HMC156A


Design Assistance

Customised Pack Sizes / Qtys

Assembly Assistance

Support for all industry recognised
supply formats:

Die handling consultancy

Hi-Rel die qualification

Hot & Cold die probing

Electrical test & trimming
o Waffle Pack
o Gel Pak
o Tape & Reel

Onsite storage, stockholding &
scheduling

100% Visual Inspection
o MIL-STD 883 Condition A
o MIL-STD 883 Condition A

On-site failure analysis

Bespoke 24 Hour monitored
storage systems for secure long
term product support

On-site failure analysis
Contact
[email protected]
For price, delivery and to place orders
HMC156A
www.analog.com
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Analog Devices Welcomes
Hittite Microwave Corporation
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HMC156A
v00.0111
FREQUency MULTIPLIERS - Passive - CHIP
2
Typical Applications
Features
The HMC156A is suitable for:
Conversion Loss: 15 dB
• Wireless Local Loop
Fo, 3Fo, 4Fo Isolation: 38 dB
• LMDS, VSAT, and Point-to-Point Radios
Input Drive Level: 10 to 20 dBm
• UNII & HiperLAN
• Test Equipment
Functional Diagram
General Description
The HMC156A is a miniature frequency doubler in
a MMIC die. Suppression of undesired fundamental
and higher order harmonics is 38 dB typical with
respect to input signal levels. The doubler uses the
same diode/balun technology used in Hittite MMIC
mixers, features small size and requires no DC bias.
Electrical Specifications, TA = +25° C, As a Function of Drive Level
Input = +10 dBm
Parameter
Min.
Typ.
Input = +15 dBm
Max.
Min.
Typ.
Input = +20 dBm
Max.
Min.
Typ.
Max.
Units
Frequency Range, Input
1.1 - 2.1
0.8 - 2.4
0.7 - 2.3
GHz
Frequency Range, Output
2.2 - 4.2
1.6 - 4.8
1.4 - 4.6
GHz
Conversion Loss
2-1
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
17
22
15
20
15
20
dB
FO Isolation
(with respect to input level)
42
47
43
47
27
35
dB
3FO Isolation
(with respect to input level)
45
55
44
55
29
40
dB
4FO Isolation
(with respect to input level)
28
38
31
38
25
35
dB
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC156A
v00.0111
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Isolation @ +15 dBm Drive Level*
Fo
3Fo
4Fo
-20
-10
ISOLATION (dB)
CONVERSION GAIN (dB)
2
0
0
-20
-30
Pin = 10 dBm
Pin = 15 dBm
Pin = 20 dBm
-40
-60
-80
-100
-40
1
1.5
2
2.5
3
3.5
4
4.5
0
5
2
4
6
8
10
FREQUENCY (GHz)
OUTPUT FREQUENCY (GHz)
*With respect to input level
Output Return Loss @ +15 Drive Level
Input Return Loss vs. Drive Level
0
0
RETURN LOSS (dB)
RETURN LOSS (dB)
-5
-10
-15
Pin =10 dBm
Pin =15 dBm
Pin = 20 dBm
-20
-25
-4
-8
-12
-16
0
0.5
1
1.5
2
2.5
3
3.5
4
INPUT FREQUENCY (GHz)
0
1
2
3
4
5
OUTPUT FREQUENCY (GHz)
Absolute Maximum Ratings
Input Drive
+27 dBm
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
FREQUency MULTIPLIERS - Passive - CHIP
Conversion Gain vs. Drive Level
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
2-2
HMC156A
v00.0111
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Outline Drawing
FREQUency MULTIPLIERS - Passive - CHIP
2
2-3
Die Packaging Information [1]
Standard
Alternate
WP-13 (Waffle Pack)
[2]
NOTES:
1. ALL UNLABELED PADS MUST BE BONDED TO GROUND (8 TOTAL).
2. ALL DIMENSIONS IN INCHES [MILLIMETERS]
3. ALL TOLERANCES ARE ±0.001 [0.025]
4. DIE THICKNESS IS ±0.005 [0.127]
5. BOND PADS ARE ±0.004 [0.100] SQUARE
6. EQUALLY SPACED AT ±0.006 [0.150] CENTERS
7. BACKSIDE METALLIZATION: NONE
8. BOND PAD METALLIZATION: GOLD
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Pad Description
Pad Number
Function
Description
1
RFIN
DC coupled and matched to 50 Ohm.
2
RFOUT
DC coupled and matched to 50 Ohm.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
Interface Schematic
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC156A
v00.0111
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Handling Precautions
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD
protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning
systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias
cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive
epoxy. The mounting surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and
terminated on the package. RF bonds should be as short as possible.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
2
FREQUency MULTIPLIERS - Passive - CHIP
Follow these precautions to avoid permanent damage.
2-4