Datasheet

NICHIA STS-DA1-2719E <Cat.No.150820>
NICHIA CORPORATION
SPECIFICATIONS FOR WARM WHITE LED
NS9L383T
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
NICHIA STS-DA1-2719E <Cat.No.150820>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Symbol
Absolute Maximum Rating
Unit
Forward Current
Item
IF
1000
mA
Pulse Forward Current
IFP
1200
mA
Allowable Reverse Current
IR
85
mA
Power Dissipation
PD
3.6
W
Operating Temperature
Topr
-40~100
°C
Storage Temperature
Tstg
-40~100
°C
Junction Temperature
TJ
135
°C
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Condition
Typ
Max
Unit
VF
IF=350mA
2.9
-
V
Φv
IF=350mA
152
-
lm
Luminous Intensity
Iv
IF=350mA
43
-
cd
Color Rendering Index
Ra
IF=350mA
75
-
-
Luminous Flux
Φv
IF=350mA
142
-
lm
Luminous Intensity
Iv
IF=350mA
42
-
cd
Color Rendering Index
Ra
IF=350mA
85
-
-
x
-
IF=350mA
0.41
-
-
y
-
IF=350mA
0.39
-
-
RθJS
-
6
9
°C/W
Forward Voltage
Luminous Flux
R70
R8000
Chromaticity Coordinate
Thermal Resistance
* Characteristics at TS=25°C.
* Luminous Flux value as per CIE 127:2007 standard.
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
* RθJS is Thermal Resistance from junction to TS measuring point.
1
NICHIA STS-DA1-2719E <Cat.No.150820>
RANKS
Item
Rank
Forward Voltage
Luminous Flux
Min
Max
L
3.2
3.6
K
2.8
3.2
J
2.4
2.8
B16
160
170
B15
150
160
B14
140
150
B13
130
140
B12
120
130
Ra
70
-
-
Ra
80
-
-
R9
0
-
-
R70
Color Rendering Index
R8000
Unit
V
lm
Color Ranks
Rank sw27
Rank sw30
x
0.4373
0.4562
0.4813
0.4593
x
0.4147
0.4299
0.4562
0.4373
y
0.3893
0.4260
0.4319
0.3944
y
0.3814
0.4165
0.4260
0.3893
Rank sw35
Rank sw40
x
0.3898
0.3996
0.4299
0.4147
x
0.3670
0.3736
0.3996
0.3898
y
0.3716
0.4015
0.4165
0.3814
y
0.3578
0.3874
0.4015
0.3716
x
0.3515
0.3548
0.3736
0.3670
y
0.3487
0.3736
0.3874
0.3578
Rank sw45
* Ranking at TS=25°C.
* Forward Voltage Tolerance: ±0.05V
* Luminous Flux Tolerance: ±7%
* Color Rendering Index Ra Tolerance: ±2
* Color Rendering Index R9 Tolerance: ±6.5
* The R9 value for the above rank shall be greater than 0.
* Chromaticity Coordinate Tolerance: ±0.005
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.
Luminous Flux Ranks by Color Rank, Color Rendering Index Rank
Ranking by
Luminous Flux
Ranking by
B12
B13
B14
B15
B16
Color Coordinates,
Color Rendering Index
sw27,sw30
sw35,sw40,sw45
R70
R8000
R70
R8000
2
NICHIA STS-DA1-2719E <Cat.No.150820>
CHROMATICITY DIAGRAM
0.50
0.45
sw27
y
sw30
sw35
0.40
sw40
sw45
0.35
黒体放射軌跡
Blackbody Locus
2870K
3220K
2580K
3710K
4260K
4745K
0.30
0.30
0.35
0.40
0.45
0.50
x
3
NICHIA STS-DA1-2719E <Cat.No.150820>
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.
管理番号 No.
