Lite-On LTST-C171GKT Datasheet

LITE-ON
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CORPORATION
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Features
* Super thin (0.80H mm) Chip LED.
* Package in 8mm tape on 7" diameter reels.
* Compatible with automatic placement equipment.
* Compatible with infrared and vapor phase reflow solder process.
* EIA STD package.
* I.C. compatible.
Package
dimensions
Part no.
Lens
Source Color
LTST-C171GKT
Water Clear
GaP on GaP Green
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
Part
No. : LTST-C171GKT
BNS-OD-C131/A4
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Absolute
Maximum
Ratings
Parameter
At
Ta=25℃
LTST-C171GKT
Unit
Power Dissipation
100
mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
120
mA
DC Forward Current
30
mA
Derating Linear From 50°C
0.6
mA/°C
5
V
Reverse Voltage
Operating Temperature Range
-55°C to + 85°C
Storage Temperature Range
-55°C to + 85°C
Wave Soldering Condition
260°C For 5 Seconds
Infrared Soldering Condition
260°C For 5 Seconds
Vapor Phase Soldering Condition
215°C For 3 Minutes
Suggest IR Reflow Condition :
Part
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Electrical
Optical
Characteristics
Parameter
Symbol
Luminous Intensity
At
Ta=25℃
Part No.
LTST-
Min.
Typ.
1.80
Max.
Unit
Test Condition
6.00
mcd
IF = 10mA
Note 1
IV
C171GKT
2θ1/2
C171GKT
130
deg
Note 2 (Fig.6)
Peak Emission Wavelength
λP
C171GKT
565
nm
Measurement
@Peak (Fig.1)
Dominant Wavelength
λd
C171GKT
569
nm
Note 3
Spectral Line Half-Width
Δλ
C171GKT
30
nm
Forward Voltage
VF
C171GKT
2.1
Reverse Current
IR
C171GKT
Capacitance
C
C171GKT
Viewing Angle
2.4
V
IF = 20mA
100
μA
VR = 5V
PF
VF = 0
f = 1MHZ
35
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
Part
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BNS-OD-C131/A4
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Bin Code List
Luminous Intensity
Unit : mcd @10mA
Bin Code
Min.
Max.
G
1.80
2.80
H
2.80
4.50
J
4.50
7.10
K
7.10
11.2
L
11.2
18.0
Tolerance on each Intensity bin is +/-15%
Part
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Typical
( 25 °C
Part
No. : LTST-C171GKT
BNS-OD-C131/A4
Electrical
Ambient
/
Optical
Temperature
Characteristics
Unless
Otherwise
Curves
Noted )
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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature
for less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
Part
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BNS-OD-C131/A4
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Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
Part
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering
Pre-heat
Pre-heat time
Peak temperature
Soldering time
120~150°C
120 sec. Max.
240°C Max.
10 sec. Max.
Wave Soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
Soldering iron
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
„
„
„
„
Part
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
No. : LTST-C171GKT
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ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product.
7. Reliability Test
Classification
Test Item
Reference Standard
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90〜95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
High Temperature
Storage
Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12 (1982)
105℃ 〜 25℃ 〜 -55℃ 〜 25℃
30mins 5mins
30mins 5mins
10 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
IR-Reflow In-Board, 2 Times
85 ± 5℃ 〜 -40℃ ± 5℃
10mins
10mins 10 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance
T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
IR-Reflow
Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6℃/second max
Operation Life
Endurance
Test
Test Condition
Temperature
Cycling
Thermal
Shock
Environmental
Test
Solderability
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
MIL-STD-750D:2031.2(1995)
J-STD-020(1999)
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
JIS C 7021:A-2(1982)
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
Part
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