Datasheet

TVS Diodes
Surface Mount – 400W > SMF4L Series
SMF4L Series
RoHS
Pb e3
Description
Uni-directional
The SMF4L series of SOD-123FL small and flat lead lowprofile plastic package is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol
Peak Pulse Power
Dissipation at
TA=25ºC (Note 1)
8/20µs (Note 2)
Value
Unit
2000
W
400
W
PPPM
10/1000µs (Note 3)
Thermal Resistance Junction to
Ambient
RθJA
220
°C/W
Thermal Resistance Junction to Lead
RθJL
100
°C/W
TJ,TSTG
-55 to
150
°C
Operating and Storage Temperature
Range
Notes:
1. Non-repetitive current pulse, per Fig. 4 and derated above TJ (initial) =25ºC per Fig. 3.
• 400W peak pulsepower
capability at 10/1000µs
waveform, repetition rate
(duty cycle): 0.01%
• Compatible with industrial
standard package SOD123FL
• Low profile: maximum
height of 0.98mm.
• Low inductance, excellent
clamping capability
• For surface mounted
applications to optimize
board space
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• Fast response time:
typically less than 1.0ns
from 0 Volts to VBR min
• High temperature
soldering: 260°C/40
seconds at terminals
• Glass passivated junction
• Built-in strain relief
• Plastic package is
flammability rated V-0 per
Underwriters Laboratories
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen-free and RoHS
compliant
• Pb-free E3 means 2nd level
interconnect is Pb-free
and the terminal finish
material is tin(Sn) (IPC/
JEDEC J-STD-609A.01)
2. SMF4L5.0A~SMF4L9.0A Peak Pulse Power Dissipation is 1850W min, 2000W
typical @8/20us
3. SMF4L5.0A~SMF4L9.0A Peak Pulse Power Dissipation is 370W min, 400W typical @
10/1000µs
Applications
SMF4L devices are ideal for the protection of portable
devices/hard drives, notebooks, VCC busses, POS terminal,
SSDs, power supplies, monitors, and vulnerable circuit
used in other consumer applications.
Functional Diagram
Bi-directional
Cathode
Anode
Uni-directional
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/19/16
TVS Diodes
Surface Mount – 400W > SMF4L Series
Electrical Characteristics (T =25°C unless otherwise noted)
A
Part
Number
SMF4L5.0A
SMF4L6.0A
SMF4L6.5A
SMF4L7.0A
SMF4L7.5A
SMF4L8.0A
SMF4L8.5A
SMF4L9.0A
SMF4L10A
SMF4L11A
SMF4L12A
SMF4L13A
SMF4L14A
SMF4L15A
SMF4L16A
SMF4L17A
SMF4L18A
SMF4L20A
SMF4L22A
SMF4L24A
SMF4L26A
SMF4L28A
SMF4L30A
SMF4L33A
SMF4L36A
SMF4L40A
SMF4L43A
SMF4L45A
SMF4L48A
SMF4L51A
SMF4L54A
SMF4L58A
SMF4L60A
SMF4L64A
SMF4L70A
SMF4L75A
SMF4L78A
SMF4L85A
Marking
Code
KE
KG
KK
KM
KP
KR
KT
KV
KX
KZ
LE
LG
LK
LM
LP
LR
LT
LV
LX
LZ
ME
MG
MK
MM
MP
MR
MT
MV
MX
MZ
NE
NG
NK
NM
NP
NR
NT
NV
Breakdown
Voltage VBR
(Volts) @ IT
MIN
MAX
Test
Current
IT
(mA)
6.40
6.67
7.22
7.78
8.33
8.89
9.44
10.00
11.10
12.20
13.30
14.40
15.60
16.70
17.80
18.90
20.00
22.20
24.40
26.70
28.90
31.10
33.30
36.70
40.00
44.40
47.80
50.00
53.30
56.70
60.00
64.40
66.70
71.10
77.80
83.30
86.70
94.40
7.00
7.37
7.98
8.60
9.21
9.83
10.40
11.10
12.30
13.50
14.70
15.90
17.20
18.50
19.70
20.90
22.10
24.50
26.90
29.50
31.90
34.40
36.80
40.60
44.20
49.10
52.80
55.30
58.90
62.70
66.30
71.20
73.70
78.60
86.00
92.10
95.80
104.00
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Maximum
Reverse Stand
Reverse
off Voltage
Leakage @ VR
VR (V)
IR (µA)
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
78
85
800
800
500
200
100
50
20
10
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Maximum
Peak Pulse
Current Ipp
(A)
40.1
35.9
33.1
30.9
28.7
27.2
25.7
24.1
23.5
22.0
20.1
18.6
17.2
16.4
15.4
14.5
13.7
12.3
11.3
10.3
9.5
8.8
8.3
7.5
6.9
6.2
5.8
5.5
5.2
4.9
4.6
4.3
4.1
3.9
3.5
3.3
3.2
2.9
Maximum
Clamping
Voltage
@Ipp
VC (V)
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113.0
121.0
126.0
137.0
Agency
Approval
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Notes:
