug-14 13-Aug-14 25-Aug-14 25-Aug-14 25-Aug-14 24-Sep-14 24-Sep-14 24-Sep-14 26-Mar-15 26-Mar-15 18-Aug-14 18-Aug-14 18-Aug-14 22-Aug-14 22-Aug-14 22-Aug-14 03-Sep-14 03-Sep-14 03-Sep-14 06-Feb-15 06-Mar-15 03-Dec-14 03-Dec-14 26 27 27 27 27 27 29 30 30 30 90 81 74 80 79 80 80 80 80 80 79 80 100 85 85 85 80 80 30 30 30 30 30 30 80 80 30 30 30 30 30 30 50 50 50 80 80 30 30 96 96 96 700 700 700 96 96 700 700 96 96 500 96 96 96 96 96 500 96 500 500 500 96 96 96 96 500 500 500 500 96 96 96 96 500 500 500 500 96 96 96 500 500 500 96 500 96 96 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 60/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q036482 Q036489 Q036485 Q036481 Q037473 Q037472 Q037471 Q037479 Q037478 Q037477 Q037550 Q037549 Q037548 Q037547 Q037546 Q037540 Q036833 Q037135 Q037134 Q037133 Q036824 Q036823 Q036668 Q036667 Q036224 Q036223 Q036306 Q036304 Q036222 Q036303 Q036828 Q036826 Q036617 Q036612 Q037408 Q037409 Q037232 Q037230 Q037673 Q037672 Q037671 Q037740 Q037739 Q037738 Q037731 Q037730 Q037729 Q037743 Q037742 UHAST Temp Cycle Temp Cycle Temp Cycle HAST HAST HAST HAST HAST HAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST Temp Cycle UHAST Temp Cycle Temp Cycle UHAST Temp Cycle UHAST HAST HAST UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST UHAST UHAST UHAST UHAST UHAST UHAST UHAST UHAST Temp Cycle Temp Cycle 10-TDFN-2.0X1.4-LF 10-TDFN-2.0X1.4-LF 10-TDFN-2.0X1.4-LF 10-TDFN-2.0X1.4-LF 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 14-SOIC-150 16-QFN-3X3-LF 16-QFN-3X3-LF 16-QFN-3X3-LF 16-QFN-3X3-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 03-Dec-14 11-Dec-14 11-Dec-14 11-Dec-14 29-Apr-15 29-Apr-15 29-Apr-15 04-May-15 04-May-15 04-May-15 08-May-15 08-May-15 08-May-15 08-May-15 08-May-15 08-May-15 30-Dec-14 19-Feb-15 19-Feb-15 19-Feb-15 20-Jul-14 28-Jul-14 05-Aug-14 13-Aug-14 25-Sep-14 25-Sep-14 04-Oct-14 09-Oct-14 09-Oct-14 17-Oct-14 28-Oct-14 31-Oct-14 16-Dec-14 16-Dec-14 18-Feb-15 27-Feb-15 25-Mar-15 01-Apr-15 20-May-15 20-May-15 20-May-15 22-May-15 22-May-15 22-May-15 22-May-15 22-May-15 22-May-15 29-May-15 29-May-15 30 30 30 30 25 25 25 25 25 25 80 80 80 80 80 80 27 27 27 27 80 79 80 80 82 82 82 80 81 82 80 80 85 85 77 77 80 80 77 77 77 25 25 25 25 25 25 25 25 96 500 500 500 96 96 96 96 96 96 500 500 500 500 500 500 500 500 500 500 96 500 96 500 500 96 500 96 96 96 96 500 96 500 96 500 96 500 96 96 96 96 96 96 96 96 96 500 500 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. 