DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Future Technology Devices International Ltd. DS_FT312D (USB Android Host IC) The FT312D is a USB 2.0 Full Speed host IC specifically targeted at providing access to peripheral hardware from an Android platform with a USB device port. The device will bridge the USB port to a UART interface via the Android Open Accessory protocol and has the following advanced features: Single chip USB to UART interface. 12MHz oscillator using external crystal. Entire USB protocol handled on the chip. No USB specific firmware programming required. Integrated power-on-reset circuit. +3V3Single Supply Operation with 5V tolerant inputs. USB 2.0 Full Speed compatible. Extended operating temperature range; -40⁰C to 85⁰C. Available in compact Pb-free 32 Pin LQFP and QFN packages (both RoHS compliant). Supports USB bulk transfer mode Basic UART interface with RXD, TXD, RTS#, CTS# pins. TX_ACTIVE signal for controlling transceivers on RS485 interfaces. UART RX buffer size is 5512 bytes UART TX buffer size is 256 bytes USB_ERROR indicator pin Suitable for use on any Android platform supporting Android Open Accessory Mode (Typically 3.1 onwards, however some platforms may port Open Accessory Mode to version 2.3.4) Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH United Kingdom. Scotland Registered Company Number: SC136640 Copyright © 2013 Future Technology Devices International Limited 1 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 1 Typical Applications Connecting Android phones to USB accessories Home automation via Android devices Connecting Android tablets to USB accessories Data logging from USB accessories Controlling instrumentation from Android devices. Connecting serial printing devices to Android devices 1.1 Part Numbers Part Number Package FT312D-32Q1C-x 32 Pin QFN FT312D-32L1C-x 32 Pin LQFP Note: Packing codes for x is: - R: Taped and Reel, QFN 3,000pcs per reel, LQFP 1500 pcs per reel. - (no suffix): Tray packing, 260pcs per tray QFN, 250 pcs per tray LQFP For example: FT312D-32Q1C-R is 3,000pcs QFN taped and reel packing 1.2 USB Compliant At the time of writing this datasheet, the FT312Dhad not completed the USB Compliancy Test. Copyright © 2013 Future Technology Devices International Limited 2 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 2 FT312D Block Diagram USB_ERROR# TXD RXD USBDP USBDM USB Transceiver RTS# USB Host Buffer UART CTS# TX_ACTIVE Figure 2.1FT312D Block Diagram For a description of the function please refer to Section 4. Copyright © 2013 Future Technology Devices International Limited 3 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Table of Contents 1 Typical Applications ...................................................................... 2 1.1 Part Numbers ..................................................................................... 2 1.2 USB Compliant .................................................................................... 2 2 FT312D Block Diagram ................................................................. 3 3 Device Pin Out and Signal Description .......................................... 6 3.1 Package Symbol.................................................................................. 6 3.1.1 4 Package PinOut Description ........................................................................................... 6 Function Description..................................................................... 8 4.1 Key Features ....................................................................................... 8 4.2 Functional Block Descriptions ............................................................. 8 4.2.1 UART Interface Module ................................................................................................. 8 4.2.2 Buffers ....................................................................................................................... 8 4.2.3 USB Host .................................................................................................................... 8 4.2.4 USB Transceivers ......................................................................................................... 8 4.3 Default Descriptor Strings .................................................................. 