EN25F16
Purpose
Eon Silicon Solution Inc. (hereinafter called “Eon”) is going to provide its products’ top marking on
ICs with < cFeon > from January 1st, 2009, and without any change of the part number and the
compositions of the ICs. Eon is still keeping the promise of quality for all the products with the
same as that of Eon delivered before. Please be advised with the change and appreciate your
kindly cooperation and fully support Eon’s product family.
Eon products’ New Top Marking
cFeon Top Marking Example:
cFeon
Part Number: XXXX-XXX
Lot Number: XXXXX
Date Code: XXXXX
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as an Eon product. Any
changes that have been made are the result of normal data sheet improvement and are noted in
the document revision summary, where supported. Future routine revisions will occur when
appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
Eon continues to support existing part numbers beginning with “Eon” and “cFeon” top marking. To
order these products, during the transition please specify “Eon top marking” or “cFeon top marking”
on your purchasing orders.
For More Information
Please contact your local sales office for additional information about Eon memory solutions.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
1
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
EN25F16
16 Megabit Serial Flash Memory with 4Kbytes Uniform Sector
FEATURES
• Software and Hardware Write Protection:
- Write Protect all or portion of memory via
software
- Enable/Disable protection with WP# pin
• Single power supply operation
- Full voltage range: 2.7-3.6 volt
• Serial Interface Architecture
- SPI Compatible: Mode 0 and Mode 3
•
-
• 16 Mbit Serial Flash
- 16 M-bit/2048 K-byte/8192 pages
- 256 bytes per programmable page
• High performance
- 100MHz clock rate
• Lockable 128 byte OTP security sector
• Minimum 100K endurance cycle
• Low power consumption
- 12 mA typical active current
- 1 μA typical power down current
•
-
High performance program/erase speed
Page program time: 1.3ms typical
Sector erase time: 90ms typical
Block erase time 400ms typical
Chip erase time: 7 seconds typical
•
-
Uniform Sector Architecture:
512 sectors of 4-Kbyte
32 blocks of 64-Kbyte
Any sector or block can be
erased individually
Package Options
8 pins SOP 150mil body width
8 pins SOP 200mil body width
8 contact VDFN
8 pins PDIP
All Pb-free packages are RoHS compliant
• Industrial temperature Range
GENERAL DESCRIPTION
The EN25F16 is a 16M-bit (2048K-byte) Serial Flash memory, with advanced write protection
mechanisms, accessed by a high speed SPI-compatible bus. The memory can be programmed 1 to
256 bytes at a time, using the Page Program instruction.
The EN25F16 is designed to allow either single Sector/Block at a time or full chip erase operation. The
EN25F16 can be configured to protect part of the memory as the software protected mode. The device can
sustain a minimum of 100K program/erase cycles on each sector or block.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
2
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Figure.1 CONNECTION DIAGRAMS
8 - LEAD SOP / DIP
8 - CONTACT VDFN
Figure 2. BLOCK DIAGRAM
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
3
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
SIGNAL DESCRIPTION
Serial Data Input (DI)
The SPI Serial Data Input (DI) pin provides a means for instructions, addresses and data to be serially
written to (shifted into) the device. Data is latched on the rising edge of the Serial Clock (CLK) input pin.
Serial Data Output (DO)
The SPI Serial Data Output (DO) pin provides a means for data and status to be serially read from
(shifted out of) the device. Data is shifted out on the falling edge of the Serial Clock (CLK) input pin.
Serial Clock (CLK)
The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See
SPI Mode")
Chip Select (CS#)
The SPI Chip Select (CS#) pin enables and disables device operation. When CS# is high the device is
deselected and the Serial Data Output (DO) pin is at high impedance. When deselected, the devices
power consumption will be at standby levels unless an internal erase, program or status register cycle
is in progress. When CS# is brought low the device will be selected, power consumption will increase to
active levels and instructions can be written to and data read from the device. After power-up, CS#
must transition from high to low before a new instruction will be accepted.
Hold (HOLD#)
The HOLD pin allows the device to be paused while it is actively selected. When HOLD is brought low,
while CS# is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be
ignored (don’t care). The hold function can be useful when multiple devices are sharing the same SPI
signals.
Write Protect (WP#)
The Write Protect (WP#) pin can be used to prevent the Status Register from being written. Used in
conjunction with the Status Register’s Block Protect (BP0, BP1and BP2) bits and Status Register
Protect (SRP) bits, a portion or the entire memory array can be hardware protected.
Table 1. PIN Names
Symbol
Pin Name
CLK
Serial Clock Input
DI
Serial Data Input
DO
Serial Data Output
CS#
Chip Enable
WP#
Write Protect
HOLD#
Hold Input
Vcc
Supply Voltage (2.7-3.6V)
Vss
Ground
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
4
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
MEMORY ORGANIZATION
The memory is organized as:
z
2,097,152 bytes
z
Uniform Sector Architecture
32 blocks of 64-Kbyte
512 sectors of 4-Kbyte
z
8192 pages (256 bytes each)
Each page can be individually programmed (bits are programmed from 1 to 0). The device is Sector,
Block or Chip Erasable but not Page Erasable.
Table 2. Uniform Block Sector Architecture
16
15
….
1A0FFF
19FFFF
190FFF
18FFFF
180000
17F000
180FFF
17FFFF
170000
16F000
170FFF
16FFFF
160000
15F000
160FFF
15FFFF
150000
14F000
150FFF
14FFFF
320
319
140000
13F000
140FFF
13FFFF
304
303
130000
12F000
130FFF
12FFFF
288
287
120000
11F000
120FFF
11FFFF
….
….
….
….
336
335
….
….
352
351
….
….
368
367
….
….
384
383
….
….
190000
18F000
….
400
399
….
….
1A0000
19F000
….
416
415
….
….
….
….
….
….
….
1B0FFF
1AFFFF
….
….
….
….
….
….
….
….
….
….
1B0000
1AF000
….
432
431
272
271
110000
10F000
110FFF
10FFFF
….
17
1C0FFF
1BFFFF
256
255
100000
0FF000h
100FFF
0FFFFFh
….
18
1C0000
1BF000
….
19
448
447
….
20
1D0FFF
1CFFFF
….
21
1D0000
1CF000
….
22
464
463
….
23
1E0FFF
1DFFFF
….
24
1E0000
1DF000
….
25
480
479
….
26
1F0FFF
1EFFFF
….
27
1F0000
1EF000
….
28
496
495
….
29
1FFFFF
….
30
Address range
1FF000
….
31
Sector
511
….
Block
240
0F0000h
0F0FFFh
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
5
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
0
….
