PHOTOCOUPLER PS2715-1 HIGH CTR, AC INPUT 4-PIN SOP PHOTOCOUPLER −NEPOC Series− DESCRIPTION The PS2715-1 is an optically coupled isolator containing GaAs light emitting diodes and an NPN silicon phototransistor in a plastic SOP for high density applications. The package is an SOP (Small Outline Package) type for high density mounting applications. FEATURES • AC input response PIN CONNECTION (Top View) • High current transfer ratio (CTR = 200% TYP. @ IF = ±1 mA) • High isolation voltage (BV = 3 750 Vr.m.s.) 4 3 • Small and thin package (4-pin SOP) • Ordering number of tape product: PS2715-1-F3, F4 • Pb-Free product 1 • Safety standards 2 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector • UL approved: File No. E72422 • DIN EN60747-5-2 (VDE0884 Part2) approved (Option) APPLICATIONS • Programmable logic controllers • Modem/FAX Document No. PN10247EJ03V0DS (3rd edition) Date Published March 2006 CP(K) The mark shows major revised points. © NEC Compound Semiconductor Devices, Ltd. 2000, 2006 PS2715-1 PACKAGE DIMENSIONS (UNIT: mm) 4±0.5 0.1±0.1 2.1±0.2 0.15 +0.10 –0.05 7.0±0.3 4.4 2.54 0.5±0.3 0.4 +0.10 –0.05 0.25 M MARKING EXAMPLE No. 1 pin Mark Trade Mark Type Number Assembly Lot 2715 N601 *1 N 6 01 Week Assembled Year Assembled (Last 1 Digit) CTR Rank Code *1 Bar : Pb-Free Remark "PS" and "-1" are omitted from original type number. 2 Data Sheet PN10247EJ03V0DS PS2715-1 ORDERING INFORMATION Part Number Order Number PS2715-1 PS2715-1-A PS2715-1-F3 PS2715-1-F3-A PS2715-1-F4 PS2715-1-F4-A PS2715-1-V Solder Plating Pb-Free Safety Standard Packing Style Specification Approval Magazine case 100 pcs Standard products Embossed Tape 3 500 pcs/reel (UL approved) PS2715-1-V-A Magazine case 100 pcs DIN EN60747-5-2 PS2715-1-V-F3 PS2715-1-V-F3-A Embossed Tape 3 500 pcs/reel (VDE0884 Part2) PS2715-1-V-F4 PS2715-1-V-F4-A Application Part *1 Number PS2715-1 Approved (Option) *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, TA = 25°C) Parameter Symbol Ratings Unit IF ±50 mA ∆PD/°C 0.8 mW/°C PD 80 mW IFP ±0.5 A Collector to Emitter Voltage VCEO 40 V Emitter to Collector Voltage VECO 5 V IC 40 mA ∆PC/°C 1.5 mW/°C PC 150 mW BV 3 750 Vr.m.s. Operating Ambient Temperature TA –55 to +100 °C Storage Temperature Tstg –55 to +150 °C Diode Forward Current (DC) Power Dissipation Derating Power Dissipation Peak Forward Current Transistor *1 Collector Current Power Dissipation Derating Power Dissipation Isolation Voltage *2 *1 PW = 100 µs, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together. Data Sheet PN10247EJ03V0DS 3 PS2715-1 ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode Transistor Symbol Conditions Forward Voltage VF IF = ±5 mA Terminal Capacitance Ct V = 0 V, f = 1 MHz Collector to Emitter Dark ICEO IF = 0 mA, VCE = 40 V CTR IF = ±1 mA, VCE = 5 V MIN. TYP. MAX. Unit 1.15 1.4 V 60 pF 100 nA 400 % 0.3 V Current Coupled Current Transfer Ratio 100 200 (IC/IF) Collector Saturation Voltage VCE (sat) IF = ±1 mA, IC = 0.2 mA Isolation Resistance RI-O VI-O = 1 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz Rise Time *1 tr *1 Fall Time VCC = 5 V, IC = 2 mA, RL = 100 Ω tf Pulse Input VCC PW = 100 µs Duty cycle = 1/10 IF In monitor 4 Ω 11 0.4 pF 4 µs 5 *1 Test circuit for