HMC6000


Design Assistance

Customised Pack Sizes / Qtys

Assembly Assistance

Support for all industry recognised
supply formats:

Die handling consultancy

Hi-Rel die qualification

Hot & Cold die probing

Electrical test & trimming
o Waffle Pack
o Gel Pak
o Tape & Reel

Onsite storage, stockholding &
scheduling

100% Visual Inspection
o MIL-STD 883 Condition A
o MIL-STD 883 Condition A

On-site failure analysis

Bespoke 24 Hour monitored
storage systems for secure long
term product support

On-site failure analysis
Contact
[email protected]
For price, delivery and to place orders
HMC6000
www.analog.com
www.micross.com
Analog Devices Welcomes
Hittite Microwave Corporation
NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
www.analog.com
www.hittite.com
THIS PAGE INTENTIONALLY LEFT BLANK
HMC6000
v02.0514
mmWAVE TRANSMITTER - CHIP
Millimeterwave Transmitter IC
57 - 64 GHz
1
Typical Applications
Features
The HMC6000 is ideal for:
Support for IEEE Channel Plan
• WiGig Single Carrier Modulations
Output Power: 12 dBm
• 60 GHz ISM Band Data Transmitter
Max Gain: 38 dB
• Multi-Gbps Data Communications
Gain Control Range: 17 dB
• High Definition Video Transmission
Integrated Frequency Synthesizer
• RFID
Integrated Image Reject Filter
Programmable IF Gain Block
Universal Analog I/Q Baseband Interface
Three-Wire Serial Digital Interface
Die Size: 4.082 x 1.814 mm
Functional Diagram
General Description
The HMC6000 is a complete mmWave transmitter
on a chip operating from 57 to 64 GHz with 1.8 GHz
of modulation bandwidth. An integrated synthesizer
provides tuning in 500 or 540 MHz step sizes
depending on the choice of external reference clock.
Support for a wide variety of modulation formats is
provided through a universal analog baseband IQ
interface. The transmitter chip supports all single
carrier WiGig modulations and optionally supports
dedicated FSK/MSK modulation formats for lower
cost and lower power serial data links without the need
for high speed data converters. A differential output
provides up to 12 dBm linear output power into a 100
ohm load. Together with the HMC6001, a complete
transmit/receive chipset is provided for multi-Gbps
operation in the unlicensed 60 GHz ISM band.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Parameter
Condition
Frequency Range
Min.
Typ.
57
Max.
Units
64
GHz
Frequency Step Size
308.5714 MHz Ref Clk
0.54
GHz
Frequency Step Size
285.714 MHz Ref Clk
0.50
GHz
3dB BW, double-sided
1.8
Modulation Bandwidth
Pout minus total Pin of all 4 baseband
inputs
Max Gain
33
36.5
GHz
40
dB
Gain Control Range
17
dB
Gain Step Size
1.3
dB
P1dB
12
dBm
Psat
17
dBm
Image Rejection
34
dB
20
dB
Sideband Suppression
14
Carrier Suppression [1]
11
20
dB
32
dBc
Phase Noise @ 100 kHz
-72
dBc/Hz
Phase Noise @ 1 MHz
-86
dBc/Hz
Phase Noise @ 10 MHz
-111
dBc/Hz
Phase Noise @ 100 MHz
-125
dBc/Hz
Phase Noise @ 1 GHz
-127
dBc/Hz
3xLO Suppression
TX Noise Floor
Max Gain
-125
dBm/Hz
PLL Loop BW
Internal Loop Ffilter
200
kHz
Synthesizer Settling Time
<6
μs
Power Dissipation
0.8
W
mmWAVE TRANSMITTER - CHIP
Table 1. Electrical Specifications, TA = +25° C, See Test Conditions
[1] Single point calibration can be used to improve carrier suppression.