0A0FFFh
09FFFFh
090FFFh
08FFFFh
080FFFh
07FFFFh
070000h
06F000h
070FFFh
06FFFFh
060000h
05F000h
060FFFh
05FFFFh
050000h
04F000h
050FFFh
04FFFFh
64
63
040000h
03F000h
040FFFh
03FFFFh
48
47
030000h
02F000h
030FFFh
02FFFFh
….
….
….
80
79
….
….
96
95
….
….
112
111
….
….
080000h
07F000h
….
128
127
….
….
090000h
08F000h
….
144
143
….
….
….
….
….
….
….
….
0A0000h
09F000h
….
….
….
….
….
….
….
160
159
….
….
0B0FFFh
0AFFFFh
32
31
020000h
01F000h
020FFFh
01FFFFh
….
1
0B0000h
0AF000h
16
15
010000h
00F000h
010FFFh
00FFFFh
….
2
176
175
….
3
0C0FFFh
0BFFFFh
….
4
0C0000h
0BF000h
….
5
192
191
….
6
0D0FFFh
0CFFFFh
….
7
0D0000h
0CF000h
….
8
208
207
….
9
0E0FFFh
0DFFFFh
….
10
0E0000h
0DF000h
….
11
224
223
….
12
0EFFFFh
….
13
0EF000h
….
239
14
4
3
2
1
0
004000h
003000h
002000h
001000h
000000h
004FFFh
003FFFh
002FFFh
001FFFh
000FFFh
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
6
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
OPERATING FEATURES
SPI Modes
The EN25F16 is accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK),
Chip Select (CS#), Serial Data Input (DI) and Serial Data Output (DO). Both SPI bus operation Modes 0
(0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and Mode 3, as shown in
Figure 3, concerns the normal state of the CLK signal when the SPI bus master is in standby and data
is not being transferred to the Serial Flash. For Mode 0 the CLK signal is normally low. For Mode 3 the
CLK signal is normally high. In either case data input on the DI pin is sampled on the rising edge of the
CLK. Data output on the DO pin is clocked out on the falling edge of CLK.
Figure 3. SPI Modes
Page Programming
To program one data byte, two instructions are required: Write Enable (WREN), which is one byte, and
a Page Program (PP) sequence, which consists of four bytes plus data. This is followed by the internal
Program cycle (of duration tPP).
To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be programmed
at a time (changing bits from 1 to 0), provided that they lie in consecutive addresses on the same page
of memory.
Sector Erase, Block Erase and Chip Erase
The Page Program (PP) instruction allows bits to be reset from 1 to 0. Before this can be applied, the
bytes of memory need to have been erased to all 1s (FFh). This can be achieved a sector at a time,
using the Sector Erase (SE) instruction, a block at a time using the Block Erase (BE) instruction or
throughout the entire memory, using the Chip Erase (CE) instruction. This starts an internal Erase cycle
(of duration tSE tBE or tCE). The Erase instruction must be preceded by a Write Enable (WREN)
instruction.
Polling During a Write, Program or Erase Cycle
A further improvement in the time to Write Status Register (WRSR), Program (PP) or Erase (SE, BE or
CE ) can be achieved by not waiting for the worst case delay (tW, tPP, tSE, tBE or tCE). The Write In
Progress (WIP) bit is provided in the Status Register so that the application program can monitor its
value, polling it to establish when the previous Write cycle, Program cycle or Erase cycle is complete.
Active Power, Stand-by Power and Deep Power-Down Modes
When Chip Select (CS#) is Low, the device is enabled, and in the Active Power mode. When Chip
Select (CS#) is High, the device is disabled, but could remain in the Active Power mode until all internal
cycles have completed (Program, Erase, Write Status Register). The device then goes into the Standby Power mode. The device consumption drops to ICC1.
The Deep Power-down mode is entered when the specific instruction (the Enter Deep Power-down
Mode (DP) instruction) is executed. The device consumption drops further to ICC2. The device remains
in this mode until another specific instruction (the Release from Deep Power-down Mode and Read
Device ID (RDI) instruction) is executed.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
7
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
All other instructions are ignored while the device is in the Deep Power-down mode. This can be used
as an extra software protection mechanism, when the device is not in active use, to protect the device
from inadvertent Write, Program or Erase instructions.
Status Register. The Status Register contains a number of status and control bits that can be read or
set (as appropriate) by specific instructions.
WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status
Register, Program or Erase cycle.
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
BP2, BP1, BP0 bits. The Block Protect (BP2, BP1, BP0) bits are non-volatile. They define the size of
the area to be software protected against Program and Erase instructions.
SRP bit / OTP_LOCK bit The Status Register Protect (SRP) bit is operated in conjunction with the
Write Protect (WP#) signal. The Status Register Protect (SRP) bit and Write Protect (WP#) signal allow
the device to be put in the Hardware Protected mode. In this mode, the non-volatile bits of the Status
Register (SRP, BP2, BP1, BP0) become read-only bits.
In OTP mode, this bit is served as OTP_LOCK bit, user can read/program/erase OTP sector as normal
sector while OTP_LOCK bit value is equal 0, after OTP_LOCK bit is programmed with 1 by WRSR
command, the OTP sector is protected from program and erase operation. The OTP_LOCK bit can only
be programmed once.
Note : In OTP mode, the WRSR command will ignore any input data and program OTP_LOCK bit to 1,
user must clear the protect bits before enter OTP mode and program the OTP code, then execute
WRSR command to lock the OTP sector before leaving OTP mode.
Write Protection
Applications that use non-volatile memory must take into consideration the possibility of noise and other
adverse system conditions that may compromise data integrity. To address this concern the EN25F16
provides the following data protection mechanisms:
z
Power-On Reset and an internal timer (tPUW) can provide protection against inadvertent changes
while the power supply is outside the operating specification.
z
Program, Erase and Write Status Register instructions are checked that they consist of a number
of clock pulses that is a multiple of eight, before they are accepted for execution.
z
All instructions that modify data must be preceded by a Write Enable (WREN) instruction to set
the Write Enable Latch (WEL) bit . This bit is returned to its reset state by the following events:
– Power-up
– Write Disable (WRDI) instruction completion or Write Status Register (WRSR) instruction
completion or Page Program (PP) instruction completion or Sector Erase (SE) instruction
completion or Block Erase (BE) instruction completion or Chip Erase (CE) instruction
completion
z
The Block Protect (BP2, BP1, BP0) bits allow part of the memory to be configured as read-only.
This is the Software Protected Mode (SPM).
z
The Write Protect (WP#) signal allows the Block Protect (BP2, BP1, BP0) bits and Status Register
Protect (SRP) bit to be protected. This is the Hardware Protected Mode (HPM).
z
In addition to the low power consumption feature, the Deep Power-down mode offers extra
software protection from inadvertent Write, Program and Erase instructions, as all instructions are
ignored except one particular instruction (the Release from Deep Power-down instruction).
