XI3030EU-NAYAYBF5F92734Z35-H41D-AM

XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Features
‧EMC package.
‧Top view LED
o
‧Wide viewing angle 115
‧High luminous intensity output
‧Qualification according to AEC-Q101 rev C.
‧Automotive reflow profile (IR reflow or wave soldering)
‧Pb-free
‧RoHS compliant
‧ESD protection
‧Compliance with EU REACH.
Description
The Everlight XI3030-AM series package has high efficacy, high power consumption, wide viewing angle
and a compact form factor. These features make this package an ideal LED for all automobile lighting
applications.
Applications
˙ Tail light
˙ Turning indicator light
Revision
: 1©
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2014, Everlight All Rights Reserved. Release Date: Jun.02.2015 Issue No: DSE-00013351
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Table of Contents
Product Nomenclature.......................................................................................................................................... 3
XI3030 Soldering Temperature Location on sample Board .............................................................................. 4
Absolute Maximum Ratings ................................................................................................................................. 5
PN of the XI3030-AM series: Amber LED ............................................................................................................ 6
Product Binning:Luminous Flux Bins ................................................................................................................ 7
Amber Bin Structure ............................................................................................................................................. 8
Forward Voltage Bins............................................................................................................................................ 9
Mechanical Dimension ....................................................................................................................................... 10
Wavelength Characteristics ............................................................................................................................... 11
Typical Diagram Characteristics of Radiation.................................................................................................. 14
Emitter Tape Packaging...................................................................................................................................... 15
Emitter Reel Packaging ...................................................................................................................................... 16
Precautions for Use ............................................................................................................................................ 17
Storage Conditions ............................................................................................................................................. 18
Revision History .................................................................................................................................................. 19
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:1
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XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Product Nomenclature
The product name is designated as below:
XI3030AB – CDEFGHIJ – KLMN – AM
Designation:
XI3030 = family name.
A = internal code
B = coating layer[1]
C = color[2]
DE = color bin or CCT bin
FG = min./max. luminous flux (lm) or radiation power (mW) performance
HI = min./max. forward voltage
J = operation current[3]
KLMN = internal code
AM = application
1.Table of coating layer:
Symbol
Description
U
Gold
G
Silver
2.Table of color:
Symbol
Description
NP
White, CRI<80
KP
White, CRI>80
NA
PC-Amber
UR
Red
3.Table of operation current:
Symbol
Z35
Description
350mA
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
XI3030 Soldering Temperature Location on Sample Board
TJ = Temperature of Junction
TS = Temperature of Solder Pad
TB = Temperature of MCPCB
TP = Temperature of Thermal Pad
RthJ-S = Thermal Resistance from Junction to Solder Pad
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Reverse Voltage
VR
Not designed for reverse operation
V
Max. DC Forward Current (mA)
IF
700
mA
Max. Peak Pulse Current (mA)
IPulse
1000[1]
mA
Junction Temperature
Thermal Resistance
(Junction to Soldering)
TJ
130
°C
Rth
11
°C/W
Operating Temperature
Topr
-40 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +125
℃
ESD Sensitivity
ESDHBM
8000
V
Max. Soldering Temperature
TSol
260
°C
Max. Allowable Reflow Cycles
N/A
3
cycles
Notes:
1.
Duty cycle = 1/[email protected] .
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
PN of the XI3030-AM series: LED
Order Code of XI3030
Minimum
Typical
Luminous Luminous
Flux (lm) Flux (lm)
Color Bin
Typical
Viewing
Forward
Current
Angle
Voltage (V)
(mA)
(degrees)
2θ1/2 i
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
52
68
YA-YB
2.7-3.4
350
115
Notes:
1.
2.
3.
Luminous flux measurement tolerance: ±8%.
The data of luminous flux measured at thermal pad=25℃
Typical luminous flux or light output performance is operated within the condition guided by this datasheet.