NS9L383
STS-DA7-1826B
(単位 Unit:±0.2)
mm)
(単位 Unit: mm, 公差 Tolerance:
6.5
5
4.9
1.4
Cathode Mark
5
0.25
2.75
4.7
項目 Item
内容 Description
2.18
パッケージ材質
Package Materials
耐熱性ポリマー
Heat-Resistant Polymer
封止樹脂材質
Encapsulating Resin
Materials
シリコーン樹脂
（拡散剤+蛍光体入り）
Silicone Resin
(with diffuser and phosphor)
電極材質
Electrodes Materials
鋼+銅+金メッキ
Au-plated Ferrous Metal and Copper
ダイヒートシンク材質
Die Heat Sink
Materials
鋼+銅+金メッキ
Au-plated Ferrous Metal and Copper
質量
Weight
0.086g(TYP)
3.5
2.81
4.12
Cathode
Anode
ダイヒートシンク
Die Heat Sink
K
* 本製品には、パッケージ本体の内側及び/または外側に
銀メッキされた金属部分があります。
This product has silver plated metal parts
that are inside and/or outside the package body.
A
保護素子
Protection Device
ダイヒートシンク
Die Heat Sink
4
NICHIA STS-DA1-2719E <Cat.No.150820>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
260°CMax
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
● Recommended Soldering Pad Pattern
8
4.6
Cathode
3.9
3.01
2.38
Anode
(単位 Unit: mm)
Die Heat Sink and the cathode should be soldered to a PCB.
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
Using a nozzle designed for the LEDs is recommended. (See Figure below)
* The nozzle must not have any direct contact with the encapsulating resin.
Φ5.3
(Φ6.3)
(4.0)
2.7
Direct contact with the encapsulating resin may result in internal disconnections causing the LED not to illuminate.
(単位 Unit: mm)
5
NICHIA STS-DA1-2719E <Cat.No.150820>
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* The Die Heat Sink should be soldered to customer PCB.
If it is difficult or impossible, use high heat-dissipating adhesive.
* When soldering, do not apply stress to the LED while the LED is hot.
* This LED can be soldered to a PCB designed for the recommended soldering pad pattern of Nichia’s 183series.
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
6
NICHIA STS-DA1-2719E <Cat.No.150820>
TAPE AND REEL DIMENSIONS
テーピング部 Tape
1.75±0.1
Φ1.5+0.25
-0
Nxxx383x
STS-DA7-1320B
(単位 Unit: mm)
6.8±0.1
7.5±0.1
Cathode Mark
0.33±0.05
3.6
2±0.1 4±0.1
16+0.3
-0.1
12±0.1
Φ1.5+0.1
-0
管理番号 No.
3±0.1
5.3
エンボスキャリアテープ
Embossed Carrier Tape
6.8±0.1
トレーラ部/リーダ部 Trailer and Leader
トップカバーテープ
Top Cover Tape
引き出し方向
Feed
Direction
トレーラ部最小160mm（空部）
Trailer 160mm MIN(Empty Pockets)
LED装着部
Loaded Pockets
引き出し部最小100mm（空部）
Leader with Top Cover Tape
100mm MIN(Empty Pocket)
リーダ部最小400mm
Leader without Top Cover Tape 400mm MIN
リール部 Reel
330±2
21.5±1
17.5±1
* 数量は1リールにつき 1500個入りです。
Reel Size: 1500pcs
Φ
21 ±
0.
ラベル
Label
Φ80±1
Φ1
3 ±0.2
8
* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).
* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,
no more than 10N should be applied to
the embossed carrier tape.
The LEDs may stick to the top cover tape.
7
NICHIA STS-DA1-2719E <Cat.No.150820>
PACKAGING - TAPE & REEL
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。
Reels are shipped with desiccants in heat-sealed moisture-proof bags.
管理番号 No.
Nxxxxxxx
STS-DA7-4989
ラベル Label
リール
Reel
シリカゲル
Desiccants
XXXX LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY.
PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
熱シール
Seal
アルミ防湿袋
Moisture-proof Bag
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。
Moisture-proof bags are packed in cardboard boxes
with corrugated partitions.
ラベル Label
XXXX LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it will not be indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING CODE"
in this document.
* ランク分けがない場合はランク表記はありません。
The label does not have the RANK field for
un-ranked products.
* 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or expose the box to external forces as it may damage the products.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water. The box is not water-resistant.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using the original package material or equivalent in transit is recommended.
