RPM871-H7 Photo Link Module IrDA Infrared communication Module RPM871-H7 RPM871-H7 is an infrared communication module for IrDA Ver. 1.2 (Low Power). The infrared LED, PIN photo diode, waveform shaping LSI are all integrated into a single package. This module is designed with power down function and low current consumption at stand-by mode. The ultra small package makes it a perfect fit for mobile devices. !Features 1) Applied to IrDA version 1.2. (Low Power) 2) Designed for low power consumption at stand-by for receiving (Typ.73µA). 3) Suitable for sets driven by battery due to power down control function. 4) Power supply voltage range : 2.6V∼3.6V 5) Constant LED load resistance can change communication range. (Approx. 20∼60cm) !Applications Cellular phones, PDAs, etc. !Absolute maximum ratings (Ta = 25°C) Parameter Symbol Limits Unit Power supply voltage VCC −0.3~+7.0 V Power dissipation Pd 150∗1 mW Operating temperature range Topr −20~+85 °C Storage temperature range Tstg −30~+100 °C IFP 200∗2 mA LED peak current ∗1 70mm×70mm, t=1.6mm, glass epoxy mounting. Derating : 2mW/°C for operation above Ta=25°C ∗2 LED peak current<90µs. ON duty<20% !Recommended operating conditions (Ta = 25°C) Parameter Power supply voltage Symbol Min. Typ. Max. Unit VCC 2.6 2.8 3.6 V VLEDA 2.6 2.8 5.5 V RPM871-H7 Photo Link Module !Block diagram and application circuit AMP 2 1 AMP GND NC VCC AMP 3 VCC GND 4 GND C1 PWDOWN PWDOWN 5 7 6 POWER DOWN RXD TXD TXD LEDA 8 RXD R1 (LEDVCC) LED DRIVER VCC (3pin) and VLEDA (8pin) can be used on either common power source or different one. RPM871-H7 Photo Link Module !Terminal description Circuit Function Pin No Terminal 1, 4 GND 2 NC This Terminal must be left open. VCC VCC For preventing from infection, connect a capacitor between VCC (3pin) and GND (4pin). 3 GND Pin1 and pin4 must be connected to the ground. VCC 5 Power-down Control Terminal H : POWERDOWN L : OPERATION CMOS Logic Level Input When input is H, it will stop the receiving circuit, Pin-PD current and transmitting LED operation. PWDOWN VCC PWDOWN 6 VCC 300k RXD VCC 7 TXD 200K 8 LEDA − Shield Case LED Receiving Data Output Terminal CMOS Logic Level Output When PWDOWN (5pin)=H, the RXD output will be pulled up to VCC at approximately 300kΩ. Transmitting Data Input Terminal H : LED (PWDOWN=L) CMOS Logic Level Input Holding TXD="H" status, LED will be turn off approximately 45µs. LED ANODE Terminal Other power source can be used difference between LEDVCC and VCC. LED current depends on LED load resistance value. Connect to Ground. RPM871-H7 Photo Link Module !Electrical characteristics (Unless otherwise noted, VCC=2.8V, VLEDVCC=2.8V, Ta = 25°C) Parameter Symbol Min. Consumption current1 ICC1 − 73 99 µA Stand-by for receiving At no input light Consumption current2 ICC2 − 0.01 0.2 µA PWDOWN PIN High At no input light 2.4 − 115.2 kbps PWDOWN INPUT High voltage VPDH VCC−0.55 − − V PWDOWN INPUT Low voltage VPDL − − 0.55 V PWDOWN INPUT High current IPDH −1.0 0 1.0 µA PWDOWN=VCC [V] PWDOWN INPUT Low current IPDL −1.0 0 1.0 µA PWDOWN=0 [V] TXD INPUT High voltage VTXH VCC−0.55 − − V TXD INPUT Low voltage VTXL − − 0.55 V TXD INPUT High current ITXH 7 14 28 µA TXD=VCC [V] Transmission rate Typ. Max. Unit Conditions <Transmitter> ITXL −1.0 0 1.0 µA TXD=0 [V] ILEDA − 144 − mA R1=7.5 [Ω] RXD OUTPUT High voltage VRXH VCC−0.5 − − V IRXH=−50µA RXD OUTPUT Low voltage VRXL − − 0.4 V IRXL=200µA RXD OUTPUT rise time tRR − 70 − ns CL=15pF RXD OUTPUT fall time tFR − 30 − ns CL=15pF twRXD 1.5 2.3 3.6 µs CL=15pF, 2.4∼115.2kbps tRT − 100 300 µs TXD INPUT Low current LED ANODE current <Receiver> RXD OUTPUT pulse width Receiver latency time !Optical characteristics (Unless otherwise noted, VCC=2.8V, VLEDVCC=2.8V, Ta = 25°C) Parameter Symbol Min. Typ. Max. Unit Peak wave length λP 850 870 900 nm Intensity1 IE1 14.4 36 93.6 mW/Sr Half-angle θL/2 − ±18 ±30 deg Rise time / Fall time Tr/Tf − − 100 ns − − 25 % Tj −40 − 40 ns Irradiance in angular Ee 0.0068 − 500 INPUT Half-Angular θD/2 ±15 − − deg TLEDmax 10 45 96 µs Optical over shoot Edge jitter Maximum emitting time 1. This product is not designed for protection against radioactive rays. 2. This product dose not include laser transmitter. 