Product Data Sheet ZC4– Chip on Board Enable High Flux and Cost Efficient System Z Power Chip on board – ZC series, ZC4 SDW01F1B, SDW81F1B MacAdam 3-Step RoHS Product Brief Description Features and Benefits • The ZC series are LED arrays which provide High Flux and High Efficacy. • It is especially designed for easy assembly of Lighting fixtures by eliminating reflow soldering process. • • • • • It‘s thermal management is excellent than other power LED solutions with wider Metal area. • ZC series are ideal light sources for General Lighting applications including Replacement Lamps, Industrial & Commercial Lightings and other high Lumen required applications. Power dissipation 4.5 ~ 8.2W MacAdam 3-step binning Uniformed Shadow Excellent Thermal management Key Applications • MR16 Table 1. Product Selection Table CCT Part Number Color Min. Typ. Max. SDW01F1B Cool White 4700K 5300K 6000K SDW81F1B Warm White 2600K 2900K 3200K 1 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Table of Contents Index • Product Brief • Table of Contents • Performance Characteristics • Color Bin Structure • Mechanical Dimensions • Packaging Information • Product Nomenclature (Labeling Information) • Handling of Silicone Resin for LEDs • Precaution for Use • Company Information 2 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Performance Characteristics Table 2. Product Selection Guide, Tc=25ºC, RH30% CCT (K) [1] Part Number SDW01F1B Typical Luminous Flux [2] ФV [3] (lm) Typical Forward Voltage (VF) [4] CRI [5], Ra Viewing Angle (degrees) 2Θ ½ Typ. 500mA 800mA* 500mA 800mA* Min. Typ. 5000 590 865 9.1 10.3 70 120 3000 500 750 9.1 10.3 80 120 2700 485 725 9.1 10.3 80 120 SDW81F1B Notes : (1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.01, CCT 5% tolerance. (2) Seoul Semiconductor maintains a tolerance of ±7% on flux and power measurements. (3) ФV is the total luminous flux output as measured with an integrating sphere. (4) Tolerance is ±2.5V on forward voltage measurements. (5) Tolerance is ±2 on CRI measurements. * No values are provided by real measurement. Only for reference purpose. 3 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Performance Characteristics Table 3. Characteristics, Tc=25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 0.5 0.8 A Power Dissipation Pd - 4.5 8.2 W Junction Temperature Tj - - 125 ºC Operating Temperature Topr -40 - 85 ºC Storage Temperature Tstg -40 - 100 ºC Thermal resistance (J to S) [1] RθJ-S - 1.7 - K/W ESD Sensitivity(HBM) [2] - - - ±8 kV Notes : (1) Thermal Resistance : RθJ-S (Junction to COB’s metal PCB) (2) A zener diode is included to protect the product from ESD. 4 www.seoulsemicon.com Product Product Data Sheet ZC4 – Chip on Board Relative Spectral Distribution Fig 1. Color Spectrum, Ta=25℃, IF=500mA, RH30% Cool White Warm White Relative Intensity[a.u.] 1.0 0.8 0.6 0.4 0.2 0.0 400 450 500 550 600 650 700 750 Wavelength[nm] 5 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Viewing Angle Fig 2. View Angle, IF=500mA Relative Intensity[a.u.] 1.0 0.8 0.6 0.4 0.2 0.0 -80 -60 -40 -20 0 6 20 40 60 80 www.seoulsemicon.com Product Product Data Sheet ZC4 – Chip on Board Forward Current Characteristics Fig 3. Forward Voltage VS. Forward Current, T a=25℃ Forward Current (A) 0.8 0.6 0.4 0.2 0.0 5 6 7 8 9 10 Forward Voltage (V) Fig 4. Forward Current vs. Relative Luminous Flux, Ta=25℃ 1.6 Relative Luminous