switching time VOUT 50 Ω 10 RL = 100 Ω Data Sheet PN10247EJ03V0DS PS2715-1 TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = 25°C) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) 80 60 40 20 50 25 0 Forward Current IF (mA) 150 100 50 25 75 100 Ambient Temperature TA (˚C) FORWARD CURRENT vs. FORWARD VOLTAGE COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE 10 000 TA = +100˚C +60˚C +25˚C 1 0˚C –25˚C –50˚C 0.1 0.01 0.0 0.5 1.0 1.5 2.0 1 000 VCE = 40 V 20 V 10 V 100 10 1 –25 0 25 50 75 100 Forward Voltage VF (V) Ambient Temperature TA (˚C) COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 25 100 10 mA 5 mA 2 mA IF = 10 mA 20 Collector Current IC (mA) Collector Current IC (mA) 50 Ambient Temperature TA (˚C) 100 10 200 0 100 75 Collector to Emitter Dark Current ICEO (nA) Diode Power Dissipation PD (mW) 100 5 mA 15 10 2 mA 5 1 mA 0.5 mA 0 2 4 6 8 10 10 1 mA 1 0.1 0.0 Collector to Emitter Voltage VCE (V) IF = 0.5mA 0.2 0.4 0.6 0.8 1.0 Collector Saturation Voltage VCE(sat) (V) Remark The graphs indicate nominal characteristics. Data Sheet PN10247EJ03V0DS 5 PS2715-1 CURRENT TRANSFER RATIO vs. FORWARD CURRENT 1.6 500 1.4 1.2 1.0 0.8 0.6 0.4 Normalized to 1.0 at TA = 25˚C, IF = 1 mA, VCE = 5 V 0.2 0.0 –50 0 –25 25 50 VCE = 5 V, n=3 400 300 200 100 0 0.01 100 75 0.1 1 100 10 Ambient Temperature TA (˚C) Forward Current IF (mA) SWITCHING TIME vs. LOAD RESISTANCE SWITCHING TIME vs. LOAD RESISTANCE 100 1 000 IC = 2 mA, VCC = 5 V, CTR = 200% tf IF = 1 mA, VCC = 5 V, CTR = 200% Switching Time t (µs) Switching Time t (µ s) Current Transfer Ratio CTR (%) Normalized Current Transfer Ratio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 10 tf tr td 1 100 ts tr 10 td 1 ts 0.1 10 100 0.1 100 10 k 1k 1k 10 k 100 k Load Resistance RL (kΩ) Load Resistance RL (kΩ) LONG TERM CTR DEGRADATION FREQUENCY RESPONSE 1.2 IF = 1 mA 1.0 –5 CTR (Relative Value) Normalized Gain Gv 0 100 Ω RL = 1 kΩ –10 300 Ω –15 TA = 25˚C 0.6 1 10 100 1 000 0 10 102 103 104 Time (Hr) Frequency f (kHz) Remark The graphs indicate nominal characteristics. 6 TA = 60˚C 0.4 0.2 –20 –25 0.1 0.8 Data Sheet PN10247EJ03V0DS 105 106 PS2715-1 TAPING SPECIFICATIONS (in millimeters) 1.55±0.1 2.9 MAX. 7.4±0.1 5.5±0.05 1.5+0.1 –0 12.0±0.2 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.4±0.1 4.6±0.1 0.3 8.0±0.1 Tape Direction PS2715-1-F4 PS2715-1-F3 Outline and Dimensions (Reel) φ 21.0±0.8 φ 13.0±0.2 R 1.0 φ 100±1.0 2.0±0.5 φ13.0±0.2 φ 330±2.0 2.0±0.5 13.5±1.0 17.5±1.0 11.9 to 15.4 Outer edge of flange Packing: 3 500 pcs/reel Data Sheet PN10247EJ03V0DS 7 PS2715-1 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One (Allowed to be dipped in solder including plastic mold portion.) • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. 8 Data Sheet PN10247EJ03V0DS PS2715-1 (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10247EJ03V0DS 9 PS2715-1 When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. • The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. 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The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 10 Data Sheet PN10247EJ03V0DS PS2715-1 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. 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