CEM880 5th Gen. Intel® Core i7 & 4th Gen. Intel® Core™ i7/i5/i3 & Celeron® Processor COM Express Type 6 Module with Intel® QM87 On-board DDR3L (optional) NEW QM87 DDR3L SODIMM Features ● 5th Gen. Intel® Core i7 (Broadwell) & 4th Gen. Intel® Qual/ Dual Core™ i7/i5/i3 and Celeron® Processor (Haswell/ Haswell Refresh) ● Intel® QM87 chipset ● On-board 4 GB DDR3L (optional) and 1 SO-DIMM max. up to 8 GB ● Max. up to 24 lanes of PCIe ● 4 SATA-600 interfaces ● 4 USB 3.0 ports ● TPM support DDR3L Embedded SBCs >EPIC COM Express Interface Connector USB USB 3.0 TripleView Full Solid Cap Design AiRD CPU System Memory Chipset BIOS Watchdog Timer Expansion Interface Battery Lithium Power Requirements Size Board Thickness Temperature Operation Humidity SATA Hardware Monitoring Ethernet Embedded SBCs >Nano-ITX Display 5th Gen. Intel® Core i Processor (Broadwell), i7-5700EQ & 4th Gen. Intel® Core™ i Processor (Haswell/ Haswell Refresh) with i7-4700EQ (47W), i5-4422E (25W), i3-4110E (37W), Celeron® 2000E (37W) 1st bank as on-board extended temperature DDR3L chips up to 4 GB (optional) 1 x 204-pin SO-DIMM supports DDR3L up to max. up to 8 GB Intel® QM87 AMI uEFI with Intel® Active Management Technology 9.0 supported 255 levels, 1~255 sec. 1 x PCIe x16 v3.0 (8GT/s) configurable supports up to 4 bus controller as (1 x16, 2 x8, 1 x 8+2 x4) 8 x PCIe x1 devices (7 x 1 while internal LAN is connected) N/A TBD 125 x 95 mm 2.0 mm -40ºC ~ +85ºC (-40ºF ~ +185ºF), operation 10% ~ 95% relative humidity, non-condensing I/O MIO Rear view Ext. Temp System Audio USB TPM 1.2 SMBus Digital I/O 2 Systems on Modules Embedded SBCs >3.5" Capa Intel® 4th Gen Core Processor DDR3L SBC Services and Solutions 1 x LPC interface 1 x SPI interface 4 x SATA-600, support Intel® Rapid Start Technology Intel® Smart Response Technology Yes 1 port as 10/100/1000Mbps supports Wake-on-LAN, PXE Boot ROM with Intel® i217LM HD link interface to baseboard for Codec 8 x USB 2.0 and 4 x USB 3.0 ST for trusted platform Yes 4 channels IN & 4 channels OUT * All specifications and photos are subject to change without notice. Chipset Memory Size Display Interface Intel® Gen 7.5 3D Graphics Intel® InTru™ 3D, Intel® Quick Sync Video 2.0, Intel® Clear Video HD Technology Gfx APIs - DX11, OCL1.1, OGL 3.1 3 independent displays DVMT Gfx physical memory up to 256MB DVMT Gfx pre-allocated memory up to 1024MB 1 x VGA 1 x LVDS; 18/24-bit single/dual channel 3 x DDI (DP, HDMI, DVI) Embedded SBCs >Pico-ITX Embedded SBCs >PC/104 Packing List Quick installation guide, user's manual/utility CD Ordering Information Standard CEM880PVG-i7-4700EQ (P/N: E38D880100) CEM880PVG-i5-4422E (P/N: E38D880103) CEM880PVG-i3-4110E (P/N: E38D880104) CEM880PVG-CEL-2000E (P/N: E38D880105) Optional CEM94006 (P/N: E394006100) TS001-CEM880 (P/N: E39J001100) TS002-CEM880 (P/N: E39J002100) TS003-CEM880 (P/N: E39J003100) TS004-CEM880 (P/N: E39J004100) a x i o m te k . c o m COM Express type 6 Module with Intel® Core™ i7-4700EQ 2.4 GHz, VGA/LVDS/DP, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 Module with Intel® Core™ i5-4422E 1.8 GHz, VGA/LVDS/DP, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 Module with Intel® Core™ i3-4110E 2.6 GHz, VGA/LVDS/DP, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 Module with Intel® Celeron® 2000E 2.2 GHz, VGA/LVDS/DP, 10/100/1000Mbps Ethernet, USB 3.0 and TPM ATX from factor type 6 evaluation board High profile heatsink with fan (L=95 mm, W=125 mm, H=27 mm) Low profile heatsink with fan (L=95 mm, W=125 mm, H=20 mm) High profile heatsink without fan (L=95 mm, W=125 mm, H=27 mm) Heatspreader for CEM880 © 2015 Axiomtek Co., Ltd. All rights reserved. Industrial Mother-boards Slot CPU Cards ARM Embedded Boards Accessories Appendix 72