SMD B 22-23/R6GHBHC

SMD  B
22-23/R6GHBHC-A01/2C
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Multi-color type.
․Pb-free.
․The product itself will remain within RoHS compliant version.
Descriptions
․The 22-23 SMD LED is much smaller than lead frame type components, thus enable smaller board size,
higher packing density, reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
• Backlighting in dashboard and switch.
• Telecommunication: indicator and backlighting in telephone and fax.
• Flat backlight for LCD, switch and symbol.
• General use.
1
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
www.everlight.com
DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Device Selection Guide
Chip
Materials
Emitted Color
AlGaInP
Brilliant Red
InGaN
Brilliant Green
InGaN
Blue
Resin Color
Water Clear
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
V
Forward Current
IF
5
R6:25
GH:25
BH:25
R6:60
GH:95
BH:100
R6:60
GH:95
BH:95
-40 ~ +85
-40 ~ +90
R6:2000
GH:2000
BH:2000
℃
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
Power Dissipation
Pd
Operating Temperature
Topr
Storage Temperature
Tstg
Electrostatic Discharge(HBM)
ESDHBM
Soldering Temperature
Tsol
2
mA
mA
mW
℃
V
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Electro-Optical Characteristics (Ta=25℃)
Parameter
Luminous Intensity
Viewing Angle
Peak Wavelength
Dominant Wavelength
Spectrum Radiation Bandwidth
Forward Voltage
Reverse Current
Symbol
Iv
2θ1/2
λp
λd
Δλ
VF
IR
Min.
Typ.
Max.
R6 45.0
GH 112
BH
28.5
-----
180
-----
450
-----
112
-----
120
-----
R6 ----GH ----BH
-----
632
-----
518
-----
468
-----
R6 615
GH 510
BH
460
-----
630
-----
540
-----
480
R6 ----GH ----BH
-----
20
-----
35
-----
25
-----
R6 1.7
GH 2.7
BH
2.7
R6 -----
2.0
2.4
3.3
3.7
3.3
3.7
-----
10
Unit
Condition
mcd
deg
nm
nm
IF=20mA
nm
V
μA
VR=5V
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Dominant Wavelength: ±1nm
3. Tolerance of Forward Voltage: ±0.1V
3
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
R6
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
P
Q
R
45.0
72.0
112
72.0
112
180
mcd
IF =20mA
GH
Bin Range of Luminous Intensity
Bin Code.
Min.
Max.
Unit
Condition
R
S
T
112
180
285
180
285
450
mcd
IF =20mA
BH
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
N
P
Q
28.5
45.0
72.0
45.0
72.0
112
mcd
IF =20mA
Note:
Tolerance of Luminous Intensity: ±11%
4
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Typical Electro-Optical Characteristics Curves
R6
Forward Current vs.
Forward Voltage
Ta=25°C
100
Forward Current IF (mA)
Relative luminous intensity (%)
Spectrum Distribution
75
50
25
40
30
25
20
10
0
500
550
600
650
Wavelength λ (nm)
0
1.2
700
Forward Current
Relative luminous intensity (%)
Relative luminous intensity (%)
Ambient Temperature
1000
100
10
1
-60 -40 -20
1.6 2.0
2.4 2.8 3.0
Forward Voltage VF (V)
Luminous Intensity vs.
Luminous Intensity vs.
0 20 40 60 80 100
Ta=25°C
1000
100
10
1 0
10
10
1
10
2
Forward Current IF (mA)
Ambient Temperature Ta (°C)
Radiation Diagram
Forward Current Derating Curve
Forward Current IF (mA)
Ta=25°C
50
0°
50
Ta=25°C
10° 20°
30°
40
30
25
20
10
0
40°
1.0
0.9
50°
0.8
60°
70°
80°
90°
0.7
0
20
40
60
85
100
0.5 0.3
0.1 0.2 0.4 0.6
Ambient Temperature Ta (°C)
5
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Typical Electro-Optical Characteristics Curves
GH
Spectrum Distribution
Forward Current vs.
Forward Voltage
Ta=25°C
50
I (mA)
100
40
F
75
30
Forward Current
Relative luminous intensity (%)
Ta=25°
50
25
0
400
500
450
550
25
20
10
0
2.6
600
Wavelength λ (nm)
Relative luminous intensity (%)
Relative luminous intensity (%)
3.4
Ambient Temperature
1000
100
10
1000
4.5
100
10
1
10
0 20 40 60 80 100
10
10
Forward Current IF(mA)
Radiation Diagram
Forward Current Derating Curve
0°
50
IF(mA)
4.2
Luminous Intensity vs
Forward Current
Ta=25°C
Ambient Temperature Ta (°C)
Forward Current
3.8
Forward Voltage VF (V)
Luminous Intensity vs.
1
-60 -40 -20
3.0
Ta=25°C
10°
20°
30°
40
40°
30
25
1.0
20
0.9
50°
0.8
60°
10
70°
0.7
0
0
20
40
60
85
100
80°
90°
0.5
0.3
0.1
0.2
0.4
0.6
Ambient Temperature Ta (°C)
6
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Typical Electro-Optical Characteristics Curves
BH
Forward Current vs.
Forward Voltage
75
50
25
0
400
450
500
550
50
40
30
25
20
10
0
2.6
600
Wavelength λ (nm)
3.8
4.2
Forward Current
Ambient Temperature
Relative luminous intensity (%)
Relative luminous intensity (%)
3.4
4.5
Luminous Intensity vs.
1000
100
10
1
-60 -40 -20
3.0
Forward Voltage VF (V)
Luminous Intensity vs.
0 20 40 60 80 100
Ta=25°C
1000
100
10
1
10
2
1
10
10
Forward Current IF (mA)
Ambient Temperature Ta (°C)
Radiation Diagram
0° 10°
Forward Current Derating Curve
Forward Current IF (mA)
Ta=25°C
Ta=25°C
100
Forward Current IF (mA)
Relative luminous intensity (%)
Spectrum Distribution
50
Ta=25°C
20°
30°
40
40°
1.0
30
25
20
10
0
0.9
50°
0.8
60°
70°
0.7
0
20
40
60
85
100
80°
90°
0.5
0.3
0.1
0.2
0.4
0.6
Ambient Temperature Ta (°C)
7
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Package Dimension
Green Mask
Polarity
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need.
8
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Moisture Resistant Packing Materials
Label Explanation
Pb
EVERLIGHT
CPN :
P N : XXXXXXXXXXXXX
RoHS
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
XXXXXXXXXXXXX
CAT : XXX
HUE : XXX
REF : XXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MADE IN TAIWAN
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm , Unit = mm
9
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Moisture Resistant Packing Process
Label
Aluminum moisture-proof bag
Desiccant
Label
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
10
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Precautions for Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
260°C Max.
10sec. Max.
Above255°C
30sec.Max.
3°C/sec.Max.
6°C/sec.Max.
Pre-heating
Above 217°C
60~150sec.
150~200°C
60~120sec.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in
less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal.
Be careful because the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the
LEDs will or will not be damaged by repairing.
11
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
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DATASHEET
SMD  B
22-23/R6GHBHC-A01/2C
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,
and medical equipment may require different product. If you have any concerns, please contact
Everlight before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
12
Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-Apr-2013 Issue No: DSE-0002063 Rev:5
www.everlight.com