SMD HP XI3030(2S) Series

SMD HP  XI3030(2S) Series
Features
˙Top view white LED
˙High luminous intensity output
˙Typical Viewing Angle:120°
˙Pb-free
˙RoHS compliant
Description
The Everlight XI3030 package has high efficacy, high CRI, mid power consumption, wide viewing angle
and a compact form factor. These features make this package an ideal LED for all lighting applications.
Applications
‧ General lighting
‧ Decorative and Entertainment Lighting
‧ Indicators
‧ Illumination
Revision
: 6©
1 Copyright
LifecyclePhase:
Release Date:2013-10-16
17:18:46.0
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2012, Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158 Rev:6
Expired Period: Forever
DATASHEET
SMD HP XI3030(2S)
Series
Table of Contents
Product Nomenclature.......................................................................................................................................... 3
Absolute Maximum Ratings ................................................................................................................................. 4
PN of the XI3030 series: White LEDs .................................................................................................................. 5
Reference Optic-Electrical Characteristic: Warm White LEDs ......................................................................... 6
Reference Optic-Electrical Characteristic: Neutral White LEDs ...................................................................... 7
Reference Optic-Electrical Characteristic: Cool White LEDs ........................................................................... 8
Product Binning:Luminous Flux Bins ................................................................................................................ 9
Prodcut Binning:White Bin Structure ............................................................................................................... 10
Prodcut Binning:Warm White Bin Structure .....................................................................................................11
Product Binning:Warm White Bin Coordinates ................................................................................................11
Prodcut Binning: Neutral White Bin Structure................................................................................................. 13
Product Binning: Neutral White Bin Coordinates............................................................................................ 13
Prodcut Binning:Cool White Bin Structure ...................................................................................................... 14
Product Binning:Cool White Bin Coordinates ................................................................................................. 14
Suggestion of Color Bin Combination .............................................................................................................. 16
Product Binning:Forward Voltage Bins ............................................................................................................ 17
Mechanical Dimension ....................................................................................................................................... 18
Wavelength Characteristics ............................................................................................................................... 19
Typical Electro-Optical Characteristic Curve ................................................................................................... 19
Emitter Tape Packaging...................................................................................................................................... 23
Emitter Reel Packaging ...................................................................................................................................... 24
Precautions for Use ............................................................................................................................................ 25
Storage Conditions ............................................................................................................................................. 26
Revision History .................................................................................................................................................. 27
Revision
:6
Release Date:2013-10-16
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2 Copyright © 2012, Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158 Rev:6
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DATASHEET
SMD HP XI3030(2S)
Series
Product Nomenclature
The product name is designated as below:
XI3030/ XK 3 C - X XX XX XX XX XX Z15/ 2T
Bin Group of Forward Voltage
Bin Group of Max. Luminous Flux
Bin Group of Min. Luminous Flux
Bin Group of Max. Color temperature
Bin Group of Min. Color temperature
Bin Code of Color Rendering Index
Table of Color Rendering Index
Symbol
Description
M
CRI(Min.) : 60
N
CRI(Min.) : 65
L
CRI(Min.) : 70
Q
CRI(Min.) : 75
K
CRI(Min.) : 80
P
CRI(Min.) : 85
H
CRI(Min.) : 90
Notes:
1. Tolerance of Color Rendering Index: ±2
Revision
:6
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DATASHEET
SMD HP XI3030(2S)
Series
Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Max. DC Forward Current (mA)
IF
240
mA
Max. Peak Pulse Current (mA)
IPulse
300[1]
mA
Power Dissipation
Pd
1
W
Thermal Resistance
Rth
15
°C/W
Max. Junction Temperature
TJ
115
°C
Operating Temperature
TOpr
-40 ~ +85
°C
Storage Temperature
TStg
-40 ~ +100
°C
Max. Soldering Temperature
TSol
260
°C
Max. Allowable Reflow Cycles
n/a
2
cycles
Notes:
1.
Duty cycle = 1/[email protected]
Revision
:6
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DATASHEET
SMD HP XI3030(2S)
Series
PN of the XI3030 series: White LEDs
Order Code of XI3030
Minimum
Typical
CCT (K)
Luminous Luminous Wavelength
Flux (lm) Flux (lm)
(nm)
Forward
Current
Voltage (V)
(mA)
CRI
(Min.)
