March 18, 2009 MPC8568 Solder-Joint Reliability Tests Data from December, 2007 TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. Air Temperature Cycling IPC-9701A Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 1 Air Temperature Cycling Printed Circuit Board 0.093” thick with 8 Cu layers (IPC-9701) • OSP NSMD 0.50mm pad • SnPb paste for SnPb2Ag parts • SnAgCu paste for SnAg parts • Cycling • 0/100C air temperature cycling • 10 minute dwells 10 minute ramps 1.5 cycles/hour Continuous In-Situ Daisy Chain Resistance Monitoring Experimental Results 2622 cycles SnPb - terminated • 7387 cycles SnAg - terminated • Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 2 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 3 Dye Penetrant Example Failure behavior is to fail from center and then move outward. View is looking at the PCB. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 4 Daisy Chain Pattern Looking at the Printed Circuit Board. Green is the PCB side of the net. Black is the inside the package net. Out from here In Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 5 Package Labeling Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 6 Monotonic Bend Test IPC-9702 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 7 Example Bend PCB Strain gage Daisy chain packge Daisy chain net connections Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 8 Example Bend Test Tilt in images is a result of angle of camera view. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 9 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 10 Bend Test Results SnPb2Ag SnAg Strain Continuity Rate Max Break Pass 5184 4850 4590 Pass 5087 4720 4395 Pass 5156 4970 4336 Pass 5167 4680 4658 Fail Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 5216 5139 5202 5161 5408 5221 4644 5123 5147 5218 4879 4690 4800 4890 4670 4940 4900 4820 4670 4920 4790 4760 4482 4360 4424 4219 4639 4355 3843 4321 4600 3901 4082 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. Continuity Rate Pass 5056 Pass 4919 Pass 4984 Pass 4970 Pass Fail/S Pass Fail/S Fail/S Fail? 4921 4929 4904 4795 4966 4921 Strain Max Break 6160 5874 5890 4790 5950 4790 5840 4517 5760 5910 5860 5820 6000 5890 4473 5093 5044 5298 5010 4980 TM 11 Example Failure Locations Failure mode is massive PCB pad rip out. Randomly during rip out some SnAg solderjoints separate at package side. No package side separations occur for SnPb. (All images are looking at the package. Red color is break surface.) Ripped out pads from PCB. Random occurrence of ball and package pad break Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 12 TM