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Product Binning
Luminous Flux Bins
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
E
1
2
3
4
5
6
7
8
9
4
5
6
8
10
13
17
20
23
5
6
8
10
13
17
20
23
27
J
1
2
3
4
5
6
7
8
9
100
110
120
130
140
150
160
180
200
110
120
130
140
150
160
180
200
225
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
F
1
2
3
4
5
6
7
8
9
27
33
39
45
52
60
70
80
90
33
39
45
52
60
70
80
90
100
K
1
2
3
4
5
6
7
8
9
225
250
275
300
325
350
375
400
425
250
275
300
325
350
375
400
425
450
Notes:
1.
Luminous flux measurement tolerance: ±8%.
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DATASHEET
XI3030EG-NAYAYBF5F92734Z35-H41D-AM
Amber Bin Structure
0.44
CIE_y
0.43
YA
0.42
YB
0.41
0.40
0.39
0.54
0.55
0.56
0.57
0.58
0.59
0.60
0.61
0.62
CIE_x
Amber Bin Coordinates
Amber
Bin
YA
CIE X
0.5680
0.5634
0.5833
0.5901
CIE Y
0.4315
0.4269
0.4075
0.4094
Bin
YB
CIE X
0.5763
0.5833
0.5634
0.5557
CIE Y
0.4054
0.4075
0.4269
0.4192
Notes:
Color coordinates measurement allowance: ±0.01.
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2014, Everlight All Rights Reserved. Release Date: Jun.02.2015 Issue No: DSE-00013351
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Forward Voltage Bins
Group
Bin
2734
A
B
C
Minimum Forward
Voltage (V)
2.7
3.0
3.3
Maximum Forward
Voltage (V)
3.0
3.3
3.4
Notes:
1.
2.
Forward voltage measurement tolerance: ±0.1V.
Forward voltage bins are defined at IF=350mA operation.
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Mechanical Dimension
Notes:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.2mm.
3. The thermal pad is electrically unity from the Anode and contact pads.
4. Do not handle the device by the lens. Incorrect force applied to the lens may lead to the failure of devices.
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Wavelength Characteristics
Relative Spectral Distribution
@ Solder Pad Temperature = 25℃
Relative luminous intensity
1.0
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength (nm)
Forward Current Derating Curve
@ Junction Temperature <130℃
800
Forward Current (mA)
700
600
500
400
300
200
100
0
0
20
40
60
80
o
Soldering Pad Temperature ( C)
100
120
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Forward Voltage vs. Forward Current
@ Solder Pad Temperature = 25℃
Luminous vs. Forward Current
@ Solder Pad Temperature = 25℃
1.8
3.8
Relative Luminous Intensity
Forward Voltage(V)
3.6
3.4
3.2
3.0
2.8
2.6
2.4
0
100
200
300
400
500
600
700
Forward Current(mA)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
100
200
300
400
500
600
700
Forward Current(mA)
Chromaticity Coordinates Shift vs.
Forward Current
@ Solder Pad Temperature = 25℃
Chromaticity Coordinates
0.64
CIE-X
CIE-Y
0.60
0.56
0.52
0.48
0.44
0.40
0
100
200
300
400
500
600
700
Forward Current (mA)
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Relative Forward Voltage
@Forward Current = 350mA/700mA
350mA
700mA
0.00
-0.05
-0.10
-0.15
-0.20
20
30
40
50
60
70
80
90
100
110
120
1.2
Relative Luminous Flux
Relative Forward Voltage
0.05
Relative Luminous Flux
@Forward Current = 350mA/700mA
350mA
700mA
1.0
0.8
0.6
0.4
0.2
20
130
30
40
Junction Temperature (oC)
0.58
0.57
0.56
0.55
0.54
20
30
40
50
60
70
80
90
100
o
Junction Temperature ( C)
70
80
90
100
110
120
130
110
120
130
Chromaticity Coordinates Shift CIE-Y
@Forward Current = 350mA/700mA
0.45
Chromaticity Coordinates CIE-Y
Chromaticity Coordinates CIE-X
350mA
700mA
0.59
60
Junction Temperature (oC)
Chromaticity Coordinates Shift CIE-X
@Forward Current = 350mA/700mA
0.60
50
350mA
700mA
0.44
0.43
0.42
0.41
0.40
0.39
20
30
40
50
60
70
80
90
100
110
120
130
o
Junction Temperature ( C)
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DATASHEET
XI3030EU-NAYAYBF5F92734Z35-H41D-AM
XI3030 series: Typical Diagram Characteristics of Radiation
0
10
1.0
20
30
40
0.8
50
0.6
60
0.4
70
0.2
80
90
A
0
30
60
0.0
90
Notes:
1.
