AP85U03GMT-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Simple Drive Requirement D ▼ SO-8 Compatible ▼ Low On-resistance 30V RDS(ON) 5mΩ ID G ▼ RoHS Compliant & Halogen-Free BVDSS 82A S D Description AP85U03 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The PMPAK ® 5x6 package is special for DC-DC converters application and the foot print is compatible with SO-8 with backside heat sink and lower profile. D D D S S S G PMPAK® 5x6 o Absolute Maximum Ratings@Tj=25 C(unless otherwise specified) Symbol Parameter Rating Units VDS Drain-Source Voltage 30 V VGS Gate-Source Voltage +20 V ID@TC=25℃ Drain Current (Chip), VGS @ 10V ID@TA=25℃ ID@TA=100℃ 82 A Drain Current, VGS @ 10V 3 24 A Drain Current, VGS @ 10V 3 15 A 200 A 50 W 5 W 29 mJ 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation PD@TA=25℃ Total Power Dissipation 4 EAS Single Pulse Avalanche Energy TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Rthj-c Rthj-a Parameter Maximum Thermal Resistance, Junction-case 3 Maximum Thermal Resistance, Junction-ambient Data & specifications subject to change without notice Value Units 2.5 ℃/W 25 ℃/W 1 201501057 AP85U03GMT-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage Static Drain-Source On-Resistance 2 Min. Typ. Max. Units VGS=0V, ID=250uA 30 - - V VGS=10V, ID=20A - - 5 mΩ VGS=4.5V, ID=20A - - 10 mΩ VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V gfs Forward Transconductance VDS=10V, ID=20A - 40 - S IDSS Drain-Source Leakage Current VDS=24V, VGS=0V - - 1 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA ID=30A - 41.5 66 nC 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=24V - 7.3 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 27 - nC 2 td(on) Turn-on Delay Time VDS=15V - 11 - ns tr Rise Time ID=30A - 87 - ns td(off) Turn-off Delay Time RG=3.3Ω - 36 - ns - ns tf Fall Time VGS=10V - 103 Ciss Input Capacitance VGS=0V - 2910 4660 pF Coss Output Capacitance VDS=25V - 475 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 445 - pF Rg Gate Resistance f=1.0MHz - 1.2 1.8 Ω Min. Typ. IS=30A, VGS=0V - - 1.2 V Source-Drain Diode Symbol VSD Parameter Forward On Voltage 2 2 Test Conditions Max. Units trr Reverse Recovery Time IS=10A, VGS=0V, - 39 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 40 - nC Notes: 1.Pulse width limited by Max. junction temperature 2.Pulse test 3.Surface mounted on 1 in 2 copper pad of FR4 board, t <10sec o 4.Starting Tj=25 C , VDD=20V , L=0.1mH , RG=25Ω , IAS=24A. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP85U03GMT-HF 200 100 o o T C =25 C T C =150 C 10V 7.0 V 80 ID , Drain Current (A) ID , Drain Current (A) 160 10V 7 .0V 5.0V 4.5 V 5.0V 120 4.5 V 80 60 40 V G =3.0V 40 20 V G = 3.0 V 0 0 0.0 2.0 4.0 6.0 8.0 0.0 4.0 6.0 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 2.0 14 I D =20A I D =20A V G =10V T C =25 o C Normalized RDS(ON) 12 10 RDS(ON) (mΩ) 2.0 V DS , Drain-to-Source Voltage (V) 8 1.6 1.2 6 0.8 4 0.4 2 2 4 6 8 -50 10 50 100 150 T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.6 40 T j =150 o C T j =25 o C 30 1.2 Normalized VGS(th) IS(A) 0 o V GS , Gate-to-Source Voltage (V) 20 10 0.8 0.4 0 0.0 0 0.4 0.8 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.6 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP85U03GMT-HF 10 f=1.0MHz 4000 8 V DS =15V V DS =18V V DS =24V 6 C iss 3000 C (pF) VGS , Gate to Source Voltage (V) I D =30A 2000 4 1000 2 C oss C rss 0 0 0 20 40 60 1 80 5 9 13 17 21 25 29 V DS ,Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1000 100 Operation in this area limited by RDS(ON) ID (A) 100us 1ms 10 10ms 100ms DC 1 T C =25 o C Single Pulse Normalized Thermal Response (Rthjc) 1 Duty factor = 0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x R thjc + T c Single Pulse 0.01 0.1 0.01 0.1 1 10 100 0.00001 0.0001 V DS ,Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4 AP85U03GMT-HF MARKING INFORMATION 85U03GMT YWWSSS Part Number meet Rohs requirement for low voltage MOSFET only Package Code : MT Date Code (YWWSSS) Y:Last Digit Of The Year WW:Week SSS:Sequence 5