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Pg. 61/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q037741 Q037734 Q037733 Q037732 Q037710 Q037709 Q037708 Q036249 Q036247 Q036228 Q036226 Q036225 Q036246 Q037268 Q037270 Q036836 Q036937 Q036938 Q036838 Q037616 Q037614 Q037612 Q037611 Q037610 Q037609 Q035873 Q035872 Q035871 Q037498 Q037500 Q037660 Q037662 Q037568 Q037566 Q035863 Q035861 Q035862 Q035864 Q036794 Q036792 Q036818 Q036819 Q037335 Q037337 Q037202 Q037200 Q037199 Q037190 Q037198 Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST Temp Cycle UHAST HAST HAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST UHAST UHAST UHAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle HAST HAST Temp Cycle HAST Temp Cycle HAST UHAST HAST HAST UHAST Temp Cycle HAST Temp Cycle Temp Cycle UHAST UHAST UHAST UHAST HAST Temp Cycle 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-150-LF 16-SOIC-300-LF 16-SOIC-300-LF 16-SOIC-300-LF 16-SOIC-300-LF 16-SOIC-300-LF 16-SOIC-300-LF 16-SOIC-300-LF 16-SOIC-300-LF 16-SSOP-150-LF 16-SSOP-150-LF 16-SSOP-150-LF 16-SSOP-150-LF 16-TSSOP-173-LF 16-TSSOP-173-LF 16-TSSOP-173-LF 16-TSSOP-173-LF 16-TSSOP-173-LF 16-TSSOP-173-LF 16-TSSOP-4.4-LF 16-TSSOP-4.4-LF 16-TSSOP-4.4-LF 16-WLCSP-1.659x1.781 16-WLCSP-1.659x1.781 16-WLCSP-1.659x1.781 16-WLCSP-1.659x1.781 16-WLCSP-1.659x1.781 16-WLCSP-1.659x1.781 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 29-May-15 29-May-15 29-May-15 29-May-15 04-Jun-15 04-Jun-15 04-Jun-15 24-Sep-14 24-Sep-14 24-Sep-14 24-Sep-14 11-Oct-14 16-Oct-14 28-Mar-15 23-Apr-15 27-Aug-14 04-Sep-14 08-Sep-14 24-Sep-14 20-May-15 20-May-15 20-May-15 20-May-15 20-May-15 20-May-15 09-Sep-14 09-Sep-14 09-Sep-14 07-May-15 18-May-15 08-Jun-15 09-Jun-15 09-Jun-15 09-Jun-15 21-Jul-14 21-Jul-14 06-Aug-14 13-Aug-14 21-Aug-14 25-Aug-14 08-Jan-15 09-Jan-15 18-Mar-15 20-Mar-15 21-Mar-15 21-Mar-15 21-Mar-15 21-Mar-15 25-Mar-15 25 25 25 25 77 77 77 82 82 82 82 82 72 80 80 80 74 80 80 80 80 80 80 80 80 30 30 30 26 26 26 26 26 26 80 84 80 80 80 80 30 30 80 80 82 80 81 77 80 500 500 500 500 500 500 500 500 96 500 96 96 96 500 96 500 96 500 96 96 96 96 500 500 500 500 500 500 500 96 96 500 96 500 96 192 96 96 96 500 96 500 500 96 96 96 96 96 500 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. 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Pg. 62/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q037197 Q037196 Q037191 Q037192 Q036832 Q036830 Q036785 Q036783 Q036578 Q036577 Q036855 Q037315 Q037313 Q037274 Q037272 Q037357 Q037355 Q037574 Q037572 Q037148 Q037147 Q037358 Q036743 Q036741 Q037287 Q037285 Q035997 Q035996 Q035995 Q036000 Q036268 Q036262 Q036251 Q036241 Q036267 Q036266 Q036261 Q036255 Q036250 Q036245 Q036240 Q036239 Q036271 Q036244 Q036265 Q036254 Q036680 Q036678 Q036747 Temp Cycle Temp Cycle HAST HAST UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST HAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle Temp Cycle UHAST HAST LTSL Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST HAST UHAST HAST UHAST HAST UHAST HAST LTSL LTSL LTSL LTSL UHAST Temp Cycle UHAST 