AS1345 18V, High Efficiency, DC-DC Step-Up Converter The AS1345 high efficiency DC-DC step-up converter contains an internal N-channel and an internal P-channel output isolation switch. General Description The device operates from a 2.9V to 5.0V supply and can boost voltages up to 18V. A hysteretic control scheme is used to provide the highest operating efficiency over a wide range of input and output load conditions. The internal MOSFET switches reduce the external component count and a high switching frequency allows the use of tiny surface mount components. The AS1345 employ a factory set current limit to reduce ripple and external component size in low output current applications. With a 500mA current limit the AS1345 is capable of providing 20mA @ 18V output. Figure 1: Available Products Devices Peak Coil Current Output AS1345A 100mA adjustable or fixed AS1345B 200mA adjustable or fixed AS1345C 350mA adjustable or fixed AS1345D 500mA adjustable or fixed For order related information, please refer to “Ordering & Contact Information” on page 26. Built-in safety features protect the internal switches and output components from fault conditions. Additional power-saving attributes include a very low quiescent current and a true shutdown mode. For further understanding in regards to the contents of the datasheet, please refer to the Reference Guide located at the end of the document. ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 1 General Description Key Benefits & Features The benefits and features of AS1345, 18V, High Efficiency, DC-DC Step-Up Converter are listed below: Figure 2: Added Value of Using AS1345 Benefits Features Supports Lithium primary and re-chargeable batteries Input Voltage Range: 2.9V to 5.0V Supports a variety of end applications Adjustable Output Voltage Range: 5.0V to 18V Supports a variety of end applications Output Current up to 40mA Allows optimization of circuit depending on output power demands Inductor Peak Currents: 100, 200, 350 and 500 mA Battery life improved 90% Efficiency Battery supply isolated during shutdown True Shutdown Fault tolerant Short Circuit and Thermal Protection Small chipscale package Packages: • 8-pin (2x2mm) TDFN • 8-bumps (1.570mm x 0.895mm) WL-CSP with 0.4mm pitch Applications The AS1345 is ideal for: • Small and low current demand LCD panels as well as for polymer LEDs (OLED) • Cell phones, PDAs • Readers • Mobile terminals • 3D shutter glasses. AS1345 – 2 ams Datasheet, Confidential: 2013-Nov [1-51] General Description Block Diagram The functional blocks of this device for reference are shown below: Figure 3: AS1345 Block Diagram Fixed Output Voltage VDD = 2.9V to 5.0V SWIN SWOUT 10uF Die Temperature Monitor EN AS1345 10uF 10uH D1 LX Vout = 5.0V to 18V 1uF to 10uF VDD FB ILIM VDD + + 100k - POK POK - Driver & Control Logic - + + + + 1.125V 1.25V GND Adjustable Output Voltage VDD = 2.9V to 5.0V SWIN SWOUT 10uF Die Temperature Monitor EN AS1345 10uF 10uH D1 LX R2 Vout = 5.0V to 18V 47pF 1uF to 10uF VDD FB ILIM + VDD R3 + 100k POK - + + 1.25V ams Datasheet, Confidential: 2013-Nov [1-51] POK + 1.125V + Driver & Control Logic GND AS1345 – 3 Pin Assignments Pin Assignments Figure 4: Pin Assignments (Top View) Pin A1 indicator VDD 1 8 GND EN 2 7 LX FB 3 6 SWOUT POK 4 5 SWIN AS1345 TDFN 8-pin 2x2mm B1 GND A1 VDD B2 LX A2 EN B3 SWOUT A3 FB B4 SWIN A4 POK Figure 5: Pin Descriptions Pin Number TDFN WLP 1 A1 2 A2 Pin Name Description VDD Supply Voltage. Connect to a 2.9V to 5.0V input supply. Bypass this pin with a 10μF capacitor. EN Enable