8
NICHIA STS-DA1-2719E <Cat.No.150820>
LOT NUMBERING CODE
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
Y
2014
E
2015
F
2016
G
2017
H
2018
I
2019
J
M - Month
Month
M
Month
M
1
1
7
7
2
2
8
8
3
3
9
9
4
4
10
A
5
5
11
B
6
6
12
C
xxxx-Nichia's Product Number
RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Forward Voltage, Ranking by Color Rendering Index
9
NICHIA STS-DA1-2719E <Cat.No.150820>
DERATING CHARACTERISTICS
管理番号 No.
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1
カソード側はんだ接合部温度-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Current
RθJA =24°C/W
RθJA =34°C/W
Derating2
1200
(25, 1000) (57, 1000)
900
600
(100, 440)
300
(100, 315)
1200
(100, 1000)
900
600
300
0
0
0
20
40
60
80
100
120
0
20
40
60
80
100
周囲温度
カソード側はんだ接合部温度
Ambient Temperature(°C)
Solder Temperature(Cathode Side)(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
Duty
10000
許容順電流
Allowable Forward Current(mA)
1500
許容順電流
許容順電流
Allowable Forward Current(mA)
1500
Allowable Forward Current(mA)
NS9x383
STS-DA7-4158
120
TA =25°C
1200
1000
100
1
10
100
デューティー比
Duty Ratio(%)
10
NICHIA STS-DA1-2719E <Cat.No.150820>
OPTICAL CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
NS9L383
STS-DA7-1839
管理番号 No.
発光スペクトル
Spectrum
TA =25°C
IFP=350mA
Spectrum
相対発光強度
Relative Emission Intensity(a.u.)
1.0
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
750
800
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
-10°
0°
TA =25°C
IFP=350mA
10°
-20°
20°
30°
-30°
40°
放射角度
Radiation Angle
-40°
50°
-50°
-60°
60°
-70°
70°
80°
-80°
-90°
90°
1
0.5
0
0.5
1
相対照度
Relative Illuminance(a.u.)
* 本特性は演色性ランクR70に対応しています。
The graphs above show the characteristics for R70 LEDs of this product.
11
NICHIA STS-DA1-2719E <Cat.No.150820>
OPTICAL CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
NS9L383
STS-DA7-1840
管理番号 No.
発光スペクトル
Spectrum
TA =25°C
IFP=350mA
Spectrum
相対発光強度
Relative Emission Intensity(a.u.)
1.0
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
750
800
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
-10°
0°
TA =25°C
IFP=350mA
10°
-20°
20°
30°
-30°
40°
放射角度
Radiation Angle
-40°
50°
-50°
-60°
60°
-70°
70°
80°
-80°
-90°
90°
1
0.5
0
0.5
1
相対照度
Relative Illuminance(a.u.)
* 本特性は演色性ランクR8000に対応しています。
The graphs above show the characteristics for R8000 LEDs of this product.
12
NICHIA STS-DA1-2719E <Cat.No.150820>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NS9L383
管理番号 No. STS-DA7-4148B
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電圧-順電流特性
Forward Voltage vs
Forward Current
周囲温度-順電圧特性
Ambient Temperature vs
Forward Voltage
VfIf
TA =25°C
10000
TaVf
IFP=350mA
4.0
順電圧
Forward Voltage(V)
順電流
Forward Current(mA)
3.5
1200
1000
350
100
3.0
2.5
2.0
10
2.0
-60
2.5
3.0
3.5
-40
順電圧
Forward Voltage(V)
順電流-相対光束特性
Forward Current vs
Relative Luminous Flux
0
20
40
60
80
100 120
周囲温度
Ambient Temperature(°C)
IfIv
TA =25°C
3.5
-20
4.0
周囲温度-相対光束特性
Ambient Temperature vs
Relative Luminous Flux
TaIv
IFP=350mA
1.4
相対光束
Relative Luminous Flux(a.u.)
相対光束
Relative Luminous Flux(a.u.)
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.6
-60
0.0
0
200
400
600
800
-40
-20
0
20
40
60
80
100 120
1000 1200 1400
順電流
Forward Current(mA)
周囲温度
Ambient Temperature(°C)
13
NICHIA STS-DA1-2719E <Cat.No.150820>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-色度特性
Forward Current vs
Chromaticity Coordinate
管理番号 No.
