CW252016

T
PL
IA
N
M
CO
*R
oH
S
Features
Applications
■ 1008 size
■ Mobile phones
■ Available in E12 series
■ Cellular phones
■ High Q
■ CTV, VCR, HIC, FDD
■ High operating temperature of 125 °C
■ RoHS compliant*
CW252016 Series - High Q Chip Inductors
Electrical Specifications
General Specifications
Inductance
Bourns® Part No.
nH
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
CW252016-10NK
CW252016-12NK
CW252016-15NK
CW252016-18NK
CW252016-22NK
CW252016-27NK
CW252016-33NK
CW252016-39NK
CW252016-47NK
CW252016-56NJ
CW252016-68NJ
CW252016-82NJ
CW252016-R10J
CW252016-R12J
CW252016-R15J
CW252016-R18J
CW252016-R22J
CW252016-R27J
CW252016-R33J
CW252016-R39J
CW252016-R47J
CW252016-R56J
CW252016-R68J
CW252016-R82J
CW252016-1R0J
CW252016-1R2J
CW252016-1R5J
CW252016-1R8J
CW252016-2R2J
CW252016-2R7J
CW252016-3R3J
CW252016-3R9J
CW252016-4R7J
Q
Tol. %
±10
±10
±10
±10
±10
±10
±10
±10
±10
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
Min.
50
50
40
50
55
55
60
60
60
60
60
60
60
50
45
45
45
45
45
45
45
45
45
45
25
25
25
25
25
22
22
20
18
Test Freq.
(MHz)
SRF
(MHz)
RDC
(Ohms)
I rms
(mA)
L
100
100
100
100
100
100
100
100
100
100
100
100
100
25
25
25
25
25
25
25
25
25
25
25
25
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
Min.
4100
3300
2500
2500
2400
1600
1600
1500
1500
1300
1300
1000
1000
950
850
750
700
600
570
500
450
415
375
350
290
250
200
160
160
70
55
48
43
Max.
0.08
0.09
0.10
0.11
0.12
0.13
0.14
0.15
0.16
0.18
0.20
0.22
0.56
0.63
0.70
0.77
0.84
0.91
1.05
1.12
1.19
1.33
1.55
2.30
1.75
2.00
2.30
2.60
2.80
3.20
3.40
3.60
4.00
Max.
600
600
500
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
400
470
400
400
360
330
280
280
270
250
195
185
180
175
Q
500
500
350
350
350
350
350
350
350
350
350
350
350
100
100
100
100
100
100
100
100
100
100
100
50
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
Temperature Rise
.................40 °C max. at rated current
Operating Temperature
................................-40 °C to +125 °C
Storage Temperature
................................-40 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
............................ +260 °C, 5 seconds
Materials
Core Material
-10NK thru -R82J ...................Ceramic
-1R0J thru -4R7J .......................Ferrite
Wire ........ Enameled copper (1W1E180)
Terminal ...........................Mo/Mn+Ni+Au
Packaging ................. 2,000 pcs. per reel
Product Dimensions
1.3 ± 0.2
(.051 ± .008)
0.5
(.020)
2.1 ± 0.2
(.083 ± .008)
1.5 ± 0.2
(.059 ± .008)
0.5
(.020)
0.5
(.020)
Packaging Specifications
Recommended Layout
2.0 ± 0.5
(.079 ± .020)
178.0
(7.00)
DIA.
21.0 ± 0.8
(.827 ± .031)
DIMENSIONS:
12.5
(.492)
MM
(INCHES)
REF.
THICKNESS
0.10
(.004)
MAX.
13.0 ± 0.5
(.512 ± .020)
DIA.
1.02
(.040)
EMBOSSED
CAVITY
50.0
(1.969)
REF.
13.0 ± 0.5
DIA.
(.512 ± .020)
10.0
(.393)
1.78
REF.
(.070)
0.76
(.030)
DIMENSIONS:
EMBOSSED
CARRIER
1.02
REF.
(.040)
8.0
(.315)
REV. 09/15
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MM
(INCHES)