Pin. Logic controlled shutdown input, 1.8V CMOS compatible; 1 = Normal operation 0 = Shutdown On request a 100kΩ pull-down resistor can be enabled (factory set). Feedback Pin. Feedback input to the gm error amplifier. For an adjustable output voltage connect a resistor divider to this pin. The output can be adjusted from 5.0V to 18V by: VOUT = VREF x (1 + R2/R3) If the fixed output voltage version is used, connect this pin to VOUT. 3 A3 FB 4 A4 POK POK. Open Drain Output. POK remains low while VOUT is less than 90% of nominal VOUT. Connect a 100kΩ pull-up resistor from this pin to VDD. 5 B4 SWIN Shutdown Disconnect Switch In. Input pin of the internal P-channel MOSFET. AS1345 – 4 ams Datasheet, Confidential: 2013-Nov [1-51] Pi n A s s i g n m e n t s Pin Number Pin Name TDFN Description WLP 6 B3 SWOUT 7 B2 LX 8 B1 GND Shutdown Disconnect Switch Out. Output pin of the internal P-channel MOSFET. Connect to power inductor and decouple to GND with a 10μF low ESR ceramic capacitor. When the input disconnect feature is not desired, SWOUT should be connected to SWIN and VDD. Inductor. The drain of the internal N-channel MOSFET. Connect to power inductor and to anode of a schottky diode. Ground ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 5 Absolute Maximum Ratings Stresses beyond those listed in the table below may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in “Electrical Characteristics” on page 7 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Figure 6: Absolute Maximum Ratings Parameter Min Max Unit Comments Electrical Parameters VDD, SWIN, SWOUT to GND -0.3 7 V LX, FB to GND -0.3 20 V Input Current (latch-up immunity) -100 100 mA 1 A SWIN to SWOUT Current Limit Norm: JEDEC 78 Electrostatic Discharge Electrostatic Discharge HBM ±2 kV Norm: MIL 883 E method 3015 Temperature Ranges and Storage Conditions Junction temperature +110 ºC -55 +125 ºC for WL-CSP -55 +150 ºC for TDFN Storage temperature range Package thermal data Package body temperature WL-CSP 60 TDFN 97 ºC/W WL-CSP Norm IPC/JEDEC J-STD-020 +260 ºC TDFN Humidity non-condensing Junction-to-ambient thermal resistance is very dependent on application and board-layout. In situations where high maximum power dissipation exists, special attention must be paid to thermal dissipation during board design. Norm IPC/JEDEC J-STD-020 5 85 % 1 Represents a maximum floor life time of 168h for TDFN 1 Represents a maximum floor life time of unlimited for WL-CSP Moisture sensitive level Note: The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020“Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. AS1345 – 6 ams Datasheet, Confidential: 2013-Nov [1-51] Electrical Characteristics Electrical Characteristics All limits are guaranteed. The parameters with Min and Max values are guaranteed by production tests or SQC (Statistical Quality Control) methods. Figure 7: VDD = VSHDNN = VSWIN = 3.7V, VOUT = 15V, CIN = COUT = 10μF, typical values @ TAMB = +25ºC (unless otherwise specified) Symbol Parameter Conditions Min Typ Max Units TAMB Operating temperature range -40 +85 °C TJ Operating junction temperature range -40 +110 °C 2.9 5.0 V Input VDD VUVLO Supply voltage range SWIN connected to VDD Minimum startup voltage VDD = SWIN 2.7 V VDD undervoltage lockout VDD decreasing (50mV Hysteresis) 2.7 V Regulation VOUT Adjustable output voltage range External FB divider 5 18 V Feedback voltage tolerance Tolerance of FB resistors not included -3 +3 % 12 Fixed output voltage Internal FB divider 15 V 17 VFB Feedback voltage 1.25 V For adjustable VOUT only