Datasheet

NICHIA STS-DA1-1286 <Cat.No.110201>
NICHIA CORPORATION
SPECIFICATIONS FOR AMBER LED
NSPA510BS
● RoHS Compliant
NICHIA STS-DA1-1286 <Cat.No.110201>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Symbol
Absolute Maximum Rating
Unit
Forward Current
Item
IF
30
mA
Pulse Forward Current
IFP
100
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
103
mW
Operating Temperature
Topr
-30 ～ 85
°C
Storage Temperature
Tstg
-40 ～ 100
°C
Junction Temperature
TJ
100
°C
* Absolute Maximum Ratings at TA=25°C.
* IFP conditions with pulse width ≤ 10 ms and duty cycle ≤ 10%.
(2) Initial Electrical/Optical Characteristics
Symbol
Condition
Typ.
Unit
Forward Voltage
Item
VF
IF=20mA
3.1
V
Luminous Intensity
Iv
IF=20mA
7.8
cd
x
-
IF=20mA
0.560
-
y
-
IF=20mA
0.435
-
Chromaticity Coordinate
* Characteristics at TA=25°C.
* Luminous Intensity value is traceable to the CIE 127:2007-compliant national standards.
* The Chromaticity Coordinates are derived from the CIE 1931 Chromaticity Diagram.
1
NICHIA STS-DA1-1286 <Cat.No.110201>
RANKS
Item
Rank
Min.
Max.
Unit
Forward Voltage
-
2.65
3.45
V
Reverse Current
-
-
50
µA
U
8.4
11.8
T
5.9
8.4
S
4.2
5.9
Luminous Intensity
cd
Color Rank
Rank L
x
0.603
0.532
0.522
0.589
y
0.397
0.467
0.460
0.393
* Ranking at TA=25°C.
* Reverse Current at VR=5V.
* Tolerance of measurements of the Forward Voltage is ±0.05V.
* Tolerance of measurements of the Luminous Intensity is ±10%.
* Tolerance of measurements of the Chromaticity Coordinate is ±0.01.
* Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank
in the shipment shall be determined by Nichia.
2
NICHIA STS-DA1-1286 <Cat.No.110201>
CHROMATICITY DIAGRAM
0.50
580
585
0.45
y
L
590
0.40
595
600
0.35
0.30
0.45
0.50
0.55
0.60
0.65
x
3
NICHIA STS-DA1-1286 <Cat.No.110201>
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。
T his product complies with RoHS Directive.
管理番号 No.
NSPA510BS
STS-DA7-0046
(単位 Unit:±0.2)
mm)
(単位 Unit: mm, 公差 Tolerance:
Anode
□0.5 +0.1
-0.05
φ5
(2.5)
1.1
1.5 MAX Not Soldered
1
5.6
5.3
Cathode
7.3
8.3
12.1±0.5
(2)
28.6±1
0.3
0.3
ストッパー部詳細図
Lead Standoff
1
項目 Item
内容 Description
樹脂材質
Resin Materials
エポキシ樹脂 (一部蛍光体入り)
Epoxy Resin (partly using phosphor)
リードフレーム材質
Lead Frame
Materials
鉄+銀メッキ+鉛フリーはんだメッキ
Ag-plated and Lead-free Solder-plated Iron
質量
Weight
0.26g (TYP)
* タイバーを切り取った部分は鉄が露出しております。
またLEDには鋭利な部分がありま す。特にリード部分は、人体を傷つける
ことがありますので、取り扱いに際しては十分注意して下さい。
The tie bar cut-end surface exhibits exposed iron base metal.
Care must be taken to handle the LEDs, as it may contain sharp parts
such as lead, and can cause injury.
* はんだメッキ部に素地の著しい露出はないこととします。
No noticeable exposure of base metal of the lead with a solder-dipped finish.
4
NICHIA STS-DA1-1286 <Cat.No.110201>
SOLDERING
• Dip Soldering
• Hand Soldering
Temperature
350°C Max.
Pre-Heat
120°C Max.
Soldering Time
3 sec. Max.
Pre-Heat Time
60 sec. Max.
