Product Data Sheet 3030 – Mid-Power LED Achieving the best system cost in Mid/High Power Mid-Power LED – 3030 Series STW9C2SA (Neutral, Warm) RoHS Product Brief Description Features and Benefits • This White Colored surface-mount LED comes in standard package dimension. Package Size : 3.0x3.0x0.65mm • It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. • • • • • • • • The die is attached within the reflector cavity and the cavity is encapsulated by silicone. • Thermally Enhanced Package Design Mid Power to High Power up to 1W Max. Driving Current 200mA Compact Package Size High Color Quality with CRI Min. 90 CRI R9 > 50 Pb-free Reflow Soldering Application Key Applications • • • • The package design coupled with careful selection of component materials allow these products to perform with high reliability. Interior lighting General lighting Indoor & Outdoor displays Architectural / Decorative lighting Table 1. Product Selection Table CCT Part Number Color Min. Typ. Max. STW9C2SA Neutral White 3700K 4000K 4200K STW9C2SA Warm White 2600K 3000K 3700K Rev1.0, August 9, 2013 1 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Table of Contents Index • Product Brief • Table of Contents • Product Nomenclature (Labeling Information) • Performance Characteristics - Relative Spectral Distribution - Viewing Angle Distribution - Forward Current Characteristics - Junction Temperature Characteristics - Ambient Temperature Characteristics • Color Bin Structure • Packaging Information • - Mechanical Dimensions / Material Structure - Packaging - Emitter Tape & Reel Packing • Recommended Solder Pad • Reflow Soldering Characteristics • Handling of Silicone Resin for LEDs • Precaution For Use • Company Information Rev1.0, August 9, 2013 2 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Product Nomenclature Table 2. Part Numbering System : X1X2X3 X4X5 X6X7 Part Number Code Description Part Number Value X1 Company S X2 Top View LED series T X3 Color Specification W9 CRI 90 X4 Package series C C series X5X6 Characteristic code 2S X7 Revision A Table 3. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number Rev1.0, August 9, 2013 Lot Number 3 Value www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Performance Characteristics Table 4-1. Product Selection Guide, IF=100mA , TA = 25ºC, RH30% Part Number CCT (K) [1] RANK Typ. 4000 3500 Luminous Intensity [2] IV (cd) Luminous Flux [3] ФV (lm) CRI Ra Min Max Min Max Min. J17 17 19.5 51.4 59.6 90 J19 19.5 21.5 59.0 65.7 90 K21 21.5 24 65.1 73.4 90 J17 17 19.5 51.4 59.6 90 J19 19.5 21.5 59.0 65.7 90 K21 21.5 24 65.1 73.4 90 J17 17 19.5 51 59.2 90 J19 19.5 21.5 58.5 65.4 90 K21 21.5 24 64.5 73 90 J17 17 19.5 51 59.2 90 J19 19.5 21.5 58.5 65.4 90 K21 21.5 24 64.5 73 90 STW9C2SA 3000 2700 Notes : 1. Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.007 2. Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements. The luminous intensity Iv was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. 3. Calculated performance values are for reference only. Rev1.0, August 9, 2013 4 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Performance Characteristics Table 5. Characteristics, IF=100mA , TA = 25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 100 200 mA Forward Voltage VF (100mA) 5.8 6.1 6.6 V Reverse Voltage Vr - 0.9 1.4 V Iv (100mA) - 20 (60) - Iv (150mA) - 28 (84) - Ra 90 93 100 - cd (lm) Luminous Intensity (3,500 K) Color Rendering Index Viewing Angle [1] [2] 2Θ1/2 120 Power Dissipation Pd - - 1.44 W Junction Temperature Tj - - 125 ºC Operating Temperature Topr - 40 - + 85 ºC Tstg - 40 - + 100 ºC RθJ-S - 10 - ℃/W - - - 5000 V Storage Temperature Thermal resistance (J to S) ESD Sensitivity(HBM) [4] [[3] Notes : 1. Tolerance : VF :±0.1V, IV :±7%, Ra :±2, x,y :±0.007 2. 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity 3. Thermal resistance : RthJS (Junction / solder) 4. A zener diode is included for ESD Protection. • • LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. All measurements were made under the standardized environment of Seoul Semiconductor. Rev1.0, August 9, 2013 5 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Relative Spectral Distribution Fig 1. Color Spectrum, Ta = 25℃, RH30% IF=100mA Relative Emission Intensity 1.0 0.5 0.0 300 400 500 600 700 800 Wavelength [nm] IF=100mA Fig 2. Viewing Angle Distribution Rev1.0, August 9, 2013 6 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Forward Current Characteristics Fig 3. Forward Voltage vs. Forward Current , Ta=25℃ 0.20 IF[A] 0.15 0.10 0.05 0.00 