XI3030/KK3C-H2727R8S4S2Z15/2T
90
101
2580-2870K
5.8~7.0
150
80
XI3030/KK3C-H3030R8S4S2Z15/2T
95
106
2870-3220K
5.8~7.0
150
80
XI3030/KK3C-H3535R8S4S2Z15/2T
95
107
3220-3710K
5.8~7.0
150
80
XI3030/KK3C-H4040R8S4S2Z15/2T
95
108
3710-4260K
5.8~7.0
150
80
XI3030/KK3C-H5050S1S5S2Z15/2T
100
113
4745-5310K
5.8~7.0
150
80
XI3030/KK3C-H5757S1S5S2Z15/2T
100
110
5310-6020K
5.8~7.0
150
80
XI3030/KK3C-H6565R8S4S2Z15/2T
95
106
6020-7050K
5.8~7.0
150
80
Notes:
1.
2.
3.
4.
5.
Luminous flux measurement tolerance: ±10%.
The data of luminous flux measured at thermal pad=25℃
Typical luminous flux or light output performance is operated within the condition guided by this datasheet.
The CRI value is based on the Everlight testing instrument.
CRI measurement tolerance: ±2.
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DATASHEET
SMD HP XI3030(2S)
Series
Reference Optic-Electrical Characteristic: Warm White LEDs
Order Code of XI2323
XI3030/KK3C-H2727R8S4S2Z15/2T
XI3030/KK3C-H3030R8S4S2Z15/2T
Typ.
Luminous
Flux (lm)
CCT (K)
Wavelength
(nm)
Forward
Voltage (V)
46
65
71
100
86
2580-2870K
5.8~7.0
125
101
150
120
175
128
200
49
65
74
100
90
106
2870-3220K
5.8~7.0
125
150
126
175
135
200
49
65
75
100
91
XI3030/KK3C-H3535R8S4S2Z15/2T
Current
(mA)
107
CRI
(Min.)
80
80
125
3220-3710K
5.8~7.0
150
127
175
136
200
80
Notes: All value are measured at IF=65 mA/100 mA/125mA/150 mA/175 mA/200 mA and reference only.
Revision
:6
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6 Copyright © 2012, Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158 Rev:6
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DATASHEET
SMD HP XI3030(2S)
Series
Reference Optic-Electrical Characteristic: Neutral White LEDs
Order Code of XI2323
XI3030/KK3C-H4040R8S4S2Z15/2T
Typ.
Luminous
Flux (lm)
CCT (K)
Wavelength
(nm)
Forward
Voltage (V)
Current
(mA)
50
65
76
100
92
3710-4260K
5.8~7.0
125
108
150
129
175
137
200
CRI
(Min.)
80
Notes: All value are measured at IF=65 mA/100 mA/125mA/150 mA/175 mA/200 mA and reference only.
Revision
:6
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DATASHEET
SMD HP XI3030(2S)
Series
Reference Optic-Electrical Characteristic: Cool White LEDs
Order Code of XI2323
XI3030/KK3C-H5050S1S5S2Z15/2T
XI3030/KK3C-H5757S1S5S2Z15/2T
XI3030/KK3C-H6565R8S4S2Z15/2T
Typ.
Luminous
Flux (lm)
CCT (K)
Wavelength
(nm)
Forward
Voltage (V)
Current
(mA)
52
65
79
100
96
4745-5310K
5.8~7.0
125
113
150
134
175
144
200
51
65
77
100
94
110
5310-6020K
5.8~7.0
125
150
131
175
140
200
49
65
74
100
90
125
106
6020-7050K
5.8~7.0
150
126
175
135
200
CRI
(Min.)
80
80
80
Notes: All value are measured at IF=65 mA/100 mA/125mA/150 mA/175 mA/200 mA and reference only.
Revision
:6
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8 Copyright © 2012, Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158 Rev:6
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DATASHEET
SMD HP XI3030(2S)
Series
Product Binning
Luminous Flux Bins
Group
Bin
1
2
3
4
5
6
7
R
8
1
2
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
50.0
55.0
60.0
65.0
70.0
76.0
83.0
90.0
95.0
55.0
60.0
65.0
70.0
76.0
83.0
90.0
95.0
100.0
Group
Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
S
1
2
3
4
5
6
7
8
100.0
110.0
120.0
130.0
140.0
150.0
160.0
170.0
110.0
120.0
130.0
140.0
150.0
160.0
170.0
180.0
Revision
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DATASHEET
SMD HP XI3030(2S)
Series
White Bin Structure
Chromaticity specification defined by ANSI
Notes:
1.