3. This product includes one PIN photo diode. 4. This product dose not include optical load. Conditions −15°≤θL≤15° R1=7.5 [Ω] 10%∼90% mW/cm2 −15°≤θL≤15° TXD=VCC RPM871-H7 Photo Link Module !Timing chart (Emitting side) TXD (7pin) less than 45µs more than 45µs (emitting) (emitting) (emitting) Internal LED (Light output) approximately 45µs (Detecting side) Light input less than 2.3µs more than 2.3µs RXD (6pin) pull up to VCC at approximately 300kΩ approximately 2.3µs approximately 2.3µs PWDOWN (5pin) !Attached components Recommended values Part symbol Recommended value C1 1µF, tantalum or ceramic Ex.) TCFGA1A105M8R (ROHM) R1 7.5Ω±5%, 1/4W (VLEDVCC=2.8V) Notice Bigger capacitance is recommended with much noise from power supply More than 60cm distance, more than 4[µW/cm2] at detecting side. (vs ver1.0) More than 46cm distance, more than 6.8[µW/cm2] at detecting side. (vs RPM871-H7) In case of using R1 with different condition from the above, formula is as follows : LED resistance value : R1[Ω], LED average consumption current : ILED[mA], Supply voltage : VLEDVCC[V], Link distance : d[cm] (Including LED’s distribution within ±15deg) R1=T × (VLEDVCC−1.45) / d2−3.5 [Ω] ILED=Duty × (VLEDVCC−1.36) / (R1+2.5) [A] Duty : LED duty at emitting T : 17300 (vs. RPM871-H7), 29400 (vs. ver1.0) ∗ Please set up to be ILED / Duty < 200[mA] (Duty < 20%) RPM871-H7 Photo Link Module !Notes 1) LEDVCC (8pin) and VCC (3pin) Other power source can be used difference between LEDVCC and VCC. • 2) Caution in designing board lay-out To get maximum potential from RPM871-H7, please keep in mind following instruction. The line of RXD (6pin) should be connected at backside via through hole close to RPM871-H7 pin lead. Better not to be close to photo diode side (1pin). ⇒This is to minimize feedback supplied to photo diode from RXD. As for C1 between 3-4 pin should be placed close to RPM871-H7. Better to be placed more than 1.0cm in radius from photo diode (pin1 side) and also away from the parts which generates noise, such as DC / DC converter. • • • 3) Others Please be sure to set up the TXD (7pin) input to be “L” (under 0.55V) except transmitting data (for < 90µsec. on duty < 20%). Power down current might increase if exposed by strong light (ex. direct sunlight) at power down mode. Please use by the signal format which is specified by IrDA Ver1.2 (2.4k∼115.2kbps). There might be on error if used by different signal format. Dust or dirt on lens portion may affect the characteristics, so pay sufficient attention. • • • • MAXIMUM LED PACK CURRENT : Iledp (mA) 4) LED current derating and ambient temperature The relation between LED peak current and maximum ambient temperature is shown below. We recommend you to use within the range as indicated in below. a) When glass-epoxy board (70×70×1.6mm) mounted. 250 Duty=10% 200 150 Duty=20% 100 50 0 −20 0 20 40 60 80 100 AMBIENT TEMPERATURE : Ta (°C) MAXIMUM LED PACK CURRENT : Iledp (mA) b) RPM871-H7 250 Duty=10% 200 150 Duty=20% 100 50 0 −20 0 20 40 60 80 AMBIENT TEMPERATURE : Ta (°C) 100 RPM871-H7 Photo Link Module 0.15 1.0 φ2 .2 Pin PD LED 1.1 1.4 2.8 0.15 0.8 0.7 2.55 4.0 8.0 2.9 2.85 R 1. 1 1 1. R 1 2.9 2.2 1.75 2.2 φ2 .2 !External dimensions (Units : mm) P 0.95x7=6.65 0.35 8 RSLP8(H7)