Flux 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 Forward Current (A) 7 www.seoulsemicon.com Product Product Data Sheet ZC4 – Chip on Board Forward Current Characteristics Fig 5. Forward Current vs. CIE X, Y Shift, T a=25℃(Cool White) 0.02 X Y 0.01 0.00 -0.01 -0.02 0 200 400 600 800 Foward Current [mA] Fig 5. Forward Current vs. CIE X, Y Shift, Ta=25℃(Warm White) 0.02 X Y 0.01 0.00 -0.01 -0.02 0 200 400 600 800 Foward Current [mA] 8 www.seoulsemicon.com Product Product Data Sheet ZC4 – Chip on Board Junction Temperature Characteristics Fig 7. Junction Temperature vs. Relative Luminous Flux, IF=500mA 1.2 Relative Louminous Flux 1.0 0.8 0.6 0.4 0.2 0.0 40 60 80 100 120 o Junction Temperture[ C] Fig 8. Junction Temperature vs. Relative Forward Voltage, IF=500mA 1.2 Relative Foward Voltage 1.0 0.8 0.6 0.4 0.2 0.0 40 60 80 100 120 o Junction Temperature[ C] 9 www.seoulsemicon.com Product Product Data Sheet ZC4 – Chip on Board Junction Temperature Characteristics Fig 9. Junction Temperature vs. CIE X, Y Shift, IF=500mA (Cool White) 0.02 x y cool 0.01 0.00 -0.01 -0.02 40 60 80 100 120 o Junction Temperature [ C] Fig 10. Junction Temperature vs. CIE X, Y Shift, IF=500mA (Warm White) 0.02 x y warm 0.01 0.00 -0.01 -0.02 40 60 80 100 120 o Junction Temperature [ C] 10 www.seoulsemicon.com Product Product Data Sheet ZC4 – Chip on Board Junction Temperature Characteristics Fig 11. Maximum Forward Current vs. Ambient Temperature, TJ(max.) = 125℃, IF=500mA Maximum Current (A) 0.8 o 5 C/W o 8 C/W 0.6 0.4 0.2 50 60 70 80 90 100 Ambient Temperture (oC) 11 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Color Bin Structure Table 4. Bin Code description Luminous Flux (lm) @ IF = 500mA Part Number Bin Code Min. Max. A2 490 570 Color Chromaticity Coordinate @ IF = 500mA SDW01F1B Typical Forward Voltage (VF) Bin Code Min. Max. P 8.75 9.50 Q 9.50 10.25 P 8.75 9.50 Q 9.50 10.25 Refer to page.6 B1 570 635 A1 440 490 SDW81F1B Refer to page.7 A2 490 570 Table 5. Ordering Information(Bin Code) CCT CIE LF rank 5300~6000K B A2 B1 P Q 4700~5300K C A2 B1 P Q 2900~3200K G A1 A2 P Q 2600~2900K H A1 A2 P Q 12 VF rank www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Color Bin Structure CIE Chromaticity Diagram (Cool white), TC=25℃, IF=500mA ANSI 0.38 4700K 5000K 0.37 C1 5300K C0 CIE Y 0.36 C3 5600K 0.35 B1 C2 6000K 0.34 B0 B3 B2 B5 C5 C4 B4 0.33 0.32 0.31 0.32 0.33 0.34 0.35 0.36 CIE X B0 B1 B2 CIE x CIE y CIE x CIE y CIE x CIE y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 B3 B4 B5 CIE x CIE y CIE x CIE y CIE x CIE y 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 C0 C1 C2 CIE x CIE y CIE x CIE y CIE x CIE y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3463 0.3687 0.3552 0.3760 0.3456 0.3601 C3 C4 C5 CIE x CIE y CIE x CIE y CIE x CIE y 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3448 0.3514 0.3366 0.3369 0.3440 0.3428 0.3526 0.3578 0.3440 0.3428 0.3514 0.3487 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 13 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Color Bin Structure CIE Chromaticity Diagram (Warm white), TC=25℃, IF=500mA 0.46 ANSI MacAdam 4-step MacAdam 3-step 0.44 2600K 2700K 2900K 3000K G22 H11 G21 CIE Y H22 H21 3200K 0.42 H10 G11 G10 0.40 H23 H24 G24 G23 0.38 0.36 0.44CIE X 0.42 0.46 0.48 3-STEP 4-STEP G10 H10 G11 H11 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4267 0.3946 0.4502 0.4020 0.4243 