2.
3.
4.
5.
The CCT range of Cool-White varies from 4745K to 7050K.
The CCT range of Neutral-White varies from 3710K to 4745K.
The CCT range of Warm-White varies from 2580K to 3710K
Color coordinates measurement allowance : ±0.01
Color bins are defined at IF=150mA operation
Revision
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DATASHEET
SMD HP XI3030(2S)
Series
Warm-White Bin Structure
0.38
27
K-A
27K
-D
30
K-A
-C
27K-G
27K
G
30K
-D
35K
-A
35K
30K-
27K-F
35K
-
C
-G
35K
-D
0.39
-F
35K
F
30K -
30K
-C
-B
0.40
35K
CIE_y
0.41
30K
-B
0.42
27K
-B
0.43
0.37
0.39
0.40
0.41
0.42
0.43
0.44
0.45
0.46
0.47
0.48
CIE_x
Warm-White Bin Coordinates
2700K
Bin
CIE X
CIE Y
0.4813
0.4319
0.4687
0.4289
0.4621
0.4169
27K-A
0.4667
0.4180
0.4627
0.4109
0.4700
0.4126
Reference Range: 2580~2700K
Bin
CIE X
CIE Y
0.4465
0.4071
0.4373
0.3893
0.4483
0.3919
27K-C
0.4544
0.4030
0.4502
0.4020
0.4539
0.4088
Reference Range: 2700~2870K
Bin
CIE X
CIE Y
0.4667
0.4180
0.4576
0.4158
27K-F
0.4539
0.4088
0.4627
0.4109
Reference Range: 2680~2790K
Bin
CIE X
CIE Y
0.4687
0.4289
0.4562
0.4260
0.4465
0.4071
27K-B
0.4539
0.4088
0.4576
0.4158
0.4621
0.4169
Reference Range: 2700~2870K
Bin
CIE X
CIE Y
0.4700
0.4126
0.4627
0.4109
0.4588
0.4041
27K-D
0.4544
0.4030
0.4483
0.3919
0.4593
0.3944
Reference Range: 2580~2700K
Bin
CIE X
CIE Y
0.4627
0.4109
0.4539
0.4088
27K-G
0.4502
0.4020
0.4588
0.4041
Reference Range: 2680~2790K
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DATASHEET
SMD HP XI3030(2S)
Series
3000K
Bin
CIE X
CIE Y
0.4562
0.4260
0.4430
0.4212
0.4375
0.4096
30K-A
0.4422
0.4113
0.4388
0.4043
0.4465
0.4071
Reference Range: 2870~3000K
Bin
CIE X
CIE Y
0.4221
0.3984
0.4147
0.3814
0.4259
0.3853
30K-C
0.4311
0.3962
0.4267
0.3946
0.4297
0.4011
Reference Range: 3000~3220K
Bin
CIE X
CIE Y
0.4422
0.4113
0.4328
0.4079
30K-F
0.4297
0.4011
0.4388
0.4043
Reference Range: 2960~3150K
3500K
Bin
CIE X
CIE Y
0.4299
0.4165
0.4148
0.4090
0.4106
0.3981
35K-A
0.4159
0.4007
0.4134
0.3943
0.4221
0.3984
Reference Range: 3220~3500K
Bin
CIE X
CIE Y
0.3943
0.3853
0.3889
0.3690
0.4018
0.3752
35K-C
0.4057
0.3853
0.4006
0.3829
0.4029
0.3893
Reference Range: 3500~3710K
Bin
CIE X
CIE Y
0.4159
0.4007
0.4051
0.3954
35K-F
0.4029
0.3893
0.4134
0.3943
Reference Range: 3370~3560K
Bin
CIE X
CIE Y
0.4430
0.4212
0.4299
0.4165
0.4221
0.3984
30K-B
0.4297
0.4011
0.4328
0.4079
0.4375
0.4096
Reference Range: 3000~3220K
Bin
CIE X
CIE Y
0.4465
0.4071
0.4388
0.4043
0.4355
0.3977
30K-D
0.4311
0.3962
0.4259
0.3853
0.4373
0.3893
Reference Range: 2870~3000K
Bin
CIE X
CIE Y
0.4388
0.4043
0.4297
0.4011
30K-G
0.4267
0.3946
0.4355
0.3977
Reference Range: 2960~3150K
Bin
CIE X
CIE Y
0.4148
0.4090
0.3996
0.4015
0.3943
0.3853
35K-B
0.4029
0.3893
0.4051
0.3954
0.4106
0.3981
Reference Range: 3500~3710K
Bin
CIE X
CIE Y
0.4221
0.3984
0.4134
0.3943
0.4108
0.3878
35K-D
0.4057
0.3853
0.4018
0.3752
0.4147
0.3814
Reference Range: 3220~3500K
Bin
CIE X
CIE Y
0.4134
0.3943
0.4029
0.3893
35K-G
0.4006
0.3829
0.4108
0.3878
Reference Range: 3370~3560K
Note: Color coordinates measurement allowance : ±0.01.