Feedback input current η 10 1000 nA Line regulation VDD = 3.5V to 3.7V 200 mV Load regulation VOUT = 15V, ILOAD = 0mA to 5mA 50 mV Efficiency L = 22μH, VDD = VSWIN = 3.7V, VOUT = 15V, ILOAD = 10mA 90 % ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 7 Electrical Characteristics Symbol Parameter Conditions Min Typ Max Units Operating Current Shutdown current @ VDD 1 VSHDNN = 0V ISHDN μA Shutdown current @ SWIN 1 IQ Quiescent current No switching, VFB = 1.5V 25 μA IDDLOAD Load current VOUT = 15V, ILOAD = 5mA 25 mA AS1345A 100 mA AS1345B 200 mA AS1345C 350 mA AS1345D 500 mA ILIMIT Coil peak current limit Switches RNMOS NMOS resistance 0.3 Ω RPMOS PMOS resistance 0.15 Ω POK Output POK output voltage ‘low’ POK sinking 1mA 0.01 POK output voltage ‘high’ POK leakage 1μA POK output high leakage current POK = 3.7V POK threshold Rising edge, referenced to VOUT(NOM) VDD 0.2 V VDD - 0.1 V 1 μA 90 % Shutdown VSHDNH SHDN input ‘high’ 1.26 V 2.9V < VDD < 5.0V, no load VSHDNL SHDN input ‘low’ ISHDN SHDN input current -1 0.55 V +1 μA Soft Start IPRE Pre-charge current 100 mA Thermal shutdown 150 °C Thermal shutdown hysteresis 10 °C Thermal Shutdown AS1345 – 8 ams Datasheet, Confidential: 2013-Nov [1-51] Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Typical Operating Characteristics V OUT = 15V Figure 8: Efficiency vs. IOUT; VIN = 2.7V, ILIMIT = 100mA 100 90 Efficiency (%) 80 70 60 50 40 30 - 40°C 20 + 25°C 10 + 85°C 0 0.1 1 10 100 Output Current (mA) Figure 9: Efficiency vs. IOUT; VIN = 2.7V, ILIMIT = 500mA 100 90 Efficiency (%) 80 70 60 50 40 30 - 40°C 20 + 25°C 10 + 85°C 0 0.1 1 10 100 Output Current (mA) ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 9 Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 10: Efficiency vs. IOUT; VIN = 4.5V, ILIMIT = 100mA 100 90 Efficiency (%) 80 70 60 50 40 30 - 40°C 20 + 25°C 10 + 85°C 0 0.1 1 10 100 Output Current (mA) Figure 11: Efficiency vs. IOUT; VIN = 4.5V, ILIMIT = 500mA 100 90 Efficiency (%) 80 70 60 50 40 30 - 40°C 20 + 25°C 10 + 85°C 0 0.1 1 10 100 Output Current (mA) AS1345 – 10 ams Datasheet, Confidential: 2013-Nov [1-51] Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 12: Efficiency vs. VIN; ILOAD = 5mA, ILIMIT = 100mA 100 90 Efficiency (%) 80 70 60 50 40 30 20 10 0 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 Input Voltage (V) Figure 13: Efficiency vs. VIN; ILOAD = 5mA/20mA, ILIMIT = 500mA 100 90 Efficiency (%) 80 70 60 50 40 30 20 Iout = 5mA 10 Iout = 20mA 0 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 Input Voltage (V) ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 11 Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 14: VOUT vs. IOUT; VIN = 2.7V, ILIMIT = 100mA 20 19 Output Voltage (V) 18 17 16 15 14 - 40°C 13 + 25°C 12 + 85°C 11 10 0 2 4 6 8 10 12 14 16 18 Output Current (mA) Figure 15: VOUT vs. IOUT; VIN = 4.5V, ILIMIT = 100mA 20 19 Output Voltage (V) 18 17 16 15 14 13 - 40°C 12 + 25°C 11 + 85°C 10 0 2 4 6 8 10 12 14 16 18 20 Output Current (mA) AS1345 – 12 ams Datasheet, Confidential: 2013-Nov [1-51] Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 16: VOUT vs. IOUT; VIN = 4.5V, ILIMIT = 500mA 20 19 Output Voltage (V) 18 17 16 15 14 13 - 40°C 12 + 25°C 11 + 85°C 10 0 5 10 15 20 25 30 35 40 Output Current (mA) ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 13 Detailed Description The AS1345 is a compact step-up DC-DC converters that operates from a 2.9V to 5.0V supply. Consuming only 25μA of Quiescent current. These devices include an internal MOSFET switch with a low on-resistance. A true