AOS Semiconductor Product Reliability Report AO8801A, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO8801A. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO8801A passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO8801A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. -RoHS Compliant -Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO8801A Standard sub-micron Low voltage P channel, dual die Package Type TSSOP8 Lead Frame Cu Die Attach Ag epoxy Bonding Au wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AO8801A Test Item Test Condition Time Point Lot Attribution Total Sample size MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB Temp = 150 °c, Vgs=100% of Vgsmax Number of Failures Standard - 4 lots 550pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 1 lot 308pcs 0 JESD22A108 0 JESD22A108 0 JESD22A110 0 JESD22A102 0 JESD22A104 3 lots 77pcs / lot Temp = 150 °c, Vds=80% of Vdsmax HTRB 168hrs 500 hrs 1000 hrs 1 lot 308pcs 3 lots 77pcs / lot HAST Pressure Pot 130 +/- 2°°c, 85%RH, 33.3 psi, Vgs = 100% of Vgs max 100 hrs 121°°c, 29.7psi, RH=100% 96 hrs 3 lots (Note A) 4 lots (Note A) Temperature Cycle -65°°c to 150°°c, air to air 250 / 500 cycles 3 lots (Note A) 165pcs 55pcs / lot 220pcs 55pcs / lot 165pcs 55pcs / lot Note A: The reliability data presents the available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 7 MTTF=15704 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in (HTGB & HTRB) sample size of the selected product (AO8801A). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 FIT= Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 / [2x (2x77x168+3x2x77x1000) x258] = 7 9 8 MTTF = 10 / FIT =1.38 x 10 hrs = 15704 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence level N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 258 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K 130 deg C 150 deg C 2.59 1