2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2.
View angle tolerance is ± 5∘.
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XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Emitter Tape Packaging
Carrier Tape Dimensions as the following:
Loaded Quantity 1000 pcs Per Reel
Notes:
1.Tolerance unless mentioned is ±0.1mm; Unit = mm
Moisture Resistant Packaging
Label
Label
Aluminum moistue-proof bag
Aluminum moisture-proof bag
Desiccant
Desiccant
Label
Label
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XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Emitter Reel Packaging
Reel Dimensions
Notes:
1.
Dimensions are in millimeters.
2.
Tolerances unless mentioned are ±0.1mm.
Product Labeling
Label Explanation
CPN: Customer Specification (when required)
P/N : Everlight Production Number
QTY: Packing Quantity
CAT: Luminous Flux (Brightness) Bin
HUE: Color Bin
REF: Forward Voltage Bin
LOT No: Lot Number
MADE IN TAIWAN: Production Place
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XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Precautions for Use
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out
will happen).
2.Storge
2.1 Before the package is opened: The LEDs should be stored at 30°C or less and 90%RH or less after being
shipped from Everlight. The storage life is 18 months. If the LEDs are to be stored for more than 18 months, they
should be stored in a sealed container with a nitrogen atmosphere and moisture absorbent material.
2.2After opening the package: The LED's should be stored under 30℃ or less and 60%RH or less. The LED
should be used within 168hrs (7days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages.
2.3Before using LEDs: The LEDs should be baked under the following conditions: pre-curing at 60±5℃ for 24
hours.
2.4Do not stack assemblies containing Everlight XI3030 LEDs to prevent damage to the optical surface of LEDs.
Forces applied to the optical surface may result in the surface being damaged.
3. Soldering Condition
3.1 Pb-free solder temperature profile
.
.x
x
a
aM
M.
c
Ce
0s
60
21
C.
x
5a
5M
2.
ec
ve
os
b0
A3
.
x
a
M
.
c
e
s
/
C
3
.
x
a
M
.
c
e
s
/
C
6
.
c
7e
1s
20
e5
v1
o~
b0
A6
g
n
i
t
a
e
h
e
r
P
.
c
Ce
0s
00
22
~1
0~
50
16
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4. Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be
careful because the damage of the product is often started at the time of the hand solder.
5. Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
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XI3030EU-NAYAYBF5F92734Z35-H41D-AM
Storage Conditions

Before the package is opened. The LEDs should be stored at 30°C or less and 90%RH or less after
being shipped from Everlight and the storage life limits are 18 months. The LEDs can be stored up
to 3 years If in a sealed container with a nitrogen atmosphere and moisture absorbent material.

After opening the package: The LED's floor life is 1 year under 30℃ or less and 60%RH or less.
The LED should be soldered with 168hrs (7days) after opening the package. If unused LEDs
remain, it should be stored in moisture proof packages.

If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions. Baking
treatment: 60±5℃ for 24 hours.
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Revision History
Current version: 06.02.2015
Issue No: DSE-0013351
Version: 1
Created by: Betty Hong
Page
Subjects (major change in previous version)
Date of change
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