No closer than 3mm from
Solder Bath
the base of the lens.
Temperature
Position
Dipping Time
Dipping Position
260°C Max.
10 sec.Max
No closer than 3mm from
the base of the lens.
* Solder the LED no closer than 3 mm from the base of the lens. Soldering beyond the base of the tie bar is recommended.
* Dip soldering and manual soldering must only be done once.
* A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
* Do not apply any stress to the lead particularly when heated.
* After soldering, the LED position must not be corrected.
* After soldering, NO mechanical shock or vibration should be applied to LED lens until the LEDs cool down
to room temperature.
* In order to avoid damage on the lens during cutting and clinching the leads, it is not recommended to solder
the LEDs directly on customer PCB without any gap between the lens and the board. If it is unavoidable,
customer is advised to check whether such soldering will not cause wire breakage or lens damage.
Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.
* When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress
on the LEDs.
* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.
5
NICHIA STS-DA1-1286 <Cat.No.110201>
PACKAGING - BULK
管理番号 No.
Nxxxxxxxx
STS-DA7-0001
袋の表示 Label printed on the bag
帯電防止袋
Anti-electrostatic Bag
XXXX LED
Type Nxxxxxxxx
*******
Lot YMxxxx-RRR
Qty
pcs
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
CAUTION TO
ELECTROSTATIC DAMAGE
静電気に注意
帯電防止袋を並べて入れ、ダンボールで仕切ります。
The anti-electrostatic bags are packed in a cardboard box with
corrugated partition.
ラベル Label attached to the box
XXXX LED
TYPE Nxxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it is not indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING SCHEME"
in this document.
* 本製品は帯電防止袋に入れたのち、輸送の衝撃から保護するためダンボールで梱包します。
The products are placed loose in anti-static bags.
The anti-static bags are packed in cardboard boxes to prevent damage during shipment.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop the cardboard box or expose it to shock. If the box falls, the products could be damaged.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
The cardboard box is not water-resistant. Do not expose to water.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Customer is advised to pack the products in the original packaging or equivalent in transit.
6
NICHIA STS-DA1-1286 <Cat.No.110201>
LOT NUMBERING SCHEME
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
Y
2009
9
2010
A
2011
B
2012
C
2013
D
2014
E
M - Month
Month
M
Month
M
1
1
7
7
2
2
8
8
3
3
9
9
4
4
10
A
5
5
11
B
6
6
12
C
xxxx-Nichia's Product Number
RRR-Ranking by Color Coordinates, Ranking by Luminous Intensity
7
NICHIA STS-DA1-1286 <Cat.No.110201>
DERATING CHARACTERISTICS
管理番号 No.
NSPA510B(S)
STS-DA7-0101
周囲温度 - 許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
許容順電流
Allowable Forward Current (mA)
50
40
(47, 30.0)
30
20
10
(85, 8.50)
0
0
20
40
60
80
100
120
周囲温度
Ambient Temperature (°C)
デューティー比 － 許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
TA = 25°C
許容順電流
Allowable Forward Current (mA)
1000
100
30
10
1
10
100
デューティー比
Duty Ratio (%)
8
NICHIA STS-DA1-1286 <Cat.No.110201>
OPTICAL CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
管理番号 No.
発光スペクトル
Spectrum
NSPA510B(S)
STS-DA7-0102
T A = 25°C
IF = 20 mA
Spectrum
1.0
相対発光強度
Relative Emission Intensity (a.u.)
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
750
800
波長
Wavelength (nm)
Directivity1
指向特性
Directivity
-20°
-10°
0°
10°
T A = 25°C
I FP = 20 mA
20°
30°
-30°
40°
放射角度
Radiation Angle
-40°
50°
-50°
-60°
60°
-70°
70°
80°
-80°
-90°
90°
1
0.5
0
0.5
1
相対光度
Relative Luminosity　(a.u.)
9
NICHIA STS-DA1-1286 <Cat.No.110201>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧 - 順電流特性
Forward Voltage vs
Forward Current
管理番号 No.
