ROHM RF101L4STE25

Fast Recovery Diode
RF101L4S
Applications
General rectification
Land size figure (Unit : mm)
Dimensions (Unit : mm)
2.0
①
②
0.1±0.02
0.1
4.2
5.0±0.3
8
6
1.2 ±0.3
8
6
4.5±0.2
3)Ultra high switching speed
4)Low switching loss
2.0
2.6±0.2
Features
1)Small power mold type. (PMDS)
2)Ultra low VF
PMDS
2.0±0.2
1.5±0.2
Construction
Silicon epitaxial planar
Structure
ROHM : PMDS
JEDEC : SOD-106
①
② Manufacture date
Taping dimensions (Unit : mm)
2.0±0.05
0.3
φ1.55±0.05
12±0.2
5.5±0.05
5.3±0.1
0.05
9.5±0.1
1.75±0.1
4.0±0.1
φ1.55
2.9±0.1
4.0±0.1
2.8MAX
Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Reverse voltage (repetitive)
Reverse voltage (DC)
Average rectified forward current (*1)
VRM
VR
Forward current surge peak (60Hz・1cyc)
Io
IFSM
Junction temperature
Storage temperature
Tj
Tstg
Limits
Unit
400
400
1
25
150
55 to 150
V
V
A
A
°C
°C
(*1)Mounted on epoxy board. 180°Half sine wave
Electrical characteristics (Ta=25°C)
Parameter
Forward voltage
Reverse current
Reverse recovery time
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©2011 ROHM Co., Ltd. All rights reserved.
Symbol
VF
Min.
Typ.
Max.
-
-
1.25
V
IF=1.0A
IR
-
-
10
μA
trr
-
-
25
ns
VR=400V
IF=0.5A,IR=1A,Irr=0.25*IR
1/3
Unit
Conditions
2011.06 - Rev.B
Data Sheet
RF101L4S
Electrical characteristics curves
1
10000
100
f=1MHz
Ta=125℃
Ta=75℃
0.1
Ta=150℃
Ta=25℃
Ta=-25℃
0.01
0.001
0
200
400
600
800
1000
Ta=75℃
100
Ta=25℃
10
Ta=-25℃
1
1
0
1300
50
1000
AVE:1007mV
900
400
350
300
250
200
150
AVE:24.8nA
100
AVE:41.8pF
40
30
20
0
Ct DISPERSION MAP
150
8.3ms
100
AVE:48.0A
50
1000
Ta=25℃
IF=0.5A
IR=1A
Irr=0.25*IR
n=10pcs
25
20
15
PEAK SURGE
FORWARD CURRENT:IFSM(A)
1cyc
AVE:18.4ns
10
5
0
0
Ifsm
8.3ms 8.3ms
1cyc
100
10
1
1
trr DISPERSION MAP
IFSM DISRESION MAP
PEAK SURGE
FORWARD CURRENT:IFSM(A)
Ifsm
t
100
10
1
10
TIME:t(ms)
IFSM-t CHARACTERISTICS
100
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© 2011 ROHM Co., Ltd. All rights reserved.
IM=10mA
IF=100mA
100
3
DC
1m
100
time
2.5
Rth(j-a)
D=1/2
300u
Rth(j-c)
10
1
FORWARD POWER
DISSIPATION:Pf(W)
TRANSIENT
THAERMAL IMPEDANCE:Rth (℃/W)
1000
10
NUMBER OF CYCLES
IFSM-CYCLE CHARACTERISTICS
Mounted on epoxy board
1000
Ta=25℃
f=1MHz
VR=0V
n=10pcs
50
10
30
Ifsm
30
60
IR DISPERSION MAP
REVERSE RECOVERY TIME:trr(ns)
PEAK SURGE
FORWARD CURRENT:IFSM(A)
70
0
VF DISPERSION MAP
200
25
80
50
800
10
15
20
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
90
Ta=25℃
VR=400V
n=30pcs
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
1100
5
100
450
REVERSE CURRENT:IR(nA)
1200
0
100 150 200 250 300 350 400
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS
500
Ta=25℃
IF=1A
n=30pcs
10
0.1
1200
FORWARD VOLTAGE:VF(mV)
VF-IF CHARACTERISTICS
FORWARD VOLTAGE:VF(mV)
Ta=125℃
1000
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
REVERSE CURRENT:IR(nA)
FORWARD CURRENT:IF(A)
Ta=150℃
2
Sin(θ=180)
1.5
1
0.5
0.1
0.001
0
0.01
0.1
1
10
100
TIME:t(s)
Rth-t CHARACTERISTICS
2/3
1000
0
0.5
1
1.5
2
2011.06 - Rev.B
Data Sheet
RF101L4S
2
t
T
VR
D=t/T
VR=200V
Tj=150℃
DC
1
Sin(θ=180)
0A
0V
Io
t
2
T
VR
D=t/T
VR=200V
Tj=150℃
1
0
25
50
75
100
125
AMBIENT TEMPERATURE:Ta(℃)
Derating Curve゙(Io-Ta)
150
25
AVE:16.3kV
20
15
10
AVE:4.60kV
5
0
0
ELECTROSTATIC
DISCHARGE TEST ESD(KV)
D=1/2
Io
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
30
3
0A
0V
0
25
50
75
100
CASE TEMPARATURE:Tc(℃)
Derating Curve゙(Io-Tc)
125
150
0
C=200pF
R=0Ω
C=100pF
R=1.5kΩ
ESD DISPERSION MAP
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© 2011 ROHM Co., Ltd. All rights reserved.
3/3
2011.06 - Rev.B
Notice
Notes
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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The Products are not designed or manufactured to be used with any equipment, device or
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RF101L4STE25