Technical - CTS Corp.

Series UP3 Series for TO- 66 Outline
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
UP3 Series for TO-66 Outline
Natural Conv. (°C/W): 13.6
Forced Air (°C/W): 3.9
Mounting Envelope: 1.50" x 1.38" x .44"
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
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•
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Thermal Resistance Case to Sink is 0.6-0.7 °C/W w/Joint Compound.
Derate 0.8 °C/watt for unplated part in natural convection only.
Derate 0.8 °C/watt for Insulube® part in natural convection only.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Ordering Information
Unplated
UP3-T066-U
CTS IERC PART NO.
Comm'l. Black
Mil. Black
Anodize
Anodize
UP3-T066-CB
UP3-T066-B
Semiconductor
Accommodated
T0-66
Hole patt.
ref. no.
Max. Weight
(Grams)
14
10.5
HOLE PATTERNS
14. Hole pattern no. 138 accommodates T0-66s. Available in
UP3 series heat dissipators only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502
Tel: (818) 842-7277
Fax: (818) 848-8872
Rev. 03-01-03