Table 2. Test Conditions
Reference frequency
308.5714 MHz
Temperature
+25°C
Gain Setting
Max
Input Signal Level
-31 dBm @ each of the 4 baseband inputs
IF Bandwidth
Max
Input Impedance
100Ω Differential
Output Impedance
100Ω Differential
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
2
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Table 3. Recommended Operation Conditions
mmWAVE TRANSMITTER - CHIP
Description
Analog Ground
Symbol
Min
GND
Typical
Max
0
Units
Vdc
VCC_PA1
VCC_PA2
3.9
4.0
4.1
Vdc
VDD_PA
VCC_DRV
VCC_TRIP
VCC_DIV
VCC_REG
VCC_IF
VCC_MIX
2.565
2.7
2.835
Vdc
1.3
1.35
1.48
Vdc
Serial Digital Interface – Logic High
DATA
ENABLE
CLK
RESET
0.9
1.2
1.4
V
Serial Digital Interface – Logic Low
DATA
ENABLE
CLK
RESET
-0.05
0.1
0.3
V
Power Supplies
VDD_PLL
VDDD
Input Voltage Ranges
Reference Clock
Baseband I and Q [1] [2]
3.3 or 2.5V
LVPECL/LVDS
1.2V CMOS
REFCLKP
REFCLKM
BB_IM
BB_IP
BB_QM
BB_QP
5
Baseband I and Q Common mode
MSK Data [3]
25
V
100
1.6
FM_IM
FM_IP
FM_QM
FM_QP
MSK Common mode
200
500
mVp-p
V
750
1.1
mVp-p
V
RF Output [4]
RFOUTP
RFOUTM
Input Resistance
DATA
ENABLE
CLK
RESET
>50
kOhms
REFCLKP / M
50
Ohm
17
dBm
Temperature
-40
+85
C
[1] Values above 25 mVp-p are to be used only with IF attenuation to keep the Pout below 16 dBm
[2] 25mVp-p is applied at each of the 4 Baseband Inputs
[3] 500mVp-p is applied at each of the 4 FM Inputs
[4] 4.0Vdc present at the TX RF output pads. To avoid damaging the Power Amplifier the pads must be AC coupled to any other DC voltage
including ground
3
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Table 4. Power Consumption
Typical Current (mA)
VCC_PA1
(4.0Vdc)
33
VCC_PA2
(4.0Vdc)
33
VCC_REG
(2.7Vdc)
12
VCC_DRV1
(2.7Vdc)
16
VCC_DRV2
(2.7Vdc)
16
VCC_MIX
(2.7Vdc)
29
VCC_IF
(2.7Vdc)
31
VCC_TRIP
(2.7Vdc)
48
VCC_DIV
(2.7Vdc)
35
VDD_PA
(2.7Vdc)
6
VDDD
(1.35Vdc)
<1
VDD_PLL
(1.35Vdc)
8
Typical Power Consumption (Watts)
0.27
0.53
0.01
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
mmWAVE TRANSMITTER - CHIP
Voltage
4
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
18
18
16
16
14
14
P1dB (dBm)
OUTPUT POWER (dBm)
Figure 2. Output P1dB vs.
Frequency Over Temperature[2]
20
12
10
8
12
10
8
6
6
4
4
2
2
0
57.2
58.3
59.4
60.4
61.5
62.6
0
57.2
63.7
58.3
59.4
FREQUENCY (GHz)
60.4
62.6
63.7
+25C
+85C
-40C
Figure 3. Output P1dB vs.
Frequency Across Voltage
Figure 4. 58.32 GHz (IEEE CH-1)
Output Power vs. IF Gain Setting[1]
20
16
OUTPUT POWER (dBm)
18
16
14
12
10
8
6
4
12
8
4
0
-4
-8
-12
2
-16
0
57.2
58.3
59.4
60.4
61.5
62.6
0
63.7
1
2
3
4
5
6
7
8
9
10
11
12
13
IF ATTENUATOR SETTING
FREQUENCY (GHz)
Pin = -40dBm
Pin = -31dBm
Pin = -22dBm
Min bias
Typical bias
Max bias
Figure 5. 60.48 GHz (IEEE CH-2)
Output Power vs. IF Gain Setting[1]
Figure 6. 62.64 GHz (IEEE CH-3)
Output Power vs. IF Gain Setting[1]
20
20
16
16
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
61.5
FREQUENCY (GHz)
Pin = -40 dBm
Pin = -31 dBm
Pin = -22 dBm
P1dB (dBm)
mmWAVE TRANSMITTER - CHIP
Figure 1. Output Power vs.
Frequency at Maximum Gain[1]
12
8
4
0
-4
-8
-12
12
8
4
0
-4
-8
-12
-16
-16
0
1
2
3
4
5
6
7
8
9
10
11
12
13
IF ATTENUATOR SETTING
Pin=-40dBm
Pin=-31dBm
Pin=-22dBm
0
1
2
3
4
5
6
7
8
9
10
11
12
13
IF ATTENUATOR SETTING
Pin=-40dBm
Pin=-31dBm
Pin=-22dBm
[1] Input power of -40, -31 and -22dBm applied at each of the 4 baseband inputs
[2] Maximum gain
5
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Figure 7. Gain vs.