1. VBR measured after IT applied for 300µs, IT = square wave pulse or equivalent.
2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/19/16
TVS Diodes
Surface Mount – 400W > SMF4L Series
I-V Curve Characteristics
Uni-directional
Vc VBR VR
V
IR VF
IT
Ipp
PPPM
VR
VBR
VC
IR
VF
Peak Pulse Power Dissipation -- Max power dissipation
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
Reverse Leakage Current -- Current measured at VR
Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating Curve
10
PPPM-Peak Pulse Power (kW)
Voltage Transients
Voltage or Current
Voltage Across TVS
Current Through TVS
1
0.2x0.2" (5.0x5.0mm)
Copper Pad Area
0.1
0.000001
Time
0.00001
0.0001
0.001
td-Pulse Width (sec.)
continues on next page.
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/19/16
TVS Diodes
Surface Mount – 400W > SMF4L Series
Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued)
A
Figure 3 - Peak Pulse Power Derating Curve
Figure 4 - Pulse Waveform - 10/1000µS
150
IPPM- Peak Pulse Current, % IRSM
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
80
60
40
20
0
0
25
50
75
100
125 150
TJ - Initial Junction Temperature (ºC)
tr=10µsec
Peak Value
IPPM
100
Half Value
IPPM IPPM
( )
2
50
0
175
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
10/1000µsec. Waveform
as defined by R.E.A
td
0
1.0
2.0
3.0
4.0
t-Time (ms)
Figure 5 - Forward Voltage
Figure 6 - Typical Junction Capacitance
Uni-directional V=0v
1000
0.8
0.7
Cj (pF)
Vf - Typical forward dropped voltage@10mA
10000
0.9
0.6
0.5
100
Uni-directional V=VR
10
0.4
1
0
-55
10
75
1
140
Temperature (ºC)
Figure 7 - Peak Forward Voltage Drop vs. Peak Forward
Current
10
VBR - Reverse Breakdown Voltage (V)
100
Figure 8 - Maximum Non-Repetitive Forward Surge
Current Uni-Directional Only
IFSM - Peak Forward Surve Current(A)
I F - Peak Forward Current(A)
35
10
1
0.1
0.01
0
0.5
1
1.5
2
2.5
3
V F - Peak Forward Voltage(V)
3.5
4
30
25
20
15
10
5
0
1
10
100
Number of Cycles at 60 Hz
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/19/16
TVS Diodes
Surface Mount – 400W > SMF4L Series
Soldering Parameters
Pre Heat
Lead–free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus Temp (TA)
to peak
3°C/second max
TS(max) to TA - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TA) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Physical Specifications
Case
SOD-123FL plastic over glass passivated
junction
Polarity
Color band denotes cathode except bipolar
Terminal
Matte tin-plated leads, solderable per
JESD22-B102
tp
TP
Ramp-up
TL
Temperature (T)
Reflow Condition
Critical Zone
TL to TP
tL
Ts(max)
Ramp-down
Ts(min)
ts
Preheat
25˚C
t 25˚C to Peak
Time (t)
Environmental Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Temperature Cycling
JESD22-A104
MSL
JEDEC-J-STD-020, Level 1
H3TRB
JESD22-A101
RSH
JESD22-A111
E
B
A
E
Dimensions - SOD-123FL Package
F
C
G
H
D
Dimensions
Millimeters
Min
Max
Inches
Min
Max
A
2.90
3.10
0.114
0.122
B
3.50
3.90
0.138
0.154
C
0.85
1.05
0.033
0.041
D
1.70
2.00
0.067
0.079
E
0.43
0.83
0.017
0.033
F
0.10
0.25
0.004
0.010
G
0.00
0.10
0.000
0.004
H
0.90
0.98
0.035
0.039
Mounting Pad Layout
1.6 (0.062)
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/19/16
TVS Diodes
Surface Mount – 400W > SMF4L Series
Part Numbering System
Part Marking System
SMF4L xx A
LF
5% VBR VOLTAGE TOLERANCE
XX
YM
VR VOLTAGE
SERIES
Cathode Band
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
Packaging Options
Part number
SMF4LXXX
Component
Package
Quantity
SOD-123FL
3000
Packaging Option
Tape & Reel – 8mm tape/7” reel
Packaging
Specification
EIA RS-481
Tape and Reel Specification
0.157
(4.0)
Cathode
0.31
(8.0)
0.157
(4.0)
Optional
7” 7.0 (178)
13” 13.0 (330)
0.80 (20.2)
Arbor Hole Dia.
0.33
(8.5)
0.059 DIA
(1.5)
Cover tape
Dimensions are in inches
(and millimeters).
Direction of Feed
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/19/16