8 5 UART Interface ........................................................................... 10 6 USB Error Detection.................................................................... 12 7 Absolute Maximum Ratings ........................................................ 13 7.1 DC Characteristics .............................................................................14 7.2 ESD and Latch-up Specifications ........................................................15 8 Application Examples ................................................................. 16 8.1 USB to UARTConverter .......................................................................16 8.2 USB to RS232 Converter ....................................................................17 9 Package Parameters ................................................................... 18 9.1 FT312D Package Markings .................................................................18 9.1.1 QFN-32 .................................................................................................................... 18 9.1.2 LQFP-32 ................................................................................................................... 19 9.2 9.2.1 QFN-32 Package Dimensions ....................................................................................... 20 9.2.2 LQFP-32 Package Dimensions ...................................................................................... 21 9.3 10 FT312DPackage Dimensions ..............................................................20 Solder Reflow Profile .........................................................................22 Contact Information ................................................................... 24 Appendix A – References ............................................................................25 Appendix B - List of Figures and Tables ......................................................26 Appendix C - Revision History.....................................................................27 Copyright © 2013 Future Technology Devices International Limited 4 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Copyright © 2013 Future Technology Devices International Limited 5 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 3 Device Pin Out and Signal Description 9 10 11 8 7 6 5 4 3 2 1 33 32 NC NC USB_ERROR# GND 31 26 25 RTS# 24 CTS# GND VCCIO TX_ACTIVE TXD RXD 30 23 29 22 28 21 XTOUT XTIN AVCC VCC GND FT312D QFN 32 27 20 12 TEST1 VREGOUT GND USBDP USBDM GND NC NC VCCIO 19 NC TEST0 RESET# TEST2 17 18 13 14 15 GND GND VCCIO GND 16 3.1 Package Symbol Figure 3.1QFN Schematic Symbol NOTE: The pinout is the same for the QFN and LQFP packages. NOTE: Pin 33 on the symbol is the copper pad in the centre of the QFN package 3.1.1 Package PinOut Description Note: # denotes an active low signal. Pin No. Name Type 2 VCC POWER Input 3 AVCC 13, 22, 28 VCCIO 7 VREGOUT 1,6,14,15,16,19,27 GND POWER Input POWER Input POWER Output POWER Input Description 3V3 supply to IC internal 1V8 regulator 1V8 supply to IC core 3V3 supply for the IO cells 1V8 output. May be used as input source for pin 3. 0V Ground input. Table 3.1 Power and Ground Copyright © 2013 Future Technology Devices International Limited 6 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Pin No. Name Type Description 4 XTIN INPUT 5 XTOUT OUTPUT 8 TEST1 INPUT For internal use. Pull to GND 9 TEST2 INPUT For factory use. Pull to 3V3. 10 RESET# INPUT Reset input (active low). 11 TEST0 OUTPUT 12 NC - 17 USBDP INPUT/OUTPUT USB Data Signal Plus. 18 USBDM INPUT/OUTPUT USB Data Signal Minus. 20 NC - No connect pins. Leave unterminated. 21 NC - No connect pins. Leave unterminated. 23 TXD OUTPUT 24 RXD INPUT 25 RTS# OUTPUT 26 CTS# INPUT 29 TX_ACTIVE OUTPUT 30 NC - No connect pins. Leave un-terminated 31 NC - No connect pins. Leave un-terminated 32 USB_ERROR# OUTPUT Input to 12MHz Oscillator Cell. Connect 12MHz crystal across pins 4 and 5. Output from 12MHz Oscillator Cell. Connect 12MHz crystal across pins 4 and 5. Leave unterminated. No connect pins. Leave unterminated. Transmit asynchronous data output Receive asynchronous data input Request to send control output Clear to send control input UART active signal (typically used with RS485) Output signal to indicate a problem with the USB connection Table 3.2 Function pins Copyright © 2013 Future Technology Devices International Limited 7 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 4 Function Description The FT312D is FTDI’s second dedicated Android Open Accessory Mode integrated circuit device or Android Host. The FT312D USB host port is dedicated to support of the Android Open Accessory class and will bridge data between this port and the UART interface. 