Frequency Over Temperature[3]
Figure 8. OIP3 vs. Frequency over
perature[2]
Tem-
30
50
25
40
20
OIP3 (dB)
GAIN (dB)
35
30
25
20
15
10
15
10
5
5
0
57.2
58.3
59.4
60.4
61.5
62.6
0
57.2
63.7
58.3
FREQUENCY (GHz)
59.4
60.4
Figure 9. Sideband Suppression vs.
Frequency Over Temperature[4]
SIDEBAND SUPPRESSION (dBc)
SIDEBAND SUPPRESSION (dBc)
30
25
20
15
10
5
58.3
59.4
60.5
61.6
62.6
25
20
15
10
5
0
57.2
63.7
58.3
FREQUENCY (GHz)
59.4
60.5
61.6
62.6
63.7
62.6
63.7
FREQUENCY (GHz)
+25C
+85C
-40C
Min bias
Typical bias
Max bias
Figure 11. Image Rejection vs.
Frequency Over Temperature[4]
Figure 12. Image Rejection vs.
Frequency Across IF Gain[5]
45
40
40
35
IMAGE SUPPRESSION (dBc)
iMAGE SUPPRESSION (dBc)
63.7
Figure 10. Sideband Suppression vs.
Frequency Across Voltage[4]
30
35
30
25
20
15
10
30
25
20
15
10
5
5
0
57.2
62.6
+25C
+85C
-40C
+25C
+85C
-40C
0
57.2
61.5
FREQUENCY (GHz)
mmWAVE TRANSMITTER - CHIP
45
58.3
59.4
60.4
61.5
FREQUENCY (GHz)
+25C
+85C
-40C
62.6
63.7
0
57.2
58.3
59.4
60.4
61.5
FREQUENCY (GHz)
IF Attn = 0dB
IF Attn = 5dB
IF Attn = 10dB
IF Attn = 15dB
[2] Maximum gain
[3] Input power of -40dBm applied at each of the 4 baseband inputs, Gain = Pout minus total Pin of all 4 baseband inputs
[4] Max gain, sideband offset = 100MHz, input power of -31dBm applied to each of the 4 baseband inputs @ +25C, -22dBm @ +85C and -40dBm @ -40C
[5] Input power of -31dBm applied to each of the 4 baseband inputs
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
6
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Figure 13. Carrier Suppression vs.
Frequency Over Temperature[6]
Figure 14. 3x LO Suppression vs.
Frequency Over Temperature[6]
60
3xLO SUPPRESSION (dBc)
CARRIER SUPPRESSION (dBc)
55
35
30
25
20
15
10
5
0
57.2
50
45
40
35
30
25
20
15
10
5
58.3
59.4
60.5
61.6
62.6
0
57.2
63.7
58.3
59.4
60.4
Figure 15. 3x LO Suppression vs.
Frequency Across IF Gain[5]
55
2xLO SUPPRESSION (dBc)
60
45
40
35
30
25
20
15
10
5
62.6
63.7
50
45
40
35
30
25
20
15
10
5
58.3
59.4
60.4
61.5
62.6
0
57.2
63.7
58.3
FREQUENCY (GHz)
IF Attn =10dB
IF Attn = 15dB
4
5
10
6
7
10
60.4
61.5
10
8
10
IF Attn = 0dB
IF Attn =10dB
IF Attn = 5dB
IF Attn = 15dB
Figure 18. Phase Noise vs.
Frequency Offset Over Voltage[7]
PHASE NOISE (dBc/Hz)
Figure 17. Phase Noise vs.
Frequency Offset Over Temperature[7]
10
59.4
FREQUENCY (GHz)
IF Attn = 0dB
IF Attn = 5dB
PHASE NOISE (dBc/Hz)
63.7
Figure 16. 2xLO vs.
Frequency Across IF Gain[5]
50
-60
-65
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
3
10
62.6
+25C
+85C
-40C
+25C
+85C
-40C
0
57.2
61.5
FREQUENCY (GHz)
FREQUENCY (GHz)
3xLO SUPPRESSION (dBc)
mmWAVE TRANSMITTER - CHIP
40
9
10
FREQUENCY (Hz)
+25C
+85C
-40C
-60
-65
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
3
10
4
10
5
10
6
10
7
10
8
10
9
10
FREQUENCY (Hz)
Min bias
Typical bias
Max bias
[5] Input power of -31dBm applied to each of the 4 baseband inputs
[6] Max gain, input power of -31dBm applied to each of the 4 baseband inputs
[7] 60.48 GHz Carrier
7
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Figure 20. 60.48 GHz MCS1 WiGig
waveform @ 16dBm vs. WiGig Mask[8]
10
5
8
0
-5
AMPLITUDE (dBc)
AMPLITUDE (dBm)
6
4
2
0
-2
-4
-10
-15
-20
-25
-30
-35
-6
-40
-8
-45
-10
-1000 -800 -600 -400 -200
-50
0
200
400
600
800 1000
FREQUENCY OFFSET (MHz)
58.32 GHz
60.48 GHz
62.64 GHz
-3000 -2250 -1500 -750
0
750
1500 2250 3000
FREQUENCY OFFSET (MHz)
RF Spectrum
WiGig Mask
Figure 21. 60.48 GHz MCS1 WiGig waveform
@ 14dBm vs. IEEE 802.15.3c Mask[9]
5
0
AMPLITUDE (dBc)
-5
-10
-15
-20
-25
-30
-35
-40
mmWAVE TRANSMITTER - CHIP
Figure 19. Passband Response vs.