Revision
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LifecyclePhase:
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DATASHEET
SMD HP XI3030(2S)
Series
Neutral-White Bin Structure
0.41
0.40
40K-A
CIE_y
0.39
0.38
0.37
0.36
45K-A
45K-B
-F
45K
-G
45K 5K-D
4
C
K
5
4
B
4 0 KF
40KG
40K-
D
4 0 K-
40K-C
0.35
0.35
0.36
0.37
0.38
0.39
0.40
CIE_x
Neutral-White Bin Coordinates
4000K
Bin
CIE X
CIE Y
0.4006
0.4044
0.3871
0.3959
0.3843
0.3858
40K-A
0.3890
0.3887
0.3873
0.3831
0.3952
0.3880
Reference Range: 3710~4000K
Bin
CIE X
CIE Y
0.3703
0.3726
0.3670
0.3578
0.3784
0.3647
40K-C
0.3810
0.3741
0.3764
0.3713
0.3779
0.3773
Reference Range: 4000~4260K
Bin
CIE X
CIE Y
0.3890
0.3887
0.3793
0.3828
40K-F
0.3779
0.3773
0.3873
0.3831
Reference Range: 3870~4080K
Bin
CIE X
CIE Y
0.3871
0.3959
0.3736
0.3874
0.3703
0.3726
40K-B
0.3779
0.3773
0.3793
0.3828
0.3843
0.3858
Reference Range: 4000~4260K
Bin
CIE X
CIE Y
0.3952
0.3880
0.3873
0.3831
0.3854
0.3768
40K-D
0.3810
0.3741
0.3784
0.3647
0.3898
0.3716
Reference Range: 3710~4000K
Bin
CIE X
CIE Y
0.3873
0.3831
0.3779
0.3773
40K-G
0.3764
0.3713
0.3854
0.3768
Reference Range: 3870~4080K
Note: Color coordinates measurement allowance : ±0.01.