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-3X3-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-QFN-4X4-LF 20-SOIC-300-LF 20-SOIC-300-LF 20-SOIC-300-LF 20-UQFN-3X3-LF 20-UQFN-3X3-LF 20-UQFN-3X3-LF 20-UQFN-3X3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-3x3-LF 24-QFN-4X4-LF 24-QFN-4X4-LF 24-QFN-4X4-LF 25-Mar-15 25-Mar-15 26-Mar-15 02-Apr-15 25-Jul-14 05-Aug-14 27-Aug-14 27-Aug-14 24-Sep-14 24-Sep-14 20-Nov-14 05-Mar-15 05-Mar-15 07-Apr-15 12-Apr-15 18-Apr-15 18-Apr-15 29-May-15 05-Jun-15 25-Feb-15 25-Feb-15 25-Mar-15 07-Oct-14 14-Oct-14 17-Feb-15 26-Feb-15 07-Aug-14 22-Aug-14 27-Aug-14 11-Sep-14 26-Sep-14 26-Sep-14 26-Sep-14 26-Sep-14 30-Sep-14 30-Sep-14 30-Sep-14 30-Sep-14 30-Sep-14 30-Sep-14 30-Sep-14 30-Sep-14 03-Nov-14 03-Nov-14 07-Nov-14 07-Nov-14 07-Jul-14 16-Jul-14 07-Oct-14 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 78 78 80 80 80 80 80 30 29 80 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 80 80 80 500 500 96 96 96 500 96 500 96 500 96 96 500 96 500 96 500 96 500 96 96 500 96 500 96 500 500 96 96 1000 500 500 500 500 96 96 96 96 96 96 96 96 1000 1000 1000 1000 96 500 96 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 63/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q036745 Q037291 Q037289 Q037341 Q037339 Q037578 Q037576 Q036802 Q036800 Q036806 Q036804 Q036508 Q036511 Q037333 Q037331 Q036528 Q036527 Q036526 Q036515 Q036513 Q036525 Q036524 Q036523 Q036519 Q036751 Q036749 Q036206 Q036842 Q036840 Q036435 Q037217 Q037215 Q037345 Q037343 Q036554 Q036556 Q036557 Q037162 Q037161 Q037160 Q037165 Q037164 Q037163 Q035788 Q035789 Q035792 Q036798 Q036796 Q037039 Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle HAST Temp Cycle UHAST Temp Cycle UHAST UHAST UHAST HAST HAST Temp Cycle Temp Cycle Temp Cycle HAST UHAST Temp Cycle Temp Cycle UHAST Temp Cycle Temp Cycle UHAST Temp Cycle UHAST Temp Cycle HAST Temp Cycle UHAST Temp Cycle Temp Cycle Temp Cycle UHAST UHAST UHAST HAST HAST HAST UHAST Temp Cycle UHAST 24-QFN-4X4-LF 24-QFN-4X4-LF 24-QFN-4X4-LF 24-QFN-4X4-LF 24-QFN-4X4-LF 24-QFN-4X4-LF 24-QFN-4X4-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 24-QSOP-150-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-4X4-LF 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-QFN-5X5 28-TSSOP-4.4-LF 28-TSSOP-4.4-LF 29-LGA-3.5X5.5-LF 14-Oct-14 17-Feb-15 26-Feb-15 25-Apr-15 25-Apr-15 13-May-15 26-May-15 18-Sep-14 18-Sep-14 26-Sep-14 30-Sep-14 07-Jan-15 09-Jan-15 25-Feb-15 25-Feb-15 14-May-15 14-May-15 14-May-15 14-May-15 14-May-15 15-May-15 15-May-15 15-May-15 21-May-15 27-Aug-14 27-Aug-14 18-Sep-14 06-Oct-14 13-Oct-14 03-Nov-14 25-Mar-15 01-Apr-15 18-Apr-15 18-Apr-15 09-Dec-14 11-Dec-14 07-Jan-15 12-Mar-15 12-Mar-15 12-Mar-15 13-Mar-15 13-Mar-15 13-Mar-15 13-Mar-15 20-Mar-15 03-Apr-15 10-Sep-14 13-Sep-14 02-Apr-15 80 80 80 80 80 80 80 80 80 78 80 25 25 80 80 80 80 80 80 80 80 80 80 80 80 80 29 80 80 30 80 80 80 80 30 30 30 80 80 80 80 80 80 77 80 80 80 80 25 500 96 500 96 500 96 500 96 500 96 500 96 500 96 500 96 96 96 96 96 500 500 500 96 96 500 500 96 500 500 96 96 96 500 96 500 96 500 500 500 96 96 96 96 96 96 96 500 96 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. 