Frequency Offset by Channel[7]
-45
-50
-3000 -2250 -1500 -750
0
750
1500 2250 3000
FREQUENCY OFFSET (MHz)
RF Spectrum
802.15.3c Mask
[7] Max gain, reference Table 12 for IF VGA and IF Up-Mixer Filter Settings
[8] Max gain, Input power of -24 dBm applied to each of the 4 baseband inputs
[9] Max gain, Input power of -27 dBm applied to each of the 4 baseband inputs
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
8
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
mmWAVE TRANSMITTER - CHIP
Table 5. Absolute Maximum Ratings
VCC_PA = 4 V
4.2 Vdc
VDD = 2.7 V
2.85 Vdc
VCC = 2.7 V
2.85 Vdc
VDD_PLL = 1.35 V
1.6 Vdc
VDDD = 1.35 V
1.6 Vdc
GND
0± 50 mV
Power Dissipation
(Combined Pdiss of VCC_PA1 and
VCC_PA2)
27 C/W (1.1W total Pdiss)
0.36W (at 85 baseplate)
Serial Digital Interface Input Voltage
1.5 Vdc
Ref CLK Input (AC coupled)(each)
0.75 Vp-p
Baseband Inputs (BB, FM)(each)
0.75 Vp-p
Storage Temperature
-55°C to 150°C
Operating Temperature
-40°C to 85°C
Outline Drawing
Table 6. Die Packaging Information
Standard
Alternate
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .028 [0.711] ± .001 [.025]
3. BOND PAD METALLIZATION: AL
4. Overall die size ± .002 [.051]
VR-33CC-02-X4 GEL_PAK
[1]
[1] For alternate packaging information contact Hittite Microwave
Corporation.
Table 7. Die Pad Dimensions
9
Pads
Pad Size
Pad Opening
1, 6, 7 - 54
0.0040 [0.101] x 0.0040 [0.101]
0.0037 [0.095] x 0.0037 [0.095]
3, 4
0.0028 [0.070] x 0.0028 [0.070]
0.0025 [0.064] x 0.0025 [0.064]
2, 5
0.0046 [0.118] x 0.0059 [0.150]
0.0028 [0.070] x 0.0036 [0.090]
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Pad Number
Function
Description
1, 2, 5, 6, 8, 11,
13, 15, 17, 19, 21,
24, 27, 28, 30, 32,
34, 36, 40, 50, 53
GND
Analog Ground
3
RFOUTM
RF negative output – DC coupled – diff match to 100Ω [1]
RF positive output – DC coupled – diff match to 100Ω [1]
4
RFOUTP
7
VCC_PA2
4.0V supply (PA)
9
VCC_DRV2
2.7V supply (Driver)
10
VCC_MIX
2.7V (Mixer)
12
BB_QM
Baseband negative quadrature input – DC coupled - 50Ω
14
BB_QP
Baseband positive quadrature input – DC coupled - 50Ω
16
VCC_IF
2.7V supply (IF)
18
BB_IM
Baseband negative in-phase input – DC coupled - 50Ω
20
BB_IP
Baseband positive in-phase input – DC coupled - 50Ω
22
FM_QM
FSK negative quadrature input – DC coupled - 50Ω
23
FM_QP
FSK positive quadrature input – DC coupled - 50Ω
25
FM_IM
FSK negative in-phase input – DC coupled - 50Ω
26
FM_IP
FSK positive in-phase input – DC coupled - 50Ω
29
VDD_PLL
1.35V supply (VCO)
31
REFCLKM
Xtal REF CLK Minus - AC or DC coupled - 50Ω
33
REFCLKP
Xtal REF CLK Plus - AC or DC coupled - 50Ω
35
VCC_REG
2.7V supply (VCO)
37, 38, 42, 43
NC
Factory test points. Leave floating. Do not connect.