Revision
6 Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158
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Date:2013-10-16www.everlight.com
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13 Copyright ©: 2012,
LifecyclePhase:
Expired Period: Forever
DATASHEET
SMD HP XI3030(2S)
Series
Cool-White Bin Structure
0.38
0.37
CIE_y
0.36
A
57K-
0.35
-A
65K
0.34
0.33
0.32
-B
65K 65K-F
-G
65K 65K-D
-B
57K
-F
57K
-G
K
7
-D
5
57K
C
K
57
A
50K-B
K
0
5
F
50KG
50K
-D
50K
C
50K-
-C
65K
0.31
0.30
0.31
0.32
0.33
0.34
0.35
CIE_x
Cool-White Bin Coordinates
5000K
Bin
CIE X
CIE Y
0.3551
0.3760
0.3464
0.3688
0.3456
0.3604
50K-A
0.3487
0.3629
0.3482
0.3583
0.3533
0.3624
Reference Range: 4745~5000K
Bin
CIE X
CIE Y
0.3371
0.3493
0.3366
0.3369
50K-C
0.3441
0.3428
0.3448
0.3507
0.3418
0.3483
0.3422
0.3533
Reference Range: 5000~5310K
Bin
CIE X
CIE Y
0.3487
0.3629
0.3425
0.3579
50K-F
0.3422
0.3533
0.3482
0.3583
Reference Range: 4900~5120K
Bin
CIE X
CIE Y
0.3464
0.3688
0.3376
0.3616
0.3371
0.3493
50K-B
0.3422
0.3533
0.3425
0.3579
0.3456
0.3604
Reference Range: 5000~5310K
Bin
CIE X
CIE Y
0.3533
0.3624
0.3482
0.3583
50K-D
0.3477
0.3530
0.3448
0.3507
0.3441
0.3428
0.3515
0.3487
Reference Range: 4745~5000K
Bin
CIE X
CIE Y
0.3482
0.3583
0.3422
0.3533
50K-G
0.3418
0.3483
0.3477
0.3530
Reference Range: 4900~5120K
Revision
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Date:2013-10-16www.everlight.com
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LifecyclePhase:
Expired Period: Forever
DATASHEET
SMD HP XI3030(2S)
Series
5700K
Bin
CIE X
CIE Y
0.3376
0.3616
0.3292
0.3539
0.3292
0.3464
57K-A
0.3321
0.3490
0.3321
0.3447
0.3371
0.3493
Reference Range: 5310~5700K
Bin
CIE X
CIE Y
0.3215
0.3353
0.3222
0.3243
0.3294
0.3306
57K-C
0.3293
0.3377
0.3263
0.3350
0.3262
0.3395
Reference Range: 5700~6020K
Bin
CIE X
CIE Y
0.3321
0.3490
0.3261
0.3436
57K-F
0.3262
0.3395
0.3321
0.3447
Reference Range: 5510~5780K
Bin
CIE X
CIE Y
0.3292
0.3539
0.3207
0.3462
0.3215
0.3353
57K-B
0.3262
0.3395
0.3261
0.3436
0.3292
0.3464
Reference Range: 5700~6020K
Bin
CIE X
CIE Y
0.3371
0.3493
0.3321
0.3447
0.3320
0.3401
57K-D
0.3293
0.3377
0.3294
0.3306
0.3366
0.3369
Reference Range: 5310~5700K
Bin
CIE X
CIE Y
0.3321
0.3447
0.3262
0.3395
57K-G
0.3263
0.3350
0.3320
0.3401
Reference Range: 5510~5780K
6500K
Bin
CIE X
CIE Y
0.3205
0.3481
0.3117
0.3393
0.3125
0.3328
65K-A
0.3157
0.3360
0.3161
0.3320
0.3213
0.3371
Reference Range: 6020~6500K
Bin
CIE X
CIE Y
0.3048
0.3209
0.3068
0.3113
65K-C
0.3145
0.3187
0.3136
0.3251
0.3106
0.3222
0.3100
0.3259
Reference Range: 6500~7050K
Bin
CIE X
CIE Y
0.3157
0.3360
0.3093
0.3297
65K-F
0.3100
0.3259
0.3161
0.3320
Reference Range: 6300~6690K
Bin
CIE X
CIE Y
0.3117
0.3393
0.3028
0.3304
0.3048
0.3209
65K-B
0.3100
0.3259
0.3093
0.3297
0.3125
0.3328
Reference Range: 6500~7050K
Bin
CIE X
CIE Y
0.3213
0.3371
0.3161
0.3320
65K-D
0.3166
0.3281
0.3136
0.3251
0.3145
0.3187
0.3221
0.3261
Reference Range: 6020~6500K
Bin
CIE X
CIE Y
0.3161
0.3320
0.3100
0.3259
65K-G
0.3106
0.3222
0.3166
0.3281
Reference Range: 6300~6690K
Note: Color coordinates measurement allowance : ±0.01.
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DATASHEET
SMD HP XI3030(2S)
Series
Suggestion of Color Bin Combination
1. Each CCT Bin consists of 6 smaller bins designated as - A, -B, -C, -D, -F, and –G. For example, the 3000K consists
of 30K-A, 30K-B, 30K-C, 30K-D, 30K-F,and 30K-G.
2. Any single CCT Bin is defined as inside 7-step Macadam Ellipse, and the combination of smaller -F and -G bins inside it
are defined as inside 3-step Macadam Ellipse.