4.1 Key Features Easy to use Android Open Accessory IC translating the Device port of the Android device into UART capabilities 4.2 Functional Block Descriptions The following paragraphs describe each function within FT312D. Please refer to the block diagram shown inFigure 2.1. 4.2.1 UART Interface Module The FT312DUART module controls the UART interface providing basic RXD, TXD signalling with RTS#/CTS# hardware flow control. An additional TX_Active signal is supplied to control external RS485 transceivers for users wishing to create a USB to RS485 bridge. The UART supports baud rates from 300 baud to 921600 baud. A full description of the UART module is provided in Section 5. 4.2.2 Buffers The FT312D provides internal buffering between the USB port and the UART port of the IC for smooth data streaming. The Android device can send NAK’s to the USB OUT token sent from the FT312D. This can happen when the UART application on the Android is running in the background or multiple applications are launched in the Android device. When the UART application on the Android device is not accepting data, the data will be buffered in the UART RX buffer in FT312D. The UART RX buffer size is 5512 bytes. The UART_TX buffer which stores data from the USB port, heading for the UART is 256 bytes. 4.2.3 USB Host The USB Host block handles the parallel-to-serial and serial-to-parallel conversion of the USB physical layer. This includes bit stuffing, CRC generation. 4.2.4 USB Transceivers USB transceiver cells provide the physical USB device interface supporting USB 1.1 and USB 2.0 standards. Low-speed and full-speed USB data rates are supported. The output driver provides 3V3 level slew rate control signalling, whilst a differential receiver and two single ended receivers provide USB DATA IN, SE0 and USB Reset condition detection. These cells also include integrated internal pull-down resistors as required for host mode. 4.3 Default Descriptor Strings When the USB port is connected to the Android USB port, the Android platform will determine which application to load based on the strings read from the FT312D. These strings are configurable with a Windows utility: FT312D_Cofiguration available for download from the FTDI website. http://www.ftdichip.com Please refer to the application note AN_236 User Guide for FT312D Configuration to change the default string values. Copyright © 2013 Future Technology Devices International Limited 8 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Default values for the strings are set in the device as per Table 4.1 Descriptor String Default Value Manufacturer FTDI Model Android Accessory FT312D Version 1.0 Serial FTDI FT312D URL http://www.ftdichip.com/Android.htm Description FTDI Android Accessory FT312D Table 4.1Default Descriptor Strings Copyright © 2013 Future Technology Devices International Limited 9 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 5 UART Interface The interface implements a standard asynchronous serial UART port with flow control, for example RS232/422/485. The UART can support baud rates from 300 to 921600 with RTS/CTS flow control. The UART can support baud rates from 300 to 115200 with no flow control. Data transfer uses NRZ (Non-Return to Zero) data format consisting of 1 start bit, 7 or 8 data bits, an optional parity bit, and one or two stop bits. When transmitting the data bits, the least significant bit is transmitted first. Transmit and receive waveforms are illustrated in Figure 5-1 and Figure 5-2: Figure 5-1 UART Receive Waveform Figure 5-2 UART Transmit Waveform Baud rate (default =9600 baud), flow control settings (default = None), number of data bits (default=8), parity (default is no parity) and number of stop bits (default=1) are all configurable from the Android application. Please refer to ftdichip document number FT_000532 for further details. http://www.ftdichip.com TX_ACTIVE is transmit enable, this output may be used in RS485 designs to enable the line driver for transmit mode. UART RX buffer size is 5512 bytes and UART TX buffer size is 256 bytes. Note: UART software flow control with XON/XOFF is not supported UART hardware flow control with DTR/DSR is not supported Note: The FT312D has to enumerate the Android device before receiving data from the UART device. This can be implemented by disconnecting the UART TXD signal of external UART device connected to the FT312D RXD signal until after the FT312D has established the USB link with Android device. The connection sequence should be: 1. Connect FT312D to Android and complete enumeration. 