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Pg. 64/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q037041 Q037040 Q037044 Q037043 Q037042 Q036624 Q036622 Q036621 Q036620 Q036619 Q037776 Q037775 Q037772 Q037771 Q036628 Q036626 Q036987 Q036988 Q037248 Q037247 Q037244 Q037243 Q037303 Q037301 Q037418 Q037113 Q037114 Q037295 Q037293 Q036329 Q036331 Q036419 Q036420 Q036333 Q036424 Q036452 Q036734 Q036735 Q036905 Q036876 Q037228 Q037226 Q036088 Q036086 Q036087 Q036684 Q036682 Q035884 Q035961 UHAST UHAST Temp Cycle Temp Cycle Temp Cycle UHAST UHAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST UHAST UHAST Temp Cycle UHAST Temp Cycle Temp Cycle UHAST Temp Cycle UHAST UHAST Temp Cycle Temp Cycle HAST Temp Cycle UHAST Temp Cycle HAST Temp Cycle HAST Temp Cycle LTSL LTSL LTSL HAST Temp Cycle Temp Cycle HAST UHAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST Temp Cycle HAST HAST 29-LGA-3.5X5.5-LF 29-LGA-3.5X5.5-LF 29-LGA-3.5X5.5-LF 29-LGA-3.5X5.5-LF 29-LGA-3.5X5.5-LF 32-LGA-5X5-LF 32-LGA-5X5-LF 32-LGA-5X5-LF 32-LGA-5X5-LF 32-LGA-5X5-LF 32-QFN-5X5 32-QFN-5X5 32-QFN-5X5 32-QFN-5X5 32-QFN-5X5-LF 32-QFN-5X5-LF 32-QFN-6x6 32-QFN-6x6 32-QFN-6x6 32-QFN-6x6 32-QFN-6x6 32-QFN-6x6 32-VQFN-S-6x6 32-VQFN-S-6x6 36-WLCSP-3.016x2.891 36-WLCSP-EFM32HG Lit 36-WLCSP-EFM32HG Lit 38-QFN-5X7-LF 38-QFN-5X7-LF 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5X5 40-QFN-5x5-LF 40-QFN-5x5-LF 40-QFN-5x5-LF 42-LGA-5X7-LF 42-LGA-5X7-LF 42-LGA-5X7-LF 42-LGA-5X7-LF 06-Apr-15 06-Apr-15 09-Apr-15 09-Apr-15 09-Apr-15 24-Oct-14 24-Oct-14 18-Nov-14 18-Nov-14 18-Nov-14 22-Jun-15 22-Jun-15 23-Jun-15 23-Jun-15 07-Jul-14 16-Jul-14 12-Feb-15 04-Mar-15 27-Mar-15 27-Mar-15 27-Mar-15 27-Mar-15 17-Feb-15 26-Feb-15 08-May-15 10-Mar-15 12-Mar-15 17-Feb-15 26-Feb-15 08-Oct-14 09-Oct-14 22-Oct-14 23-Oct-14 13-Nov-14 02-Dec-14 05-Dec-14 09-Dec-14 10-Dec-14 16-Jan-15 20-Jan-15 25-Mar-15 01-May-15 20-Aug-14 20-Aug-14 25-Aug-14 07-Jul-14 16-Jul-14 20-Jul-14 01-Aug-14 25 25 25 25 25 25 25 25 25 25 27 27 27 27 80 80 30 30 30 30 30 30 80 80 27 25 27 80 80 30 30 30 30 30 30 30 28 30 30 30 80 80 30 30 30 80 80 30 30 96 96 500 500 500 96 96 500 500 500 500 500 96 96 96 500 96 500 500 96 500 96 96 500 500 96 500 96 500 96 500 96 500 1000 1000 1000 96 500 500 96 96 500 500 500 500 96 500 264 264 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. 