NS9L383
STS-DA7-4364
Ifxy
TA =25°C
0.41
y
0.40
20mA
100mA
350mA
1000mA
1200mA
0.39
0.38
0.37
0.39
0.40
0.41
0.42
0.43
x
周囲温度-色度特性
Ambient Temperature vs
Chromaticity Coordinate
Taxy
IFP= 350mA
0.41
0.40
y
-40°C
0°C
25°C
0.39
100°C
0.38
0.37
0.39
0.40
0.41
0.42
0.43
x
* 本特性は演色性ランクR70に対応しています。
The graphs above show the characteristics for R70 LEDs of this product.
14
NICHIA STS-DA1-2719E <Cat.No.150820>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
順電流-色度特性
Forward Current vs
Chromaticity Coordinate
管理番号 No.
NS9L383
STS-DA7-4365
Ifxy
TA =25°C
0.41
0.40
y
1200mA
350mA
0.39
20mA
0.38
0.37
0.39
0.40
0.41
0.42
0.43
x
周囲温度-色度特性
Ambient Temperature vs
Chromaticity Coordinate
Taxy
IFP= 350mA
0.41
-40°C
0.40
y
0°C
25°C
0.39
100°C
0.38
0.37
0.39
0.40
0.41
0.42
0.43
x
* 本特性は演色性ランクR8000に対応しています。
The graphs above show the characteristics for R8000 LEDs of this product.
15
NICHIA STS-DA1-2719E <Cat.No.150820>
RELIABILITY
(1) Tests and Results
Reference
Test
Standard
Resistance to
Test
Test Conditions
Duration
JEITA ED-4701
Tsld=260°C, 10sec, 2reflows,
300 301
Precondition: 30°C, 70%RH, 168hr
Solderability
JEITA ED-4701
Tsld=245±5°C, 5sec,
(Reflow Soldering)
303 303A
Lead-free Solder(Sn-3.0Ag-0.5Cu)
JEITA ED-4701
-40°C(30min)~25°C(5min)~
100 105
100°C(30min)~25°C(5min)
Moisture Resistance
JEITA ED-4701
25°C~65°C~-10°C, 90%RH,
(Cyclic)
200 203
24hr per cycle
High Temperature
JEITA ED-4701
Storage
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature
JEITA ED-4701
Storage
200 202
Soldering Heat
(Reflow Soldering)
Temperature Cycle
#2
0/22
100cycles
#1
0/50
10cycles
#1
0/22
TA=100°C
1000hours
#1
0/22
TA=60°C, RH=90%
1000hours
#1
0/22
TA=-40°C
1000hours
#1
0/22
1000hours
#1
0/22
1000hours
#1
0/22
500hours
#1
0/22
1000hours
#1
0/22
48minutes
#1
0/22
#1
0/22
#1
0/22
TA=25°C, IF=1000mA
Test board: See NOTES below
High Temperature
TA=100°C, IF=250mA
Operating Life
Test board: See NOTES below
Temperature Humidity
60°C, RH=90%, IF=550mA
Operating Life
Test board: See NOTES below
Low Temperature
TA=-40°C, IF=700mA
Operating Life
Test board: See NOTES below
JEITA ED-4701
200m/s2, 100~2000~100Hz,
400 403
4cycles, 4min, each X, Y, Z
JEITA ED-4701
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
300 304
alternately positive or negative
Soldering Joint Shear
JEITA ED-4702B
Strength
002 3
Failed/Tested
0/22
Operating Life
Electrostatic Discharges
#
Units
#1
Room Temperature
Vibration
Failure
Criteria
5N, 10±1sec
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈34°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
#1
#2
Items
Conditions
Failure Criteria
Forward Voltage(VF)
IF=350mA
>Initial value×1.1
Luminous Flux(ΦV)
IF=350mA
<Initial value×0.7
Solderability
-
Less than 95% solder coverage
16
NICHIA STS-DA1-2719E <Cat.No.150820>
CAUTIONS
(1) Storage
Conditions
Storage
Temperature
Humidity
Time
Before Opening Aluminum Bag
≤30°C
≤90%RH
Within 1 Year from Delivery Date
After Opening Aluminum Bag
≤30°C
≤70%RH
≤168hours
65±5°C
-
≥24hours
Baking
● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.
● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags
to minimize moisture absorption during transportation and storage.
Included silica gel desiccants change from blue to red if moisture had penetrated bags.
● After opening the moisture-proof aluminum bag, the products should go through the soldering process
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants
in a hermetically sealed container, preferably the original moisture-proof bags for storage.
● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,
the products should be baked. Baking should only be done once.
● Customer is advised to keep the LEDs in an airtight container when not in use. Exposure to a corrosive environment
may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristics.
It is also recommended to return the LEDs to the original moisture proof bags and reseal.
● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials
in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing.
Resin materials, in particular, may contain substances which can affect silver plating, such as halogen.
● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended
as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts
inside the products, caused by low molecular weight volatile siloxane.
● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.
Since ferrous metal is exposed at the end of the lead frames, please be careful of corrosion.
● Do not store the LEDs in a dusty environment.
● Do not expose the LEDs to direct sunlight and/or an environment where the temperature is higher than
normal room temperature.
(2) Directions for Use
● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
...
...
● This product should be operated using forward current. Ensure that the product is not subjected to
either forward or reverse voltage while it is not in use. In particular, subjecting it to continuous reverse voltage
may cause migration, which may cause damage to the LED die. When used in displays that are not used for a long time,
the main power supply should be switched off for safety.
● It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.
● Ensure that excessive voltages such as lightning surges are not applied to the LEDs.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
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NICHIA STS-DA1-2719E <Cat.No.150820>
(3) Handling Precautions
● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics:
it might cause the LED to be deformed and/or the wire to break, which will cause the LED not to illuminate.
The lead could also cause an injury.
● When handling the product with tweezers, be careful not to apply excessive force to the resin.
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures.
● When handling the product with tweezers, always pick it up from the short side of the LED (the resin package body)
and never from the long side which has the leads. Failure to comply can cause wire-bond breaks and package damage,
which will cause the LEDs not to illuminate.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures.
(4) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not using hands.
● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, packing,
adhesive, secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin.
If the LEDs are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed
to heat and/or photon energy and it may greatly reduce the LED light output and/or cause a color shift.
In this case, ventilating the environment may improve the reduction in light output and/or color shift.
Perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues,
especially if the LEDs are planned to be used in a hermetically sealed environment.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
● Ensure that tools, jigs and machines that are being used are properly grounded and
that proper grounding techniques are used in work areas. For devices/equipment that mount the LEDs,
protection against surge voltages should also be used.
● If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
● The customer is advised to check if the LEDs are damaged by ESD
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement at low current (≤9mA).
● ESD damaged LEDs may have current flow at a low voltage.
Failure Criteria: VF<2.0V at IF=4.5mA
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NICHIA STS-DA1-2719E <Cat.No.150820>
(6) Thermal Management
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
● The following equations can be used to calculate the junction temperature of the products.
1) TJ=TA+RθJA･W
2) TJ=TS+RθJS･W
*TJ=LED junction temperature: °C
TA=Ambient temperature: °C
TS=Soldering temperature (cathode side): °C
RθJA=Thermal resistance from junction to ambient: °C/W
RθJS=Thermal resistance from junction to TS measuring point: °C/W
W=Input power(IF×VF): W
Ts Point
(7) Cleaning
● The LEDs should not be cleaned with water, benzine, and/or thinner.
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● When dust and/or dirt adheres to the LEDs, soak a cloth with Isopropyl alcohol (IPA), then squeeze it before wiping the LEDs.
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.
(8) Eye Safety
● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps
and lamp systems, which added LEDs in its scope.
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.
However, please be advised that some countries and regions have adopted standards
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs
with optical instruments which may greatly increase the damages to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
please be careful to avoid adverse effects on the human body caused by light stimulation.
(9) Others
● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,
communications equipment, measurement instruments and household appliances).
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,
traffic control equipment, life support systems and safety devices).
● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
● The specifications and appearance of this product may change without notice;
Nichia does not guarantee the contents of this specification. Both the customer and Nichia
will agree on the official specifications of supplied products before the volume production of a program begins.
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