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
8
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Table 3. Protected Area Sizes Sector Organization
Status Register
Content
BP2
BP1
BP0
Bit
Bit
Bit
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
Memory Content
Protect Areas
None
Block 0 to 30
Block 0 to 29
Block 0 to 27
Block 0 to 23
Block 0 to 15
All
All
Addresses
None
000000h-1EFFFFh
000000h-1DFFFFh
000000h-1BFFFFh
000000h-17FFFFh
000000h-0FFFFFh
000000h-1FFFFFh
000000h-1FFFFFh
Density(KB)
None
1984KB
1920KB
1792KB
1536KB
1024KB
2048KB
2048KB
Portion
None
Lower 31/32
Lower 30/32
Lower 28/32
Lower 24/32
Lower 16/32
All
All
Hold Function
The Hold (HOLD) signal is used to pause any serial communications with the device without resetting
the clocking sequence. However, taking this signal Low does not terminate any Write Status Register,
Program or Erase cycle that is currently in progress.
To enter the Hold condition, the device must be selected, with Chip Select (CS#) Low. The Hold
condition starts on the falling edge of the Hold (HOLD) signal, provided that this coincides with Serial
Clock (CLK) being Low (as shown in Figure 4.).
The Hold condition ends on the rising edge of the Hold (HOLD) signal, provided that this coincides with
Serial Clock (CLK) being Low.
If the falling edge does not coincide with Serial Clock (CLK) being Low, the Hold condition starts after
Serial Clock (CLK) next goes Low. Similarly, if the rising edge does not coincide with Serial Clock (CLK)
being Low, the Hold condition ends after Serial Clock (CLK) next goes Low. (This is shown in Figure 4.).
During the Hold condition, the Serial Data Output (DO) is high impedance, and Serial Data Input (DI)
and Serial Clock (CLK) are Don’t Care.
Normally, the device is kept selected, with Chip Select (CS#) driven Low, for the whole duration of the
Hold condition. This is to ensure that the state of the internal logic remains unchanged from the moment of entering the Hold condition.
If Chip Select (CS#) goes High while the device is in the Hold condition, this has the effect of resetting
the internal logic of the device. To restart communication with the device, it is necessary to drive Hold
(HOLD) High, and then to drive Chip Select (CS#) Low. This prevents the device from going back to the
Hold condition.
Figure 4. Hold Condition Waveform
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
9
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial
Data Input (DI) is sampled on the first rising edge of Serial Clock (CLK) after Chip Select (CS#) is
driven Low. Then, the one-byte instruction code must be shifted in to the device, most significant bit first,
on Serial Data Input (DI), each bit being latched on the rising edges of Serial Clock (CLK).
The instruction set is listed in Table 4. Every instruction sequence starts with a one-byte instruction
code. Depending on the instruction, this might be followed by address bytes, or by data bytes, or by
both or none. Chip Select (CS#) must be driven High after the last bit of the instruction sequence has
been shifted in. In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed
(Fast_Read), Read Status Register (RDSR) or Release from Deep Power-down, and Read Device ID
(RDI) instruction, the shifted-in instruction sequence is followed by a data-out sequence. Chip Select
(CS#) can be driven High after any bit of the data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip Erase (CE), Write
Status Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP)
instruction, Chip Select (CS#) must be driven High exactly at a byte boundary, otherwise the instruction
is rejected, and is not executed. That is, Chip Select (CS#) must driven High when the number of clock
pulses after Chip Select (CS#) being driven Low is an exact multiple of eight. For Page Program, if at
any time the input byte is not a full byte, nothing will happen and WEL will not be reset.
In the case of multi-byte commands of Page Program (PP), and Release from Deep Power Down
(RES ) minimum number of bytes specified has to be given, without which, the command will be
ignored.
In the case of Page Program, if the number of byte after the command is less than 4 (at least 1
data byte), it will be ignored too. In the case of SE and BE, exact 24-bit address is a must, any
less or more will cause the command to be ignored.
All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase
cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle continues
unaffected.
Table 4. Instruction Set
Instruction Name
Byte 1
Code
Write Enable
Write Disable / Exit
OTP mode
Read Status
Register
Write Status
Register
Read Data
06h
Byte 2
Byte 3
Byte 4
Byte 5
Byte 6
n-Bytes
04h
05h
(S7-S0)(1)
01h
S7-S0
03h
A23-A16
continuous(2)
A15-A8
A7-A0
(D7-D0)
(Next byte)
continuous
Fast Read
0Bh
A23-A16
A15-A8
A7-A0
dummy
(D7-D0)
(Next Byte)
continuous
Page Program
Sector Erase / OTP
erase
Block Erase
02h
A23-A16
A15-A8
A7-A0
D7-D0
Next byte
continuous
20h
A23-A16
A15-A8
A7-A0
D8h
A23-A16
A15-A8
A7-A0
Chip Erase
C7h/ 60h
Deep Power-down
Release from Deep
Power-down, and
read Device ID
Release from Deep
Power-down
B9h
(3)
dummy
dummy
dummy
(ID7-ID0)
ABh
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
10
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Manufacturer/
Device ID
Read Identification
Enter OTP mode
90h
dummy
dummy
9Fh
3Ah
(M7-M0)
(ID15-ID8)
00h
01h
(ID7-ID0)
(M7-M0)
(ID7-ID0)
(5)
(ID7-ID0)
(M7-M0)
(4)
Notes:
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being read from the
device on the DO pin.
2. The Status Register contents will repeat continuously until CS# terminate the instruction.
3. The Device ID will repeat continuously until CS# terminate the instruction.
4. The Manufacturer ID and Device ID bytes will repeat continuously until CS# terminate the instruction.
00h on Byte 4 starts with MID and alternate with DID, 01h on Byte 4 starts with DID and alternate with MID.
5. (M7-M0) : Manufacturer, (ID15-ID8) : Memory Type, (ID7-ID0) : Memory Capacity
Table 5. Manufacturer and Device Identification
OP Code
(M7-M0)
(ID15-ID0)
ABh
(ID7-ID0)
14h
90h
1Ch
9Fh
1Ch
14h
3115h
Write Enable (WREN) (06h)
The Write Enable (WREN) instruction (Figure 5) sets the Write Enable Latch (WEL) bit. The Write
Enable Latch (WEL) bit must be set prior to every Page Program (PP), Sector Erase (SE), Block Erase
(BE), Chip Erase (CE) and Write Status Register (WRSR) instruction.
