Low Inductance Chip Capacitors

Low Inductance Chip Capacitors
InterDigitated Capacitor (IDC)
GENERAL DESCRIPTION
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AVX’s interdigitated capacitor is a very low inductance, surface mount capacitor. A measured inductance of 175pH
makes this the lowest, FR4 mountable device in the industry. With the high speed microprocessors approaching
500MHz, and beyond, the need for low inductance, decoupling caps becomes critical. Also, by connecting the device
with eight (8) vias to the power and ground planes, the
inductance of the entire system can be lowered. This allows
engineers to speed up board interconnect for the current,
and next generation, of microprocessors.
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HOW TO ORDER
W
3
Style
L
1
Case
Low
Number
Size Inductance of Caps
Y
C
105
M
Voltage
6=6.3V
Z=10V
Y=16V
Dielectric
C=X7R
Capacitance
Code
Tolerance
M=±20%
A
T
3
A
Terminations Packaging
Special
T= Plated Ni
Code
A=Standard
and Solder
(Reel Size) F=1,000 Per
1=7" Reel
Reel Only
Embossed Tape
3=13" Reel
Embossed Tape
Impedance Characteristics of 1µF - X7R
IDC
Feedthru
0612
1206
Measured
Inductance (pH)
175
375
550
1200
30
10
Impedance
Package Style
IDC
3
Feedthru
1
1206
0612
0.3
0.1
Capacitance (µF) .047 0.1 0.22 0.47 0.68 1.0 2.2
X7R
16V
10V
6.3V
0.03
0.01
0.1
1
10
Frequency (MHz)
100
1000
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
X7R
±20%
Dissipation Factor
For 16 volts: 3.5% max.
For 10 volts: 5% max.
For 6.3 volts: 6.5% max.
Insulation Resistance
(+25°C,VDC)
100,000MΩ min. or
1,000MΩ-µF min.,
whichever is less
ESR and Impedance, Ohms
Typical Impedance and ESR - 2.2µF - ESR
1
0.1
0.01
0.001
.1
1
10
100
1000
Frequency, MHz
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Low Inductance Chip Capacitors
InterDigitated Capacitor (IDC)
PHYSICAL DIMENSIONS AND PAD LAYOUT
L
X
X
P
S
S
T
E
D
BW
C/L OF CHIP
C
L
A
B
C
BL
W
PART DIMENSIONS
L
W
T
PAD LAYOUT DIMENSIONS
millimeters (inches)
BW
3.20±0.2
1.60±0.2
1.22 MAX 0.41±0.1
(.126±.008) (.063±.008) (.048 MAX) (.016±.004)
BL
P
X
S
0.18 +0.25
0.76 REF
1.14±0.1
0.38±0.1
-0.08
(.007 +.010
) (.030 REF) (.045±.004) (.015±.004)
-.003
A
B
C
D
0.89 1.65 2.54 0.46
(.035) (.065) (.100) (.018)
E
0.79
(.030)
ASSEMBLY NOTES
AVX recommends a minimum spacing of 0.020" between parts when placing them end to end on assembly boards. The purpose of this spacing is to facilitate post assembly board cleaning and inaccuracies in pick and placement, due to machine
placement tolerances.
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