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 VF[V] Fig 4. Forward Current vs. Relative Luminous Flux, Ta=25℃ 2.0 1.8 Relative Luminous Intensity 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 20 40 60 80 100 120 140 160 180 200 Forward Current IF [mA] Rev1.0, August 9, 2013 7 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Forward Current Characteristics Fig 5. Forward Current vs. CIE X, Y Shift , Ta=25℃ (2600~4200K) 0.403 0.402 50mA y 75mA 100mA 20mA 0.435 0.436 0.401 150mA 0.400 200mA 0.399 0.433 0.434 0.437 0.438 x Rev1.0, August 9, 2013 8 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Junction Temperature Characteristics Fig 6. Relative Light Output vs. Junction Temperature IF=100mA Relative Luminous Intensity 1.0 0.8 0.6 0.4 0.2 0.0 30 45 60 75 90 105 120 O Junction temperature Tj( C) Fig 7. Junction Temperature vs. Relative Forward Voltage IF=100mA Relative Forward Voltage 1.0 0.8 0.6 0.4 0.2 0.0 30 45 60 75 90 105 120 O Junction temperature Tj( C) Rev1.0, August 9, 2013 9 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Junction Temperature Characteristics Fig 8. Chromaticity Coordinate vs. Junction Temperature IF=100mA (2600~4200K) 0.404 0.400 25 0.396 y 70 100 0.392 125 0.388 0.384 0.420 0.422 0.424 0.426 0.428 0.430 0.432 0.434 x Rev1.0, August 9, 2013 10 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Ambient Temperature Characteristics Fig 9. Maximum Forward Current vs. Ambient Temperature Forward Current IF [mA] 250 200 150 Rth j-a : 60 ℃/W 100 50 0 -40 -20 0 20 40 60 80 100 O Ambient Temperature TA [ C] Rev1.0, August 9, 2013 11 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Color Bin Structure Table 6. Bin Code description Luminous Intensity (cd) @ IF = 100mA Part Number Bin Code Min. Max. J17 17 19.5 J19 19.5 21.5 Color Chromaticity Coordinate @ IF = 100mA STW9C2SA Typical Forward Voltage (Vf) Bin Code Min. Max. Z58 5.8 6.0 Z60 6.0 6.2 Z62 6.2 6.4 Z64 6.4 6.6 Refer to page.14 K21 21.5 24 Table 7. Intensity rank distribution CCT CIE IV Rank 3200- 4200K E,F J17 J19 K21 2600 - 3200K G, H J17 J19 K21 Currently available Not yet available Notes • All measurements were made under the standardized environment of Seoul Semiconductor. • Seoul Semiconductor sorts the LED package according to the luminous intensity IV. • The lumen table is only for reference. Rev1.0, August 9, 2013 12 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Color Bin Structure CIE Chromaticity Diagram Ta=25℃, IF=100mA 0.44 2600K 2700K 2900K 3000K 3200K 0.42 3500K 3700K F1 4000K CIE Y 0.40 F0 4200K F2 E0 0.38 F3 E1 E3 F5 0.44 E2 2600K 2700K F4 2900K E5 3000K 3200K 0.42 E4 H11 G41 H21 G31 G21 G11 H12 G32 CIE Y 0.36 H13 G23 G34 G14 H23 H33 H43 G43 G33 G13 H32 H41 H42 G42 G22 G12 0.40 H22 H31 G44 H14 H24 H34 H44 G24 0.38 0.34 0.42 0.44 0.46 0.48 CIE X 0.36 0.38 0.40 0.42 0.44 0.46 0.48 CIE X 0.44 2600K 2700K 2900K 3000K 3200K 0.42 H11 G41 H21 G31 G21 G11 H12 CIE Y G32 H13 0.40 G23 G34 G14 H42 H23 H33 H43 G43 G33 G13 H32 H41 G42 G22 G12 H22 H31 G44 H14 H24 H34 H44 G24 0.38 MacADAM 3STEP Rank 0.42 0.44 0.46 0.48 CIE X • Energy Star binning applied to all 2600~4200K. • MACADAM 3 Step binning for 2600~3200K. • Measurement Uncertainty of the Color Coordinates : ± 0.007 Rev1.0, August 9, 2013 13 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Color Bin Structure <IF=100mA, Ta=25℃> E0 E1 E2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3736 0.3874 0.3869 0.3958 0.3714 0.3775 0.3714 0.3775 0.3842 0.3855 0.3692 0.3677 0.3842 0.3855 0.397 0.3935 0.3813 0.3751 0.3869 0.3958 0.4006 0.4044 0.3842 0.3855 E3 E4 E5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3842 0.3855 0.3692 0.3677 0.3813 0.3751 0.3813 0.3751 0.367 0.3578 0.3783 0.3646 0.3934 0.3825 0.3783 0.3646 0.3898 0.3716 0.397 0.3935 0.3813 0.3751 0.3934 0.3825 F0 F1 F2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3996 0.4015 0.4146 0.4089 0.396 0.3907 0.396 0.3907 0.4104 0.3978 0.3925 0.3798 0.4104 0.3978 0.4248 0.4048 0.4062 0.3865 0.4146 0.4089 0.4299 0.4165 0.4104 0.3978 F3 F4 F5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4104 0.3978 0.3925 0.3798 0.4062 0.3865 0.4062 0.3865 0.3889 0.369 0.4017 0.3751 0.4198 0.3931 0.4017 0.3751 0.4147 0.3814 0.4248 0.4048 0.4062 0.3865 0.4198 0.3931 Rev1.0, August 9, 2013 14 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Color Bin Structure <IF=100mA, Ta=25℃> G11 G21 G31 G41 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 0.4562 0.4260 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 0.4261 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4299 