3. Through bin combination, it is possible to get a good color uniformity. Please refer to following combination rule for
getting good color uniformity mentioned above:
Kit 1: To combine -A bin with -C bin with 1:1 mixing rate for approaching 3-step Macadam Ellipse
Kit 2: To combine -B bin with -D bin with 1:1 mixing rate for approaching 3-step Macadam Ellipse
Kit 3: To combine -F bin with -C or -D bin with 1:1 mixing rate for approaching 4-step Macadam Ellipse
Kit 4: To combine -G bin with -A or -B bin with 1:1 mixing rate for approaching 4-step Macadam Ellipse
Kit 5: -F or -G bin only will be inside 3-step Macadam Ellipse
An Example of 3000K Combination
0.43
3000K
Inner Range: 3-Step MacAdam Ellipse
CIE_y
0.42
30K-A
30K-B
0.41
30K-F
0.40
0.39
30K-G
30K-D
30K-C
Outer Range: 7-Step MacAdam Ellipse
0.38
0.41
0.42
0.43
0.44
0.45
0.46
CIE_x
Note:
1. The percentage of each bin is determined by EVERLIGHT
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DATASHEET
SMD HP XI3030(2S)
Series
Forward Voltage Bins
Bin
S2
Minimum Forward
Voltage (V)
Maximum Forward
Voltage (V)
5.80
5.90
6.00
6.10
6.20
6.30
6.40
6.50
6.60
6.70
6.80
6.90
5.90
6.00
6.10
6.20
6.30
6.40
6.50
6.60
6.70
6.80
6.90
7.00
5#8
5#9
6#0
6#1
6#2
6#3
6#4
6#5
6#6
6#7
6#8
6#9
Notes:
1.
2.
Forward voltage measurement tolerance: ±0.1V.
Forward voltage bins are defined at IF=150mA operation.
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DATASHEET
SMD HP XI3030(2S)
Series
Mechanical Dimension
Notes:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.2mm.
3. The thermal pad is electrically unity from the Anode and contact pads.
4. Do not handle the device by the lens. Incorrect force applied to the lens may lead to the failure of devices.
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DATASHEET
SMD HP XI3030(2S)
Series
Wavelength Characteristics
For Cool-White, Warm-White
Relative Spectral Distribution
@ Solder Pad Temperature = 25℃
Relative luminous intensity
1.0
Warm White
Cool White
0.8
0.6
0.4
0.2
0.0
400
500
600
700
800
Wavelength (nm)
Typical Electrical Characteristics
For Cool-White, Warm-White
@ Solder Pad Temperature = 25℃
7.5
Forward Voltage (v)
7.0
6.5
6.0
5.5
5.0
0
50
100
150
200
250
300
Forward Current (mA)
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DATASHEET
SMD HP XI3030(2S)
Series
Typical Relative Luminous Flux vs. Forward Current
For Cool-White ,Warm-White
@ Solder Pad Temperature = 25℃
1.8
Relative Luminous Flux
1.5
1.2
0.9
0.6
0.3
0.0
0
50
100
150
200
250
300
Forward Current(mA)
Typical Wavelength & Color Shift Characteristics
vs. Forward Current
For Cool-White , Warm-White
@ Solder Pad Temperature = 25℃
6000
5500
Warm White
Cool White
5000
CCT
4500
4000
3500
3000
2500
0
50
100
150
200
250
300
Forward Current(mA)
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DATASHEET
SMD HP XI3030(2S)
Series
Relative Luminous Flux vs. Soldering Temperature
@Forward Current = 150mA
Relative Luminous Flux
1.2
1.0
0.8
0.6
0.4
0.2
20
30
40
50
60
70
80
90
100
o
Soldering Temperatur e( C)
Forward Voltage vs. Soldering Temperature
@ Forward Current = 150mA
6.40
Forward Voltage(V)
6.35
6.30
6.25
6.20
6.15
6.10
20
30
40
50
60
70
80
90
100
o
Soldering Temperatur e( C)
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DATASHEET
SMD HP XI3030(2S)
Series
Forward Current Derating Curve
@ Junction Temperature <115℃
200
Forward Current(mA)
160
120
80
40
0
0
10
20
30
40
50
60
70
80
90
100
o
Soldering Temperatur e( C)
Typical Radiation Patterns
XI3030 series: Typical Diagram Characteristics of
Radiation for Warm-White and Cool-White
0
10
1.0
20
30
40
0.8
50
0.6
60
0.4
70
0.2
80
90
A
0
30
60
0.0
90
Notes:
1.
