Design Assistance Customised Pack Sizes / Qtys Assembly Assistance Support for all industry recognised supply formats: Die handling consultancy Hi-Rel die qualification Hot & Cold die probing Electrical test & trimming o Waffle Pack o Gel Pak o Tape & Reel Onsite storage, stockholding & scheduling 100% Visual Inspection o MIL-STD 883 Condition A o MIL-STD 883 Condition A On-site failure analysis Bespoke 24 Hour monitored storage systems for secure long term product support On-site failure analysis Contact [email protected] For price, delivery and to place orders HMC-APH196 www.analog.com www.micross.com Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK HMC-APH196 v02.0209 LINEAR & POWER AMPLIFIERS - CHIP 3 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 17 - 30 GHz Typical Applications Features This HMC-APH196 is ideal for: Output IP3: +31 dBm • Point-to-Point Radios P1dB: +22 dBm • Point-to-Multi-Point Radios Gain: 20 dB @ 20 GHz • VSAT Supply Voltage: +4.5V • Military & Space 50 Ohm Matched Input/Output Die Size: 3.3 x 1.95 x 0.1 mm Functional Diagram General Description The HMC-APH196 is a two stage GaAs HEMT MMIC Medium Power Amplifier which operates between 17 and 30 GHz. The HMC-APH196 provides 20 dB of gain at 20 GHz, and an output power of +22 dBm at 1 dB compression from a +4.5V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation. The HMC-APH196 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as well as thermocompression and thermosonic wirebonding, making it ideal for MCM and hybrid microcircuit applications. All data Shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes. Electrical Specifi cations, TA = +25° C, Vdd1 = Vdd2 = 4.5V, Idd1 + Idd2 = 400 mA [2] Parameter Min Frequency Range Gain Typ Max Min 17 - 24 15 20 Typ Max Min 24 - 27 14 17 11 Typ Max 27 - 30 GHz 16 dB Input Return Loss 17 17 17 dB Output Return Loss 25 23 23 dB Output Power for 1 dB Compression (P1dB) Output Third Order Intercept (IP3) Supply Current (Idd1 + Idd2) 20 22 22 dBm 31 20 22 31 20 31 dBm 400 400 400 dBm [1] Unless otherwise indicated, all measurements are from probed die [2] Adjust Vgg1=Vgg2 between -1V to +0.3V (typ -0.5V) to achieve Idd total = 400 mA 3 - 160 Units For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-APH196 v02.0209 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 17 - 30 GHz Pulsed P1dB vs. Frequency 25 26 20 24 15 10 5 3 22 20 18 0 16 15 20 25 30 15 FREQUENCY (GHz) 25 30 FREQUENCY (GHz) Input Return Loss vs. Frequency Output Return Loss vs. Frequency 0 0 -5 -5 RETURN LOSS (dB) RETURN LOSS (dB) 20 -10 -15 -20 -25 -10 -15 -20 -25 -30 -30 15 20 25 FREQUENCY (GHz) 30 15 20 25 FREQUENCY (GHz) 30 LINEAR & POWER AMPLIFIERS - CHIP POUT (dBm) GAIN (dB) Pulsed Gain vs. Frequency Note: Measured Performance Characteristics (Typical Performance at 25°C) Vdd1 = Vdd2 = 4.5 V, Idd1 + Idd2 = 400 mA For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 161 HMC-APH196 v02.0209 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 17 - 30 GHz Absolute Maximum Ratings LINEAR & POWER AMPLIFIERS - CHIP 3 Drain Bias Voltage 6 Vdc Gate Bias Voltage -1 to +0.3 Vdc RF Input Power 10 dBm Thermal Resistance (Channel to die bottom) 35.7 °C/W Channel Temperature 180 °C Storage Temperature -65 °C to +150 °C Operating Temperature -55 °C to +85 °C Drain Bias Current (stage 1) 176 mA Drain Bias Current (stage 2) 440 mA ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing Die Packaging Information [1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 3 - 162 3. BACKSIDE METALLIZATION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002” For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-APH196 v02.0209 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 17 - 30 GHz Pad Descriptions Function Description 1 RFIN This pad is AC coupled and matched to 50 Ohms. 2, 4 Vgg1, Vgg2 Gate control for amplifier. Please follow “MMIC Amplifier Biasing Procedure” application note. See assembly for required external components. 3, 5 Vdd1, Vdd2 Power Supply Voltage for the amplifier. See assembly for required external components. 6 RFOUT This pad is AC coupled and matched to 50 Ohms. Die Bottom GND Die bottom must be connected to RF/DC ground. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 LINEAR & POWER AMPLIFIERS - CHIP Pad Number 3 - 163 HMC-APH196 v02.0209 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 17 - 30 GHz Assembly Diagram LINEAR & POWER AMPLIFIERS - CHIP 3 3 - 164 Note 1: Bypass caps should be 100 pF ceramic (single-layer) placed no further than 30 mils from the amplifier Note 2: Best performance obtained from use of <10 mil (long) by 3 by 0.5 mil ribbons on input and output. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-APH196 v02.0209 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 17 - 30 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). 0.102mm (0.004”) Thick GaAs MMIC Ribbon Bond 3 0.076mm (0.003”) RF Ground Plane Microstrip substrates should be placed as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. 0.102mm (0.004”) Thick GaAs MMIC Ribbon Bond 0.076mm (0.003”) RF Ground Plane Follow ESD precautions to protect against ESD Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pickup. 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010” Thick Alumina Thin Film Substrate Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. LINEAR & POWER AMPLIFIERS - CHIP The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 165