Z-Power LED X10490 Technical Data Sheet Specification SUYT801 SSC Drawn Approval Customer Approval Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Contents 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics Color & Binnig 5. Color & Binnig 6. Outline Dimension 7. Packing 8. Soldering 9. Precaution for use Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SUYT801 SUYT801 Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. Features 사진 • Industry Standard PLCC SMT package • High brightness using AlInGaP and InGaN dice technologies • Available in multiple colors • High volume, high reliability Applications • Interior automotive • Electronic Signs and Signals • Office Automation, Electrical Appliances, Industrial Equipment Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Features • Yellow colored SMT package • Material AlInGaP • Suitable for all SMT assembly methods Suitable for all soldering methods • RoHS Compliant Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation Pd 75 mW Forward Current IF 30 mA 90 mA Peak Forward Current IFM *2 Reverse Voltage VR 5 V Operating Temperature Topr -40 ~ +100 oC Storage Temperature Tstg -40 ~ +100 oC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF =20mA 1.7 2.1 2.5 V Reverse Current IR VR=5V - - 10 A Luminance Intensity *1 IV IF =20mA 250 350 500 mcd Peak Wavelength P IF =20mA - 595 - nm Dominant Wavelength d IF =20mA 584 589 594 nm Spectral Bandwidth 50% IF =20mA - 17 - nm ½ IF =20mA - 120 - deg. Viewing Angle *2 2 *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity vs Forward Current Forward Current vs. Forward Voltage 10 10 (Ta=25 OC ) 2 1 0 1 .8 0 1 .8 5 1 .9 0 1 .9 5 2 .0 0 (Ta=25 OC ) 1 .6 Relative Luminous Intensity Iv/Iv [Rel] 10 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 1 .4 1 .2 1 .0 0 .8 0 .6 0 .4 0 .2 0 .0 2 .0 5 0 5 10 15 20 25 30 Forward Current IF [mA] Forward Voltage VF (V) Forward Current Derating Curve Radiation Diagram (Ta=25 OC ) 40 Forward Current IF [mA] 0 -30 30 20 -60 30 60 10 -90 90 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature TA [OC] Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning ● SUYT801 BINNING RANK VF(V) IV(mcd) Wd[nm] RANK VF(V) IV(mcd) Wd[nm] A 1.7-2.1 250-300 587-590 P 2.1-2.5 400-450 590-593 B 2.1-2.5 250-300 587-590 Q 1.7-2.1 450-500 587-590 C 1.7-2.1 250-300 590-593 R 2.1-2.5 450-500 587-590 D 2.1-2.5 250-300 590-593 S 1.7-2.1 450-500 590-593 E 1.7-2.1 300-350 587-590 T 2.1-2.5 450-500 590-593 F 2.1-2.5 300-350 587-590 A1 1.7-2.1 250-300 584-587 G 1.7-2.1 300-350 590-593 B1 2.1-2.5 250-300 584-587 H 2.1-2.5 300-350 590-593 C1 1.7-2.1 300-350 584-587 I 1.7-2.1 350-400 587-590 D1 2.1-2.5 300-350 584-587 J 2.1-2.5 350-400 587-590 E1 1.7-2.1 350-400 584-587 K 1.7-2.1 350-400 590-593 F1 2.1-2.5 350-400 584-587 L 2.1-2.5 400-450 590-593 G1 1.7-2.1 400-450 584-587 M 1.7-2.1 400-450 587-590 H1 2.1-2.5 400-450 584-587 N 2.1-2.5 400-450 587-590 I1 1.7-2.1 450-500 584-587 O 1.7-2.1 400-450 590-593 J1 2.1-2.5 450-500 584-587 [Note] All measurements were made under the standardized environment of SSC. Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6.outline dimension Package Outlines ATTENTION MARKING ON LED IS ANODE (+) 2 Package Marking (Anode) 1 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Circuit Diagram Recommended Solder Pad Anode 2 1 Cathode Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) 1.55 ± 0.05 1.75±0.1 2.0±0.05 0.22±0.05 3.83±0.1 5° 8±0.1 cathod 4.0±0.1 3.5±0.1 Z-Power LED X10490 Technical Data Sheet 7. packing 1.0±0.1 anode 8° 3.1±0.1 Package Marking 2.22±0.1 11.4 ± 0.1 180 +0 -3 2.0 9.0 ± 0.3 LABLE ± 0.2 30° 10 60 13 ±0.2 22 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape Rev. 02 (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet Reel Aluminum Vinyl Bag Desiccant Humidity indicator Barcode Label RANK : Outer Box Structure XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXX c TUV SSC PART NUMBER : XXXXXXXX SEOUL MADE IN KOREA Acriche SWBK05 SIZE (mm) a c b 245 220 142 7inch 245 220 80 TYPE Semiconductor EcoLight Material : Paper(SW3B(B)) RoHS b a • Lot Number The lot number is composed of the following characters SUYT ○□□◎◎ ◇◇◇ Symbol Meaning Example ○ Year 8 for 2008, 9 for 2009, 10 for 2010 ‥‥ □□ Month 01 for Jan., 02 for Feb., ‥‥ 12 for Dec. ◎◎ Day 01, 02, 03, 04, 05, ‥‥ 27, 28, 29, 30, 31 ◇◇◇ Internal Number 001, 002, 003, 004, 005, 006, 007 ‥‥ Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder 1~5 oC / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 150~200 oC 260 oC Max. 10 sec. Max. 60sec. Max. Above 220oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Rev. 02 April 2010 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-24 (Rev.00)