APD0505-000 DataSheet - Skyworks Solutions, Inc.

DATA SHEET
APD Series: Silicon PIN Diode Bondable Chips
Applications
 Switches
 Attenuators
Features
 Established Skyworks PIN diode process
 Low capacitance designs to 0.05 pF
 Voltage ratings to 200 V
 Chip size < 15 mils square
 Tight control of I layer base width
 Mesa and planar chip designs
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Description
Skyworks APD series of silicon PIN diodes are designed for use as
switch and attenuator devices in high-performance RF and
microwave circuits. The PIN diode designs are useful over a wide
range of frequencies from below 100 MHz to beyond 30 GHz.
These devices use Skyworks well-established silicon technology
resulting in PIN diodes with tightly controlled I-region
characteristics.
The low capacitance and low resistance of the APD0505 through
APD1520 diodes are ideal for switch applications that require
insertion loss and fast switching speed. For switch or attenuator
applications requiring high power and low distortion, the thick Iregion and high reverse breakdown voltage of the APD2220 is
ideal.
The absolute maximum ratings of the APD diode series are
provided in Table 1. Electrical specifications are provided in
Table 2. Table 3 identifies the die part numbers with their
corresponding top contact diameters and die outline drawings.
Typical performance characteristics are provided in Figures 1
through 4.
Skyworks Solutions, Inc.  Phone [781] 376-3000 • Fax [781] 376-3100  [email protected]  www.skyworksinc.com
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DATA SHEET  APD SERIES: SILICON PIN DIODE BONDABLE CHIPS
Table 1. APD Series Absolute Maximum Ratings
Parameter
Symbol
Minimum
Typical
Maximum
Units
Power dissipation
PDIS
Maximum TJ  Case Temp
Thermal Re sis tan ce junctiontocase
W
Reverse voltage
VR
See Voltage Rating column in Table 2
V
Forward current
IF
200
mA
Operating temperature
TOP
–65
+175
C
Storage temperature
TSTG
–65
+200
C
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. APD Series Electrical Specifications (Note 1)
(TOP = +25 C, Unless Otherwise Noted)
Junction
Capacitance
(CJ)
VR = 50 V,
1 MHz
(pF)
Junction
Capacitance
(CJ)
VR = 0 V,
1 MHz
(pF)
Series
Resistance (RS),
I = 10 mA,
500 MHz
(Ω)
Minority Carrier
Lifetime (TL)
I = 10 mA
(ns)
Maximum
Typical
Maximum
Typical
APD0505-000
0.05
0.10
2.5
70
APD0510-000
0.10
0.20
1.5
90
APD0520-000
0.20
0.25
1.0
120
50
5
55
APD0805-000
0.05
0.10
2.0
100
100
8
87
APD0810-000
0.10
0.15
1.5
160
100
8
60
APD1505-000
0.06 @ 10 V
0.12
2.5
350
200
15
60
APD1510-000
0.10
0.20
2.0
300
200
15
56
APD1520-000
0.20
0.25
1.2
900
200
15
44
0.20
0.35
4.0
700
100
50
18
Parameter
I-Region
Thickness
(μm)
Thermal
Resistance
(θJC)
(C/W)
Nominal
Maximum
50
5
118
50
5
76
Voltage
Rating
(Note 2)
(V)
Switching Applications
Attenuator Applications
APD2220-000
Note 1: Performance is guaranteed only under the conditions listed in this table.
Note 2: Reverse current is specified at 10 μA maximum at the voltage rating noted. Do not exceed this voltage.
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DATA SHEET  APD SERIES: SILICON PIN DIODE BONDABLE CHIPS
Table 3. APD Series Parts
Part Number
Top Contact Diameter (±0.5 mils)
Die Drawing
APD0505-000
1.50
150-806
APD0510-000
2.30
150-801
APD0520-000
3.05
150-801
APD0805-000
2.25
150-801
APD0810-000
3.05
150-801
APD1505-000
2.75
150-806
APD1510-000
3.50
150-813
APD1520-000
5.00
150-802
8.50
149-815
Switching Applications
Attenuator Applications
APD2220-000
Skyworks Solutions, Inc.  Phone [781] 376-3000  Fax [781] 376-3100  [email protected]  www.skyworksinc.com
200075S  Skyworks Proprietary Information  Products and Product Information are Subject to Change Without Notice  September 8, 2014
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DATA SHEET  APD SERIES: SILICON PIN DIODE BONDABLE CHIPS
Typical Performance Characteristics at 25 °C
1000
1000
APD2220-000
100
Resistance (Ω)
Resistance (Ω)
100
APD0805-000
10
1
APD0505-000
10
APD0810-000
APD0510-000
1
APD1510-000
0.1
0.01
0.1
1
10
0.1
0.01
100
0.1
Forward Current (mA)
10.0
1.0
0.10
1
10
Forward Current (mA)
Figure 3. Resistance vs Forward Current @ 500 MHz
(APD1505-000 Package)
100
APD0505
APD0510
APD0520
APD0805
APD0810
APD1505
APD1510
APD1520
APD2220
180
160
140
120
100
80
60
40
Y0246
Maximum CW Input Power (W)
200
100.0
20
0
25
50
75
100
125
150
175
Case Temperature (°C)
Figure 4. Maximum CW Input Power vs Case Temperature
(-000 Package)
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100
Figure 2. Resistance vs Forward Current @ 1 GHz
1000.0
Resistance (Ω)
10
Forward Current (mA)
Figure 1. Resistance vs Forward Current @ 1 GHz
0.1
0.01
1
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DATA SHEET  APD SERIES: SILICON PIN DIODE BONDABLE CHIPS
Package Outline Drawings
Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods
and Packaging (document #200532).
Package outline die drawings for the APD diode series are shown
in Figures 5 and 6. Additional bonding and handling methods are
contained in the Skyworks Application Notes, Waffle Pack Chip
Carrier Handling/Opening Procedure (document #200146) and
Die Packages
Schematic
1
Anode
Top Contact, Gold
0.002 (0.051 mm)
Diameter Minimum
[0.008 (0.203 mm) Diameter
for the APD2220-000]
2
0.014 ± 0.001
(0.356 ± 0.025 mm)
0.014 ± 0.001
(0.356 ± 0.025 mm)
0.004 (0.10 mm)
0.006 (0.15 mm) Nominal
1
Cathode Metallized Back
Contact, Gold
2
S1565a
Figure 5. 149-815 Package
Schematic
Anode
Metallized
Gold Dot
0.010 (0.254 mm) Min.
0.014 (0.356 mm) Max. Sq.
1
2
150-801:
0.002 (0.051 mm) Min.
[0.0015 (0.038 mm) Min.
for the APD0805-000]
150-806:
0.0011 (0.028 mm) Nom.
0.004 (0.10 mm) Min.
0.006 (0.15 mm) Max.
1
Silicon
2
Cathode Metallized Back
Contact: Gold
S1567a
Figure 6. 150 Series Package
Skyworks Solutions, Inc.  Phone [781] 376-3000  Fax [781] 376-3100  [email protected]  www.skyworksinc.com
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DATA SHEET  APD SERIES: SILICON PIN DIODE BONDABLE CHIPS
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