0.3922 0.4477 0.3998 0.4328 0.4079 0.4576 0.4158 0.4324 0.4100 0.4575 0.4182 0.4422 0.4113 0.4667 0.4180 0.4451 0.4145 0.4697 0.4211 0.4355 0.3977 0.4588 0.4041 0.4361 0.3964 0.4591 0.4025 ANSI G21 G22 G23 G24 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4223 0.3990 0.4406 0.4055 0.4147 0.3814 0.4259 0.3853 0.4299 0.4165 0.4451 0.4145 0.4223 0.3990 0.4302 0.3943 0.4430 0.4212 0.4387 0.4122 0.4284 0.4011 0.4361 0.3964 0.4387 0.4122 0.4430 0.4212 0.4243 0.3922 0.4406 0.4055 0.4324 0.4100 0.4562 0.4260 0.4302 0.3943 0.4468 0.4077 0.4284 0.4011 0.4468 0.4077 0.4259 0.3853 0.4373 H21 H22 H23 0.3893 H24 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4468 0.4077 0.4644 0.4118 0.4373 0.3893 0.4483 0.3919 0.4562 0.4260 0.4697 0.4211 0.4468 0.4077 0.4534 0.4012 0.4687 0.4289 0.4636 0.4197 0.4526 0.4090 0.4591 0.4025 0.4636 0.4197 0.4687 0.4289 0.4477 0.3998 0.4644 0.4118 0.4575 0.4182 0.4810 0.4319 0.4534 0.4012 0.4703 0.4132 0.4526 0.4090 0.4703 0.4132 0.4483 0.3919 0.4593 0.3944 14 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Mechanical Dimensions Circuit Cathode Anode Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm 15 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Packaging Specification Notes : 1. 2. 3. Quantity : 30pcs/Tray All dimensions are in millimeters (tolerance : ±0.3) Scale none 16 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Packaging Specification Notes : (1) Heat Sealed after packing (Use Zipper Bag) (2) Quantity : 3Tray(90pcs) /Bag 17 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Product Nomenclature Table 6. Part Numbering System : X1X2X3 X4X5 X6X7 X8 Part Number Code Description Part Number Value X1 Company S X2 Package series D X3X4 Color Specification W0 CRI70 W8 CRI80 X5 Series number 1 X6 Lens type F Flat X7 PCB type 1 PCB X8 Revision number B MR16 type Table 7. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13 Lot Number Code Description Y1Y2 Year Y3Y4 Month Y5Y6 Day Y7Y8Y9Y10 Mass order Y11Y12Y13 Tray No. Lot Number 18 Value www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) Avoid leaving fingerprints on silicone resin parts. 19 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week or the color of the desiccant changes. (3) For manual soldering Seoul Semiconductor recommends the soldering condition (ZC series product is not adaptable to reflow process) a. Use lead-free soldering b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C. c. Before proceeding the next step, product temperature must be stabilized at room temperature. (4) Components should not be mounted on warped (non coplanar) portion of PCB. (5) Radioactive exposure is not considered for the products listed here in. (6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (8) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from Seoul Semiconductor, a sealed container with vacuum atmosphere should be used for storage. (10) The appearance and specifications of the product may be modified for improvement without notice. 20 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Precaution for Use (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (14) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) 21 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device 22 www.seoulsemicon.com Product Data Sheet ZC4 – Chip on Board Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. 23 www.seoulsemicon.com