39
VCC_DIV
2.7V supply (Divider)
41
VCC_TRIP
2.7V supply (Tripler)
44
RESET
Asynchronous reset-all registers (1.2V CMOS, active high)
45
ENABLE
Serial digital interface enable (1.2V CMOS) - 50kΩ
46
VDDD
1.35V supply (serial digital interface)
47
CLK
Serial digital interface clock (1.2V CMOS) - 50kΩ
48
DATA
Serial digital interface data (1.2V CMOS) - 50kΩ
49
SCANOUT
Serial digital interface out (1.2V CMOS) - 50kΩ
51
VCC_DRV1
2.7V supply (Driver)
52
VDD_PA
2.7V supply (PA)
mmWAVE TRANSMITTER - CHIP
Table 8. Pad Descriptions
54
VDD_PA1
4.0V supply (PA)
[1] 4.0Vdc present at the TX RF output pads. To avoid damaging the Power Amplifier the pads must be AC coupled to any other DC voltage including ground
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
10
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
mmWAVE TRANSMITTER - CHIP
Theory of Operation
An integrated frequency synthesizer creates a low-phase noise LO between 16.3 and 18.3 GHz. This is divided by
2, split into quadrature components and used to modulate differential baseband I and Q signals onto an 8 to 9.1 GHz
sliding IF. This signal is then filtered and amplified with 17 dB of variable gain, then mixed with three times the LO
frequency to upconvert to an RF frequency between 57 and 64 GHz. The step size of the synthesizer equates to
540MHz steps at RF when used with 308.5714 MHz reference crystal (compatible with the IEEE channels of the ISM
band) or 500 MHz steps if used with a 285.714 MHz reference crystal. Integrated notch filters attenuate the lower
mixing product at 40-46GHz. Two RF amplifier stages provide gain to allow up to 12 dBm differential output.
The phase noise and quadrature balance of the HMC6000 is sufficient to carry up to 16QAM modulation.
There are no special power sequencing requirements for the HMC6000; all voltages are to be applied simultaneously.
Register Array Assignments and Serial Interface
The register arrays for both the transmitter and receiver are organized into 16 rows of 8 bits. Using the serial interface,
the arrays are written or read one row at a time as shown in Figure 22 and Figure 23, respectively. Figure 22 shows
the sequence of signals on the ENABLE, CLK, and DATA lines to write one 8-bit row of the register array. The ENABLE
line goes low, the first of 18 data bits (bit 0) is placed on the DATA line, and 2 ns or more after the DATA line stabilizes,
the CLK line goes high to clock in data bit 0. The DATA line should remain stable for at least 2 ns after the rising edge
of CLK.
The Tx IC will support a serial interface running up to several hundred MHz, and the interface is 1.2V CMOS levels.
A write operation requires 18 data bits and 18 clock pulses, as shown in Figure 22. The 18 data bits contain the 8-bit
register array row data (LSB is clocked in first), followed by the register array row address (ROW0 through ROW15,
000000 to 001111, LSB first), the Read/Write bit (set to 1 to write), and finally the Tx chip address 110, LSB first).
Note that the register array row address is 6 bits, but only four are used to designate 16 rows, the two MSBs are 0.
After the 18th clock pulse of the write operation, the ENABLE line returns high to load the register array on the IC; prior
to the rising edge of the ENABLE line, no data is written to the array. The CLK line should have stabilized in the low
state at least 2 ns prior to the rising edge of the ENABLE line.
Figure 22. Timing Diagram for writing a row of the Transmitter Serial Interface
11
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Figure 23. Timing Diagram for reading a row of the Transmitter Serial Interface
Table 9. Transmitter Register Array Assignments
Register Array Row & Bit
Internal Signal Name
Signal Function
mmWAVE TRANSMITTER - CHIP
Millimeterwave Transmitter IC
57 - 64 GHz
ROW0
ROW0<7>
pa_pwrdn
Active high to power down most other PA circuits not controlled by ROW0<6>
ROW0<6>
pa_pwrdn_fast
Active high to power down the PA core in < 1 µs
ROW0<5>
upmixer_pwrdn
Active high to power down IF to RF upmixer
ROW0<4>
divider_pwrdn
Active high to power down local oscillator divider
ROW0<3>
if_bgmux_pwrdn
Active high to power down one of three on-chip bandgap refs (IF) and associated mux
ROW0<2>
if_upmixer_pwrdn
Active high to power down baseband to IF upmixer
ROW0<1>
driver_pwrdn
Active high to power down PA predriver
ROW0<0>
ifvga_pwrdn
Active high to power down IF variable gain amplifier
ROW1
ROW1<7>
ipc_pwrdn
Active high to power down on chip current reference generator
ROW1<6>
tripler_pwrdn
Active high to power down frequency tripler
ROW1<5>
ifvga_q_cntrl<2>
ROW1<4>
ifvga_q_cntrl<1>
ROW1<3>
ifvga_q_cntrl<0>
These bits control the Q of the IF filter in the baseband to IF upmixer;
ROW1<5:3> = 000 for highest Q and highest gain.