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Pg. 65/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q036012 Q037299 Q037297 Q035850 Q037507 Q037504 Q036130 Q036156 Q036231 Q036230 Q036229 Q036157 Q037052 Q037082 Q037079 Q037076 Q037075 Q037078 Q036055 Q036054 Q036057 Q036056 Q036672 Q036060 Q036061 Q036671 Q036158 Q036159 Q036160 Q036789 Q036787 Q036186 Q036185 Q036235 Q036234 Q036344 Q036342 Q036398 Q036851 Q036400 Q036850 Q036531 Q036530 Q036772 Q036774 Q036875 Q036874 Q036873 Q036920 HAST UHAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle HAST HAST Temp Cycle Temp Cycle Temp Cycle HAST HAST Temp Cycle Temp Cycle Temp Cycle HAST HAST UHAST UHAST Temp Cycle Temp Cycle UHAST HAST HAST Temp Cycle UHAST HAST Temp Cycle UHAST Temp Cycle THB THB LTSL LTSL THB LTSL Temp Cycle UHAST HAST Temp Cycle Temp Cycle Temp Cycle HAST Temp Cycle HAST HAST HAST Temp Cycle 42-LGA-5X7-LF 42-LGA-5X7-LF 42-LGA-5X7-LF 44-QFN-7X7-LF 44-QFN-7X7-LF 44-QFN-7X7-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-6X6-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 15-Aug-14 17-Feb-15 26-Feb-15 02-Oct-14 07-May-15 07-May-15 03-Sep-14 09-Sep-14 16-Sep-14 16-Sep-14 16-Sep-14 17-Sep-14 05-Feb-15 09-Feb-15 09-Feb-15 09-Feb-15 09-Feb-15 24-Feb-15 01-Aug-14 01-Aug-14 08-Aug-14 08-Aug-14 11-Aug-14 13-Aug-14 14-Aug-14 15-Aug-14 29-Aug-14 03-Sep-14 04-Sep-14 05-Sep-14 05-Sep-14 10-Sep-14 10-Sep-14 11-Sep-14 11-Sep-14 07-Oct-14 07-Oct-14 24-Oct-14 04-Nov-14 11-Nov-14 14-Nov-14 14-Nov-14 14-Nov-14 15-Dec-14 18-Dec-14 13-Jan-15 13-Jan-15 13-Jan-15 14-Jan-15 30 80 80 26 27 27 25 25 30 30 30 25 25 25 25 25 25 25 25 25 25 25 80 25 25 80 25 25 25 80 80 25 25 25 25 25 25 25 80 25 80 28 28 25 25 25 25 25 25 264 96 500 500 500 500 96 96 500 500 500 96 96 500 500 500 96 96 96 96 500 500 96 96 96 500 96 96 500 96 500 1000 1000 1000 1000 1000 1000 500 96 96 500 500 500 96 500 96 96 96 500 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 66/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q036919 Q036918 Q036902 Q036900 Q037121 Q037120 Q037119 Q037019 Q037018 Q037017 Q037278 Q037276 Q037349 Q037347 Q037311 Q037309 Q037005 Q037009 Q037014 Q037013 Q037008 Q037000 Q036143 Q036137 Q036145 Q035805 Q035893 Q035891 Q035890 Q035932 Q035931 Q035934 Q037353 Q037351 Q037397 Q037429 Q037428 Q037427 Q037031 Q037030 Q037029 Q037750 Q035817 Q035883 Q035882 Q036569 Q036570 Q036769 Q036768 Temp Cycle Temp Cycle Temp Cycle HAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST Temp Cycle UHAST UHAST UHAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST HAST HAST UHAST HAST Temp Cycle UHAST Temp Cycle HAST UHAST Temp Cycle Temp Cycle HAST HAST HAST Temp Cycle Temp Cycle Temp Cycle HAST HAST HAST HAST Temp Cycle HAST HAST HAST 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-QFN-7X7-LF 48-TQFP-7x7 48-TQFP-7x7 48-TQFP-7x7 48-TQFP-7x7 48-TQFP-7x7 48-TQFP-7x7 48-TQFP-7x7 48-TQFP-7x7 52-LQFP-10x10-LF 52-LQFP-10x10-LF 