2. Connect the TXD of UART device to FT312D’s RXD then start to receive data. There are two methods to implement this function: 1.When FT312D connects to the Android device and enumeration is completed, the USB_ERROR# will become Logic 0 (default Logic 1). This signal can be used to control the TTL gate (74LVC2G241, 74LVC1G125 or others) ON/OFF such that the TXD/RXD lines are connected/disconnected. Copyright © 2013 Future Technology Devices International Limited 10 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Figure 5-3 UART RXD and TXD connection gated by Enumeration 2. If the UART device has an enable pin(active high enable) such as on the GPS module, the USB_ERROR# can also be used. The USB_ERROR# pin may be inverted with an NPN BJT then connected to the enable pin of the GPS module. Figure 5-4 Inverting Gate Control signal to enable GPS module(active high enable) Copyright © 2013 Future Technology Devices International Limited 11 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 6 USB Error Detection Pin 32 of the device is provided to indicate a problem has occurred with the USB connection. The errors are USB device not supported, USB hub not supported and USB device not responding. USB device not supported would occur if the USB port was connected to a non-Android class device port. e.g. The FT312D is not designed to host memory sticks or printers etc. USB hub not supported would be reported if FT312D is connected to a USB hub. USB device not responding would occur if the USB device connected to the FT312D host port did not respond and the enumeration failed. The signal states are as follows: Pin state Definition Logic 0 Device connected to USB and functional Logic 1 Device not connected One 50ms logic 0 pulse Device not responding. This pulse occurs at plug-in and then the signal returns to logic 1. This then repeats every second. Two 50ms logic 0 pulses Device not supported. These pulses occur at plugin and then the signal returns to logic 1. This then repeats every second. Three 50ms logic 0 pulses Hub not supported. These pulses occur at plug-in and then the signal returns to logic 1. This then repeats every second. Table 6.1 Error Detection Copyright © 2013 Future Technology Devices International Limited 12 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 7 Absolute Maximum Ratings The absolute maximum ratings for FT312D are shown in Table 7.1. These are in accordance with the Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the device. Parameter Value Unit Storage Temperature -65°C to 150°C Degrees C Floor Life (Out of Bag) At Factory Ambient ( 30°C / 60% Relative Humidity) 168 Hours (IPC/JEDEC J-STD-033A MSL Level 3 Hours Compliant)* Degrees Ambient Temperature (Power Applied) -40°C to 85°C Vcc Supply Voltage 0 to +3.63 V VCCIO 0 to +3.63 V AVCC 0 to + 1.98 V DC Input Voltage - USBDP and USBDM -0.5 to +(Vcc +0.5) V -0.5 to +5.00 V DC Input Voltage - All other Inputs -0.5 to +(Vcc +0.5) V DC Output Current - Outputs 4 mA 4 mA DC Input Voltage - High Impedance Bidirectional DC Output Current - Low Impedance Bidirectional C. Table 7.1 Absolute Maximum Ratings * If devices are stored out of the packaging beyond this time limit the devices should be baked before use. The devices should be ramped up to a temperature of 125°C and baked for up to 17 hours. Copyright © 2013 Future Technology Devices International Limited 13 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 7.1 DC Characteristics DC Characteristics (Ambient Temperature -40˚C to +125˚C) Parameter Vcc1 Vcc2 AVCC Description VCC Operating Supply Voltage VCCIO Operating Supply Voltage VCC_PLL Operating Supply Voltage Minimum Typical Maximum Units 2.97 3.3 3.63 V 2.97 3.3 3.63 V 1.62 1.8 1.98 V Operating