shutdown feature disconnects the battery from the load and reduces the supply current to 0.05μA (typ). These DC-DC converters are available with either a fixed output or are adjustable up to 18V. Four current-limit options are available: 100mA, 200mA, 350mA and 500mA. Detailed Description Figure 17: Typical Application Diagram 10uF 10uH to 22uH SWIN VDD = 2.9V to 5.0V SWOUT VDD 10uF 100k ON POK EN LX AS1345 FB Vout = 5.0V to 18V 47pF R2 1uF to 10uF R3 GND OFF Modes of Operation The AS1345 features an advanced current-limited control scheme operating in hysteretic mode. An internal P-channel MOSFET switch connects VDD to SWIN to provide power to the inductor when the converter is operating. When the converter is shut down, this switch disconnects the input supply from the inductor (see Figure 17). To boost the output voltage an N-channel MOSFET switch turns on and allows current to ramp up in the inductor. Once this current reaches the current limit, the switch turns off and the inductor current flows through D1 to supply the output. The switching frequency varies depending on the load and input voltage and can be up to 10kHz. AS1345 – 14 ams Datasheet, Confidential: 2013-Nov [1-51] Detailed Description Shutdown Drive EN low to enter shutdown mode. During shutdown the supply current drops to 0.05μA (typ), the output is dis-connected from the input, and LX enters a high impedance state. The capacitance and load at the output set the rate at which V OUT decays. EN can be pulled as high as 6V regardless of the input and output voltages. With a typical step-up converter circuit, the output remains connected to the input through the inductor and output rectifier, holding the output voltage to one diode drop below V DD when the converter is shutdown and allowing the output to draw power from the input. The AS1345 features a True-Shutdown mode, disconnecting the output from the input with an internal P-channel MOSFET switch when shut down. This eliminates power draw from the input during shutdown mode. Start-up and Inrush Limiting If the ENABLE pin is high, the AS1345 uses a multi-stage start-up sequence. With increasing supply voltage, first the power-on circuitry becomes active and some internal blocks are initiated. If the supply exceeds the under-voltage-lockout threshold (2.7V typ), the pre-charge-phase is initiated. The capacitor at the SWOUT pin is charged to V IN, and the capacitor at V OUT is charged to V IN-VSD. During this phase the current is limited to 100mA typical. After the completion of the pre-charge-phase, the AS1345 enters into switching mode. Here the specified current-limit IPEAK is used. The circuit operates at maximum frequency until the desired V OUT is reached. Then AS1345 switches to normal hysteretic operation mode. If the load current is too high (>50mA) during the start-up-phase, the attainment of normal operation mode might be delayed or not done at all. Adjustable Output Voltage The output voltage of the AS1345 is adjustable from 5.0V to 18V by using a resistor voltage-divider (see Figure 18 and Figure 19). Select R1 from 10kΩ to 600kΩ and calculate R2 with the following equation: V OUT = V REF (1 + R 2/R 3) (EQ1) Where: V REF = 1.25V V OUT can range from 5.0V to 18V For best accuracy, ensure that the bias current through the feedback resistors is at least 2μA. The AS1345 can also be used with a fixed output voltage. When using one of these parts, connect FB directly to the output (see Figure 20 and Figure 21). ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 15 Detailed Description For improved regulation speed and lower ripple C3 should be applied. For best ripple performance always the adjustable variant of the AS1345 together with C3 should be used. Other measures to reduce the ripple could be to select a low peak current I PEAK and increase C4 and to decrease the value of L. Figure 18: AS1345 with Adjustable Output Voltage, with Output Disconnect 10uF 10uH to 22uH SWIN VDD = 2.9V to 5.0V SWOUT VDD 10uF 100k ON LX AS1345 POK EN FB Vout = 5.0V to 18V 47pF R2 1uF to 10uF R3 GND OFF Figure 19: AS1345 with Adjustable Output Voltage, without Output Disconnect 10uH to 22uH SWIN VDD = 2.9V to 5.0V SWOUT VDD 10uF 100k ON POK EN LX AS1345 FB GND Vout = 5.0V to 18V 47pF R2 1uF to 10uF R3 OFF AS1345 – 16 ams Datasheet, Confidential: 2013-Nov [1-51] Detailed Description Figure 20: AS1345 with Fixed Output Voltage, with Output Disconnect 10uF 10uH to 22uH SWIN VDD = 2.9V to 5.0V SWOUT VDD 10uF 100k ON LX AS1345 POK EN FB Vout = 5.0V to 18V 1uF to 10uF GND OFF Figure 21: AS1345 with Fixed Output Voltage, without Output Disconnect 10uH to 22uH SWIN VDD = 2.9V to 5.0V SWOUT VDD 10uF 100k ON POK LX AS1345 EN FB Vout = 5.0V to 18V 1uF to 10uF GND OFF ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 17 Detailed Description Power OK Operation If desired the POK functionality can be used. In this case a resistor R1 (~100k) has to be applied between the POK pin and VIN, because the POK output is an open drain type. If the POK functionality is not used the pin should be unconnected. During shut-down the POK pin is high impedance to save current. Therefore it shows VIN if connected to VIN with a resistor or is floating otherwise. During start-up the POK goes to LOW. During normal operation it is usually HIGH but it goes to LOW if for some reason VOUT drops below 90% of the nominal output voltage. Thermal Shutdown To prevent the AS1345 from short-term misuse and overload conditions the chip includes a thermal overload protection. To block the normal operation mode all switches will be turned off. The device is in thermal shutdown when the junction temperature exceeds 150°C typ. To resume the normal operation the temperature has to drop below 140°C typ. A good thermal path should be provided to dissipate the heat generated within the package, especially at higher output power. To dissipate as much heat as possible from the package into a copper plane with as much area as possible, it’s recommended to use multiple vias in the printed circuit board. Continuing operation in thermal overload conditions may damage the device, and therefore, is considered a bad practice. AS1345 – 18 ams Datasheet, Confidential: 2013-Nov [1-51] Detailed Description Inductor Selection For best efficiency, choose an inductor with high frequency core material, such as ferrite, to reduce core losses. The inductor should have low DCR (DC resistance) to reduce the I²R losses, and must be able to handle the peak inductor current without saturating. A 10μH to 22μH inductor with greater than 500mA current rating and less than 500mΩ DCR is recommended. When smaller peak currents are selected, the inductor current specification can be reduced accordingly. Figure 22: Recommended Inductors Part Number Value Current Resistance Size (ins) ELJLA100KF 10μH 600mA 0.71Ω 1210 ELJLA220KF 22μH 420mA 1.9Ω 1210 ELJPA100KF2 10μH 400mA 0.35Ω 1210 ELJPA220KF2 22μH 290mA 0.66Ω 1210 ELJPA100KF 10μH 240mA 0.5Ω 1210 ELJPA150KF 15μH 220mA 0.74Ω 1210 ELJPA220KF 22μH 185mA 1.15Ω 1210 ELJPC100MF3 10μH 140mA 0.58Ω 1008 ELJPC220MF3 22μH 