To reduce Q and widen bandwidth, increment ROW1<5:3> in the sequence
001
100
101
111
ROW1<2>
not used
ROW1<1>
not used
ROW1<0>
not used
ROW1<2:0> = xxx - not used
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
12
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Table 9. Transmitter Register Array Assignments
mmWAVE TRANSMITTER - CHIP
Register Array Row & Bit
Internal Signal Name
Signal Function
ROW2
ROW2<7>
FDB<11>
ROW2<6>
FDB<10>
ROW2<5>
FDB<9>
ROW2<4>
FDB<8>
ROW2<3>
pa_sel_vgbs<3>
ROW2<2>
pa_sel_vgbs<2>
ROW2<1>
pa_sel_vgbs<1>
ROW2<0>
pa_sel_vgbs<0>
Factory Diagnostics;
ROW2<7:4> = 1111 for normal operation
Controls the regulator for the base voltage of the PA output transistors;
ROW2<3:0> = 0000 for normal operation
ROW3
ROW3<7>
FDB<7>
ROW3<6>
FDB<6>
ROW3<5>
FDB<5>
ROW3<4>
FDB<4>
ROW3<3>
FDB<3>
ROW3<2>
FDB<2>
ROW3<1>
FDB<1>
ROW3<0>
FDB<0>
ROW4<7>
pa_sel_vref<3>
ROW4<6>
pa_sel_vref<2>
ROW4<5>
pa_sel_vref<1>
Factory Diagnostics;
ROW4<7:4> = 0001 for normal operation
Factory Diagnostics;
ROW4<3:0> = 1111 for normal operation
ROW4
ROW4<4>
pa_sel_vref<0>
ROW4<3>
driver_bias<2>
ROW4<2>
driver_bias<1>
ROW4<1>
driver_bias<0>
ROW4<0>
driver_bias2<2>
Controls the bias current for the PA output transistors;
ROW4<7:4> = 0011 for normal operation
Controls the bias current for the PA predriver;
ROW4<3:1> = 111 for normal operation
Controls the bias current for the PA predriver2;
ROW4<0> = 1 for normal operation
ROW5
ROW5<7>
not used
ROW5<6>
not used
ROW5<5>
not used
ROW5<4>
not used
ROW5<3>
bg_monitor_sel
ROW5<2>
if_refsel
ROW5<1>
enable_fm
Active high to enable the FSK/MSK modulator inputs.
ROW5<1> = 0 for normal I/Q operation
ROW5<0>
not used
ROW5<0> = x - not used
ROW6<7>
ifvga_bias<3>
ROW6<6>
ifvga_bias<2>
ROW6<5>
ifvga_bias<1>
ROW6<4>
ifvga_bias<0>
ROW5<7:4> = x - not used
These bits are for reserved for diagnostic purposes;
ROW5<3:2> = 01 for normal operation
ROW6
13
Controls the bias current of the IF variable gain amplifier;
ROW6<7:4> = 1000 for normal operation
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Table 9. Transmitter Register Array Assignments
Internal Signal Name
ROW6<3>
ifvga_tune<3>
ROW6<2>
ifvga_tune<2>
ROW6<1>
ifvga_tune<1>
ROW6<0>
ifvga_tune<0>
Signal Function
Controls the tuning of the IF filter for the variable gain amplifier;
ROW6<3:0> = 1111 for normal operation
ROW7
ROW7<7>
ifvga_vga_adj<3>
ROW7<6>
ifvga_vga_adj<2>
ROW7<5>
ifvga_vga_adj<1>
ROW7<4>
ifvga_vga_adj<0>
ROW7<3>
if_upmixer_tune<3>
ROW7<2>
if_upmixer_tune<2>
ROW7<1>
if_upmixer_tune<1>
ROW7<0>
if_upmixer_tune<0>
ROW8<7>
tripler_bias<13>
ROW8<6>
tripler_bias<12>
IF variable gain amplifier gain control bits;
ROW7<7:4> =
0000 is highest gain
1101 is lowest gain
Attenuation is ≈ 1.3 dB / step, ≈ 17 dB maximum
Controls the tuning of the IF filter for the IF to RF upmixer;
ROW7<3:0> = 1111 for normal operation
ROW8
ROW8<5>
tripler_bias<11>
ROW8<4>
tripler_bias<10>
ROW8<3>
tripler_bias<9>
ROW8<2>
tripler_bias<8>
ROW8<1>
tripler_bias<7>
ROW8<0>
tripler_bias<6>
ROW9<7>
tripler_bias<5>
ROW9<6>
tripler_bias<4>
These bits control the biasing of the frequency tripler;
ROW8<7:0> = 10111111 for normal operation
mmWAVE TRANSMITTER - CHIP
Register Array Row & Bit
ROW9
ROW9<5>
tripler_bias<3>
ROW9<4>
tripler_bias<2>
ROW9<3>
tripler_bias<1>
ROW9<2>
tripler_bias<0>
ROW9<1>
driver_bias2<1>
ROW9<0>
driver_bias2<0>
ROW10<7>
RDACIN<5>
These bits control the biasing of the frequency tripler;
ROW9<7:2> = 011011 for normal operation