52-LQFP-10x10-LF 56-LGA-8x8-LF 56-LGA-8x8-LF 56-LGA-8x8-LF 56-LGA-8x8-LF 56-LGA-8x8-LF 56-LGA-8x8-LF 56-LGA-8x8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 56-QFN-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 14-Jan-15 14-Jan-15 15-Jan-15 27-Jan-15 05-Mar-15 05-Mar-15 05-Mar-15 19-Mar-15 19-Mar-15 19-Mar-15 26-Mar-15 02-Apr-15 18-Apr-15 18-Apr-15 17-Feb-15 26-Feb-15 06-Mar-15 08-Mar-15 09-Mar-15 12-Mar-15 12-Mar-15 12-Mar-15 08-Sep-14 09-Sep-14 15-Sep-14 01-Jul-14 21-Jul-14 21-Jul-14 21-Jul-14 31-Jul-14 31-Jul-14 14-Aug-14 18-Apr-15 18-Apr-15 20-Apr-15 05-May-15 05-May-15 05-May-15 14-May-15 14-May-15 14-May-15 15-Jun-15 07-Jul-14 20-Jul-14 20-Jul-14 19-Nov-14 25-Nov-14 20-Jan-15 20-Jan-15 25 25 25 25 25 25 25 25 25 25 80 80 80 80 80 80 30 30 30 30 30 30 27 27 27 25 15 25 25 15 25 25 79 80 27 25 22 24 25 25 25 27 28 28 28 27 26 27 27 500 500 500 96 500 500 500 500 500 500 96 500 96 500 96 500 96 96 96 500 500 500 700 96 96 96 96 96 1000 96 1000 96 96 500 700 96 96 96 500 500 500 96 96 264 264 500 264 264 264 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 67/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q037234 Q037233 Q036771 Q036767 Q037236 Q037235 Q036781 Q036779 Q035780 Q036313 Q036312 Q036311 Q036316 Q036315 Q036314 Q037203 Q037241 Q037205 Q037534 Q036122 Q036119 Q036142 Q036141 Q036146 Q036144 Q036136 Q036135 Q036896 Q036895 Q036894 Q036889 Q036892 Q036888 Q036899 Q036898 Q036897 Q036049 Q036048 Q036047 Q036046 Q036045 Q036044 Q036052 Q036051 Q036050 Q036664 Q036663 Q036162 Q036161 Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle UHAST Temp Cycle HAST HAST HAST HAST Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle HAST Temp Cycle HAST UHAST Temp Cycle Temp Cycle HAST HAST UHAST UHAST UHAST UHAST UHAST HAST HAST HAST Temp Cycle Temp Cycle Temp Cycle UHAST UHAST UHAST Temp Cycle Temp Cycle Temp Cycle HAST HAST HAST UHAST Temp Cycle HAST HAST 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-LGA-8X8-LF 60-QFN-8X8-LF 60-QFN-8X8-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-QFN-9X9-LF 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-TQFP-10x10 64-VQFN-S-9x9 64-VQFN-S-9x9 64-VQFN-S-9x9 64-VQFN-S-9x9 64-VQFN-S-9x9 64-VQFN-S-9x9 64-VQFN-S-9x9 64-VQFN-S-9x9 64-VQFN-S-9x9 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 27-Jan-15 27-Jan-15 27-Jan-15 27-Jan-15 28-Jan-15 28-Jan-15 02-Sep-14 02-Sep-14 07-Jul-14 15-Sep-14 15-Sep-14 15-Sep-14 26-Sep-14 26-Sep-14 26-Sep-14 12-Mar-15 20-Mar-15 31-Mar-15 03-Jun-15 03-Sep-14 03-Sep-14 08-Sep-14 08-Sep-14 09-Sep-14 09-Sep-14 09-Sep-14 09-Sep-14 16-Jan-15 16-Jan-15 16-Jan-15 27-Jan-15 05-Feb-15 05-Feb-15 06-Feb-15 06-Feb-15 06-Feb-15 22-Aug-14 22-Aug-14 22-Aug-14 03-Sep-14 03-Sep-14 03-Sep-14 18-Sep-14 18-Sep-14 18-Sep-14 07-Aug-14 13-Aug-14 03-Sep-14 03-Sep-14 30 29 30 30 30 30 80 80 27 28 28 28 28 28 28 80 80 80 79 27 27 27 27 27 27 27 27 30 30 30 30 30 29 30 29 29 30 30 30 30 30 30 30 30 30 80 80 25 25 500 500 500 500 500 500 96 500 96 96 96 96 500 500 500 500 500 96 1000 96 96 700 700 96 96 96 96 96 96 96 96 96 96 500 500 500 96 96 96 500 500 500 96 96 96 96 500 96 96 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. 