Supply Current Icc1 25 mA 128 µA 48MHz Icc2 Operating Supply Current Conditions Normal Operation USB Suspend Table 7.2Operating Voltage and Current Parameter Description Minimum Voh Output Voltage High 2.4 Vol Output Voltage Low Vin Typical Maximum 0.4 Input Switching 1.5 Threshold Units Conditions V I source = 8mA V I sink = 8mA V Table 7.3I/O Pin Characteristics Parameter UVoh UVol UVse UCom Description I/O Pins Static Output ( High) Minimum Differential Common Mode Units Conditions V 0.3 V 0.8 2.0 V 0.8 2.5 V ( Low ) Threshold Maximum 2.8 I/O Pins Static Output Single Ended Rx Typical Copyright © 2013 Future Technology Devices International Limited 14 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Parameter Description Minimum Differential Input UVdif Sensitivity Driver Output UDrvZ Impedance Typical Maximum 0.2 Units Conditions V 3 6 9 Ohms Table 7.4USB I/O Pin (USBDP, USBDM) Characteristics Parameter Description Minimum Typical Maximum Units 1.62 1.8 1.98 V 1.62 1.8 1.98 V -40 25 125 °C -10 ±1 10 µA -10 ±1 10 µA Power supply of internal VCCK core cells and I/O to core interface VCC18IO Power supply of 1.8V OSC pad Operating junction TJ temperature Iin Input leakage current Ioz Tri-state output leakage current Conditions 1.8V power supply 1.8V power supply Iin= VCC18IO or 0V Table 7.5Crystal Oscillator 1.8 Volts DC Characteristics 7.2 ESD and Latch-up Specifications Description Specification Human Body Mode (HBM) ± 2000V Machine mode (MM) ± 200V Charged Device Mode (CDM) ± 500V Latch-up > ± 200mA Table 7.6 ESD and Latch-up Specifications Copyright © 2013 Future Technology Devices International Limited 15 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 8 Application Examples The following sections illustrate possible applications of the FT312D. 8.1 USB to UARTConverter 5V 3V3 3V3 REGULATOR 5V Power to USB VCC Ferrite Bead VCCIO 1 UART_TXD TXD RESET# 27R 2 USBDM RXD 3 UART_RXD USBDP 27R 4 RTS# 5 47pF 47pF CTS# MCU/FPGA UART_RTS# UART_CTS# SHIELD FT312D UART_TX_ACTIVE TX_ACTIVE 100nF GND GND LED AVCC 620R 3V3 GN D VREGOUT 3V3 100nF USB_ERROR + 4.7uF 100nF GND GND Figure 8.1Application Example showing USB to UART Converter The UART signals are at 3V3 level and may be used to drive directly into a FPGA or MCU with a 3V3 interface, or could be level shifted with an RS232, RS422 or RS485 transceiver. The TX_ACTIVE signal is used mostly with RS485 transceivers to enable the Transmit line drivers. The unused pins may be left unterminated. Copyright © 2013 Future Technology Devices International Limited 16 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 8.2 USB to RS232 Converter 5V 3V3 3V3 REGULATOR 5V Power to USB VCC Ferrite Bead VCCIO 1 DB9 TXD UART_TXD 3 TXD RESET# 27R 2 USBDM RXD 3 RXD UART_RXD 2 USBDP 27R 4 RTS# 5 47pF 47pF CTS# RS232 LEVEL CONVERTER UART_RTS# RTS 7 CTS UART_CTS# 8 SHIELD 10 FT312D 5 TX_ACTIVE 100nF GND SHIELD GND AVCC LED 620R 3V3 100nF 3V3 GN D VREGOUT USB_ERROR + 4.7uF 100nF GND GND Figure 8.2Application Example showing USB to RS232 Converter An example of using the FT312D as a USB to RS232 converter is illustrated in Figure 8.2. In this application, a TTL to RS232 Level Converter IC is used on the serial UART interface of the FT312D to convert the TTL levels of the FT312D to RS232 levels. This level shift can be done using line drivers from a variety of vendors e.g. Zywyn. A suitable level shifting device is the Zywyn ZT3243F which is capable of RS232 communication at up to 1000k baud. The unused pins may be left unterminated. Copyright © 2013 Future Technology Devices International Limited 17 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 9 Package Parameters FT312D is available in RoHS Compliant packages, QFN package (32QFN) and an LQFP package (32LQFP). The packages are lead (Pb) free and use a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. The mechanical drawings of the packages are shown in sections 9.2- all dimensions are in millimetres. The solder reflow profile for all packages can be viewed in Section 9.3. 