TVS Diodes Surface Mount – 400W > SMF4L Series SMF4L Series RoHS Pb e3 Description Uni-directional The SMF4L series of SOD-123FL small and flat lead lowprofile plastic package is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Agency Approvals AGENCY AGENCY FILE NUMBER E230531 Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Peak Pulse Power Dissipation at TA=25ºC (Note 1) 8/20µs (Note 2) Value Unit 2000 W 400 W PPPM 10/1000µs (Note 3) Thermal Resistance Junction to Ambient RθJA 220 °C/W Thermal Resistance Junction to Lead RθJL 100 °C/W TJ,TSTG -55 to 150 °C Operating and Storage Temperature Range Notes: 1. Non-repetitive current pulse, per Fig. 4 and derated above TJ (initial) =25ºC per Fig. 3. • 400W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01% • Compatible with industrial standard package SOD123FL • Low profile: maximum height of 0.98mm. • Low inductance, excellent clamping capability • For surface mounted applications to optimize board space • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 • EFT protection of data lines in accordance with IEC 61000-4-4 • Fast response time: typically less than 1.0ns from 0 Volts to VBR min • High temperature soldering: 260°C/40 seconds at terminals • Glass passivated junction • Built-in strain relief • Plastic package is flammability rated V-0 per Underwriters Laboratories • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen-free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD-609A.01) 2. SMF4L5.0A~SMF4L9.0A Peak Pulse Power Dissipation is 1850W min, 2000W typical @8/20us 3. SMF4L5.0A~SMF4L9.0A Peak Pulse Power Dissipation is 370W min, 400W typical @ 10/1000µs Applications SMF4L devices are ideal for the protection of portable devices/hard drives, notebooks, VCC busses, POS terminal, SSDs, power supplies, monitors, and vulnerable circuit used in other consumer applications. Functional Diagram Bi-directional Cathode Anode Uni-directional ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/19/16 TVS Diodes Surface Mount – 400W > SMF4L Series Electrical Characteristics (T =25°C unless otherwise noted) A Part Number SMF4L5.0A SMF4L6.0A SMF4L6.5A SMF4L7.0A SMF4L7.5A SMF4L8.0A SMF4L8.5A SMF4L9.0A SMF4L10A SMF4L11A SMF4L12A SMF4L13A SMF4L14A SMF4L15A SMF4L16A SMF4L17A SMF4L18A SMF4L20A SMF4L22A SMF4L24A SMF4L26A SMF4L28A SMF4L30A SMF4L33A SMF4L36A SMF4L40A SMF4L43A SMF4L45A SMF4L48A SMF4L51A SMF4L54A SMF4L58A SMF4L60A SMF4L64A SMF4L70A SMF4L75A SMF4L78A SMF4L85A Marking Code KE KG KK KM KP KR KT KV KX KZ LE LG LK LM LP LR LT LV LX LZ ME MG MK MM MP MR MT MV MX MZ NE NG NK NM NP NR NT NV Breakdown Voltage VBR (Volts) @ IT MIN MAX Test Current IT (mA) 6.40 6.67 7.22 7.78 8.33 8.89 9.44 10.00 11.10 12.20 13.30 14.40 15.60 16.70 17.80 18.90 20.00 22.20 24.40 26.70 28.90 31.10 33.30 36.70 40.00 44.40 47.80 50.00 53.30 56.70 60.00 64.40 66.70 71.10 77.80 83.30 86.70 94.40 7.00 7.37 7.98 8.60 9.21 9.83 10.40 11.10 12.30 13.50 14.70 15.90 17.20 18.50 19.70 20.90 22.10 24.50 26.90 29.50 31.90 34.40 36.80 40.60 44.20 49.10 52.80 55.30 58.90 62.70 66.30 71.20 73.70 78.60 86.00 92.10 95.80 104.00 10 10 10 10 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Maximum Reverse Stand Reverse off Voltage Leakage @ VR VR (V) IR (µA) 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 78 85 800 800 500 200 100 50 20 10 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Maximum Peak Pulse Current Ipp (A) 40.1 35.9 33.1 30.9 28.7 27.2 25.7 24.1 23.5 22.0 20.1 18.6 17.2 16.4 15.4 14.5 13.7 12.3 11.3 10.3 9.5 8.8 8.3 7.5 6.9 6.2 5.8 5.5 5.2 4.9 4.6 4.3 4.1 3.9 3.5 3.3 3.2 2.9 Maximum Clamping Voltage @Ipp VC (V) 9.2 10.3 11.2 12.0 12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103.0 113.0 121.0 126.0 137.0 Agency Approval X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Notes: 1. VBR measured after IT applied for 300µs, IT = square wave pulse or equivalent. 