The Write Enable (WREN) instruction is entered by driving Chip Select (CS#) Low, sending the
instruction code, and then driving Chip Select (CS#) High.
Figure 5. Write Enable Instruction Sequence Diagram
Write Disable (WRDI) (04h)
The Write Disable instruction (Figure 6) resets the Write Enable Latch (WEL) bit in the Status Register
to a 0 or exit from OTP mode to normal mode. The Write Disable instruction is entered by driving Chip
Select (CS#) low, shifting the instruction code “04h” into the DI pin and then driving Chip Select (CS#)
high. Note that the WEL bit is automatically reset after Power-up and upon completion of the Write
Status Register, Page Program, Sector Erase, Block Erase (BE) and Chip Erase instructions.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
11
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Figure 6. Write Disable Instruction Sequence Diagram
Read Status Register (RDSR) (05h)
The Read Status Register (RDSR) instruction allows the Status Register to be read. The Status
Register may be read at any time, even while a Program, Erase or Write Status Register cycle is in
progress. When one of these cycles is in progress, it is recommended to check the Write In Progress
(WIP) bit before sending a new instruction to the device. It is also possible to read the Status Register
continuously, as shown in Figure 7.
Figure 7. Read Status Register Instruction Sequence Diagram
Table 6. Status Register Bit Locations
S7
SRP
Status Register
Protect
1 = status
register write
disable
S6
S5
OTP_LOCK
bit
Non-volatile bit
S3
S2
S1
BP2
BP1
BP0
WEL
(Block Protected (Block Protected (Block Protected (Write Enable
bits)
bits)
bits)
Latch)
(note 1)
1 = OTP
sector is
protected
S4
Reserved Reserved
bits
bits
S0
WIP
(Write In
Progress bit)
(note 2)
(note 2)
(note 2)
1 = write
enable
0 = not write
enable
1 = write
operation
0 = not in write
operation
Non-volatile bit
Non-volatile bit
Non-volatile bit
volatile bit
volatile bit
Note
1. In OTP mode, SRP bit is served as OTP_LOCK bit.
2. See the table “Protected Area Sizes Sector Organization”.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
12
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
The status and control bits of the Status Register are as follows:
WIP bit. The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status
Register, Program or Erase cycle. When set to 1, such a cycle is in progress, when reset to 0 no such
cycle is in progress.
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable Latch is
reset and no Write Status Register, Program or Erase instruction is accepted.
BP2, BP1, BP0 bits. The Block Protect (BP2, BP1, BP0) bits are non-volatile. They define the size of
the area to be software protected against Program and Erase instructions. These bits are written with
the Write Status Register (WRSR) instruction. When one or both of the Block Protect (BP2, BP1, BP0)
bits is set to 1, the relevant memory area (as defined in Table 3.) becomes protected against Page
Program (PP) Sector Erase (SE) and , Block Erase (BE), instructions. The Block Protect (BP2, BP1,
BP0) bits can be written provided that the Hardware Protected mode has not been set. The Chip Erase
(CE) instruction is executed if, and only if, all Block Protect (BP2, BP1, BP0) bits are 0.
Reserved bit. Status register bit locations 5 and 6 are reserved for future use. Current devices will read
0 for these bit locations. It is recommended to mask out the reserved bit when testing the Status
Register. Doing this will ensure compatibility with future devices.
SRP bit / OTP_LOCK bit. The Status Register Protect (SRP) bit is operated in conjunction with the
Write Protect (WP#) signal. The Status Register Write Protect (SRP) bit and Write Protect (WP#) signal
allow the device to be put in the Hardware Protected mode (when the Status Register Protect (SRP) bit
is set to 1, and Write Protect (WP#) is driven Low). In this mode, the non-volatile bits of the Status
Register (SRP, BP2, BP1, BP0) become read-only bits and the Write Status Register (WRSR)
instruction is no longer accepted for execution.
In OTP mode, this bit is served as OTP_LOCK bit, user can read/program/erase OTP sector as normal
sector while OTP_LOCK value is equal 0, after OTP_LOCK is programmed with 1 by WRSR command,
the OTP sector is protected from program and erase operation. The OTP_LOCK bit can only be
programmed once.
Note : In OTP mode, the WRSR command will ignore any input data and program OTP_LOCK bit to 1,
user must clear the protect bits before enter OTP mode and program the OTP code, then execute
WRSR command to lock the OTP sector before leaving OTP mode.
Write Status Register (WRSR) (01h)
The Write Status Register (WRSR) instruction allows new values to be written to the Status Register.
Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed.
After the Write Enable (WREN) instruction has been decoded and executed, the device sets the Write
Enable Latch (WEL).
The Write Status Register (WRSR) instruction is entered by driving Chip Select (CS#) Low, followed by
the instruction code and the data byte on Serial Data Input (DI).
The instruction sequence is shown in Figure 8. The Write Status Register (WRSR) instruction has no
effect on S6, S5, S1 and S0 of the Status Register. S6 and S5 are always read as 0. Chip Select (CS#)
must be driven High after the eighth bit of the data byte has been latched in. If not, the Write Status
Register (WRSR) instruction is not executed. As soon as Chip Select (CS#) is driven High, the selftimed Write Status Register cycle (whose duration is tW) is initiated. While the Write Status Register
cycle is in progress, the Status Register may still be read to check the value of the Write In Progress
(WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Write Status Register cycle, and is
0 when it is completed. When the cycle is completed, the Write Enable Latch (WEL) is reset.
The Write Status Register (WRSR) instruction allows the user to change the values of the Block Protect
(BP2, BP1, BP0) bits, to define the size of the area that is to be treated as read-only, as defined in
Table 3.. The Write Status Register (WRSR) instruction also allows the user to set or reset the Status
Register Protect (SRP) bit in accordance with the Write Protect (WP#) signal. The Status Register
Protect (SRP) bit and Write Protect (WP#) signal allow the device to be put in the Hardware Protected
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13
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EN25F16
Mode (HPM). The Write Status Register (WRSR) instruction is not executed once the Hardware
Protected Mode (HPM) is entered.
NOTE : In the OTP mode, WRSR command will ignore input data and program OTP_LOCK bit to 1.
Figure 8. Write Status Register Instruction Sequence Diagram
Read Data Bytes (READ) (03h)
The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read Data
Bytes (READ) instruction is followed by a 3-byte address (A23-A0), each bit being latched-in during the
rising edge of Serial Clock (CLK). Then the memory contents, at that address, is shifted out on Serial
Data Output (DO), each bit being shifted out, at a maximum frequency fR, during the falling edge of
Serial Clock (CLK).