9.1 FT312D Package Markings 9.1.1 QFN-32 An example of the markings on the QFN package are shown in Figure 9-1. The FTDI part number is too long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line. FTDI I XXXXXXXX FT312D-32Q 1C YYWW 32 Line 1 – FTDI Logo Line 2 – Wafer Lot Number Line 3 – FTDI Part Number Line 4 – Revision and Date Code 1 Figure 9-1QFN Package Markings 1C should be printed on line 4, then a space and then the Date Code. 1. YYWW = Date Code, where YY is year and WW is week number 2. Marking alignment should be centre justified 3. Laser Marking should be used 4. All marking dimensions should be marked proportionally. Marking font should be using Unisem standard font (Roman Simplex) Copyright © 2013 Future Technology Devices International Limited 18 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 9.1.2 LQFP-32 An example of the markings on the LQFP package are shown in Figure 9-2. FTD I XXXXXXXXXX FT312D-32L 1C YYWW 32 Line 1 – FTDI Logo Line 2 – Wafer Lot Number Line 3 – FTDI Part Number Line 4 – Revision, Date Code 1 Figure 9-2 LQFP Package Markings Notes: 1. YYWW = Date Code, where YY is year and WW is week number 2. Marking alignment should be centre justified 3. Laser Marking should be used 4. All marking dimensions should be marked proportionally. Marking font should be using Unisem standard font (Roman Simplex) Copyright © 2013 Future Technology Devices International Limited 19 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 9.2 FT312DPackage Dimensions 9.2.1 QFN-32 Package Dimensions FTDl XXXXXXXX FT312D-32Q 1C YYWW 1 1 Figure 9-3 QFN-32 Package Dimensions Note: Dimensions are in mm Note: The centre pad should be connected to the GND plane for improved thermal conduction and noise immunity. Copyright © 2013 Future Technology Devices International Limited 20 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 9.2.2 LQFP-32 Package Dimensions FTDl XXXXXXXX FT312D-32L 1C YYWW PIN #32 PIN #1 Figure 9-4LQFP-32 Package Dimensions Note: Dimensions are in mm Copyright © 2013 Future Technology Devices International Limited 21 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 9.3 Solder Reflow Profile Figure 9-5 All packages Reflow Solder Profile Copyright © 2013 Future Technology Devices International Limited 22 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Pb Free Solder Process SnPb Eutectic and Pb free (non (green material) green material) Solder Process 3°C / second Max. 3°C / Second Max. Profile Feature Average Ramp Up Rate (Ts to Tp) Preheat - Temperature Min (Ts Min.) 150°C 100°C - Temperature Max (Ts Max.) 200°C 150°C - Time (ts Min to ts Max) 60 to 120 seconds 60 to 120 seconds 217°C 183°C 60 to 150 seconds 60 to 150 seconds 260°C see Figure 9-5 30 to 40 seconds 20 to 40 seconds Ramp Down Rate 6°C / second Max. 6°C / second Max. Time for T= 25°C to Peak Temperature, Tp 8 minutes Max. 6 minutes Max. Volume mm3 < 350 Volume mm3 >=350 < 2.5 mm 235 +5/-0 deg C 220 +5/-0 deg C ≥ 2.5 mm 220 +5/-0 deg C 220 +5/-0 deg C Time Maintained Above Critical Temperature TL: - Temperature (TL) - Time (tL) Peak Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Table 9.1Reflow Profile Parameter Values SnPb Eutectic and Pb free (non green material) Package Thickness Pb Free (green material) = 260 +5/-0 deg C Table 9.2 Package Reflow Peak Temperature Copyright © 2013 Future Technology Devices International Limited 23 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 10 Contact Information Head Office – Glasgow, UK Future Technology Devices International Limited Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) [email protected] [email protected] [email protected] Branch Office – Taipei, Taiwan Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan, R.O.C. Tel: +886 (0) 2 8791 3570 Fax: +886 (0) 2 8791 3576 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) [email protected] [email protected] [email protected] Branch Office – Oregon, USA Future Technology Devices International Limited (USA) 7130 SW Fir Loop Tigard, OR 97223 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-Mail (Sales) E-Mail (Support) E-Mail (General Enquiries) [email protected] [email protected] [email protected] Branch Office – Shanghai, China Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 China Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) [email protected] [email protected] E-mail (Support) E-mail (General Enquiries) [email protected] Copyright © 2013 Future Technology Devices International Limited 24 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Appendix A – References Useful Links http://www.ftdichip.com/Support/Documents/White_Papers/WP_001_Connecting_%20Peripherals_to_an _Android_%20Platform.pdf http://www.ftdichip.com/Support/Documents/ProgramGuides/FT31XD_Android_programmer_guide(FT_0 00532).pdf Useful utilities and examples firmware http://www.ftdichip.com/Support/Utilities/FT312D_Configuration_V010000.zip http://www.ftdichip.com/Support/SoftwareExamples/Android_Projects.htm Copyright © 2013 Future Technology Devices International Limited 25 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Appendix B - List of Figures and Tables List of Figures Figure 2.1FT312D Block Diagram .................................................................................................... 