HMC240A


Design Assistance

Customised Pack Sizes / Qtys

Assembly Assistance

Support for all industry recognised
supply formats:

Die handling consultancy

Hi-Rel die qualification

Hot & Cold die probing

Electrical test & trimming
o Waffle Pack
o Gel Pak
o Tape & Reel

Onsite storage, stockholding &
scheduling

100% Visual Inspection
o MIL-STD 883 Condition A
o MIL-STD 883 Condition A

On-site failure analysis

Bespoke 24 Hour monitored
storage systems for secure long
term product support

On-site failure analysis
Contact
[email protected]
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HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
Typical Applications
Features
The HMC240A is ideal for:
Broadband Performance: DC - 4 GHz
• Telecom Infrastructure
Low Insertion Loss: 0.5 dB @ 2 GHz
• Microwave Radio & VSAT
High IIP3: +48 dBm
• Military & Space
Small Size: 0.66 x 0.60 x 0.18 mm
• Test Instrumentation
General Description
Functional Diagram
The HMC240A is a low cost GaAs MESFET SPDT
switch chip. Covering DC to 4 GHz, this switch offers
high isolation and low insertion loss. RF1 and RF2
are reflective shorts when “off”. The switch can operate using either two negative control logic inputs of
-5/0V or two positive control voltage logic inputs of
0/+5V. All data is tested with the chip in a 50 Ohm test
fixture connected via 0.025 mm (1 mil) diameter wire
bonds of 0.31 mm (12 mils) length.
Switches - Chip
7
Pads 3 & 7 are alternate A & B Control Inputs.
Electrical Specifications, TA = +25° C,
With 0/-5V Control or +5/0V Control, 50 Ohm System
Parameter
7-1
Frequency
Insertion Loss
DC - 1.0 GHz
DC - 2.0 GHz
DC - 3.0 GHz
DC - 4.0 GHz
Isolation
DC - 4.0 GHz
Return Loss
DC - 1.0 GHz
DC - 2.0 GHz
DC - 3.0 GHz
DC - 4.0 GHz
“On State”
Min.
24
Typ.
Max.
Units
0.4
0.5
0.6
0.9
0.7
0.8
0.9
1.4
dB
dB
dB
dB
28
dB
22
16
14
11
dB
dB
dB
dB
Input Power for 1 dB Compression
0.5 - 1.0 GHz
0.5 - 4.0 GHz
25
23
30
29
dBm
dBm
Input Third Order Intercept
(Two-Tone Input Power= +7 dBm Each Tone)
0.5 - 1.0 GHz
0.5 - 4.0 GHz
43
40
48
45
dBm
dBm
Switching Characteristics
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
DC - 4.0 GHz
3
10
ns
ns
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
Insertion Loss vs. Temperature
Isolation
0
0
-10
-1
-1.5
ISOLATION (dB)
+25 C
+85 C
-55 C
-2
RF1
RF2
-20
-30
-40
-2.5
-50
-3
0
0.5
1
1.5
2
2.5
3
3.5
0
4
0.5
1
1.5
Return Loss
2.5
3
3.5
4
0.1 and 1 dB Input Compression Point
35
0
RFC
RF1, RF2, ON
30
P1dB (dBm)
-10
-20
-30
25
1.0 dB Compression Point
0.1 dB Compression Point
20
-40
15
-50
0
0.5
1
1.5
2
2.5
3
3.5
0
4
0.5
1
1.5
2
2.5
3
3.5
4
FREQUENCY (GHz)
FREQUENCY (GHz)
7
Input Third Order Intercept Point
60
55
50
IP3 (dBm)
RETURN LOSS (dB)
2
FREQUENCY (GHz)
FREQUENCY (GHz)
Switches - Chip
INSERTION LOSS (dB)
-0.5
45
40
+25 C
+85 C
-55 C
35
30
0
0.5
1
1.5
2
2.5
3
3.5
4
FREQUENCY (GHz)
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
7-2
HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
Positive Control Voltage
Negative Control Voltage
State
Bias Condition
State
Bias Condition
Low
0 Vdc @ 5 uA
Low
-3 Vdc @ 3 uA to -8 Vdc @ 32 uA
High
+3 Vdc @ 3 uA to +8 Vdc @ 32 uA
High
0 Vdc @ 5 uA
Control input voltage tolerences are ±0.2 Vdc.
Control input voltage tolerences are ±0.2 Vdc.
Truth Table: Positive Control Voltage
Control Input
Switches - Chip
7
7-3
Truth Table: Negative Control Voltage
Control Current
Signal Path State
A
(Vdc)
B
(Vdc)
Ia
(uA)
RFC to
RF1
RFC to
RF2
A
(Vdc)
0
+5
-5
5
ON
OFF
+5
0
5
-5
OFF
ON
Ib
(uA)
Control Input
Control Current
Signal Path State
B
(Vdc)
Ia
(uA)
RFC to
RF1
RFC to
RF2
-5
0
-5
5
ON
OFF
0
-5
5
-5
OFF
ON
Ib
(uA)
Absolute Maximum Ratings
RF Input Power
Vctrl= 0/+5 (-5)V
< 0.5 GHz
0.5 - 4 GHz
+27 dBm
+34 dBm
Control Voltage Range (A & B= 0/+5V)
-0.2 to +10 Vdc
Control Voltage Range (A & B= -5/0V)
-10 to +0.2 Vdc
Storage Temperature
-65 to +150 deg C
Operating Temperature
-55 to +85 deg C
ESD Sensitivity (HBM)
Class 1A
Note:
This part can be controlled with either positive or negative
voltages per the above table. DC blocks are required at
ports RFC, RF1 and RF2 if positive control voltage is used.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
GP-5 (Gel-Pak®)
[2]
NOTES:
1. DIMENSIONS IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS 0.005”.
3.TYPICAL BOND PAD IS 0.004” SQUARE.
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
4.TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.
5. BOND PAD METALLIZATION: GOLD.
6.PADS 4 AND 6 MUST BE CONNECTED TO RF/DC GROUND.
Pad Descriptions
Pad Number
Function
Description
1, 7
A, A (alt.)
See truth table and control voltage table.
Connect either pad 1 or pad 7 to control logic input.
2, 5, 8
RF1, RFC, RF2
These pads are DC coupled and matched to 50 Ohms.
Blocking capacitors are required.
3, 9
B, B (alt.)
See truth table and control voltage table.
Connect either pad 3 or pad 9 to control logic input.
4, 6
AC GND
Must be connected to RF/DC ground.
Switches - Chip
7
Interface Schematic
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
7-4
HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
Assembly Diagram
Switches - Chip
7
7-5
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective
bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean
and flat.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
7
Switches - Chip
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
7-6