周囲温度 - 順電圧特性
Ambient Temperature vs
Forward Voltage
VfIf
T A = 25°C
100
NSPA510B(S)
STS-DA7-0103
IFP = 5 mA
IFP = 20 mA
IFP = 60 mA
TaVf
5.0
順電圧
Forward Voltage (V)
順電流
Forward Current (mA)
4.5
20
10
4.0
3.5
3.0
2.5
1
2.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-60 -40 -20
順電圧
Forward Voltage (V)
20
40
60
80
100 120
周囲温度
Ambient Temperature (°C)
周囲温度 - 相対光度特性
順電流 - 相対光度特性
Forward Current vs
Relative Luminosity
Ambient Temperature vs
Relative Luminosity
IfIv
TA = 25°C
5
TaIv
IFP = 20 mA
1.4
4
相対光度
Relative Luminosity (a.u.)
相対光度
Relative Luminosity (a.u.)
0
3
2
1.2
1.0
0.8
1
0.6
0
0
20
40
60
80
順電流
Forward Current (mA)
100
120
-60 -40 -20
0
20
40
60
80
100 120
周囲温度
Ambient Temperature (°C)
10
NICHIA STS-DA1-1286 <Cat.No.110201>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流 - 色度特性
Forward Current vs
Chromaticity Coordinate
管理番号 No.
NSPA510B(S)
STS-DA7-0104
Ifxy
TA = 25°C
0.445
0.440
y
100 mA
20 mA
1 mA
0.435
0.430
0.425
0.550
0.555
0.560
0.565
0.570
x
周囲温度 - 色度特性
Ambient Temperature vs
Chromaticity Coordinate
Taxy
IFP = 20 mA
0.445
0.440
y
-30°C
0°C
25°C
50°C
85°C
0.435
0.430
0.425
0.550
0.555
0.560
0.565
0.570
x
11
NICHIA STS-DA1-1286 <Cat.No.110201>
RELIABILITY
(1) Tests and Results
Reference
Test
Test
Test Conditions
Standard
Duration
Resistance to
JEITA ED-4701
Tsld = 260 ± 5°C, 10 sec, 1 dip,
Soldering Heat
300 302
3 mm from the base of the lens
JEITA ED-4701
-40°C (30 min) ~ 25°C (5 min) ~
100 105
100°C (30 min) ~ 25°C (5 min)
Moisture Resistance
JEITA ED-4701
25°C ~ 65°C ~ -10°C, 90%RH,
(Cyclic)
200 203
24 hr per cycle
Terminal Bending
JEITA ED-4701
5 N, 0° ~ 90° ~ 0° bend,
Strength
400 401
2 bending cycles
Terminal Pull
JEITA ED-4701
Strength
400 401
High Temperature
JEITA ED-4701
Storage
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature
JEITA ED-4701
Storage
200 202
Temperature Cycle
Room Temperature
Operating Life
Temperature Humidity
Operating Life
Low Temperature
Operating Life
Failure
Criteria
#
Unites
Failed/Tested
#1
0/50
100 cycles
#1
0/50
10 cycles
#1
0/50
#1
0/50
#1
0/50
10 N, 10 ± 1 sec
TA=100°C
1000 hours
#1
0/50
TA=60°C、RH=90%
1000 hours
#1
0/50
TA=-40°C
1000 hours
#1
0/50
TA=25℃、IF=30mA
1000 hours
#1
0/50
60°C、RH=90%、IF=20mA
500 hours
#1
0/50
TA=-30°C、IF=20mA
1000 hours
#1
0/50
NOTES:
Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
#1
Items
Conditions
Failure Criteria
Forward Voltage (VF)
IF=20mA
> U.S.L.×1.1
Luminous Intensity (Iv)
IF=20mA
< L.S.L.×0.7
Reverse Current (IR)
VR=5V
> U.S.L.×2.0
U.S.L. : Upper Specification Limit
L.S.L. : Lower Specification Limit
12
NICHIA STS-DA1-1286 <Cat.No.110201>
CAUTIONS
(1) Lead Forming
● When forming leads, the leads should be bent at a point at lease 3mm from the base of the epoxy bulb.Do not use
the base of the leadframe as a fulcrum during lead forming.
