1N914BW

®
SEMICONDUCTOR
400mW SOD-123 SURFACE MOUNT
Green Product
Small Outline Flat Lead Plastic Package
General Purpose Application
Fast Switching Diode
Absolute Maximum Ratings
Symbol
TA = 25°C unless otherwise noted
Parameter
PD
Power Dissipation
Value
Units
400
mW
-65 to +150
°C
Operating Junction Temperature
+150
°C
VRSM
Non-Repetitive Peak Reverse Voltage
100
V
VRRM
Repetitive Peak Reverse Voltage
75
V
Repetitive Peak Forward Current
300
mA
Continuous Forward Current
Peak Forward Surge Current
(Pulse Width=1us)
150
mA
2
A
TSTG
Storage Temperature Range
TJ
IFRM
IO
IFSM
SOD-123 Flat Lead
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
DEVICE MARKING CODE:
Fast Switching Device (TRR <4.0 nS)
General Purpose Diodes
Flat Lead SOD-123 Small Outline Plastic Package
Surface Device Type Mounting
Device Type
Device Marking
1N4148W
1N4448W
1N914BW
D1
D2
D3
RoHS Compliant
Green EMC
Matte Tin(Sn) Lead Finish
Band Indicates Cathode
Electrical Characteristics
Symbol
TA = 25°C unless otherwise noted
Parameter
Limits
Test Condition
Min
BV
Breakdown Voltage
IR
Reverse Leakage Current
VF
Forward Voltage
IR=100µA
100
IR=5µA
75
Volts
VR=20V
VR=75V
1N4448W, 1N914BW
TC1N444
8W, 1N4148W
1N4448W, 1N914BW
TRR
Reverse Recovery Time
IF=5mA
Unit
Max
0.62
25
nA
5
µA
0.72
IF=10mA
1.0
IF=100mA
1.0
Volts
IF=10mA
IR=60mA
4
nS
4
pF
RL=100Ω
IRR=1mA
C
Capacitance
VR=0V, f=1MHZ
Number: DB-022
July 2011 Release, Revision F
Page 1
1N4148W/1N4448W/1N914BW
TAK CHEONG
TAK CHEONG
®
SEMICONDUCTOR
Typical Performance Characteristics
Total Capacitance
Forward Voltage vs Ambient Temperature
Number: DB-022
July 2011 Release, Revision F
Page 2
TAK CHEONG
®
SEMICONDUCTOR
Power Derating Curve
PD-Power Passipation [mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
175
200
Temperature [℃ ]
Reverse Current vs Reverse Voltage
Number: DB-022
July 2011 Release, Revision F
Page 3
TAK CHEONG
®
SEMICONDUCTOR
Flat Lead SOD-123 Package Outline
Note: Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions.
Number: DB-022
July 2011 Release, Revision F
Page 4
TAK CHEONG
®
DISC LA I MER NOTIC E
NOTICE
The information presented in this document is for reference only. Tak Cheong reserves the right to make
changes without notice for the specification of the products displayed herein.
The product listed herein is designed to be used with ordinary electronic equipment or devices, and not
designed to be used with equipment or devices which require high level of reliability and the malfunction of with
would directly endanger human life (such as medical instruments, transportation equipment, aerospace
machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor
Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such
improper use of sale.
This publication supersedes & replaces all information reviously supplied. For additional information, please visit
our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further assistance.
Number: DB-100
April 14, 2008 / A