LD-701 Series LED displays Large flat displays LD-701 Series The LD-701 series were designed in response to the need for large, flat displays. These are three-chip, flat displays with high luminance. !External dimensions (Units : mm) 21.0 0.6 Pin No.1 2 (7.0) 3 4 5 6 (2.5) 5.0±0.5 5.6±0.1 0.3 R4 !Features 1) Three independent chip elements. 2) Large 4.5 x 19.8 mm emission area. 3) Thin outer casing, multiple units can be coupled together. 4) Four colors are available: red, orange, yellow and green. (1.525) 4.5±0.1 5.7 2° 19.8±0.1 Pin No.1 2 3 4 5 6 (7.0) Tolerances are ±0.3 unless otherwise noted: !Selection guide Emitting color Type Red Orange Yellow Green LD-701VR LD-701DU∗ LD-701YY∗ LD-701MG ∗Order-based production. !Absolute maximum ratings (Ta = 25°C) Parameter Symbol Green LD-701MG Unit Power dissipation PD 180 180 180 225 mW Forward current IF 20 20 20 25 mA Peak forward current IFP 60∗ 60∗ 60∗ 60∗ mA Reverse voltage VR 3 3 3 3 V Red LD-701VR Orange LD-701DU Yellow LD-701YY Operating temperature Topr −25~+75 °C Storage temperature Tstg −30~+85 °C ∗ Pulse width 1ms duty 1 / 5 LD-701 Series LED displays ! Electrical and optical characteristics (Ta = 25°C) Parameter Red Symbol Conditions Orange Yellow Green Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Forward voltage VF IF = 10mA − 2.0 3.0 − 2.0 3.0 − 2.1 3.0 − 2.1 3.0 V Reverse current IR VR = 3V − − 10 − − 10 − − 10 − − 10 µA Peak wavelength λP IF = 10mA − 650 − − 610 − − 585 − − 563 − nm Spectral line half width ∆λ IF = 10mA − 40 − − 40 − − 40 − − 40 − nm Electrical and optical values are guaranteed values per element. !Luminous intensity vs. wavelength Axial Luminous Intensity 1.0 0.8 Green Yellow Red Orange 0.6 0.4 0.2 0 500 550 600 650 700 750 Wavelength : λP (nm) ! Luminous intensity Type Min. Typ. Max. Unit Red LD-701VR 3.6 10 − mcd Orange LD-701DU 3.6 10 − mcd Yellow LD-701YY 2.2 6.3 − mcd Green LD-701MG 3.6 10 − mcd Color Note 1: Measured at IF = 10mA Note 2: Current passes through all elements. ! Operation notes When forming leads, the bend should be at least 2mm from the base of the package. Solder after forming the leads, and ensure that the inside of the LED is not subjected to mechanical stress while it is hot.