100mA 1.22Ω 1008 LQH32PN100MNO 10μH 750mA 0.38Ω 1210 LQH32PN150MNO 15μH 600mA 0.57Ω 1210 LQH32PN220MNO 22μH 500mA 0.81Ω 1210 LQH3NPN100NGO 10μH 500mA 0.38Ω 1212 LQH3NPN150NGO 15μH 370mA 0.91Ω 1212 LQH3NPN220NGO 22μH 340mA 1.1Ω 1212 LQH2MCN100M52 10μH 200mA 2.27Ω 0806 LQH2MCN150M52 15μH 150mA 3.5Ω 0806 LQH2MCN220M52 22μH 130mA 5.5Ω 0806 ams Datasheet, Confidential: 2013-Nov [1-51] Supplier Panasonic www.panasonic.com Murata Manufacturing Company www.murata.com AS1345 – 19 Detailed Description Capacitor Selection The convertor requires three capacitors. Ceramic X5R or X7R types will minimize ESL and ESR while maintaining capacitance at rated voltage over temperature. The V IN capacitor should be 10μF. The V OUT capacitor should be between 1μF and 10μF. A larger output capacitor should be used if lower peak to peak output voltage ripple is desired. A larger output capacitor will also improve load regulation on V OUT. See table below for a list of capacitors for input and output capacitor selection. Figure 23: Recommended Capacitors Part Number Value Voltage TC Code Size (ins) GRM31CR71E106KA12L 10μF 25V X7 1206 GRM31CR71C106KAC7L 10μF 16V X7 1206 GRM31CR71A106KA01L 10μF 10V X7 1206 GRM21BR70J106KE76L 10μF 6.3V X7 0805 GRM31CR71E475KA88L 4.7μF 25V X7 1206 GRM21BR71C475KA73L 4.7μF 16V X7 0805 GRM188R71E105KA12D 1μF 25V X7 0603 GRM188R71C105KA12D 1μF 16V X7 0603 AS1345 – 20 Supplier Murata Manufacturing Company www.murata.com ams Datasheet, Confidential: 2013-Nov [1-51] Detailed Description Schottky Diode Selection The selection of the external diode depends on the application. If I OUT is very low most of the time, and VOUT is high, select a diode with a low reverse current for best efficiency. For lower V OUT and higher I OUT, select a diode with a lower V FORWARD and RFORWARD. Figure 24: Recommended Diodes Part Number Reverse Voltage Average Rectified Current Forward Voltage Reverse Leakage Current Package Supplier MBR0540 40V 500mA 460mV @ 500mA 1μA @ 20V SOD123 Fairchild Semiconductor www.fairchildsemi.com B140HW 40V 1000mA 460mV @ 500mA 0.35μA @ 20V SOD123 Diodes Inc www.diodes.com PMEG2010AEB 20V 1A 200mV @ 500mA 320μA @ 20V SOD523 NXP Semiconductors www.nxp.com CRS04 40V 1A 450mV @ 500mA 40μA @ 20V 3-2A1A (Toshiba) CRS06 20V 1A 325mV @ 500mA 250μA @ 20V 3-2A1A (Toshiba) ams Datasheet, Confidential: 2013-Nov [1-51] Toshiba www.toshiba-compone nts.com AS1345 – 21 Detailed Description PCB Layout Carefully printed circuit layout is important for minimizing ground bounce and noise. Keep the GND pin and ground pads for the input and output capacitors as close together as possible. Keep the connection to LX as short as possible. Locate the feedback resistors as close as possible to the FB pin and keep the feedback traces routed away from noisy areas such as LX. EMI and overall performance quality are affected by the PCB layout. The high speed operation of the AS1345 demands careful attention to board layout. Stated performance will be difficult to achieve with careless layout. Figure 25 identifies the high current paths during an operation cycle involving the switching of the N-channel and P-channel internal switches. The current paths between SWIN, VIN, C1, C2, C4, L1, D1 and GND should be short and wide for lowest intrinsic resistive loss and lowest stray inductance. A large ground pin copper area will help to lower the chip temperature. A multilayer board with a separate ground plane is ideal, but not absolutely necessary. Figure 25: AS1345 - Inductor Current Paths L1 D1 SWOUT SWIN VOUT LX AS1345 