2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2.
View angle tolerance is ± 5∘.
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DATASHEET
SMD HP XI3030(2S)
Series
Emitter Tape Packaging
Carrier Tape Dimensions as the following:
Reel:2000pcs
Notes:
1.Tolerance unless mentioned is ±0.1mm; Unit = mm
2.Minimum packing amount is 250/500/1000/2000 pcs per reel
Moisture Resistant Packaging
Label
Label
Aluminum moistue-proof bag
Aluminum moisture-proof bag
Desiccant
Desiccant
Label
Label
Revision
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DATASHEET
SMD HP XI3030(2S)
Series
Emitter Reel Packaging
Reel Dimensions
Notes:
1.
Dimensions are in millimeters.
2.
Tolerances unless mentioned are ±0.1mm.
Product Labeling
Label Explanation
CPN: Customer Specification (when required)
P/N : Everlight Production Number
QTY: Packing Quantity
CAT: Luminous Flux (Brightness) Bin
HUE: Color Bin
REF: Forward Voltage Bin
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Revision
6 Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158
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DATASHEET
SMD HP XI3030(2S)
Series
Precautions for Use
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out
will happen).
2.Storge
2.1 Before the package is opened: The LEDs should be stored at 30°C or less and 50%RH or less after being
shipped from Everlight. The storage life is 6 months. If the LEDs are to be stored for more than 6 months, they should
be stored in a sealed container with a nitrogen atmosphere and moisture absorbent material.
2.2After opening the package: The LED's should be stored under 30℃ or less and 30%RH or less. The LED
should be used within 168hrs (7days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages.
2.3Before using LEDs: The LEDs should be baked under the following conditions: pre-curing at 60±5℃ for 24
hours.
2.4Do not stack assemblies containing Everlight XI3030 LEDs to prevent damage to the optical surface of LEDs.
Forces applied to the optical surface may result in the surface being damaged.
3. Soldering Condition
3.1 Pb-free solder temperature profile
.
.x
x
a
aM
M.
c
Ce
0s
60
21
C.
x
5a
5M
2.
ec
ve
os
b0
A3
.
x
a
M
.
c
e
s
/
C
3
.
x
a
M
.
c
e
s
/
C
6
.
c
7e
1s
20
e5
v1
o~
b0
A6
g
n
i
t
a
e
h
e
r
P
.
c
Ce
0s
00
22
~1
0~
50
16
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4. Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be
careful because the damage of the product is often started at the time of the hand solder.
5. Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
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6 Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158
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25 Copyright ©: 2012,
LifecyclePhase:
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DATASHEET
SMD HP XI3030(2S)
Series
Storage Conditions

Before the package is opened. The LEDs should be stored at 30°C or less and 85%RH or less after
being shipped from Everlight and the storage life limits are 1 year. The LEDs can be stored up to 3
years If in a sealed container with a nitrogen atmosphere and moisture absorbent material.

After opening the package: The LED's floor life is 1 year under 30℃ or less and 60%RH or less.
The LED should be soldered with 168hrs (7days) after opening the package. If unused LEDs
remain, it should be stored in moisture proof packages.

If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions. Baking
treatment: 60±5℃ for 24 hours.
Revision
6 Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158
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DATASHEET
SMD HP XI3030(2S)
Series
Revision History
Current version: 10.11.2013
Issue No: DSE-0009158
Version: 6
Created by: Sherry Chen
Page
Subjects (major change in previous version)
Date of change
5
Created new Order Code of XI3030
July,15,2013
4
Revise Max. DC Forward Current, Max. Peak Pulse Current (mA)
July.22.2013
9
Created 3500K Warm-White Bin Coordinates
Aug.06.2013
6-8
Add reference optic-electrical characteristic
Sep.05.2013
Revision
6 Everlight All Rights Reserved. Release Date: Oct.11.2013 Issue No: DSE-0009158
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27 Copyright ©: 2012,
LifecyclePhase:
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