● Lead forming should be done before soldering.
● Do not apply any bending stress to the base of the lead. The stress to the base may damage the LED's characteristics or
it may break the LEDs.
● When mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned
with the lead pitch of the product.If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin
and this will degrade the LEDs.
(2) Storage
● Shelf life of the products in unopened bag is 3 months (max.) at <30°C and 70% RH from the delivery date.If the shelf life
exceeds 3 months or more, the LEDs need to be stored in a sealed container with desiccant (silica gel) to ensure
their shelf life will not exceed 1 year.
● Customer is advised to store properly the products in controlled ambient and complete immediately all high temperature
related process including soldering as exposure to corrosive environment might cause the plated metal parts of the product
to tarnish, which might lead to difficulties in soldering.
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
(3) Directions for Use
● In designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating specified for each LED.
It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile,
when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
...
...
● This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to
either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product,
such operation can cause migration resulting in LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating when using the LEDs
with matrix drive.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
(4) Handling Precautions
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface and affect
on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure due to
package damage and/or wire breakage.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
(5) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to brake.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not with hands.
13
NICHIA STS-DA1-1286 <Cat.No.110201>
(6) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. An ESD event may damage its die or reduce its reliability
performance. When handling the products, measures against electro static discharge, including the followings, are strongly
recommended.
Eliminating the charge;
Wrist strap, ESD footwear and garments, ESD floors
Grounding the equipment and tools at workstation
ESD table/shelf mat (conductive materials)
● Proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products.
Also note that surge protection should be considered in the design of customer products.
● If tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge,
including the followings, are strongly recommended.
Dissipating the charge with conductive materials
Preventing the charge generation with moisture
Neutralizing the charge with ionizers
● When performing the characteristics inspection of the LEDs in your application, customer is advised to check on the LEDs
whether or not they are damaged by ESD. Such damage can be detected during forward voltage measurement
or lightup test at low current. (the recommended current is 1mA or lower)
● ESD-damaged LEDs may have an increased leakage current, current flow at low voltage, or no longer light up at low current.
Failure Criteria: VF<2.0V at IF=0.5mA
(7) Thermal Management
● Thermal management is an important factor when designing your product by using the LEDs. The rise in LED die temperature
can be affected by PCB thermal resistance or/and LED spacing as mounted on the board. Customer is advised to design
the product to ensure that the LED die temperature does not exceed the required maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
(8) Cleaning
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs due to
the damage to the resin portion. The effects of such solvents should be verified prior to use. In addition,
the use of CFCs such as Freon is heavily regulated.
● Ultrasonic cleaning is not recommended for the LEDs since it may adversely effect on the LEDs by the ultrasonic power and
LED assembled condition. If it is unavoidable, customer is advised to check prior to use that the cleaning
will not damage the LEDs.
(9) Eye Safety
● The International Electrical Commission (IEC) published in 2006, IEC 62471:2006 Photobiological safety of lamps
and lamp systems which includes LEDs within its scope. Meanwhile LEDs were removed from the scope
of the IEC 60825-1:2007 laser safety standard, the 2001 edition of which included LED sources within its scope.
However, keep it mind that some countries and regions have adopted standards based on the IEC laser safety
standard IEC 60825-1:2001 which includes LEDs within its scope. Following IEC 62471:2006,
most of Nichia LEDs can be classified as belonging to either Exempt Group or Risk Group 1.
Especially a high-power LED, that emits light containing blue wavelengths, may be in Risk Group 2.
Great care should be taken when viewing directly the LED driven at high current or the LED with optical instruments,
which greatly increase the hazard to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
precaution should be taken to avoid adverse effect on human body caused by the light stimulus.
14
NICHIA STS-DA1-1286 <Cat.No.110201>
(10) Others
● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,
communications equipment, measurement instruments and household appliances).
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,
traffic control equipment, life support systems and safety devices).
● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
● Customer and Nichia shall agree the official specification of supplied products prior to the start of a customer’s volume production.
● The appearance and specifications of the product may be modified for improvement without notice.
15