Spec. No. : C268S6R Issued Date : 2003.05.28 Revised Date : 2011.02.21 Page No. : 1/6 CYStech Electronics Corp. Dual PNP Digital Transistors HBA143ES6R Features •Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see equivalent circuit). •The bias resistors consist of thin-film resistors with complete isolation to allow positive biasing of the input. They also have the advantage of almost completely eliminating parasitic effects. •Only the on/off conditions need to be set for operation, making device design easy. •Two DTA143E chips in a SOT-363 package. •Mounting by SOT-323 automatic mounting machines is possible. •Mounting cost and area can be cut in half. •Transistor elements are independent, eliminating interference. •Complements the HBC143ES6R. •Pb-free package. Equivalent Circuit Outline SOT-363R HBA143ES6R RBE2 RB2 TR1 TR2 RB1 RBE1 RB1=4.7kΩ , RB2=4.7 kΩ RBE1=4.7kΩ , RBE2=4.7 kΩ HBA143ES6R CYStek Product Specification Spec. No. : C268S6R Issued Date : 2003.05.28 Revised Date : 2011.02.21 Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings (Each Transistor, Ta=25℃) Parameter Symbol Supply Voltage Input Voltage Limits VCC VIN IO Output Current -50 -30~+10 -100 -100 200 (Note) 150 -55~+150 IO(max.) Pd Tj Tstg Power Dissipation Junction Temperature Storage Temperature Unit V V mA mA mW °C °C Note : 150mW per element must not be exceeded. Characteristics (Each Transistor, Ta=25℃) Parameter Input Voltage Output Voltage Input Current Output Current DC Current Gain Input Resistance Resistance Ratio Transition Frequency Symbol VI(off) VI(on) VO(on) II IO(off) GI R1 R2/R1 fT Min. -3 20 3.29 0.8 - Typ. 4.7 1 250 Max. -0.5 -0.3 -1.8 -0.5 6.11 1.2 - Unit V V V mA μA kΩ MHz Test Conditions VCC=-5V, IO=-100μA VO=-0.3V, IO=-20mA IO/II=-10mA/-0.5mA VI=-5V VCC=-50V, VI=0V VO=-5V, IO=-10mA VCE=-10V, IC=-5mA, f=100MHz * * Transition frequency of the device Ordering Information Device HBA143ES6R HBA143ES6R Package SOT-363 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel 0J CYStek Product Specification Spec. No. : C268S6R Issued Date : 2003.05.28 Revised Date : 2011.02.21 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Current Gain vs Output Current Output Voltage vs Output Current 1 Output Voltage---V O(ON)(V) 1000 Current Gain---G I VO = 5V 100 10 1 Io / Ii = 20 0.1 0.01 0.1 0.1 1 10 Output Current---I O(mA) 1 100 100 Output Current---I O(mA) Input Voltage vs Output Current(ON characteristics) Output Current vs Input Voltage(OFF characteristics) 10 Output Current---I O(mA) 100 Input Voltage---VI(ON) (V) 10 Vo = 0.3V 10 Vcc = 5V 1 0.1 0.01 1 0.1 1 10 100 Output Current---I O(mA) 0 1 2 3 Input Voltage---VI(OFF)(V) Power Derating Curves Power Dissipation---P D(mW) 250 200 Dual Single 150 100 50 0 0 HBA143ES6R 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C268S6R Issued Date : 2003.05.28 Revised Date : 2011.02.21 Page No. : 4/6 Reel Dimension Carrier Tape Dimension HBA143ES6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C268S6R Issued Date : 2003.05.28 Revised Date : 2011.02.21 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. HBA143ES6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C268S6R Issued Date : 2003.05.28 Revised Date : 2011.02.21 Page No. : 6/6 SOT-363 Dimension Marking: Date Code: Year + Month Year : 6→2006, 7→2007,…, etc Month : 1→Jan 2→Feb, …, 9→ Sep, A→Oct, B →Nov, C→Dec 0J Device Code 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Millimeters Min. Max. 0.900 1.100 0.000 0.100 0.900 1.000 0.150 0.350 0.080 0.150 2.000 2.200 1.150 1.350 DIM A A1 A2 b c D E Inches Min. Max. 0.035 0.043 0.000 0.004 0.035 0.039 0.006 0.014 0.003 0.006 0.079 0.087 0.045 0.053 DIM E1 e e1 L L1 θ Millimeters Min. Max. 2.150 2.450 0.650 TYP 1.200 1.400 0.525 REF 0.260 0.460 0° 8° Inches Min. Max. 0.085 0.096 0.026 TYP 0.047 0.055 0.021 REF 0.010 0.018 0° 8° Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HBA143ES6R CYStek Product Specification