MC10EL07, MC100EL07 5.0 V ECL 2‐Input XOR/XNOR The MC10EL/100EL07 is a 2-input XOR/XNOR gate. The device is functionally equivalent to the E107 device with higher performance capabilities. With propagation delays and output transition times significantly faster than the E107, the EL07 is ideally suited for those applications which require the ultimate in AC performance. The 100 Series contains temperature compensation. Features • 260 ps Propagation Delay • ESD Protection: Human Body Model; > 1.0 KV MARKING DIAGRAMS* 8 1 Machine Model; > 100 V SOIC−8 D SUFFIX CASE 751 • PECL Mode Operating Range: VCC = 4.2 V to 5.7 V • http://onsemi.com with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V Internal Input Pulldown Resistors 8 HEL07 ALYW G 1 1 TSSOP−8 DT SUFFIX CASE 948R KEL07 ALYW G 1 8 8 • • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test • Moisture Sensitivity Level 1 8 1 8 HL07 ALYWG G 1 KL07 ALYWG G 4P M G G Oxygen Index: 28 to 34 • Transistor Count = 47 devices • Pb−Free Packages are Available 1 4 2D M G G For Additional Information, see Application Note AND8003/D • Flammability Rating: UL 94 V−0 @ 0.125 in, 1 4 DFN8 MN SUFFIX CASE 506AA NC 1 8 VCC D0 2 7 Q D1 3 6 Q NC 4 5 VEE H = MC10 K = MC100 4P = MC10 2D = MC100 A = Assembly Location L Y W M G = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Figure 1. Logic Diagram and Pinout Assignment © Semiconductor Components Industries, LLC, 2008 August, 2008 − Rev. 7 1 Publication Order Number: MC10EL07/D MC10EL07, MC100EL07 Table 1. PIN DESCRIPTION PIN D0, D1 Q, Q VCC VEE NC EP FUNCTION ECL Data Inputs ECL Data Outputs Positive Supply Negative Supply No Connect (DFN8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. Table 2. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C qJC Thermal Resistance (Junction−to−Case) 35 to 40 °C/W Pb Pb−Free (Note 1) VI VCC VI VEE DFN8 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) http://onsemi.com 2 MC10EL07, MC100EL07 Table 3. 10EL SERIES PECL DC CHARACTERISTICS VCC= 5.0 V; VEE= 0.0 V (Note 2) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 14 17 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 5) 3920 4010 4110 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 3) 3050 3200 3350 3050 3210 3370 3050 3227 3405 mV VIH Input HIGH Voltage 3770 4110 3870 4190 3940 4280 mV VIL Input LOW Voltage 3050 3500 3050 3520 3050 3555 mV IIH Input HIGH Current IIL Input LOW Current D0 D1 250 150 250 150 0.5 0.5 250 150 0.3 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V for +25°C and +85°C or VEE can vary +0.06 V / −0.5 V for −40°C. 3. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 4. 10EL SERIES NECL DC CHARACTERISTICS VCC= 0.0 V; VEE= −5.0 V (Note 4) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 14 17 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 5) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 5) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV VIH Input HIGH Voltage −1230 −890 −1130 −810 −1060 −720 mV VIL Input LOW Voltage −1950 −1500 −1950 −1480 −1950 −1445 mV IIH Input HIGH Current IIL Input LOW Current D0 D1 250 150 0.5 250 150 0.5 250 150 0.3 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C. 5. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 3 MC10EL07, MC100EL07 Table 5. 100EL SERIES PECL DC CHARACTERISTICS VCC= 5.0 V; VEE= 0.0 V (Note 6) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 16 20 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 7) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 7) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV VIH Input HIGH Voltage 3835 4120 3835 4120 3835 4120 mV VIL Input LOW Voltage 3190 3525 3190 3525 3190 3525 mV IIH Input HIGH Current IIL Input LOW Current D0 D1 250 150 0.5 250 150 0.5 250 150 0.5 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 7. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 6. 100EL SERIES NECL DC CHARACTERISTICS VCC= 0.0 V; VEE= −5.0 V (Note 8) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 16 20 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 9) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 9) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage −1810 −1475 −1810 −1475 −1810 −1475 mV IIH Input HIGH Current IIL Input LOW Current D0 D1 250 150 0.5 250 150 0.5 250 150 0.5 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 9. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 4 MC10EL07, MC100EL07 Table 7. AC CHARACTERISTICS VCC= 5.0 V; VEE= 0.0 V or VCC= 0.0 V; VEE= −5.0 V (Note 10) −40°C Symbol Characteristic fmax Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output tJITTER Random Clock Jitter tr tf Output Rise/Fall Times Q (20% − 80%) Min 25°C Typ Max Min Typ 85°C Max Min Typ Max >2 90 250 435 150 0.5 100 GHz 260 395 170 0.5 225 350 100 Unit 280 415 0.5 225 350 100 225 ps ps 350 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. 10 Series: VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C. 100 Series: VEE can vary +0.8 V / −0.5 V. Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 3.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) http://onsemi.com 5 MC10EL07, MC100EL07 ORDERING INFORMATION Package Shipping† SOIC−8 98 Units / Rail MC10EL07DG SOIC−8 (Pb−Free) 98 Units / Rail MC10EL07DR2 SOIC−8 2500 / Tape & Reel MC10EL07DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10EL07DT TSSOP−8 100 Units / Rail MC10EL07DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10EL07DTR2 TSSOP−8 2500 / Tape & Reel MC10EL07DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC10EL07MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel SOIC−8 98 Units / Rail MC100EL07DG SOIC−8 (Pb−Free) 98 Units / Rail MC100EL07DR2 SOIC−8 2500 / Tape & Reel MC100EL07DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100EL07DT TSSOP−8 100 Units / Rail MC100EL07DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100EL07DTR2 TSSOP−8 2500 / Tape & Reel MC100EL07DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC100EL07MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC10EL07D MC10EL07MNR4G MC100EL07D MC100EL07MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 6 MC10EL07, MC100EL07 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8 _ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EL07, MC100EL07 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U V S 0.25 (0.010) B −U− 4 M A −V− S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 8 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10EL07, MC100EL07 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ TOP VIEW 0.10 C 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10EL07/D