PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 (C36000) Contact Beryllium copper (C17200) Accepted pin Ø 0.36 to 0.46 mm Insertion force 0.3 N typ. Withdrawal force 0.15 N typ. (polished steel gauge Ø 0.43 mm) Mechanical life Min. 100 cycles Rated current 1A Contact resistance Max. 10 m Dielectric strength Min. 500 V RMS ORDERING INFORMATION: PP Plating code Sleeve Clip 87 Tin Gold flash 83 Tin Gold 0.75 µm Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here. For example a 20x20 pin configuration with 256 contacts as shown here becomes 514-83-256M20-001148. PHONE PRECI-DIP SA Rue Saint-Henri 11 P.P.Box 834 CH-2800 Delémont / Switzerland +41 (0)32 421 04 00 FAX +41 (0)32 421 04 01 E-MAIL [email protected] www.precidip.com TECHNICAL ASSISTANCE GENERAL SPECIFICATIONS: The values listed below are general specs applying for PRECI-DIP PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data. Operating temperature range -55 ... +125 °C Climatic category (IEC) 55/125/21 Operating humidity range annual mean 75 % Max working voltage 100 VRMS/150 VDC (2.54 mm grid) PRECI-DIP sockets are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal, Control and Power Applications", File Nr. E174442 MECHANICAL CHARACTERISTICS: Clip retention Min. 40 N (no displacement under axial force applied) Contact (sleeve / clip) retention Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2 ELECTRICAL CHARACTERISTICS: Insulation resistance between any two adjacent contacts Min. 10'000 M at 500 V AC Capacitance between any two adjacent contacts Max. 1 pF (PLCC max. 2 pF) Self inductance per contact Max. 2 nH ENVIRONMENTAL CHARACTERISTICS: The sockets withstand the following environmental tests without mechanical and electrical defects: - Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h - Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h - Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h - Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min - Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis - Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis During the above two tests no contact interruption >50 ns does appear. - Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7 - Resistance to soldering heat J-STD-0020C, 260°C, 20 s - Moisture sensitivity J-STD-020C level 1 - Resistance to corrosion : 1) Salt spray test IEC 60068-2-11.Ka: 48 h 2) Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH 3) Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH SOLDERLESS COMPLIANT PRESS-FIT CHARACTERISTICS: PRESS-FIT CHARACTERISTICS MEASURED ACC. TO IEC 60352-5 - Press-in force: 90 N max. (at min. hole dia.) / 65 N typ. - Push-out force: 30 N min. (at max. hole dia.) / 50 N typ. - Push-out 3rd cycle: 20 N min. (at max. hole dia.) PCB HOLE DIMENSIONS - 2.54 mm grid: Finished hole Ø: 1 + 0.09/-0.06 mm | Drilled hole Ø: 1.15 ± 0.02 mm PHONE PRECI-DIP SA Rue Saint-Henri 11 P.P.Box 834 CH-2800 Delémont / Switzerland +41 (0)32 421 04 00 FAX +41 (0)32 421 04 01 E-MAIL [email protected] www.precidip.com - Interstitial grid: Finished hole Ø: 0.7 + 0.09/-0.06 mm | Drilled hole Ø: 0.8 ± 0.02 mm PCB HOLE PLATING - PCB surface finish: Hole plating - Tin: 5-15 µm tin over min. 25 µm copper - Copper: min. 25 µm copper - Gold over nickel: 0.05-0.2 µm gold over 2.5-5 µm nickel over min. 25 µm copper PHONE PRECI-DIP SA Rue Saint-Henri 11 P.P.Box 834 CH-2800 Delémont / Switzerland +41 (0)32 421 04 00 FAX +41 (0)32 421 04 01 E-MAIL [email protected] www.precidip.com