VDD VBAT PDRV C2 C1 RLOAD R2 NDRV FB FB ILIM C3 R3 GND 0V 0V Inductor Current Path NMOS-ON, D1-OFF Inductor Current Path NMOS-OFF, D1-ON Load Current Path NMOS-OFF, D1-OFF AS1345 – 22 ams Datasheet, Confidential: 2013-Nov [1-51] Pa c k a g e D r a w i n g s & M a r k i n g s Package Drawings & Markings The product is available in a 8-pin (2x2) TDFN and 8-bump (1.570mm x 0.895mm) WL-CSP package. Figure 26: 8-bump WL-CSP with 0.4mm Pitch zz XXXX Encoded Date Code Marking Code XXXX zz Note(s) and/or Footnote(s): 1. ccc Coplanarity. 2. All dimensions in μm. ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 23 Pack age Drawings & Mark ings Figure 27: 8-pin (2x2) TDFN Package zz XXX Encoded Date Code Marking Code XXX zz Note(s) and/or Footnote(s): 1. Dimensions & tolerancing conform to ASME Y14.5M-1994. 2. All dimensions are in millimeters. Angles are in degrees. 3. Coplanarity applies to the exposed heat slug as well as the terminal. 4. Radius on terminal is optional. 5. N is the total number of terminals. AS1345 – 24 ams Datasheet, Confidential: 2013-Nov [1-51] Pa c k a g e D r a w i n g s & M a r k i n g s Figure 28: Package Dimensions Symbol Min Nom Max A 0.51 0.55 0.60 A1 0.00 0.02 0.05 A3 - - 0.22 L 0.45 0.55 0.65 b 0.15 0.20 0.25 D 2.00 BSC E 2.00 BSC e 0.50 BSC aaa - 0.15 - bbb - 0.10 - ccc - 0.10 - ddd - 0.05 - eee - 0.08 - N ams Datasheet, Confidential: 2013-Nov [1-51] 8 AS1345 – 25 Ordering & Contact Information Ordering & Contact Information The device is available as the standard products listed in the table below. On request, all devices can be factory set to enable a 100kΩ pull-down resistor for the EN pin. Figure 29: Ordering Information Ordering Code Marking ILIMIT Output Description AS1345A-BWLT-AD BK 100mA adjustable AS1345A-BWLT-12 BS 12V AS1345A-BWLT-15 CA 15V 18V, High Efficiency DCDC Step-up Converter AS1345A-BWLT-17 CI 17V AS1345A-BTDT-AD BI 100mA adjustable AS1345B-BTDT-AD BJ 200mA adjustable AS1345C-BTDT-AD CD 350mA adjustable AS1345D-BTDT-AD CL 500mA adjustable AS1345D-BWLT-15 BG 500mA 15V AS1345D-BWLT-17 BH 500mA 17V Delivery Form Tape & Reel Package 8-bumps (1.570x0.895m m) WL-CSP 8-pin (2x2mm) TDFN 8-bumps (1.570x0.895m m) WL-CSP Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support For further information and requests, e-mail us at: [email protected] For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com AS1345 – 26 ams Datasheet, Confidential: 2013-Nov [1-51] RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams knowledge and belief as of the date that it is provided. ams bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams and ams suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. ams Datasheet, Confidential: 2013-Nov [1-51] AS1345 – 27 Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This Product is provided by ams “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. AS1345 – 28 ams Datasheet, Confidential: 2013-Nov [1-51] Reference Guide Reference Guide ams Datasheet, Confidential: 2013-Nov [1-51] 1 2 2 3 General Description Key Benefits & Features Applications Block Diagram 4 6 7 9 Pin Assignments Absolute Maximum Ratings Electrical Characteristics Typical Operating Characteristics 14 14 15 15 15 18 18 19 20 21 22 Detailed Description Modes of Operation Shutdown Start-up and Inrush Limiting Adjustable Output Voltage Power OK Operation Thermal Shutdown Inductor Selection Capacitor Selection Schottky Diode Selection PCB Layout 23 26 27 28 Package Drawings & Markings Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer AS1345 – 29