5.2mm Square Low-profile (Surface Mount Type) SKQG Series856KB

SKQG
5.2mm Square Low-profile (Surface Mount Type)
TM
検 Switch
出
TACT
Available in two types, 0.8mm height without stem
or 1.5mm height with stem
■ Typical Specifications
Items
Specifications
50mA 12V DC
Rating(min.)
10μA 1V DC
Initial contact resistance
100mΩ max.
Travel(mm)
Sharp
Feeling
Rating(max.)
0.25
Soft
Feeling
■ Product Line
Operating
force
SKQGAEE010
0.98N
SKQGAAE010
1.57N
SKQGACE010
2.55N
SKQGAFE010
0.98N
SKQGABE010
1.57N
SKQGADE010
2.55N
SKQGAKE010
3.43N
Operating direction
Operating life
(5mA 5V DC)
Minimum order unit(pcs.)
Japan
Export
Drawing
No.
Without stem
5,000
5,000
1
With stem
4,000
4,000
2
Stem
500,000 cycles
Surface
Mount Type
50,000 cycles
Snap-in
Type
Product No.
Top push
500,000 cycles
Radial
Type
100,000 cycles
Packing Specifications
Taping
Series
Unit:mm
Number of packages(pcs.)
1 reel
SKQGAA
SKQGAC
SKQGAE
5,000
SKQGAB
SKQGAD
SKQGAF
SKQGAK
4,000
1 case / Japan 1 case / export packing
50,000
Tape width
Export package
(mm)
measurements(mm)
50,000
12
40,000
Reel size
401×401×214
40,000
Note
For reels of 330mm diameter, please inquire.
Refer to P.259 for soldering conditions.
213
SKQG
5.2mm Square Low-profile (Surface Mount Type)
TACT SwitchTM
Dimensions
No.
Unit:mm
Photo
PC board mounting hole dimensions
(Viewed from switch mounting face)
Style
Without stem type
1
4
5.2
6.4
4.8
3
2.6
Soft
Feeling
1
Prohibited area
of copper tracks
5.2
0.5
Sharp
Feeling
ø3
3.7
2
2
4.4
Snap-in
Type
0.8
8
Surface
Mount Type
With stem type
1
4
5.2
6.4
2
4.4
Stem
0.8
Circuit Diagram
214
1
2
3
4
1.5
1.2
8
4.8
3
2.6
Radial
Type
2
Prohibited area
of copper tracks
5.2
0.5
ø2
3.7
2
TACT SwitchTM
List of Varieties
TACT SwitchTM
Sharp Feeling Type
Type
Surface Mount
SKSH
Series
SKRW
SKRM
SKRB
SKRR
SKQG
Low–profile
and long life
Low–profile
SKTC
SKSK
Photo
Features
Low–profile
Double action
Sharp
Feeling
Soft
Feeling
Water-proof
—
—
—
—
—
—
●
—
Dust-proof
—
—
—
—
—
—
●
—
IP standard
—
—
—
—
—
—
67 equivalency
—
Top push
●
●
●
●
●
●
●
●
Side push
—
—
—
—
—
—
—
—
□3.7
□4.5
□4.8
3.4
3.5
2.2
3.2
0.4
0.55
0.62
0.6
Operating
direction
Snap-in
Type
Dimensions
(mm)
W
3.3
D
2.9
H
0.35
7.5
□5.2
7
0.6
0.8/1.5
Surface
Mount Type
to 1N
1N to 2N
Operation
force
coverage
See the relevant pages for
respective product
descriptions
2N to 3N
3N to 4N
4N to 5N
Radial
Type
Travel(mm)
Ground terminal
Operating temperature range
Automotive use
0.15
—
0.15/0.2
—
—
−30℃ to +85℃
—
—
—
—
−40℃ to +85℃
—
See the relevant pages for
respective product descriptions
0.25
—
−40℃ to 90℃
●
—
—
●
−30℃ to +85℃
○
—
—
Life Cycle
Electrical
performance
Rating(max.)
(Resistive load)
50mA 12V DC
Rating(min.)
(Resistive load)
10μA 1V DC
Insulation resistance
100MΩ min. 100V DC 1min.
Voltage proof
100V AC 1min.
100V AC 1min.
Vibration
10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies,
in the 3 direction of X, Y and Z for 2 hours respectively
Lifetime
Shall be in accordance with individual specifications.
Cold
−40℃ 96h
Dry heat
90℃ 96h
Damp heat
60℃, 90 to 95%RH 96h
Durability
Environmental
performance
250V AC 1min.
Page
208
209
210
211
212
213
215
216
W:Width. The most outer dimension excluding terminal portion.
D :Depth. The most outer dimension excluding terminal portion.
H :Height. The minimum dimension if there are variances.
TACT SwitchTM Soldering Conditions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 259
TACT SwitchTM Cautions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 260
Notes
1. The automotive operating temperature range to be individually discussed upon request.
2. ● Indicates applicability to all products in the series, while ○ indicates applicability to some products in the series.
188
TACT SwitchTM Soldering Conditions
TM
検 Switch
出
TACT
Condition for Reflow
Available for Surface Mount Type.
1. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA(K)or CC(T)at solder joints
(copper foil surface)
.
A heat resistive tape should be used to fix thermocouple.
2. Temperature profile
Temperature (˚C )
260˚C max. 3 sec max.
Sharp
Feeling
230˚C
180
150
Time
Soft
Feeling
120 sec max.
(pre-heating)
40s max.
3 to 4min.
Time inside soldering equipment
Manual Soldering
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature Ambient temperature of the soldered surface of PC board. 100℃ max.
Items
Condition
Soldering temperature
350℃ max.
Duration of soldering
3s max.
Capacity of soldering iron
60W max.
Preheating time
60s max.
Soldering temperature
260℃ max.
Duration of immersion
5s max.
Items
Condition
2times max.
Soldering temperature
360℃ max.
Number of soldering
SKHH, SKPD Series
Radial
Type
Items
Surface
Mount Type
Conditions for Auto-dip
Available for Snap-in Type and Radial Type.
Snap-in
Type
Notes
1. The above temperature shall be measured of the top of switch. There are cases where the PC board's temperature greatly
differs from that of the switch, depending on the material, size, thickness of PC boards and others.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines.
Prior verification of soldering condition is highly recommended.
SKHH, SKHW, SKRG, SKPD Series
Duration of soldering
3s max.
Capacity of soldering iron
60W max.
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature
Ambient temperature of the soldered surface of PC board. 110℃ max.
Items
Condition
Preheating time
60s max.
Soldering temperature
350℃ max.
Soldering temperature
260℃ max.
Duration of soldering
3s max.
Duration of immersion
5s max.
Capacity of soldering iron
20W max.
Number of soldering
2times max.
SKTD, SKTG, SKQJ, SKQK, SKEG Series
SKQJ, SKQK, SKEG Series
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature
Ambient temperature of the soldered surface of PC board. 100℃ max.
Preheating time
45s max.
Soldering temperature
255℃ max.
Duration of immersion
5s max.
Number of soldering
2times max.
Notes
1. Prevent flux penetration from the top side of the TACT SwitchTM.
2. Switch terminals and a PC board should not be coated with flux prior to soldering.
3. The second soldering should be done after the switch is stable with normal temperature.
4. Use the flux with a specific gravity of min 0.81.
(EC-19S-8 by TAMURA Corporation, or equivalents.)
259