Controls the bias current for the PA predriver2;
ROW9<1:0> = 11 for normal operation
ROW10
ROW10<6>
RDACIN<4>
ROW10<5>
RDACIN<3>
ROW10<4>
RDACIN<2>
ROW10<3>
RDACIN<1>
ROW10<2>
RDACIN<0>
ROW10<1>
SYNRESET
VCO amplitude adjustment DAC;
ROW10<7:2> = 111100 for normal operation
ROW10<1> = 0 for normal operation
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
14
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Table 9. Transmitter Register Array Assignments
mmWAVE TRANSMITTER - CHIP
Register Array Row & Bit
ROW10<0>
Internal Signal Name
Signal Function
DIVRATIO<4>
ROW10<0>
Control the synthesizer divider ratio and output frequency. Refer to Tables 10 and 11
for synthesizer control details.
ROW11
ROW11<7>
DIVRATIO<3>
ROW11<6>
DIVRATIO<2>
ROW11<5>
DIVRATIO<1>
ROW11<4>
DIVRATIO<0>
ROW11<3>
BAND<2>
ROW11<2>
BAND<1>
ROW11<1>
BAND<0>
ROW11<0>
REFSELDIV
ROW12<7>
CPBIAS<2>
ROW12<6>
CPBIAS<1>
ROW12<5>
CPBIAS<0>
ROW11<7:4>
Control the synthesizer divider ratio and output frequency. Refer to Tables 10 and 11
for synthesizer control details.
ROW11<3:1>
Control the VCO band, and must be changed when tuning the synthesizer output
frequency. Refer to Tables 10 and 11 for synthesizer control details.
These bits are for reserved for diagnostic purposes;
ROW11<0> = 1 for normal operation
ROW12
These bits control the synthesizer charge pump bias.
ROW12<7:5> = 010 for normal operation
ROW12<4>
VRSEL<3>
ROW12<3>
VRSEL<2>
ROW12<2>
VRSEL<1>
ROW12<1>
VRSEL<0>
ROW12<0>
REFSELVCO
This bit is for reserved for diagnostic purposes;
ROW12<0> = 1 for normal operation
ROW13<7>
MUXREF
These bit are reserved for diagnostic purposes;
ROW13<7> = 1 for normal operation
ROW13<6>
DIV4
ROW13<6> = 0 for normal operation
ROW13<5>
ENDC
Active high to enable DC coupling on synthesizer reference input;
ROW13<5> = 0 for normal operation
ROW13<4>
INI
This bit is for reserved for diagnostic purposes;
ROW13<4> = 0 for normal operation
These bits control the width of the lock window for the synthesizer lock detector.
ROW12<4:1> = 1111 specifies the widest lock window for normal operation
ROW13
ROW13<3>
PDDIV12
Active high to power down 1.2V circuits in synthesizer divider
ROW13<2>
PDDIV27
Active high to power down 2.7V circuits in synthesizer divider
ROW13<1>
PDQP
Active high to power down synthesizer charge pump
ROW13<0>
PDVCO
Active high to power down synthesizer VCO
ROW14<7>
PDCAL
Active high to power down VCO calibration comparators;
ROW14<7> = 0 for normal operation
ROW14<6>
MUXOUT
Controls multiplexing of diagnostic bits, high to read Row15<7:0>
ROW14<6> = 1 for normal operation
ROW14<5>
PDALC12
Active high to power down VCO automatic level control (ALC);
ROW14<5> = 1 for normal operation
ROW14<4>
PLOAD
Active high to load external amplitude adjustment bits for VCO
ROW14<4> = 1 for normal operation
ROW14
15
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Register Array Row & Bit
Internal Signal Name
Signal Function
ROW14<3>
WIDE<1>
ROW14<2>
WIDE<0>
Control bits for VCO ALC loop;
ROW14<3:2> = 01 for normal operation
ROW14<1>
SLEW<1>
ROW14<0>
SLEW<0>
ROW15<7>
COMPP
ROW15<6>
COMPN
ROW15<5>
RDACMSB<2>
Controls slew rate in sub-integer N divider
ROW14<1:0> = 10 for normal operation
ROW15
ROW15<4>
RDACMSB<1>
ROW15<3>
RDACMSB<0>
ROW15<2>
RDACMUX<0>
ROW15<1>
RDACMUX<1>
ROW15<0>
RDACMUX<2>
Read only bits to indicate synthesizer lock:
ROW15<7:6> =
01 indicates that the VCO control voltage is within the lock window and the synthesizer is locked.