The instruction sequence is shown in Figure 9. The first byte addressed can be at any location. The
address is automatically incremented to the next higher address after each byte of data is shifted out.
The whole memory can, therefore, be read with a single Read Data Bytes (READ) instruction. When
the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence
to be continued indefinitely.
The Read Data Bytes (READ) instruction is terminated by driving Chip Select (CS#) High. Chip Select
(CS#) can be driven High at any time during data output. Any Read Data Bytes (READ) instruction,
while an Erase, Program or Write cycle is in progress, is rejected without having any effects on the
cycle that is in progress.
Figure 9. Read Data Instruction Sequence Diagram
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EN25F16
Read Data Bytes at Higher Speed (FAST_READ) (0Bh)
The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read Data
Bytes at Higher Speed (FAST_READ) instruction is followed by a 3-byte address (A23-A0) and a
dummy byte, each bit being latched-in during the rising edge of Serial Clock (CLK). Then the memory
contents, at that address, is shifted out on Serial Data Output (DO), each bit being shifted out, at a
maximum frequency FR, during the falling edge of Serial Clock (CLK).
The instruction sequence is shown in Figure 10. The first byte addressed can be at any location. The
address is automatically incremented to the next higher address after each byte of data is shifted out.
The whole memory can, therefore, be read with a single Read Data Bytes at Higher Speed
(FAST_READ) instruction. When the highest address is reached, the address counter rolls over to
000000h, allowing the read sequence to be continued indefinitely.
The Read Data Bytes at Higher Speed (FAST_READ) instruction is terminated by driving Chip Select
(CS#) High. Chip Select (CS#) can be driven High at any time during data output. Any Read Data Bytes
at Higher Speed (FAST_READ) instruction, while an Erase, Program or Write cycle is in progress, is
rejected without having any effects on the cycle that is in progress.
Figure 10. Fast Read Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25F16
Page Program (PP) (02h)
The Page Program (PP) instruction allows bytes to be programmed in the memory. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Page Program (PP) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, three address bytes and at least one data byte on Serial Data Input (DI). If the 8 least
significant address bits (A7-A0) are not all zero, all transmitted data that goes beyond the end of the
current page are programmed from the start address of the same page (from the address whose 8
least significant bits (A7-A0) are all zero). Chip Select (CS#) must be driven Low for the entire duration
of the sequence.
The instruction sequence is shown in Figure 11. If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256 data bytes are guaranteed to be programmed correctly within the same page. If less than 256 Data bytes are sent to device, they are correctly programmed at the requested addresses without having any effects on the other bytes of the same page.
Chip Select (CS#) must be driven High after the eighth bit of the last data byte has been latched in,
otherwise the Page Program (PP) instruction is not executed.
As soon as Chip Select (CS#) is driven High, the self-timed Page Program cycle (whose duration is tPP)
is initiated. While the Page Program cycle is in progress, the Status Register may be read to check the
value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Page
Program cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed,
the Write Enable Latch (WEL) bit is reset.
A Page Program (PP) instruction applied to a page which is protected by the Block Protect (BP2, BP1,
BP0) bits (see Table 3) is not executed.
Figure 11. Page Program Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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EN25F16
Sector Erase (SE) (20h)
The Sector Erase (SE) instruction sets to 1 (FFh) all bits inside the chosen sector. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Sector Erase (SE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data Input (DI). Any address inside the Sector (see
Table 2) is a valid address for the Sector Erase (SE) instruction. Chip Select (CS#) must be driven Low
for the entire duration of the sequence.
The instruction sequence is shown in Figure 12. Chip Select (CS#) must be driven High after the eighth
bit of the last address byte has been latched in, otherwise the Sector Erase (SE) instruction is not
executed. As soon as Chip Select (CS#) is driven High, the self-timed Sector Erase cycle (whose duration is tSE) is initiated. While the Sector Erase cycle is in progress, the Status Register may be read
to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the
self-timed Sector Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle
is completed, the Write Enable Latch (WEL) bit is reset.
A Sector Erase (SE) instruction applied to a sector which is protected by the Block Protect (BP2, BP1,
BP0) bits (see Table 3) is not executed.
Figure 12. Sector Erase Instruction Sequence Diagram
Block Erase (BE) (D8h)
The Block Erase (BE) instruction sets to 1 (FFh) all bits inside the chosen block. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Block Erase (BE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction code, and three address bytes on Serial Data Input (DI). Any address inside the Block (see
Table 2) is a valid address for the Block Erase (BE) instruction. Chip Select (CS#) must be driven Low
for the entire duration of the sequence.
The instruction sequence is shown in Figure 13. Chip Select (CS#) must be driven High after the eighth
bit of the last address byte has been latched in, otherwise the Block Erase (BE) instruction is not
executed. As soon as Chip Select (CS#) is driven High, the self-timed Block Erase cycle (whose duration is tSE) is initiated. While the Block Erase cycle is in progress, the Status Register may be read to
check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the selftimed Block Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is
completed, the Write Enable Latch (WEL) bit is reset.
A Block Erase (BE) instruction applied to a block which is protected by the Block Protect (BP2, BP1,
BP0) bits (see Table 3) is not executed.
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©2004 Eon Silicon Solution, Inc.,
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EN25F16
Figure 13 Block Erase Instruction Sequence Diagram
Chip Erase (CE) (C7h/60h)
The Chip Erase (CE) instruction sets all bits to 1 (FFh). Before it can be accepted, a Write Enable
(WREN) instruction must previously have been executed. After the Write Enable (WREN) instruction
has been decoded, the device sets the Write Enable Latch (WEL).
The Chip Erase (CE) instruction is entered by driving Chip Select (CS#) Low, followed by the instruction
code on Serial Data Input (DI). Chip Select (CS#) must be driven Low for the entire duration of the
sequence.
The instruction sequence is shown in Figure 14. Chip Select (CS#) must be driven High after the eighth
bit of the instruction code has been latched in, otherwise the Chip Erase instruction is not executed. As
soon as Chip Select (CS#) is driven High, the self-timed Chip Erase cycle (whose duration is tCE) is
initiated. While the Chip Erase cycle is in progress, the Status Register may be read to check the value
of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Chip Erase
cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write
Enable Latch (WEL) bit is reset.
The Chip Erase (CE) instruction is executed only if all Block Protect (BP2, BP1, BP0) bits are 0. The
Chip Erase (CE) instruction is ignored if one, or more, sectors are protected.
Figure 14. Chip Erase Instruction Sequence Diagram
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EN25F16
Deep Power-down (DP) (B9h)
Executing the Deep Power-down (DP) instruction is the only way to put the device in the lowest consumption mode (the Deep Power-down mode). It can also be used as an extra software protection
mechanism, while the device is not in active use, since in this mode, the device ignores all Write,
Program and Erase instructions.
