Investor Fact Sheet www.umc.com Company Profile Industry: Semiconductor Foundry Services Date Incorporated: May, 1980 About UMC: UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include volume production 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the automotive industry’s highest-rated AEC-Q100 Grade-0 manufacturing capabilities for production of ICs found in cars. UMC’s 10 wafer fabs are strategically located throughout Asia and are able to produce over 500,000 wafers per month. The company employs more than 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com. Chronology 1980 May UMC established 1985 Jul Becomes the first IC company to list on the Taiwan Stock Exchange 1995 Jul Jul –Sep Begins transformation into a pure-play foundry Establishes three joint venture foundries; USC, UICC, USIC 1998 Apr Acquires Holtek Semiconductor and renames the fab UTEK 1999 Nov Begins construction of a 300mm fab in Taiwan’s Tainan Science Park, Fab 12A 2000 Jan Sep Dec Mar Consolidates five companies: UMC, USC, UTEK, USI, and UICC Debuts on the New York Stock Exchange Announces plan to establish advanced 300mm foundry in Singapore (UMCi) Delivers foundry’s first customer ICs built on 90nm 2004 May Dec 90nm full qualification and volume production Fully acquires its subsidiary UMCi; renames UMC Fab 12i 2005 Jan Delivered the foundry industry’s first 65nm customer products 2007 Jan Expands advanced technology complex in Tainan Science Park 2008 Sep Named as a Global Index Component for Dow Jones Sustainability Indexes 2010 May Celebrates 30th anniversary 2011 Nov Surpasses 90,000 45/40-nanometer wafer shipments 2012 May Jun Fab 12A Phase 5 & 6 groundbreaking Licenses IBM’s FinFET 3DIC technology 2013 Feb Jun Acquires majority stake in SuZhou, China-based HeJian Technology Establishes the Specialty Technology Center of Excellence in Singapore 2014 Aug Dec Becomes a minority shareholder of Fujitsu’s new 300mm foundry company Enters a joint venture for a 12” fab in Xiamen, China 2015 Mar Dec Groundbreaking for Fab 12X in Xiamen, China Makes second round investment in Fujitsu’s 300mm foundry company 2003 Solid Growth Strategy Financial Highlights 2015 Revenue Breakdown Consolidated 2013‐15 results are based on IFRS accounting standards 2015 2014 2013 2012 2011 0.25/0.35um 12% Income Statement (NT$ billion) Net Operating Revenue 31.8 31.9 23.5 22.5 24.0 Operating Income(Loss) 10.8 10.1 4.0 9.1 10.1 Net Income(Loss) 12.8 11.5 12.1 7.9 10.8 Total Liabilities Long-term Liabilities Stockholders' Equity 40nm 24% 0.15/0.18um 11% 337.4 313.2 295.9 264.3 258.5 53.3 45.7 50.8 31.8 30.8 108.5 88.2 83.5 61.8 50.6 60.3 40.1 35.3 28.9 15.2 90nm 5% 65nm 22% Other 228.8 225.0 212.4 202.5 207.9 6% Computer Cash Flow Statement(NT$ billion) Cash Flow from Operations Cash Flow from Investing Cash Flow from Financing Net Cash Flow Free Cash Flow ≤ 40nm 34% 0.11/0.13um 13% Balance Sheet(NT$ billion) Cash and Cash equ. ≤ 28nm 10% 144.8 140.0 123.8 106.0 105.9 Gross Profit Total Assets ≥ 0.5um 3% 60.0 44.8 43.5 41.5 12% 45.2 (68.7) (42.6) (31.5) (46.5) (51.8) 15.0 (8.3) (3.9) 6.5 4.0 7.1 (4.6) 8.3 0.9 (2.1) (0.5) 1.6 3.1 (9.3) (1.2) 32.2 28.2 28.2 23.4 19.6 Communication Consumer 54% 28% Financial Analysis(%) Debt Ratio Current Ratio 196.5 201.4 184.2 222.8 191.4 Quick Ratio 155.4 151.0 147.6 175.2 156.0 Research Coverage Solid Manufacturing Base B ank of A m erica Merrill Lynch B arclays Capital B NP Paribas C IM B C iti C LS A C redit S uisse D aiwa D eutsche Securities G oldm an Sachs H SB C JP M organ KGI Morgan S tanley N om ura S anford C . B ernstein U BS Y uanta LAST UPDATED: Feb. 2016 3, Li-Hsin 2nd Road, Hsinchu, Taiwan 300, R.O.C. Tel: +886 (3) 578 2258 www.umc.com E-mail: [email protected]