1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT SERIES Single-Phase Full-Wave Motor Driver for Fan Motor TYPE ＢＤ６９７３ＦＶ FEATURES Pre-driver compatible for external Tr Speed controllable by DC/PWM input PWM soft switching drive 〇ABSOLUTE MAXIMUM RATINGS Symbol Limit Parameter Supply voltage Vcc 20 Power dissipation Pd 874.7＊ Operating temperature Topr -40 to +100 Storage temperature Tstg -55 to +150 High side output voltage VOH 36 Low side output voltage VOL 15 Low side output current IOL 10 FG output current IFG 10 FG output voltage VFG 20 REF current ability IREF 12 HB current ability IHB 12 Input voltage(H+, H-, TH, MIN, CS, SS) VIN 7 Junction temperature Tjmax 150 ＊Reduce by 7.0mW/°C over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board) 〇OPERATING CONDITIONS Parameter Operating supply voltage range Symbol Vcc Hall input voltage range VH TH input voltage range MIN input voltage range VTH VMIN ＊This product is not designed for production against radioactive rays. REV. D Limit 4.3 to 17.0 0 to Vcc-2.0 0 to 7.0 0 to REF 0 to REF Unit V mW °C °C V V mA mA V mA mA V °C Unit V V V V V less than Vcc=9.0V more than Vcc=9.0V 2/4 〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25°C, Vcc=12V) Limit Symbol Parameter Unit Conditions Min. Typ. Max. Circuit current Icc 3 5 8 mA Hall input hysteresis VHYS ±5 ±10 ±15 mV High side output current IH 9.0 12.0 16.5 mA VOH=12V High side output leak current IHL 10 μA VOH=36V Low side output high voltage VLH 9.3 9.5 V IOL=-5mA Low side output low voltage VLL 0.5 0.7 V IOL=5mA Lock detection ON time TON 0.2 0.3 0.45 s Lock detection OFF time TOFF 4.0 6.0 9.0 s FG output low voltage VFGL 0.3 V IFG=5mA FG output leak current IFGL 10 μA VFG=17V OSC low voltage VOSCL 0.8 1.0 1.2 V OSC high voltage VOSCH 2.3 2.5 2.7 V OSC charge current ICOSC -55 -40 -25 μA OSC discharge current IDOSC 25 40 55 μA VTH=VREF×0.26 Output ON duty 1 DUTY1 75 80 85 % (H side pull up R=1kΩ, COSC=470pF) VTH=VREF×0.35 Output ON duty 2 DUTY2 45 50 55 % (H side pull up R=1kΩ, COSC=470pF) VTH=VREF×0.44 Output ON duty 3 DUTY3 15 20 25 % (H side pull up R=1kΩ, COSC=470pF) REF voltage VREF 4.8 5.0 5.2 V IREF=-2mA Hall bias voltage VHB 1.10 1.26 1.50 V IHB=-2mA Current limit voltage VCL 120 150 180 mV SS charge current ISS 50 120 300 nA VSS=0V TH bias current ITH 0.2 μA MIN bias current IMIN 0.2 μA CS bias current ICS 0.2 μA REV. D 3/4 〇PACKAGE OUTLINES 16 9 0.3Min. 1.15 ± 0.1 6.4 ± 0.3 0.1 4.4 ± 0.2 5.0 ± 0.2 D6973 1 8 0.15 ± 0.1 Lot No. 0.1 0.22 ± 0.1 0.65 SSOP-B16 (UNIT: mm) 〇BLOCK DIAGRAM 〇TERMINAL NAME GND FG 1 SIGNAL OUTPUT SOFT START QUICK START 16 TSD H- OSC 2 SOFT SWITCH OSC MIN + 3 - + TH LOCK PROTECTION HB HB TH PWMCOMP HALL COMP - 4 15 MIN PWMCOMP 14 - H+ + 13 VCL CONTROL REF 5 REF LOGIC A1H 7 A1L 8 + - SS 12 CS Vcc 6 CURRENT LIMIT COMP + PRE DRIVER 11 A2H 10 A2L 9 REV. D PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Terminal name FG OSC MIN TH REF Vcc A1H A1L A2L A2H CS SS H+ HB HGND 4/4 〇CAUTIONS ON USE 1) Absolute maximum ratings An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. REV. D Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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