Driving Chip Select (CS#) High deselects the device, and puts the device in the Standby mode (if there
is no internal cycle currently in progress). But this mode is not the Deep Power-down mode. The Deep
Power-down mode can only be entered by executing the Deep Power-down (DP) instruction, to reduce
the standby current (from ICC1 to ICC2, as specified in Table 9.).
Once the device has entered the Deep Power-down mode, all instructions are ignored except the
Release from Deep Power-down and Read Device ID (RDI) instruction. This releases the device from
this mode. The Release from Deep Power-down and Read Device ID (RDI) instruction also allows the
Device ID of the device to be output on Serial Data Output (DO).
The Deep Power-down mode automatically stops at Power-down, and the device always Powers-up in
the Standby mode. The Deep Power-down (DP) instruction is entered by driving Chip Select (CS#) Low,
followed by the instruction code on Serial Data Input (DI). Chip Select (CS#) must be driven Low for the
entire duration of the sequence.
The instruction sequence is shown in Figure 15.Chip Select (CS#) must be driven High after the eighth
bit of the instruction code has been latched in, otherwise the Deep Power-down (DP) instruction is not
executed. As soon as Chip Select (CS#) is driven High, it requires a delay of tDP before the supply
current is reduced to ICC2 and the Deep Power-down mode is entered.
Any Deep Power-down (DP) instruction, while an Erase, Program or Write cycle is in progress, is
rejected without having any effects on the cycle that is in progress.
Figure 15. Deep Power-down Instruction Sequence Diagram
Release from Deep Power-down and Read Device ID (RDI)
Once the device has entered the Deep Power-down mode, all instructions are ignored except the
Release from Deep Power-down and Read Device ID (RDI) instruction. Executing this instruction takes
the device out of the Deep Power-down mode.
Please note that this is not the same as, or even a subset of, the JEDEC 16-bit Electronic Signature
that is read by the Read Identifier (RDID) instruction. The old-style Electronic Signature is supported for
reasons of backward compatibility, only, and should not be used for new designs. New designs should,
instead, make use of the JEDEC 16-bit Electronic Signature, and the Read Identifier (RDID) instruction.
When used only to release the device from the power-down state, the instruction is issued by driving
the CS# pin low, shifting the instruction code “ABh” and driving CS# high as shown in Figure 16. After
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©2004 Eon Silicon Solution, Inc.,
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EN25F16
the time duration of tRES1 (See AC Characteristics) the device will resume normal operation and other
instructions will be accepted. The CS# pin must remain high during the tRES1 time duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the CS# pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device
ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in
Figure 17. The Device ID value for the EN25F16 are listed in Table 5. The Device ID can be read
continuously. The instruction is completed by driving CS# high.
When Chip Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device
was not previously in the Deep Power-down mode, the transition to the Stand-by Power mode is
immediate. If the device was previously in the Deep Power-down mode, though, the transition to the
Standby Power mode is delayed by tRES2, and Chip Select (CS#) must remain High for at least tRES2
(max), as specified in Table 11. Once in the Stand-by Power mode, the device waits to be selected, so
that it can receive, decode and execute instructions.
Except while an Erase, Program or Write Status Register cycle is in progress, the Release from Deep
Power-down and Read Device ID (RDI) instruction always provides access to the 8bit Device ID of the
device, and can be applied even if the Deep Power-down mode has not been entered.
Any Release from Deep Power-down and Read Device ID (RDI) instruction while an Erase, Program or
Write Status Register cycle is in progress, is not decoded, and has no effect on the cycle that is in
progress.
Figure 16. Release Power-down Instruction Sequence Diagram
Figure 17. Release Power-down / Device ID Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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©2004 Eon Silicon Solution, Inc.,
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EN25F16
Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the CS# pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Eon (1Ch)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as
shown in Figure 18. The Device ID values for the EN25F16 are listed in Table 5. If the 24-bit address is
initially set to 000001h the Device ID will be read first
Figure 18. Read Manufacturer / Device ID Diagram
Read Identification (RDID)(9Fh)
The Read Identification (RDID) instruction allows the 8-bit manufacturer identification to be read,
followed by two bytes of device identification. The device identification indicates the memory type in the
first byte , and the memory capacity of the device in the second byte .
Any Read Identification (RDID) instruction while an Erase or Program cycle is in progress, is not
decoded, and has no effect on the cycle that is in progress. The Read Identification (RDID) instruction
should not be issued while the device is in Deep Power down mode.
The device is first selected by driving Chip Select Low. Then, the 8-bit instruction code for the
instruction is shifted in. This is followed by the 24-bit device identification, stored in the memory, being
shifted out on Serial Data Output, each bit being shifted out during the falling edge of Serial Clock. The
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EN25F16
instruction sequence is shown in Figure 19. The Read Identification (RDID) instruction is terminated by
driving Chip Select High at any time during data output.
When Chip Select is driven High, the device is put in the Standby Power mode. Once in the Standby
Power mode, the device waits to be selected, so that it can receive, decode and execute instructions.
Figure 19. Read Identification (RDID)
This Data Sheet may be revised by subsequent versions
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EN25F16
Enter OTP Mode (3Ah)
This Flash has an extra 128 bytes OTP sector, user must issue ENTER OTP MODE command to read,
program or erase OTP sector. After entering OTP mode, the OTP sector is mapping to sector 511, SRP
bit becomes OTP_LOCK bit and can be read with RDSR command. Program / Erase command will be
disabled when OTP_LOCK bit is ‘1’
WRSR command will ignore the input data and program OTP_LOCK bit to 1.
User must clear the protect bits before enter OTP mode.
OTP sector can only be program and erase before OTP_LOCK bit equal ‘1’ and BP [2:0] = ‘000’. In
OTP mode, user can read other sectors, but program/erase other sectors only allowed when
OTP_LOCK bit equal ‘0’.
User can use WRDI (04h) command to exit OTP mode.
Erase OTP Command (20h)
User can use Sector Erase (20h) command only to erase OTP data.
Table 7. OTP Sector Address
Sector
Sector Size
Address Range
511
128 byte
1FF000 – 1FF07Fh
Note: The OTP sector is mapping to sector 511
Figure 20. Enter OTP Mode
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
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©2004 Eon Silicon Solution, Inc.,
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EN25F16
Power-up Timing
Figure 21. Power-up Timing
Table 8. Power-Up Timing and Write Inhibit Threshold
Symbol
Parameter
Min.
Max.
