Product Data Sheet SZW03F1D - Z3 Series White Applicable for automotive Exterior light Z3 Series white SZW03F1D RoHS AEC-Q101 Product Brief Description • Features and Benefits • • • • • Z-Power series is designed for high current operation and high flux output applications. • Column by applying a strong material has been to maximize White Color Viewing angle 120℃ AEC-Q101 Qualified RoHS compliant Light emitting surface : 1.0 X 4.3 (mm) heat dissipation. By measuring the resistance of NTC products can determine the temperature. • Key Applications • Z-Power LED is ideal light sources Automotive Exterior Lighting for automotive headlamp application. Rev1.0, Aug 25, 2015 1 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 4 • Color Bin Structure 10 • Reliability Test 12 • Mechanical Dimensions 13 • Emitter Tape & Reel Packaging 14 • Product Nomenclature 16 • Precaution For Use 17 • Handling of Silicone Resin for LEDs 20 • Company Information 21 Rev1.0, Aug 25, 2015 2 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Performance Characteristics Table 1. Electro Optical Characteristics, IF =1.0A, Tj = 25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Voltage [1] VF 13.0 14.5 16.0 V Luminous Flux ΦV 1,000 - 1,400 lm x - 0.35 - - y - 0.35 - - Viewing Angle [3] 2θ1/2 - 120 - deg. Thermal resistance [4] Rth JC - 2.5 - K/W Color Coordinate (x,y) [2] Notes : [1] The luminous Flux was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Flux Measurement allowance is ±10% [2] Measurement Uncertainty of the Color Coordinates is ±0.005 [3] 2½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] Rth-JC is Junction to case (bottom of metal PCB) temp. Rev1.0, Aug 25, 2015 3 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Performance Characteristics Table 2. Absolute Maximum Ratings Parameter Symbol Min. Typ. Max. Unit Power Dissipation*1 Pd 13.0 - 16.0 W Forward Current IF 0.1 1.0 1.2 A Operating Temperature Topr -40 - 125 ℃ Storage Temperature Tstg -40 - 125 ℃ Junction Temperature Tj - 150 ℃ NTC Operating Temperature Topr NTC -40 - 150 ℃ Zener Operating Temperature Topr Zener -55 - 150 ℃ Electrostatic Discharge*2 ESD 2,000 - - V Notes : [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] ESD testing method : EIAJ4701/300(304) HBM / 1.5㏀, 100㎊ Rev1.0, Aug 25, 2015 4 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Characteristics Graph Fig 1. Color Spectrum, IF = 1.0A, Tj = 25ºC, RH30% Relative Emission Intensity 1.0 0.8 0.6 0.4 0.2 0.0 400 450 500 550 600 650 700 750 Wavelength [nm] Fig 2. Viewing Angle Distribution, IF = 1.0A 0 1.01.0 30 0.80.8 0.60.6 60 0.40.4 0.20.2 0.00.0 -90 90 -60 0 -30 0.2 0.4 0.6 Rev1.0, Aug 25,0.8 2015 1.0 5 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Characteristics Graph Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC 1.4 1.2 Forward Current [A] 1.0 0.8 0.6 0.4 0.2 0.0 10 11 12 13 14 15 16 Forward Voltage [V] Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC 1.2 1.1 1.0 0.9 0.8 IV 0.7 0.6 0.5 ▷ 0.4 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 △IV = IV / IV(1.0A) Rev1.0, Aug 25, 2015 Forward Current [A] 6 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Characteristics Graph Fig 5. Forward Current vs. CIE X, Y Shift, Tj = 25ºC 0.030 CIE x CIE y Relative Color Coordinate 0.025 0.020 0.015 0.010 0.005 0.000 -0.005 -0.010 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Forward Current [mA] Rev1.0, Aug 25, 2015 7 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Characteristics Graph Fig 6. Junction Temperature vs. Relative Light Output, IF = 1.0A 1.4 1.2 IV 1.0 0.8 ▷ 0.6 0.4 0.2 0.0 -60 -40 -20 △IV = IV / IV(25℃) 0 20 40 60 80 100 120 140 160 Junction Temperature [℃] Fig 7. Junction Temperature vs. Forward Voltage shift, IF = 1.0A 2.0 1.5 1.0 VF 0.5 0.0 ▷ -0.5 -1.0 -1.5 -2.0 -60 -40 -20 △VF = VF - VF(25℃) Rev1.0, Aug 25, 2015 0 20 40 60 80 100 120 140 160 Junction Temperature [℃] 8 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Characteristics Graph Fig 8. Junction Temperature vs. CIE X, Y Shift, IF = 1.0A 0.03 CIE x CIE y Relative Color Coordinate 0.02 0.01 0.00 -0.01 -0.02 -0.03 -60 -40 -20 0 20 40 60 80 100 120 140 160 Forward Current [mA] Rev1.0, Aug 25, 2015 9 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Characteristics Graph Fig 9. Maximum Forward Current vs. Temperature 1400 Maximum Current [mA] Maximum Forward Current IF [mA] 1200 1000 800 600 400 200 0 0 20 40 60 80 100 120 140 o Ambient Temperature [ C] Case Temperature [℃] Rev1.0, Aug 25, 2015 10 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Color Bin Structure Table 3. Bin Code description, IF =1.0A Luminous Flux (lm) Part Number SZW03F1D Bin Code Min. Max. D2 1,000 1,100 D3 1,100 1,200 D4 1,200 1,400 Color Chromaticity Coordinate Refer to page.13 Forward Voltage (VF) Bin Code Min. Max. W 12 16 I 3.2 3..4 J 3.4 3.6 *Notes : (1) All measurements were made under the standardized environment of Seoul Semiconductor In order to ensure availability, single color rank will not be orderable. Rev1.0, Aug 25, 2015 11 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Color Bin Structure CIE Chromaticity Diagram, IF = 1.0A, Tj = 25ºC 0.39 0.38 0.37 0.36 A 0.35 Cy 0.34 0.33 0.32 0.31 0.30 ECE White Zone SSC Binning 0.29 0.28 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 Cx ECE White A CIE x CIE y CIE x CIE y 0.3100 0.2830 0.3382 0.3504 0.3100 0.3500 0.3382 0.3309 0.4500 0.4400 0.3586 0.3679 0.5000 0.4400 0.3586 0.3813 0.5000 0.3850 0.3529 0.3775 0.4400 0.3850 0.3382 0.3504 *Notes : •Measurement Uncertainty of the Color Coordinates : ± 0.005 Rev1.0, Aug 25, 2015 12 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Reliability Test Test Item Standard Test Method Test Condition Duration / Cycle Number Of Test External Visual JESD22 B-101 Visual inspection - 77 D.P.A AEC-Q101-004 Random Sample H3TRB,HAST,TC - 2 ESD JESD22 A-114 Human-body mode, R=1.5㏀, C = 100pF 3 times Negative/ Positive 30 Physical Dimension JESD22 B-100 Verify physical dimensions against device mechanical drawing 3 times 30 Temperature cycling JESD22 A-104 Tc= -55°∼150°C, 15 min. dwell, 5 min transfer, 1000 cycles 1000hrs 77 Power Temperature Cycle JESD22 A-105 Ta=-40℃~85℃, If =1000mA, 10 min dwell / 20 min transition (1 hour cycle), 2 min ON / 2 min OFF 1000hrs 77 High Humidity High Temp. Operating Life JESD22 A-101 85℃/85% RH, @ 800mA 1hr ON/1hr OFF 1000hrs 77 High Temperature Operating Life JESD22 A-108C Ta= 100°C, If =1000mA 1000hrs 77 Thermal Resistance JESD24 Measure TR to assure specification compliance - 10 Wire bond strength MIL-STD-750 Pull test to assure specification compliance - 10 Bond shear AEC-Q101-003 Shear test to assure specification compliance - 10 Die shear MIL-STD-750 Shear test to assure specification compliance - 10 Low Temperature Operating Life SSC (Internal standard) Ta=-40℃, IF=1000mA 1000hrs 77 Criteria for Judging the Damage Criteria for Judgment Item Forward Voltage Luminous Intensity Rev1.0, Aug 25, 2015 Symbol VF Condition MIN MAX IF =1000mA - Initial × 1.2 IF =1000mA Initial × 0.8 - 13 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Mechanical Dimensions (Dimension : mm) < CirCuit Diagram > NTC (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm Rev1.0, Aug 25, 2015 14 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Emitter Tape & Reel Packaging (Dimension : mm) (1) Tray Tolerance : ± 0.5 mm (2) 2 Trays are contained into Moisture-proof bag. Rev1.0, Aug 25, 2015 15 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Emitter Tape & Reel Packaging Tray (1) Tray Max. (The Highest tray is an empty.) Aluminum Bag Outer Box Rev1.0, Aug 25, 2015 16 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Product Nomenclature Table 4. Part Numbering System : X1X2X3X4X5X6X7X8 Part Number Code Description Part Number Value X1 Company S SSC X2 Package Type Z Z Power LED X3X4 Color W0 White X5 Package series 3 Z3 Series X6 Number of Chip F Flat Type X7 Number of Pin 1 4 Chips X8 Product Revision D - Table 5. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number Rev1.0, Aug 25, 2015 Lot Number 17 Value www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 weeks or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. Rev1.0, Aug 25, 2015 18 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (16) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev1.0, Aug 25, 2015 19 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires - This damage usually appears due to the thermal stress produced during the EOS event c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev1.0, Aug 25, 2015 20 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. Do not touch Emitting Area. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (4) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. Rev1.0, Aug 25, 2015 21 www.seoulsemicon.com Product Data Sheet SZW03F1D - Z3 Series White Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.0, Aug 25, 2015 22 www.seoulsemicon.com