HIGH DENSITY CARD EDGE .050" [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA) HMCA SERIES Introduction: Adam Tech HMCA Series Card Edge Connectors include Standard and Express versions designed for PCB’s in Peripheral Component Interconnect (PCI) applications. Each is manufactured in a four row, high density package which is completely compatible to industry standards and has specially engineered contacts which provide a very short electrical path between boards. Adam Tech card edge connectors are designed for high performance with solid board pegs and precision located, selectively gold plated contacts which are ideal in high speed, increased bandwidth applications Features: PCI and PCI Express Versions High density compact designs Industry standard PCI compatible Special contact design reduces electrical path Selectively plated contacts Open bottom for after solder cleaning Mating PC Boards: All .050" centerline printed circuit board pads with a thickness of .062" to .072" Specifications: Material: Standard insulator: PPS, 30% glass reinforced, rated UL94V-0 Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0 Insulator Color: Dark Brown (White for 120 pos.) Contacts: Phosphor Bronze Contact Plating: Gold over Nickel underplate on contact area, tin over copper underplate on tails. Electrical: Operating voltage: 125V AC max. Current rating: 1 Amp max. Contact resistance: 30 mΩ max. initial Insulation resistance: 1000 MΩ min. Dielectric withstanding voltage: 500V AC for 1 minute ORDERING INFORMATION HMCA A 112 G PLATING G=Selectively SERIES INDICATOR HMCA = gold plated contacts VESA Micro-channel Card Edge connector PEGS A = Plastic pegs B = Metal boardlocks Mechanical: Insertion force: 7 oz max. Withdrawal force: 0.9 oz min Temperature Rating: Operating temperature: -55°C to +105°C Soldering process temperature: Standard insulator: 235°C Hi-Temp insulator: 260°C POSITIONS 112, 120, 132, 182, 184, 194 Packaging: Anti-ESD plastic trays Safety Agency Approvals: UL Recognized & CSA Certified, File no. E224053 OPTIONS Add designator(s) to end of part number 30 =30 µin gold plating in contact area HT =Hi-Temp insulator for Hi-Temp soldering processes up to 260°C 178 www.adam-tech.com HIGH DENSITY CARD EDGE .050" [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA) HMCA SERIES A C B .070 ]1.78] .050 [1.27] D E .023 [0.60] F D .300 [7.62] E .100 [2.54] .050 [1.27] .050 [1.27] 184 PIN G .050 [1.27] .100 [2.54] E D ø.098 [2.49] ø.040 [1.02] ø.098 [2.49] 2.350 [59.69] 184 PIN 112 and 120 PIN E ø.040 [1.02] 2.550 [64.77] 112 and 120 PIN D 2.200 [55.88] 2.400 [60.96] ø.098 [2.49] ø.040 [1.02] F ø.098 [2.49] .100 [2.54] .157 [4.00] .100 [2.54] ø.083 [2.10] .100 [2.54] .300 [7.62] .610 [15.50] .118 [3.00] .050 [1.27] ø.040 [1.02] F F 132 PIN 132 PIN 182 PIN 182 PIN Recommended PCB Layout Unit: Inch [mm] Dimensions Part No. & Positions A B C HMCA-112-G 3.140 [79.76] 0.625 [15.88] HMCA-120-G 3.340 [84.84] 0.625 [15.88] HMCA-132-G 3.740 [95.00] 0.625 [15.88] HMCA-182-G 4.890 [124.21] HMCA-194-G 5.290 [134.37] D E F 2.325 [59.06] 0.500 [12.70] 2.200 [ 55.88] 2.232 [56.69] — 2.525 [64.14] 0.500 [12.70] 2.400 [ 60.96] 2.550 [64.77] — 2.925 [74.30] 1.834 [46.60] 2.200 [55.88] 2.350 [59.69] 2.175 [55.25] 2.525 [64.14] 2.050 [52.07] 2.050 [52.07] 2.550 [64.77] 2.175 [55.25] 2.925 [74.30] 2.050 [52.07] 2.200 [55.88] 2.350 [55.88] www.adam-tech.com G 0.450 [11.43] — 0.450 [11.43] 179