Unit
tVSL(1)
VCC(min) to CS# low
10
tPUW(1)
Time delay to Write instruction
1
10
ms
VWI(1)
Write Inhibit Voltage
1
2 .5
V
µs
Note:
1.The parameters are characterized only.
2. VCC (max.) is 3.6V and VCC (min.) is 2.7V
INITIAL DELIVERY STATE
The device is delivered with the memory array erased: all bits are set to 1 (each byte contains FFh). The
Status Register contains 00h (all Status Register bits are 0).
This Data Sheet may be revised by subsequent versions
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©2004 Eon Silicon Solution, Inc.,
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EN25F16
Table 9. DC Characteristics
(Ta = - 40°C to 85°C; VCC = 2.7-3.6V)
Symbol
Parameter
Test Conditions
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC1
Standby Current
ICC2
Deep Power-down Current
ICC3
Operating Current (READ)
Min.
CS# = VCC, VIN = VSS or VCC
CS# = VCC, VIN = VSS or VCC
CLK = 0.1 VCC / 0.9 VCC at
100MHz, DQ = open
CLK = 0.1 VCC / 0.9 VCC at
75MHz, DQ = open
CS# = VCC
ICC4
Operating Current (PP)
ICC5
Operating Current (WRSR)
ICC6
ICC7
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 1.6 mA
VOH
Output High Voltage
IOH = –100 µA
Max.
Unit
±2
µA
±2
µA
20
µA
20
µA
25
mA
20
mA
28
mA
18
mA
Operating Current (SE)
CS# = VCC
CS# = VCC
25
mA
Operating Current (BE)
CS# = VCC
25
mA
– 0.5
0.2 VCC
V
0.7VCC
VCC+0.4
V
0.4
V
VCC-0.2
V
Table 10. AC Measurement Conditions
Symbol
CL
Parameter
Min.
Load Capacitance
Max.
20/30
Input Rise and Fall Times
Unit
pF
5
ns
Input Pulse Voltages
0.2VCC to 0.8VCC
V
Input Timing Reference Voltages
0.3VCC to 0.7VCC
V
VCC / 2
V
Output Timing Reference Voltages
Notes:
1.
CL = 20 pF when CLK=100MHz, CL = 30 pF when CLK=75MHz,
Figure 22. AC Measurement I/O Waveform
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EN25F16
Table 11.100MHz AC Characteristics
(Ta = - 40°C to 85°C; VCC = 2.7-3.6V)
Symbol
FR
Alt
fC
fR
tCH
Parameter
Serial Clock Frequency for:
FAST_READ, PP, SE, BE, DP, RES, WREN,
WRDI, WRSR
Serial Clock Frequency for READ, RDSR, RDID
1
Min
Typ
Max
Unit
D.C.
100
MHz
D.C.
66
MHz
Serial Clock High Time
4
ns
Serial Clock Low Time
4
ns
Serial Clock Rise Time (Slew Rate)
0.1
V / ns
Serial Clock Fall Time (Slew Rate)
0.1
V / ns
CS# Active Setup Time
5
ns
tCHSH
CS# Active Hold Time
5
ns
tSHCH
CS# Not Active Setup Time
5
ns
tCHSL
CS# Not Active Hold Time
5
ns
100
ns
tCL1
tCLCH2
tCHCL
2
tSLCH
tCSS
tSHSL
tCSH
CS# High Time
tSHQZ 2
tDIS
Output Disable Time
tCLQX
tHO
Output Hold Time
0
ns
tDVCH
tDSU
Data In Setup Time
2
ns
tCHDX
tDH
Data In Hold Time
5
ns
tHLCH
HOLD# Low Setup Time ( relative to CLK )
5
ns
tHHCH
HOLD# High Setup Time ( relative to CLK )
5
ns
tCHHH
HOLD# Low Hold Time ( relative to CLK )
5
ns
tCHHL
HOLD# High Hold Time ( relative to CLK )
5
ns
6
ns
tHLQZ
2
tHZ
HOLD# Low to High-Z Output
6
ns
tHHQX
2
tLZ
HOLD# High to Low-Z Output
6
ns
tV
Output Valid from CLK
8
ns
tCLQV
tWHSL3
Write Protect Setup Time before CS# Low
20
ns
tSHWL3
Write Protect Hold Time after CS# High
100
ns
tDP
2
CS# High to Deep Power-down Mode
3
µs
3
µs
1.8
µs
tRES2 2
CS# High to Standby Mode without Electronic
Signature read
CS# High to Standby Mode with Electronic
Signature read
tW
Write Status Register Cycle Time
10
15
ms
tPP
Page Programming Time
1.3
5
ms
tSE
Sector Erase Time
0.09
0.3
s
tBE
Block Erase Time
0.4
2
s
tCE
Chip Erase Time
7
35
s
tRES1 2
Note: 1. tCH + tCL must be greater than or equal to 1/ fC
2. Value guaranteed by characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write status Register instruction when Status Register Protect Bit is set at 1.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
26
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Figure 23. Serial Output Timing
Figure 24. Input Timing
Figure 25. Hold Timing
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
27
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
ABSOLUTE MAXIMUM RATINGS
Stresses above the values so mentioned above may cause permanent damage to the device. These
values are for a stress rating only and do not imply that the device should be operated at conditions up
to or above these values. Exposure of the device to the maximum rating values for extended periods of
time may adversely affect the device reliability.
Parameter
Value
Unit
Storage Temperature
-65 to +150
°C
Plastic Packages
-65 to +125
°C
Output Short Circuit Current1
200
mA
Input and Output Voltage
(with respect to ground) 2
-0.5 to +4.0
V
Vcc
-0.5 to +4.0
V
Notes:
1.
No more than one output shorted at a time. Duration of the short circuit should not be greater than one second.
2.
Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, inputs may undershoot Vss to –1.0V for periods of
up to 50ns and to –2.0 V for periods of up to 20ns. See figure below. Maximum DC voltage on output and I/O pins is Vcc + 0.5 V.
During voltage transitions, outputs may overshoot to Vcc + 1.5 V for periods up to 20ns. See figure below.
RECOMMENDED OPERATING RANGES 1
Parameter
Value
Ambient Operating Temperature
Industrial Devices
-40 to 85
Operating Supply Voltage
Vcc
Full: 2.7 to 3.6
Unit
°C
V
Notes:
1. Recommended Operating Ranges define those limits between which the functionality of the device is guaranteed.
Vcc
+1.5V
Maximum Negative Overshoot Waveform
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
Maximum Positive Overshoot Waveform
28
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Table 12. DATA RETENTION and ENDURANCE
Parameter Description
Test Conditions
Min
Unit
150°C
10
Years
125°C
20
Years
-40 to 85 °C
100k
cycles
Data Retention Time
Erase/Program Endurance
Table 13. CAPACITANCE
( VCC = 2.7-3.6V)
Parameter Symbol
Parameter Description
Test Setup
CIN
Input Capacitance
COUT
Output Capacitance
Typ
Max
Unit
VIN = 0
6
pF
VOUT = 0
8
pF
Note : Sampled only, not 100% tested, at TA = 25°C and a frequency of 20MHz.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
29
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
PACKAGE MECHANICAL
b
E
E1
Figure 26. SOP 8 ( 150 mil )
e
Detail A
Detail A
DIMENSION IN MM
MIN.