2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2. 3. All terms and symbols are consistent with ANSI/IEEE C62.35. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/19/16 TVS Diodes Surface Mount – 400W > SMF4L Series I-V Curve Characteristics Uni-directional Vc VBR VR V IR VF IT Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Curve 10 PPPM-Peak Pulse Power (kW) Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS 1 0.2x0.2" (5.0x5.0mm) Copper Pad Area 0.1 0.000001 Time 0.00001 0.0001 0.001 td-Pulse Width (sec.) continues on next page. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/19/16 TVS Diodes Surface Mount – 400W > SMF4L Series Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A Figure 3 - Peak Pulse Power Derating Curve Figure 4 - Pulse Waveform - 10/1000µS 150 IPPM- Peak Pulse Current, % IRSM Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 80 60 40 20 0 0 25 50 75 100 125 150 TJ - Initial Junction Temperature (ºC) tr=10µsec Peak Value IPPM 100 Half Value IPPM IPPM ( ) 2 50 0 175 TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM 10/1000µsec. Waveform as defined by R.E.A td 0 1.0 2.0 3.0 4.0 t-Time (ms) Figure 5 - Forward Voltage Figure 6 - Typical Junction Capacitance Uni-directional V=0v 1000 0.8 0.7 Cj (pF) Vf - Typical forward dropped voltage@10mA 10000 0.9 0.6 0.5 100 Uni-directional V=VR 10 0.4 1 0 -55 10 75 1 140 Temperature (ºC) Figure 7 - Peak Forward Voltage Drop vs. Peak Forward Current 10 VBR - Reverse Breakdown Voltage (V) 100 Figure 8 - Maximum Non-Repetitive Forward Surge Current Uni-Directional Only IFSM - Peak Forward Surve Current(A) I F - Peak Forward Current(A) 35 10 1 0.1 0.01 0 0.5 1 1.5 2 2.5 3 V F - Peak Forward Voltage(V) 3.5 4 30 25 20 15 10 5 0 1 10 100 Number of Cycles at 60 Hz ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/19/16 TVS Diodes Surface Mount – 400W > SMF4L Series Soldering Parameters Pre Heat Lead–free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Physical Specifications Case SOD-123FL plastic over glass passivated junction Polarity Color band denotes cathode except bipolar Terminal Matte tin-plated leads, solderable per JESD22-B102 tp TP Ramp-up TL Temperature (T) Reflow Condition Critical Zone TL to TP tL Ts(max) Ramp-down Ts(min) ts Preheat 25˚C t 25˚C to Peak Time (t) Environmental Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Temperature Cycling JESD22-A104 MSL JEDEC-J-STD-020, Level 1 H3TRB JESD22-A101 RSH JESD22-A111 E B A E Dimensions - SOD-123FL Package F C G H D Dimensions Millimeters Min Max Inches Min Max A 2.90 3.10 0.114 0.122 B 3.50 3.90 0.138 0.154 C 0.85 1.05 0.033 0.041 D 1.70 2.00 0.067 0.079 E 0.43 0.83 0.017 0.033 F 0.10 0.25 0.004 0.010 G 0.00 0.10 0.000 0.004 H 0.90 0.98 0.035 0.039 Mounting Pad Layout 1.6 (0.062) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/19/16 TVS Diodes Surface Mount – 400W > SMF4L Series Part Numbering System Part Marking System SMF4L xx A LF 5% VBR VOLTAGE TOLERANCE XX YM VR VOLTAGE SERIES Cathode Band Marking Code Trace Code Marking Y:Year Code M: Month Code Packaging Options Part number SMF4LXXX Component Package Quantity SOD-123FL 3000 Packaging Option Tape & Reel – 8mm tape/7” reel Packaging Specification EIA RS-481 Tape and Reel Specification 0.157 (4.0) Cathode 0.31 (8.0) 0.157 (4.0) Optional 7” 7.0 (178) 13” 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.33 (8.5) 0.059 DIA (1.5) Cover tape Dimensions are in inches (and millimeters). Direction of Feed ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/19/16