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Pg. 68/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 QLotNum Stress PkgType Read Date Sample Size Read Point Fails Q036164 Q036163 Q036238 Q036237 Q036607 Q036413 Q036411 Q036410 Q036408 Q036407 Q036345 Q036605 Q036604 Q037224 Q037222 Q037364 Q037363 Q037213 Q037320 Q037421 Q037381 Q037492 Q037651 Q035729 Q035730 Q035617 Q036426 Q036425 Q035985 Q035984 Q036293 Q036292 Q037455 Q035958 Q036276 Q036275 Q036277 Q036280 Q036279 Q036278 Q036676 Q036674 Q036739 Q036737 UHAST UHAST Temp Cycle Temp Cycle HAST Temp Cycle THB LTSL THB LTSL UHAST LTSL THB UHAST Temp Cycle Temp Cycle Temp Cycle HAST HAST Temp Cycle HAST HAST HAST HAST HAST HAST HAST HAST Temp Cycle HAST Temp Cycle Temp Cycle HAST Temp Cycle UHAST UHAST UHAST Temp Cycle Temp Cycle Temp Cycle UHAST Temp Cycle UHAST Temp Cycle 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 68-QFN-8X8-LF 72-QFN-10X10-LF 72-QFN-10X10-LF 72-QFN-10X10-LF 72-QFN-10X10-LF 72-QFN-10X10-LF 72-QFN-10X10-LF 72-QFN-10X10-LF 72-QFN-10X10-LF 80-PBGA-10X10-LF 80-PBGA-10X10-LF 80-PBGA-10X10-LF 81-WLCSP-4.27x4.25 81-WLCSP-4.27x4.25 81-WLCSP-EFM32WG Ern 81-WLCSP-EFM32WG Ern 81-WLCSP-EFM32WG Ern 81-WLCSP-EFM32WG Ern 84-QFN-12x12-LF 85-LGA-6X8-LF 100-LQFP-14x14 100-LQFP-14x14 100-LQFP-14x14 100-LQFP-14x14 100-LQFP-14x14 100-LQFP-14x14 112-LFBGA-10x10 112-LFBGA-10x10 120-VFBGA-7x7 120-VFBGA-7x7 04-Sep-14 04-Sep-14 12-Sep-14 12-Sep-14 10-Oct-14 10-Oct-14 14-Oct-14 14-Oct-14 14-Oct-14 14-Oct-14 29-Oct-14 06-Nov-14 06-Nov-14 25-Mar-15 01-Apr-15 30-Mar-15 30-Mar-15 03-Apr-15 14-Apr-15 24-Apr-15 01-May-15 28-May-15 30-Jun-15 05-Jul-14 23-Aug-14 06-Sep-14 11-Nov-14 19-Nov-14 01-Aug-14 21-Aug-14 22-Oct-14 22-Oct-14 20-May-15 28-Jul-14 28-Aug-14 28-Aug-14 29-Aug-14 10-Sep-14 10-Sep-14 10-Sep-14 09-Jul-14 21-Jul-14 10-Oct-14 17-Oct-14 25 25 25 25 25 25 25 25 25 25 25 25 25 80 80 80 80 35 35 80 35 42 42 25 25 25 26 26 27 25 27 27 84 100 48 47 49 50 48 48 80 80 80 80 96 96 500 500 96 500 1000 1000 1000 1000 96 1000 1000 96 500 500 500 192 192 500 192 96 96 264 264 264 96 96 500 96 500 500 96 500 96 96 96 500 500 500 96 500 96 500 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Pg. 69/70 Quarterly Quality & Reliability Report 15Q2_QR_Report-01 Revision History Rev No 01 Description Original All rights reserved. No part of this publication may be reproduced without prior approval by Silicon Labs. Effective Date 20-Jul-2015 Pg. 70/70