3 Figure 3.1QFN Schematic Symbol ................................................................................................... 6 Figure 5-1 UART Receive Waveform .............................................................................................. 10 Figure 5-2 UART Transmit Waveform ............................................................................................ 10 Figure 5-3 UART RXD and TXD connection gated by Enumeration ..................................................... 11 Figure 5-4 Inverting Gate Control signal to enable GPS module(active high enable) ............................ 11 Figure 8.1Application Example showing USB to UART Converter ....................................................... 16 Figure 8.2Application Example showing USB to RS232 Converter ...................................................... 17 Figure 9-1QFN Package Markings .................................................................................................. 18 Figure 9-2 LQFP Package Markings ................................................................................................ 19 Figure 9-3 QFN-32 Package Dimensions ........................................................................................ 20 Figure 9-4LQFP-32 Package Dimensions ........................................................................................ 21 Figure 9-5 All packages Reflow Solder Profile ................................................................................. 22 List of Tables Table 3.1 Power and Ground .......................................................................................................... 6 Table 3.2 Function pins ................................................................................................................. 7 Table 4.1Default Descriptor Strings ................................................................................................. 9 Table 6.1 Error Detection ............................................................................................................. 12 Table 7.1 Absolute Maximum Ratings ............................................................................................ 13 Table 7.2Operating Voltage and Current ........................................................................................ 14 Table 7.3I/O Pin Characteristics .................................................................................................... 14 Table 7.4USB I/O Pin (USBDP, USBDM) Characteristics ................................................................... 15 Table 7.5Crystal Oscillator 1.8 Volts DC Characteristics ................................................................... 15 Table 7.6 ESD and Latch-up Specifications ..................................................................................... 15 Table 9.1Reflow Profile Parameter Values ...................................................................................... 23 Table 9.2 Package Reflow Peak Temperature .................................................................................. 23 Copyright © 2013 Future Technology Devices International Limited 26 DS_FT312D USB ANDROID HOST IC Datasheet Version 1.1 Document No.: FT_000816 Clearance No.: FTDI# 331 Appendix C - Revision History Document Title: USB Android Host ICDS_FT312D Document Reference No.: FT_000816 Clearance No.: FTDI# 331 Product Page: http://www.ftdichip.com/FTProducts.htm Document Feedback: Send Feedback Version 1.0 Initial Release Version 1.1 Note added on USB enumeration to be completed before Receiving data in RXD Feb2013 Nov 2013 Copyright © 2013 Future Technology Devices International Limited 27