NOR
MAX
A
1.35
--1.75
A1
0.10
--0.25
A2
----1.50
D
4.80
--5.00
E
5.80
--6.20
E1
3.80
--4.00
e
--1.27
--b
0.33
--0.51
L
0.4
--1.27
0
0
θ
--0
8
Note : 1. Coplanarity: 0.1 mm
2. Max. allowable mold flash is 0.15 mm
at the pkg ends, 0.25 mm between leads.
SYMBOL
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
30
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Figure 27. SOP 200 mil ( official name = 208 mil )
SYMBOL
MIN.
1.75
0.05
1.70
5.15
7.70
5.15
--0.35
0.5
DIMENSION IN MM
NOR
1.975
0.15
1.825
5.275
7.90
5.275
1.27
0.425
0.65
MAX
2.20
0.25
1.95
5.40
8.10
5.40
--0.50
0.80
A
A1
A2
D
E
E1
e
b
L
0
0
0
θ
4
8
0
Note : 1. Coplanarity: 0.1 mm
2. Max. allowable mold flash is 0.15 mm
at the pkg ends, 0.25 mm between leads.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
31
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Figure 28. VDFN8 ( 5x6mm )
Controlling dimensions are in millimeters (mm).
DIMENSION IN MM
MIN.
NOR
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.04
A2
--0.20
--D
5.90
6.00
6.10
E
4.90
5.00
5.10
D2
3.30
3.40
3.50
E2
3.90
4.00
4.10
e
--1.27
--b
0.35
0.40
0.45
L
0.55
0.60
0.65
Note : 1. Coplanarity: 0.1 mm
SYMBOL
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
32
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Figure 29. PDIP8
SYMBOL
A
A1
A2
D
E
E1
L
eB
Θ0
DIMENSION IN INCH
MIN.
NOR
MAX
----0.210
0.015
----0.125
0.130
0.135
0.355
0.365
0.400
0.300
0.310
0.320
0.245
0.250
0.255
0.115
0.130
0.150
0.310
0.350
0.375
0
7
15
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
33
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
ORDERING INFORMATION
EN25F16
-
100
H
I
P
PACKAGING CONTENT
P = RoHS compliant
TEMPERATURE RANGE
I = Industrial (-40°C to +85°C)
PACKAGE
G = 8-pin 150mil SOP
H = 8-pin 200mil SOP
W = 8-pin VDFN
Q = 8-pin PDIP
SPEED
100 = 100 Mhz
BASE PART NUMBER
EN = Eon Silicon Solution Inc.
25F = 3V Serial 4KByte Uniform-Sector FLASH
16 = 16 Megabit (2048K x 8)
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
34
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com
EN25F16
Revisions List
Revision No Description
A
B
C
D
Date
Preliminary draft
2007/05/02
1. Correct the extra OTP sector from 256 bytes to 512 bytes on page 1
and 22.
2. Correct the OTP sector is mapping to sector from 255 to 511 on page
22.
3. Update the Table 6. Status Register Bit Locations on page 12.
4. Modify the Figure 17 on page 20 for the starting point of tRES2
5. Modify the Figure 18 on page 21
2008/03/10
(1) revise the manufacture ID to 1Ch
(2) the number of clock count to cover the manufacture ID should be
31 to 38 and the last clock to clock out device ID is 46.
6. Modify the Figure 19 in page 22, the clock count to cover the device ID
should be from 15 to 31
7. Change Table 10. 100MHz AC Characteristics tCLQV from 6 ns to 8 ns
on page 25
Remove C grade option of temperature range on page 1 and page 34
2008/06/23
1. Add Eon products’ New top marking “cFeon“ information on page 1.
2. Add the description “Serial Interface Architecture “and modify active
current (typical) from 5mA to 12mA on page 2.
3. List the Note 4 for 90h command in Table 4 on page 12.
4. Update Table 6. Status Register Bit Locations on page 13.
5. Add Table 7. OTP Sector Address on page 23.
6. Add Note “ Vcc (max) is 3.6V and Vcc (min) is 2.7V “ in Table 8 on
page 24.
7. Modify ICC3 from "Q = open" to " DQ = open " in Table 9 on page 25
2008/12/18
8. Correct the typo “tCLH to tCH” 、 “tCLL to tCL”、”tHHQZ to tHHQX” in
Table 11 and Table 12 on page 26 and 27.
9. Modify Storage Temperature from "-65 to + 125" to "-65 to +150"
on page 29
10.Delete Latch up Characteristics Table from version C.
11.Modify official name from 209mil to 208mil and delete dimension " c "
in Figure 26 on page 31.
12. Modify Figure 28. VDFN8 ( 5x6mm ) dimension A from 0.80 to 0.75
on page 32.
E
F
G
H
1. Update Page program, Sector erase and Block erase time parameter
on page2, 26 and 27.
2. Modify Icc4, Icc5, Icc6 and Icc7 on page 25.
1 Modify Chip erase time (typical) from 18 s to 7s on page 2 and 25
2. Change OTP security sector from 512 byte to 128 byte and update
table 7 on page 2 and 22.
3. Remove the Protected Area Sizes definition of BP2、BP1 and BP0 =
001 to 110 in table 3 on page 9.
4. Remove 16 pin SOP 300mil package information from version E
5. Remove speed 75MHz information from version E.
6. Update the VDFN package (D2 from 4.23mm to 3.4mm) on page 30
and 32.
1. Add the SOP 8pin 150mil package information on page 2, 29 and 33.
2. Update the Protected Area Sizes definition of BP2、BP1 and BP0 =
001 to 110 in table 3 on page 9.
3. Remove the Block Erase “52h” command on page 10, 17 and 18.
1. Add the description of OTP erase command on page 10 and page 23.
2. Modify Table 9. DC Characteristics ICC1 (Standby) and ICC2 (Deep
2009/01/20
2009/03/16
2009/04/02
2009/10/21
Power-down) Current from 5µA to 20µA on page 25.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
35
©2004 Eon Silicon Solution, Inc.,
Rev. H, Issue Date: 2009/10/21
www.eonssi.com