0.4165 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 G12 G22 G32 G42 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4261 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 G13 G23 G33 G43 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4420 0.3985 0.4185 0.3902 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 G14 G24 G34 G44 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4316 0.3873 0.4203 0.3834 0.4259 0.3853 0.4259 0.3853 0.4302 0.3943 0.4147 0.3814 0.4203 0.3834 0.4420 0.3985 0.4373 0.3893 0.4185 0.3902 0.4243 0.3922 0.4316 0.3873 0.4361 0.3964 Rev1.0, August 9, 2013 15 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Color Bin Structure <IF=100mA, Ta=25℃> H11 H21 H31 H41 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4325 0.4275 0.4687 0.4289 0.4750 0.4304 0.4810 0.4319 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4562 0.4260 0.4625 0.4275 0.4687 0.4289 0.4750 0.4304 H12 H22 H32 H42 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 H13 H23 H33 H43 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 H14 H24 H34 H44 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4593 0.3944 0.4373 0.3893 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 Rev1.0, August 9, 2013 16 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Mechanical Dimensions Bottom View Top View Cathode Cathode Mark (-) Side View Circuit Cathode 1 Anode 2 Zener Diode 1. 2. 3. All dimensions are in millimeters. Scale : none Undefined tolerance is ±0.2mm Rev1.0, August 9, 2013 17 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Mechanical Dimensions ② ③ ④ ⑤ ⑥ ① Parts No. Name Description Materials ① LEAD FRAME Metal Copper Alloy (Silver Plated) ② Chip Source Blue LED GaN on Sapphire ③ Wire Metal Gold Wire ④ Encapsulation Silicone +Phosphor ⑤ Body Thermo Plastic Heat-resistant Polymer ⑥ Zener Diode Si - Rev1.0, August 9, 2013 18 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Reel Packaging ( Tolerance: ±0.2, Unit: mm ) 1) Quantity : Max 4,500pcs/Reel 2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3) Adhesion Strength of Cover Tape Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10˚ to the carrier tape. 4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package. Rev1.0, August 9, 2013 19 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Reel Packaging Reel X9X10X11X12X13X14X15X16X17 xxxx QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : STW8Q2SA STW9C2SA SEOUL SEMICONDUCTOR SEOUL SEMICONDUCTOR CO.,CO.. LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag X9X10X11X12X13X14X15X16X17 xxxx QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : STW8Q2SA STW9C2SA SEOUL SEMICONDUCTOR CO.,CO.. LTD. SEOUL SEMICONDUCTOR Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE SIDE c X9X X10X X11X X12X X13X X14X X15X X16X X17 X 9 10 11 12 13 14 15 16 17 xxxx xxxx 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX STW8Q2SA STW9C2SA STW8Q2SA b PART NUMBER : a SEOUL SEMICONDUCTOR CO.. SEOUL SEMICONDUCTOR SEOUL SEMICONDUCTOR CO.,CO.. LTD. Rev1.0, August 9, 2013 20 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Recommended Solder Pad Notes : 1. 2. 3. 4. All dimensions are in millimeters. Scale : none This drawing without tolerances are for reference only Undefined tolerance is ±0.1mm Rev1.0, August 9, 2013 21 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Table 7. Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution 1. 2. 3. 4. 5. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. Die slug is to be soldered. When soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board. Rev1.0, August 9, 2013 22 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Handling 3030 Series LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. Rev1.0, August 9, 2013 23 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. Rev1.0, August 9, 2013 24 www.seoulsemicon.com Product Data Sheet 3030 – Mid-Power LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, deep UV LEDs, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich, high-brightness LEDs, mid-power LEDs, side-view LEDs, through-hole type LED lamps, custom displays, and sensors. The company is vertically integrated from epitaxial growth and chip manufacture in it’s fully owned subsidiary, Seoul Viosys, through packaged LEDs and LED modules in three Seoul Semiconductor manufacturing facilities. Seoul Viosys also manufactures a wide range of unique deep-UV wavelength devices. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.0, August 9, 2013 25 www.seoulsemicon.com