11 indicates the VCO control voltage above lock window
00 below lock window
10 is a disallowed state indicating an error
These bits are read only and reserved for factory diagnostic purposes.
These bits are read only and reserved for factory diagnostic purposes.
mmWAVE TRANSMITTER - CHIP
Table 9. Transmitter Register Array Assignments
Synthesizer Settings
Table 10. IEEE Channels Using 308.5714 MHz Reference
Frequency (GHz)
Divider Setting
Typical Band Setting
57.24
10101
001
57.78
10100
001
58.32 (IEEE CH 1)
10011
010
58.86
10010
010
011
59.40
10001
59.94
10000
011
60.48 (IEEE CH 2)
11111
100
61.02
00000
100
61.56
00001
101
62.10
00010
101
62.64 (IEEE CH 3)
00011
110
63.18
00100
110
63.72
00101
Divide Ratio settings consist of registers ROW10 bit <0> (MSB) and ROW11 bits <4:7> (4 LSBs)
111
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
16
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
mmWAVE TRANSMITTER - CHIP
Table 11. 500 MHz Channels Using 285.7143 MHz Reference
Frequency (GHz)
Divider Setting
Typical Band Setting
57
00001
000
57.5
00010
000
58
00011
001
58.5
00100
001
59
00101
010
59.5
00110
010
60
00111
011
60.5
01000
011
61
01001
100
61.5
01010
100
62
01011
101
62.5
01100
101
63
01101
110
63.5
01110
110
64
01111
111
Divide Ratio settings consist of registers ROW10 bit <0> (MSB) and ROW11 bits <4:7> (4 LSBs)
Table 12. Typical IF VGA and IF Upmixer Filter Settings
Frequency (GHz)
IF VGA Filter Setting (ifvga_tune)
IF UPMIXER Filter Setting (if_upmixer_tune)
57-60
1000
1010
60-62
1011
1111
62-64
1111
1111
if_vga_tune settings consist of registers ROW6 bit <3:0> (4 MSBs)
if_upmixer_tune settings consist of registers ROW7 <3:0> (4 MSBs)
17
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
Table 13. Pad Discriptions
Function
Pad Description
BB_QM
BB_QP
BB_IM
BB_IP
Pads are DC coupled,
matched to 50Ω (100Ω
differential)
FM_QM
FM_QP
Fm_IM
FM_IP
Pads are DC coupled,
matched to 50Ω (100Ω
differential)
31,33
REFCLKM
REFCLKP
Pads are DC coupled,
matched to 50Ω (100Ω
differential)
3,4
RFOUTM
RFOUTP
Pads are DC coupled,
matched to 50Ω (100Ω
differential)
12,14,18,20
22,23,25,26
Interface Schematic
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
mmWAVE TRANSMITTER - CHIP
Item
18
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
mmWAVE TRANSMITTER - CHIP
Table 14. Evaluation Kit Order Information
19
Item
Part Number
Description
1
EKIT01-HMC6450
60 GHz Antenna in Package Transceiver Evaluation Kit
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC6000
v02.0514
Millimeterwave Transmitter IC
57 - 64 GHz
The die should be attached directly to the ground plane with conductive epoxy (see HMC general Handling, Mounting,
Bonding Note).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD
protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias
cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a sharp pair of bent tweezers or use a top side vacuum tool
to pick and place. The surface should not be touched with tweezers or fingers.
Mounting
The chip should be mounted with electrically conductive epoxy. The mounting surface should be clean and flat.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s recommendation.
Wire Bonding
RF bonds made with 0.003” (0.076mm) x 0.0005” (0.012mm) ribbon are recommended and should be thermosonically
bonded. DC bonds of 0.001” (0.025 mm) diameter are recommended and should also be thermosonically bonded.
All bonds should be made with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy
should be applied to achieve reliable bonds. All bonds should be as short as possible.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
mmWAVE TRANSMITTER - CHIP
Mounting & Bonding Techniques for Millimeterwave SiGe Die
20